CN105448876A - Sensor and assembly methods thereof - Google Patents
Sensor and assembly methods thereof Download PDFInfo
- Publication number
- CN105448876A CN105448876A CN201510910249.0A CN201510910249A CN105448876A CN 105448876 A CN105448876 A CN 105448876A CN 201510910249 A CN201510910249 A CN 201510910249A CN 105448876 A CN105448876 A CN 105448876A
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- CN
- China
- Prior art keywords
- lead
- lead plate
- pin
- chip
- bracket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/63—Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a sensor, which comprises a lead pin, a lead bracket, a lead board and a chip, wherein a convex ring is arranged on the inner wall of the lead bracket; a lead pin hole is formed in the convex ring; the upper part of the lead pin hole is filled with an insulating layer; the lead pin passes through the lead pin hole, is inserted into a welding hole and is welded; the lower end surface of the lead pin is flush with the lower surface of the lead plate; the chip is in contact with the lower surface of the lead board; and the lead of the chip passes through a lead hole and is welded with the upper surface of the lead board. The invention further discloses an assembly method of the sensor. The method comprises the following steps: firstly, fixing the lead pin on the lead bracket; and then welding the lead pin and the lead board and ensuring that the lower surface of the lead board is flush. The invention further discloses another assembly method, which comprises the following steps: welding the lead pin and the lead board and then fixing the lead pin in the lead pin hole, and simultaneously ensuring that the lead pin does not extend out of the lower surface of the lead board. The sensor and the assembly methods thereof disclosed by the invention have the advantages of being simple and compact in structure, short in lead, high in working reliability and the like.
Description
Technical field
The present invention relates generally to field of sensing technologies, refers in particular to a kind of transducer and assembly method thereof.
Background technology
Along with the extensive use of sensor technology, more and more higher to the reliability requirement of transducer, the lead technology of chip is then the key affecting sensor reliability.
Conventional gage system, what lead plate is welded on down-lead bracket draws on pin, then down-lead bracket and chip is assembled together.As shown in Figure 1, for guaranteeing intensity and the electric property of solder joint, solder joint can protrude lead plate surface 0.8mm ~ 1.5mm, solder joint is between lead plate and chip, the i.e. difference in height of lead plate and chip at least 0.8mm, cause lead plate pad and chip bonding pad difference in height large, go between elongated, affect reliability.
Summary of the invention
The technical problem to be solved in the present invention is just: the technical problem existed for prior art, the invention provides a kind of simple and compact for structure, take the transducer that volume is little, wire length is short, functional reliability is high, and correspondingly provide two kinds of simple transducer assembly methods of assembling process.
For solving the problems of the technologies described above, the technical scheme that the present invention proposes is:
A kind of transducer, comprise and draw pin, down-lead bracket, lead plate and chip, described down-lead bracket is the ring-type of hollow and its inwall is provided with a bulge loop, described bulge loop is provided with and draws pin hole, described top of drawing pin hole is filled with insulating barrier, the pin hole position of drawing of the corresponding bulge loop of described down-lead bracket is provided with welding hole, the middle part of described down-lead bracket is provided with fairlead, describedly draw pin drawing pin hole and welding after being inserted into the welding hole of lead plate through described bulge loop, the described lower end surface drawing pin is mutually concordant with the lower surface of described lead plate, described chip near the lower surface of described lead plate and the lead-in wire of chip weld through the upper surface of described fairlead with described lead plate.
Further improvement as technique scheme:
Described lead plate contacts with the bulge loop lower surface of described down-lead bracket.
Described insulating barrier is ceramic glaze.
The invention also discloses a kind of assembly method of transducer, comprise the following steps:
S01, beginning, the pin hole top of drawing on the bulge loop of down-lead bracket inwall is filled insulating barrier and will be drawn pin and is fixed on and draws in pin hole;
S02, lead plate is assembled to down-lead bracket inside, in the welding hole that the bottom of drawing pin is inserted into lead plate and its lower surface is mutually concordant with the lower surface of described lead plate, then by lead plate with draw pin and weld mutually, and solder joint is extended to draw the bottom of pin hole;
S03, chip and down-lead bracket to be assembled, make chip near the lower surface of described lead plate, the lead-in wire on chip is then by welding with the upper surface of lead plate after the fairlead of lead plate.
The present invention also discloses a kind of assembly method of transducer in addition, comprises the following steps:
S01, beginning, be inserted in the welding hole of lead plate by the bottom of drawing pin, then lead plate upper surface by lead plate with draw pin and weld mutually, and ensure that the lower surface of drawing pin is mutually concordant with the lower surface of described lead plate;
S02, pin will be drawn and lead plate is assembled in down-lead bracket, described in draw pin through the bulge loop of down-lead bracket inwall draws pin hole, and fill insulating barrier and will draw pin and fix drawing in pin hole;
S03, chip and down-lead bracket to be assembled, make chip near the lower surface of described lead plate, the lead-in wire on chip is then by welding with the upper surface of lead plate after the fairlead of lead plate.
Compared with prior art, the invention has the advantages that:
Transducer of the present invention, only fill insulating barrier on the top of drawing pin hole, and solder joint being extended to the bottom of drawing pin hole by when drawing and weld between pin with lead plate, thus to draw between pin and lead plate while firm welding in guarantee, make the lower surface of drawing pin mutually concordant with the lower surface of lead plate, thus make between chip and lead plate closely close, shorten the length gone between lead plate and chip, improve the reliability of working sensor; Sensor construction of the present invention is simply compact in addition, to take volume little.
Transducer assembly method of the present invention, have the advantage as described in upper sensor equally, and assembling process is simple.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing transducer.
Fig. 2 is the structural representation of transducer of the present invention.
Fig. 3 is down-lead bracket in transducer assembly method of the present invention and draw pin installation diagram.
Fig. 4 of the present inventionly draws pin and lead plate assembles schematic diagram.
Fig. 5 is that chip of the present invention and lead plate assemble schematic diagram.
Number in the figure represents: 1, down-lead bracket; 11, bulge loop; 12, pin hole is drawn; 13, insulating barrier; 2, pin is drawn; 3, lead plate; 31, welding hole; 32, fairlead; 4, chip; 41, go between.
Embodiment
Below in conjunction with Figure of description and specific embodiment, the invention will be further described.
As shown in Figure 2, the transducer of the present embodiment, comprise and draw pin 2, down-lead bracket 1, lead plate 3 and chip 4, down-lead bracket 1 is the ring-type of hollow and its inwall is provided with a bulge loop 11, wherein bulge loop 11 is provided with and more than onely draws pin hole 12, draw pin 2 for wearing and fixedly draw pin 2, the top of drawing pin hole 12 is filled with insulating barrier 13, insulating barrier 13 is for fixedly drawing pin 2 and ensureing that drawing pin 2 insulate with down-lead bracket 1, wherein lead plate 3 contacts with bulge loop 11 lower surface of down-lead bracket 1, pin hole 12 position of drawing of the corresponding bulge loop 11 of down-lead bracket 1 is provided with welding hole 31, the middle part of down-lead bracket 1 is provided with fairlead 32, draw pin 2 drawing pin hole 12 and welding together after being inserted into the welding hole 31 of lead plate 3 through bulge loop 11, and ensure that the lower end surface drawing pin 2 after welding is mutually concordant with the lower surface of lead plate 3, chip 4 near the lower surface of lead plate 3 and the lead-in wire 41 of chip 4 weld with the upper surface of lead plate 3 through fairlead 32.Transducer of the present invention, the solder joint drawing pin 2 and lead plate 3 is moved to the top of lead plate 3 from the below of lead plate 3, corresponding reserves certain space so that firm welding in the bottom of drawing pin hole 12, even if draw pin 2 do not stretch out lead plate 3, welding portion can not protrude lead plate 3 lower surface, thus makes between chip 4 with lead plate 3 closely near (but not contacting, to ensure insulating properties), thus make lead-in wire 41 length between chip 4 and lead plate 3 the shortest, improve the reliability of working sensor; In addition simple and compact for structure, to take volume little.
In the present embodiment, insulating barrier 13 is ceramic glaze, insulate with down-lead bracket 1 for drawing pin 2; Draw pin 2 in addition to weld with lead plate 3 and not only need to ensure fixing, but also need to ensure conduction between the two, namely the signal of chip 4 41 is passed to lead plate 3 through going between, then is passed to through lead plate 3 and draws pin 2, the transmission of settling signal.
In addition, in other embodiments, in order to ensure the contraction in length of lead-in wire 41, the size of lead plate 3 can be increased, as the internal diameter making the external diameter of chip 4 be less than bulge loop 11, now chip 4 can not have any contact with drawing pin 2, or is directly assemblied in the lead plate 3 of lead plate 3 by chip 4, namely the upper surface of chip 4 is mutually concordant with the upper surface of lead plate 3, can shorten the length of lead-in wire 41 further.
The invention also discloses two embodiments of the assembly method of the sensor, specific as follows:
embodiment one:
As shown in Figures 3 to 5, the assembly method of the transducer of the embodiment of the present invention, comprises the following steps:
S01, beginning, pin hole 12 top of drawing on the bulge loop 11 of down-lead bracket 1 inwall is filled insulating barrier 13 and will be drawn pin 2 and is fixed on and draws in pin hole 12;
S02, lead plate 3 to be assembled to down-lead bracket 1 inner and contact with the lower surface of down-lead bracket 1, in the welding hole 31 that the bottom of now drawing pin 2 is inserted into lead plate 3 and its lower surface is mutually concordant with the lower surface of lead plate 3, then by lead plate 3 with draw pin 2 and weld mutually, and solder joint is extended to draw the bottom of pin hole 12, specifically spot welding can be adopted, weld at the lower surface of lead plate 3, and welding fluid is stayed into the top to lead plate 3, namely the bottom of pin hole 12 is drawn, ensure the fixing of welding, finally also need to ensure that the solder joint of lead plate 3 lower surface can not protrude;
S03, chip 4 and down-lead bracket 1 are assembled, make chip 4 closely close with the lower surface of lead plate 3,41, the lead-in wire on chip 4 is by welding with the upper surface of lead plate 3, until enter next step assembling process after the fairlead 32 of lead plate 3.
This kind of method mainly for draw pin 2 and down-lead bracket 1 fixed-type after assembling.
embodiment two:
The assembly method of the transducer of the embodiment of the present invention, comprises the following steps:
S01, beginning, the bottom of drawing pin 2 is inserted in the welding hole 31 of lead plate 3, then lead plate 3 upper surface by lead plate 3 with draw pin 2 and weld mutually, and ensure that the lower surface of drawing pin 2 is mutually concordant with the lower surface of lead plate 3, this kind of method directly can will be drawn pin 2 and be welded with lead plate 3 above lead plate 3, solder joint directly can stay the top of lead plate 3, ensures that lead plate 3 lower surface is concordant;
S02, pin 2 will be drawn and lead plate 3 is assembled in down-lead bracket 1, lead plate 3 contacts with the lower surface of bulge loop 11, draw pin 2 through the through hole on the bulge loop 11 of down-lead bracket 1 inwall, and in through hole, fill insulating barrier 13 will draw pin 2 and fix, and guarantee is drawn pin 2 and do not contacted with down-lead bracket 1;
S03, chip 4 and down-lead bracket 1 are assembled, make chip 4 closely close with the lower surface of lead plate 3,41, the lead-in wire on chip 4, by welding with the upper surface of lead plate 3 after the fairlead 32 of lead plate 3, enters lower step assembling process.
Below be only the preferred embodiment of the present invention, protection scope of the present invention be not only confined to above-described embodiment, all technical schemes belonged under thinking of the present invention all belong to protection scope of the present invention.It should be pointed out that for those skilled in the art, some improvements and modifications without departing from the principles of the present invention, should be considered as protection scope of the present invention.
Claims (5)
1. a transducer, comprise and draw pin (2), down-lead bracket (1), lead plate (3) and chip (4), the ring-type of described down-lead bracket (1) in hollow and its inwall is provided with a bulge loop (11), described bulge loop (11) is provided with and draws pin hole (12), it is characterized in that, described top of drawing pin hole (12) is filled with insulating barrier (13), pin hole (12) position of drawing of described down-lead bracket (1) corresponding bulge loop (11) is provided with welding hole (31), the middle part of described down-lead bracket (1) is provided with fairlead (32), described draw pin (2) through described bulge loop (11) draw pin hole (12) and the welding hole (31) being inserted into lead plate (3) afterwards and weld, the described lower end surface drawing pin (2) is mutually concordant with the lower surface of described lead plate (3), described chip (4) welds through the upper surface of described fairlead (32) with described lead plate (3) near the lower surface of described lead plate (3) and the lead-in wire (41) of chip (4).
2. transducer according to claim 1, is characterized in that, described lead plate (3) contacts with bulge loop (11) lower surface of described down-lead bracket (1).
3. transducer according to claim 1 and 2, is characterized in that, described insulating barrier (13) is ceramic glaze.
4. an assembly method for transducer, is characterized in that, comprises the following steps:
S01, beginning, pin hole (12) top of drawing on the bulge loop (11) of down-lead bracket (1) inwall is filled insulating barrier (13) and will be drawn pin (2) and is fixed on and draws in pin hole (12);
S02, lead plate (3) to be assembled to down-lead bracket (1) inner, in the welding hole (31) that the bottom of drawing pin (2) is inserted into lead plate (3) and its lower surface is mutually concordant with the lower surface of described lead plate (3), then by lead plate (3) with draw pin (2) and weld mutually, and solder joint is extended to draw the bottom of pin hole (12);
S03, chip (4) and down-lead bracket (1) to be assembled, make chip (4) near the lower surface of described lead plate (3), the lead-in wire (41) on chip (4) is then welded with the upper surface of lead plate (3) afterwards by the fairlead (32) of lead plate (3).
5. an assembly method for transducer, is characterized in that, comprises the following steps:
S01, beginning, the bottom of drawing pin (2) is inserted in the welding hole (31) of lead plate (3), then lead plate (3) upper surface by lead plate (3) with draw pin (2) and weld mutually, and ensure that the lower surface of drawing pin (2) is mutually concordant with the lower surface of described lead plate (3);
S02, pin (2) will be drawn and lead plate (3) is assembled in down-lead bracket (1), the described pin (2) that draws through the bulge loop (11) of down-lead bracket (1) inwall draws pin hole (12), and is filled insulating barrier (13) will to draw pin (2) fixing drawing in pin hole (12);
S03, chip (4) and down-lead bracket (1) to be assembled, make chip (4) near the lower surface of described lead plate (3), the lead-in wire (41) on chip (4) is then welded with the upper surface of lead plate (3) afterwards by the fairlead (32) of lead plate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510910249.0A CN105448876B (en) | 2015-12-10 | 2015-12-10 | A kind of sensor and its assembly method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510910249.0A CN105448876B (en) | 2015-12-10 | 2015-12-10 | A kind of sensor and its assembly method |
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| Publication Number | Publication Date |
|---|---|
| CN105448876A true CN105448876A (en) | 2016-03-30 |
| CN105448876B CN105448876B (en) | 2018-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510910249.0A Active CN105448876B (en) | 2015-12-10 | 2015-12-10 | A kind of sensor and its assembly method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106546363A (en) * | 2016-09-29 | 2017-03-29 | 中国电子科技集团公司第四十八研究所 | A kind of diaphragm pressure sensor and its method for packing |
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| CN2556622Y (en) * | 2002-06-25 | 2003-06-18 | 沈阳仪器仪表工艺研究所 | To tube base type pressure sensor |
| CN2718545Y (en) * | 2004-07-06 | 2005-08-17 | 浙江三花制冷集团有限公司 | Integrated assembling pressure sensor apparatus |
| US20080247142A1 (en) * | 2005-12-28 | 2008-10-09 | Kuno Wolf | Electronic Module and Method for Producing Such a Module |
| CN202382900U (en) * | 2011-11-17 | 2012-08-15 | 中国电子科技集团公司第四十八研究所 | Absolute pressure packaging structure for strain pressure transducer and strain pressure transducer |
| CN102928150A (en) * | 2012-10-26 | 2013-02-13 | 中国电子科技集团公司第四十八研究所 | Leadless packaged metal film pressure sensor and preparation method thereof |
| CN204088318U (en) * | 2014-08-19 | 2015-01-07 | 益海芯电子技术江苏有限公司 | Optical induction device |
-
2015
- 2015-12-10 CN CN201510910249.0A patent/CN105448876B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2556622Y (en) * | 2002-06-25 | 2003-06-18 | 沈阳仪器仪表工艺研究所 | To tube base type pressure sensor |
| CN2718545Y (en) * | 2004-07-06 | 2005-08-17 | 浙江三花制冷集团有限公司 | Integrated assembling pressure sensor apparatus |
| US20080247142A1 (en) * | 2005-12-28 | 2008-10-09 | Kuno Wolf | Electronic Module and Method for Producing Such a Module |
| CN202382900U (en) * | 2011-11-17 | 2012-08-15 | 中国电子科技集团公司第四十八研究所 | Absolute pressure packaging structure for strain pressure transducer and strain pressure transducer |
| CN102928150A (en) * | 2012-10-26 | 2013-02-13 | 中国电子科技集团公司第四十八研究所 | Leadless packaged metal film pressure sensor and preparation method thereof |
| CN204088318U (en) * | 2014-08-19 | 2015-01-07 | 益海芯电子技术江苏有限公司 | Optical induction device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106546363A (en) * | 2016-09-29 | 2017-03-29 | 中国电子科技集团公司第四十八研究所 | A kind of diaphragm pressure sensor and its method for packing |
| CN106546363B (en) * | 2016-09-29 | 2019-09-20 | 中国电子科技集团公司第四十八研究所 | A kind of diaphragm pressure sensor and its packaging method |
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| Publication number | Publication date |
|---|---|
| CN105448876B (en) | 2018-07-03 |
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