CN201549493U - Micro diode molybdenum electrode lead structure - Google Patents
Micro diode molybdenum electrode lead structure Download PDFInfo
- Publication number
- CN201549493U CN201549493U CN 200920125892 CN200920125892U CN201549493U CN 201549493 U CN201549493 U CN 201549493U CN 200920125892 CN200920125892 CN 200920125892 CN 200920125892 U CN200920125892 U CN 200920125892U CN 201549493 U CN201549493 U CN 201549493U
- Authority
- CN
- China
- Prior art keywords
- molybdenum electrode
- lead wire
- welding
- lead
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The utility model discloses a micro diode molybdenum electrode lead structure which comprises a lead wire (1), a copper welding plate (2) and a molybdenum electrode (3), wherein the copper welding plate (2) is connected and fixed with the lead wire (1) and the molybdenum electrode (3) together through soldering, and the lead wire (1) is formed by nickel material or iron nickel alloy materials. The micro diode molybdenum electrode lead wire structure utilizes the characteristics of intermiscibility of copper and nickel, can connect and fix the molybdenum electrode and the lead wire together through primary braze welding (namely the braze welding of the molybdenum electrode, the copper welding plate and the lead wire), reduces occupied space of one layer of welding materials, lowers production cost, simplifies manufacturing technology, and improves yield ratio and reliability of products. The micro diode molybdenum electrode lead wire structure has the advantages of small volumes of welding points, simple manufacture technology, low cost and high product reliability.
Description
Technical field
The utility model and a kind of microdiode molybdenum electrode pin configuration belong to the microdiode manufacture technology field.
Background technology
The electrode leads to client of microdiode needs electric conductivity and the processing of plasticity excellent material on the one hand, guarantee in electronic circuit, to possess lower electrical loss and reliable mechanical connection and favorable manufacturability, the consistency that must keep hot expansibility on the other hand with silicon guarantees that diode satisfies harsh reliability environmental test requirement.At present, microdiode of the prior art generally adopts Mo as electrode, and molybdenum electrode is connected with lead-in wire by the mode of twice soldering, promptly adopt soldering for the first time with molybdenum electrode with the brazing sheet soldering be in the same place, soldering for the second time with silver-bearing copper weld tabs, molybdenum electrode with lead-in wire soldering be in the same place, the welding manner and the existing defective of structure of kind electrode lead-in wire are: 1, the solder joint volume is big, causes microdiode overall dimension to be difficult to satisfy code requirement; 2,, thereby improved production cost owing to employing silver-bearing copper weld tabs; 3, complex manufacturing technology, thus cause reliability of products to reduce and the rate of finished products reduction.The manufacture method and the structure of therefore existing microdiode molybdenum electrode lead-in wire still are not ideal enough.
The utility model content
The purpose of this utility model is: provide the microdiode molybdenum electrode pin configuration that a kind of solder joint volume is little, manufacture craft simple, cost is lower, product reliability is higher, to overcome the deficiencies in the prior art.
The utility model is to constitute like this: microdiode molybdenum electrode pin configuration of the present utility model is, this molybdenum electrode pin configuration is made up of lead-in wire, brazing sheet and molybdenum electrode, and the brazing sheet will go between by soldering and molybdenum electrode is connected and fixed.
Above-mentioned lead-in wire is the lead-in wire that nickel material or iron-nickel alloy material constitute.
Owing to adopted technique scheme, the characteristic that the utility model utilizes copper nickel to dissolve each other, molybdenum electrode and lead-in wire can be connected and fixed by a soldering (being molybdenum electrode, brazing sheet, lead-in wire soldering), this has not only reduced the shared space of one deck scolder, reduced production cost, but also simplified manufacture craft, improved the rate of finished products and the reliability of product; In addition when reaching the design temperature process from temperature rise, two kinds of materials of nickel down-lead of the present utility model (or iron-nickel alloy lead-in wire) and brazing sheet contact site diffuse to form eutectic mutually until balance, simultaneously also to the molybdenum matrix diffusion of molybdenum electrode and form firm weld layer.Therefore, the utility model compared with prior art the utlity model has the advantage that the solder joint volume is little, manufacture craft is simple, cost is low, product reliability is high.Through evidence, adopt the microdiode overall dimension of the utility model production can satisfy code requirement, its unfailing performance satisfies the harsh reliability environmental test requirement of diode.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described.
Embodiment of the present utility model: microdiode molybdenum electrode pin configuration of the present utility model as shown in Figure 1, this molybdenum electrode pin configuration is made up of lead-in wire 1, brazing sheet 2 and molybdenum electrode 3, lead-in wire 1 adopts existing nickel material or iron-nickel alloy material as lead-in wire, brazing sheet 2 by soldering will go between 1 and molybdenum electrode 3 be connected and fixed.During making, the size of its lead-in wire 1, brazing sheet 2 and molybdenum electrode 3 is determined by existing code requirement, adopt existing nickel or iron-nickel alloy material lead-in wire 1, will be used for the molybdenum electrode 3 that microdiode contacts with silicon and molybdenum electrode 3 and lead-in wire 1 can be linked together by the disposable soldering of existing brazing mode by brazing sheet 2 as microdiode.
Claims (2)
1. microdiode molybdenum electrode pin configuration is characterized in that: this molybdenum electrode pin configuration is made up of lead-in wire (1), brazing sheet (2) and molybdenum electrode (3), and brazing sheet (2) will go between (1) by soldering and molybdenum electrode (3) is connected and fixed.
2. microdiode molybdenum electrode pin configuration according to claim 1 is characterized in that: lead-in wire (1) is the lead-in wire of nickel material or iron-nickel alloy material formation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920125892 CN201549493U (en) | 2009-12-04 | 2009-12-04 | Micro diode molybdenum electrode lead structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920125892 CN201549493U (en) | 2009-12-04 | 2009-12-04 | Micro diode molybdenum electrode lead structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201549493U true CN201549493U (en) | 2010-08-11 |
Family
ID=42604672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920125892 Expired - Lifetime CN201549493U (en) | 2009-12-04 | 2009-12-04 | Micro diode molybdenum electrode lead structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201549493U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102699466A (en) * | 2012-06-19 | 2012-10-03 | 中国振华集团永光电子有限公司 | Brazing method of semiconductor electrode assembly |
| CN104659111A (en) * | 2015-02-11 | 2015-05-27 | 中国振华集团永光电子有限公司（国营第八七三厂） | Micro commutation diode supporting glass passivation packaging |
-
2009
- 2009-12-04 CN CN 200920125892 patent/CN201549493U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102699466A (en) * | 2012-06-19 | 2012-10-03 | 中国振华集团永光电子有限公司 | Brazing method of semiconductor electrode assembly |
| CN102699466B (en) * | 2012-06-19 | 2015-08-19 | 中国振华集团永光电子有限公司 | The method for welding of semi-conducting electrode assembly |
| CN104659111A (en) * | 2015-02-11 | 2015-05-27 | 中国振华集团永光电子有限公司（国营第八七三厂） | Micro commutation diode supporting glass passivation packaging |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100811 |