CN105451431B - 电路板及其制作方法 - Google Patents
电路板及其制作方法 Download PDFInfo
- Publication number
- CN105451431B CN105451431B CN201410442114.1A CN201410442114A CN105451431B CN 105451431 B CN105451431 B CN 105451431B CN 201410442114 A CN201410442114 A CN 201410442114A CN 105451431 B CN105451431 B CN 105451431B
- Authority
- CN
- China
- Prior art keywords
- layer
- copper foil
- groove
- conductive circuit
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (9)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410442114.1A CN105451431B (zh) | 2014-09-02 | 2014-09-02 | 电路板及其制作方法 |
TW103131070A TWI566660B (zh) | 2014-09-02 | 2014-09-09 | 電路板及其製作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410442114.1A CN105451431B (zh) | 2014-09-02 | 2014-09-02 | 电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105451431A CN105451431A (zh) | 2016-03-30 |
CN105451431B true CN105451431B (zh) | 2018-10-30 |
Family
ID=55561088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410442114.1A Active CN105451431B (zh) | 2014-09-02 | 2014-09-02 | 电路板及其制作方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN105451431B (zh) |
TW (1) | TWI566660B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1744794A (zh) * | 2004-09-03 | 2006-03-08 | 华为技术有限公司 | 一种阶梯状印刷电路板及其制造方法 |
CN101650527A (zh) * | 2008-08-15 | 2010-02-17 | 信越化学工业株式会社 | 灰色调掩模坯、灰色调掩模及制品加工标识或制品信息标识的形成方法 |
CN101661218A (zh) * | 2008-08-28 | 2010-03-03 | 富葵精密组件(深圳)有限公司 | 透明光掩模的制备方法 |
CN103119542A (zh) * | 2010-09-29 | 2013-05-22 | 大日本印刷株式会社 | 触摸面板传感器膜及其制造方法 |
CN103781281A (zh) * | 2012-10-24 | 2014-05-07 | 富葵精密组件(深圳)有限公司 | 电路板及其制作方法 |
-
2014
- 2014-09-02 CN CN201410442114.1A patent/CN105451431B/zh active Active
- 2014-09-09 TW TW103131070A patent/TWI566660B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1744794A (zh) * | 2004-09-03 | 2006-03-08 | 华为技术有限公司 | 一种阶梯状印刷电路板及其制造方法 |
CN101650527A (zh) * | 2008-08-15 | 2010-02-17 | 信越化学工业株式会社 | 灰色调掩模坯、灰色调掩模及制品加工标识或制品信息标识的形成方法 |
CN101661218A (zh) * | 2008-08-28 | 2010-03-03 | 富葵精密组件(深圳)有限公司 | 透明光掩模的制备方法 |
CN103119542A (zh) * | 2010-09-29 | 2013-05-22 | 大日本印刷株式会社 | 触摸面板传感器膜及其制造方法 |
CN103781281A (zh) * | 2012-10-24 | 2014-05-07 | 富葵精密组件(深圳)有限公司 | 电路板及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI566660B (zh) | 2017-01-11 |
TW201611697A (zh) | 2016-03-16 |
CN105451431A (zh) | 2016-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11744022B2 (en) | Method for manufacturing a circuit having a lamination layer using laser direct structuring process | |
CN105027691A (zh) | 印刷电路板及其制造方法 | |
CN103489841B (zh) | 同时埋入电容、电感、电阻的pcb板及其制备方法 | |
TWI646879B (zh) | 柔性電路板、電路板元件及柔性電路板的製作方法 | |
TWI612860B (zh) | 電子電路模組 | |
JP2017539095A (ja) | フレキシブルプリント配線板、これを含む電子装置、およびフレキシブルプリント配線板の製造方法 | |
CN104219882B (zh) | 一种下沉式软硬结合线路板及其制作方法 | |
KR20150092625A (ko) | 임베디드 인쇄회로기판 | |
TWI615076B (zh) | 軟硬結合電路板及其製作方法 | |
CN103974522A (zh) | 布线基板及其制造方法 | |
US20150054162A1 (en) | Method of manufacturing chip package substrate and method of manufacturing chip package | |
CN105451431B (zh) | 电路板及其制作方法 | |
CN106358369A (zh) | 电路板及其制作方法 | |
US9707706B2 (en) | Flexible substrate embedded with wires and method for fabricating the same | |
CN105451469B (zh) | 一种电路板金手指的制作方法 | |
TWI507108B (zh) | 柔性電路板及其製作方法 | |
WO2014049721A1 (ja) | 部品内蔵基板の製造方法及びこの方法を用いて製造した部品内蔵基板 | |
CN104768336B (zh) | 一种层间互连工艺 | |
CN106158672B (zh) | 埋入指纹识别芯片的基板及其加工方法 | |
CN106604545B (zh) | 铜箔基板的制作方法 | |
TW201349956A (zh) | 軟硬複合線路板及其製作方法 | |
CN104754853B (zh) | 具有收音孔的电路板及其制作方法 | |
CN206433253U (zh) | 一种电路板 | |
JP2009021510A (ja) | プリント基板及びその製造方法 | |
TWM526769U (zh) | 垂直互連結構 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170306 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
|
TA01 | Transfer of patent application right | ||
CB02 | Change of applicant information |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant |