CN105448876B - A kind of sensor and its assembly method - Google Patents
A kind of sensor and its assembly method Download PDFInfo
- Publication number
- CN105448876B CN105448876B CN201510910249.0A CN201510910249A CN105448876B CN 105448876 B CN105448876 B CN 105448876B CN 201510910249 A CN201510910249 A CN 201510910249A CN 105448876 B CN105448876 B CN 105448876B
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- draw pin
- lead
- lead plate
- bracket
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a kind of sensors, including draw pin, down-lead bracket, lead plate and chip, a bulge loop is provided on the inner wall of down-lead bracket, a draw pin hole is provided on bulge loop, the top in the draw pin hole is filled with insulating layer, draw pin passes through draw pin hole and is inserted into after welding hole and welds, the lower end surface of draw pin and the lower surface flush of lead plate, and chip is contacted with the lower surface of lead plate and the lead of chip passes through the upper surface of fairlead and lead plate to weld.The invention also discloses a kind of assembly methods of sensor, and draw pin is fixed on down-lead bracket first, and then draw pin is welded with lead plate again and ensures that lead plate lower surface is concordant.The invention also discloses another assembly methods, are fixed on draw pin in draw pin hole again, while ensure that draw pin does not stretch out the lower surface of lead plate after by draw pin and lead plate welding.Sensor of the invention and its assembly method are respectively provided with the advantages that simple and compact for structure, wire length is short, and functional reliability is high.
Description
Technical field
The invention mainly relates to field of sensing technologies, refer in particular to a kind of sensor and its assembly method.
Background technology
It is higher and higher to the reliability requirement of sensor with the extensive use of sensor technology, and the lead skill of chip
Art is the key that then to influence sensor reliability.
Common gage system, lead plate is welded in the draw pin of down-lead bracket, then fills down-lead bracket and chip
With together.As shown in Figure 1, intensity and electric property to ensure solder joint, solder joint can protrude lead plate surface 0.8mm~
1.5mm, solder joint is between lead plate and chip, i.e. the difference in height of lead plate and chip at least 0.8mm, cause lead plate pad with
Chip bonding pad difference in height is big, lead is elongated, influences reliability.
Invention content
The technical problem to be solved in the present invention is that：For technical problem of the existing technology, the present invention provides one
The sensor that kind is simple and compact for structure, occupancy is small, wire length is short, functional reliability is high, and two kinds of assemblings are accordingly provided
The simple sensor assembly method of process.
In order to solve the above technical problems, technical solution proposed by the present invention is：
A kind of sensor, including draw pin, down-lead bracket, lead plate and chip, the down-lead bracket in hollow ring-type and
A bulge loop is provided on its inner wall, draw pin hole is provided on the bulge loop, the top in the draw pin hole is described filled with insulating layer
The draw pin hole location that down-lead bracket corresponds to bulge loop is provided with welding hole, and fairlead, institute are provided in the middle part of the down-lead bracket
State draw pin across the bulge loop draw pin hole and be inserted into after the welding hole of lead plate and weld, the lower end surface of the draw pin with
The lower surface flush of the lead plate, the chip pass through described draw close to the lead of the lower surface of the lead plate and chip
String holes and the upper surface of the lead plate are welded.
As a further improvement of the above technical scheme：
The lead plate is in contact with the bulge loop lower surface of the down-lead bracket.
The insulating layer is ceramic glaze.
The invention also discloses a kind of assembly methods of sensor, include the following steps：
S01, beginning, the draw pin hole top on the bulge loop of down-lead bracket inner wall, which fills insulating layer and is fixed on draw pin, draws
In pin hole；
S02, lead plate is assembled to inside down-lead bracket, the lower part of draw pin is inserted into the welding hole of lead plate and under it
End face and the lower surface flush of the lead plate, then mutually weld lead plate with draw pin, and solder joint is made to extend to draw pin hole
Lower part；
S03, chip and down-lead bracket are assembled, makes chip drawing on the lower surface of the lead plate, chip
Line after the fairlead of lead plate with the upper surface of lead plate then by welding.
In addition the present invention also discloses a kind of assembly method of sensor, include the following steps：
The lower part of draw pin is inserted into the welding hole of lead plate by S01, beginning, then will be drawn in the upper surface of lead plate
Line plate is mutually welded with draw pin, and ensures the lower face of draw pin and the lower surface flush of the lead plate；
S02, draw pin and lead plate are assembled in down-lead bracket, the draw pin is passed through on the bulge loop of down-lead bracket inner wall
Draw pin hole, and fill insulating layer in draw pin hole and fix draw pin；
S03, chip and down-lead bracket are assembled, makes chip drawing on the lower surface of the lead plate, chip
Line after the fairlead of lead plate with the upper surface of lead plate then by welding.
Compared with prior art, the advantage of the invention is that：
Sensor of the invention, only the top in draw pin hole fill insulating layer, and by between draw pin and lead plate into
Solder joint is extended to the lower part in draw pin hole during row welding, thus while firm welding between draw pin and lead plate is ensured,
Make the lower face of draw pin and the lower surface flush of lead plate, so as to make between chip and lead plate in close proximity to shortening and draw
The length of lead between line plate and chip improves the reliability of working sensor；In addition sensor of the invention is simple in structure
It is compact, occupy it is small.
Sensor of the invention assembly method equally has the advantages that described in as above sensor, and assembling process is simple.
Description of the drawings
Fig. 1 is the structure diagram of existing sensor.
Fig. 2 is the structure diagram of sensor of the invention.
Fig. 3 is down-lead bracket and draw pin installation diagram in sensor of the invention assembly method.
Fig. 4 is the draw pin of the present invention and lead plate assembling schematic diagram.
Fig. 5 is the chip of the present invention and lead plate assembling schematic diagram.
Figure label represents：1st, down-lead bracket；11st, bulge loop；12nd, draw pin hole；13rd, insulating layer；2nd, draw pin；3rd, lead plate；
31st, welding hole；32nd, fairlead；4th, chip；41st, lead.
Specific embodiment
Below in conjunction with Figure of description and specific embodiment, the invention will be further described.
As shown in Fig. 2, the sensor of the present embodiment, including draw pin 2, down-lead bracket 1, lead plate 3 and chip 4, lead branch
Frame 1 is wherein provided with more than one draw pin hole 12 in a bulge loop 11 is provided in hollow ring-type and its inner wall on bulge loop 11,
For wearing draw pin 2 and fixed draw pin 2, filled with insulating layer 13, insulating layer 13 is then used to fix draw pin 2 on the top in draw pin hole 12
And ensure that draw pin 2 insulate with down-lead bracket 1, wherein lead plate 3 is in contact with 11 lower surface of bulge loop of down-lead bracket 1, lead branch
Frame 1 corresponds to and is provided with welding hole 31 at 12 position of draw pin hole of bulge loop 11, and the middle part of down-lead bracket 1 is provided with fairlead 32, draws
Needle 2 passes through the draw pin hole 12 of bulge loop 11 and is inserted into after the welding hole 31 of lead plate 3 and welds together, and ensures after welding
The lower end surface of draw pin 2 and the lower surface flush of lead plate 3, chip 4 is against the lower surface of lead plate 3 and the lead of chip 4
41 pass through fairlead 32 and the upper surface of lead plate 3 to weld.Sensor of the invention, by the solder joint of draw pin 2 and lead plate 3 from drawing
The lower section of line plate 3 moves to the top of lead plate 3, corresponding to reserve certain space in the lower part in draw pin hole 12 to weld jail
Gu even if draw pin 2 does not stretch out lead plate 3, welding portion will not protrude 3 lower surface of lead plate, so as to make chip 4 and lead plate 3
Between in close proximity to（But it does not contact, to ensure insulating properties）, so as to make 41 length of lead between chip 4 and lead plate 3 most short,
Improve the reliability of working sensor；In addition it is simple and compact for structure, occupy it is small.
In the present embodiment, insulating layer 13 is ceramic glaze, for draw pin 2 and down-lead bracket 1 to be insulated；In addition draw pin 2 with
Lead plate 3, which welds, not only to be needed to ensure fixing, but also also needs to ensure the signal warp of conduction between the two, i.e. chip 4
Lead 41 is transferred to lead plate 3, then is transferred to draw pin 2 through lead plate 3, completes the transmission of signal.
In addition, in other embodiments, in order to ensure that the length of lead 41 shortens, it is possible to increase the size of lead plate 3 such as makes
The outer diameter of chip 4 is less than the internal diameter of bulge loop 11, and chip 4 will not have with draw pin 2 at this time any contact or directly fill chip 4
It fits in the lead plate 3 of lead plate 3, i.e. the upper surface of chip 4 and the upper surface flush of lead plate 3, can further shorten and draw
The length of line 41.
It is specific as follows the invention also discloses two embodiments of the assembly method of the sensor：
Embodiment one：
As shown in Figures 3 to 5, the assembly method of the sensor of the embodiment of the present invention, includes the following steps：
S01, beginning, 12 top of draw pin hole filling insulating layer 13 on the bulge loop 11 of 1 inner wall of down-lead bracket and by draw pin 2
It is fixed in draw pin hole 12；
S02, lead plate 3 is assembled to 1 inside of down-lead bracket and is in contact with the lower surface of down-lead bracket 1, at this time draw pin 2
Lower part be inserted into the welding hole 31 of lead plate 3 and its lower face and the lower surface flush of lead plate 3, then by lead plate
3 weld, and solder joint is made to extend to the lower part in draw pin hole 12 with 2 phase of draw pin, spot welding specifically can be used, in the lower surface of lead plate 3
It is welded, and welding fluid is stayed to the fixing for into the lower part to the top of lead plate 3, i.e. draw pin hole 12, ensureing welding, it is final to go back
The solder joint for ensureing 3 lower surface of lead plate is needed not protrude；
S03, chip 4 and down-lead bracket 1 are assembled, makes the lower surface of chip 4 and lead plate 3 in close proximity to chip 4
On lead 41 then by after the fairlead 32 of lead plate 3 with the upper surface of lead plate 3 weld, until into next step assembled
Journey.
Assembling of such method mainly for draw pin 2 and down-lead bracket 1 after fixed-type.
Embodiment two：
The assembly method of the sensor of the embodiment of the present invention, includes the following steps：
The lower part of draw pin 2 is inserted into the welding hole 31 of lead plate 3 by S01, beginning, then in the upper surface of lead plate 3
Lead plate 3 and 2 phase of draw pin are welded, and ensure the lower face of draw pin 2 and the lower surface flush of lead plate 3, such method can
Directly draw pin 2 and lead plate 3 are welded in the top of lead plate 3, solder joint can directly stay in the top of lead plate 3, ensure lead
3 lower surface of plate is concordant；
S02, draw pin 2 and lead plate 3 are assembled in down-lead bracket 1, lead plate 3 is contacted with the lower surface of bulge loop 11, is drawn
Needle 2 passes through the through-hole on the bulge loop 11 of 1 inner wall of down-lead bracket, and fills insulating layer 13 in through-hole and fix draw pin 2, and ensure
Draw pin 2 is not in contact with down-lead bracket 1；
S03, chip 4 and down-lead bracket 1 are assembled, makes the lower surface of chip 4 and lead plate 3 in close proximity to chip 4
On lead 41 then by after the fairlead 32 of lead plate 3 with the upper surface of lead plate 3 weld, into lower step assembling process.
The above is only the preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-described embodiment,
All technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art
For those of ordinary skill, several improvements and modifications without departing from the principles of the present invention should be regarded as the protection of the present invention
Range.
Claims (5)
1. a kind of sensor, including draw pin（2）, down-lead bracket（1）, lead plate（3）And chip（4）, the down-lead bracket（1）It is in
A bulge loop is provided on hollow ring-type and its inner wall（11）, the bulge loop（11）On be provided with draw pin hole（12）, feature exists
In the draw pin hole（12）Top be filled with insulating layer（13）, the down-lead bracket（1）Corresponding bulge loop（11）Draw pin hole
（12）Welding hole is provided at position（31）, the down-lead bracket（1）Middle part be provided with fairlead（32）, the draw pin（2）
Across the bulge loop（11）Draw pin hole（12）And it is inserted into lead plate（3）Welding hole（31）It afterwards and welds, the draw pin（2）
Lower end surface and the lead plate（3）Lower surface flush, the chip（4）Close to the lead plate（3）Lower surface
And chip（4）Lead（41）Across the fairlead（32）With the lead plate（3）Upper surface welding.
2. sensor according to claim 1, which is characterized in that the lead plate（3）With the down-lead bracket（1）It is convex
Ring（11）Lower surface is in contact.
3. sensor according to claim 1 or 2, which is characterized in that the insulating layer（13）For ceramic glaze.
4. a kind of assembly method of sensor, which is characterized in that include the following steps：
S01, beginning, in down-lead bracket（1）The bulge loop of inner wall（11）On draw pin hole（12）Fill insulating layer in top（13）It and will
Draw pin（2）It is fixed on draw pin hole（12）It is interior；
S02, by lead plate（3）It is assembled to down-lead bracket（1）Inside, draw pin（2）Lower part be inserted into lead plate（3）Welding hole
（31）Interior and its lower face and the lead plate（3）Lower surface flush, then by lead plate（3）With draw pin（2）Mutually weld,
And solder joint is made to extend to draw pin hole（12）Lower part；
S03, by chip（4）With down-lead bracket（1）It is assembled, makes chip（4）Close to the lead plate（3）Lower surface, core
Piece（4）On lead（41）Then pass through lead plate（3）Fairlead（32）Afterwards with lead plate（3）Upper surface welding.
5. a kind of assembly method of sensor, which is characterized in that include the following steps：
S01, beginning, by draw pin（2）Lower part be inserted into lead plate（3）Welding hole（31）It is interior, then in lead plate（3）It is upper
Surface is by lead plate（3）With draw pin（2）It mutually welds, and ensures draw pin（2）Lower face and the lead plate（3）Lower surface phase
Concordantly；
S02, by draw pin（2）And lead plate（3）It is assembled to down-lead bracket（1）It is interior, the draw pin（2）Across down-lead bracket（1）It is interior
The bulge loop of wall（11）On draw pin hole（12）, and in draw pin hole（12）Interior filling insulating layer（13）By draw pin（2）It is fixed；
S03, by chip（4）With down-lead bracket（1）It is assembled, makes chip（4）Close to the lead plate（3）Lower surface, core
Piece（4）On lead（41）Then pass through lead plate（3）Fairlead（32）Afterwards with lead plate（3）Upper surface welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510910249.0A CN105448876B (en) | 2015-12-10 | 2015-12-10 | A kind of sensor and its assembly method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510910249.0A CN105448876B (en) | 2015-12-10 | 2015-12-10 | A kind of sensor and its assembly method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105448876A CN105448876A (en) | 2016-03-30 |
| CN105448876B true CN105448876B (en) | 2018-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510910249.0A Active CN105448876B (en) | 2015-12-10 | 2015-12-10 | A kind of sensor and its assembly method |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106546363B (en) * | 2016-09-29 | 2019-09-20 | 中国电子科技集团公司第四十八研究所 | A kind of diaphragm pressure sensor and its packaging method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2556622Y (en) * | 2002-06-25 | 2003-06-18 | 沈阳仪器仪表工艺研究所 | To tube base type pressure sensor |
| CN2718545Y (en) * | 2004-07-06 | 2005-08-17 | 浙江三花制冷集团有限公司 | Integrated assembling pressure sensor apparatus |
| CN202382900U (en) * | 2011-11-17 | 2012-08-15 | 中国电子科技集团公司第四十八研究所 | Absolute pressure packaging structure for strain pressure transducer and strain pressure transducer |
| CN102928150A (en) * | 2012-10-26 | 2013-02-13 | 中国电子科技集团公司第四十八研究所 | Leadless packaged metal film pressure sensor and preparation method thereof |
| CN204088318U (en) * | 2014-08-19 | 2015-01-07 | 益海芯电子技术江苏有限公司 | Optical induction device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005062783A1 (en) * | 2005-12-28 | 2007-07-05 | Robert Bosch Gmbh | Electronic module for controlling electric motor, has upper substrate comprising smaller base surface than base body of lower substrate, and power component fastened to lower substrate at outer side of outer periphery of upper substrate |
-
2015
- 2015-12-10 CN CN201510910249.0A patent/CN105448876B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2556622Y (en) * | 2002-06-25 | 2003-06-18 | 沈阳仪器仪表工艺研究所 | To tube base type pressure sensor |
| CN2718545Y (en) * | 2004-07-06 | 2005-08-17 | 浙江三花制冷集团有限公司 | Integrated assembling pressure sensor apparatus |
| CN202382900U (en) * | 2011-11-17 | 2012-08-15 | 中国电子科技集团公司第四十八研究所 | Absolute pressure packaging structure for strain pressure transducer and strain pressure transducer |
| CN102928150A (en) * | 2012-10-26 | 2013-02-13 | 中国电子科技集团公司第四十八研究所 | Leadless packaged metal film pressure sensor and preparation method thereof |
| CN204088318U (en) * | 2014-08-19 | 2015-01-07 | 益海芯电子技术江苏有限公司 | Optical induction device |
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| Publication number | Publication date |
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| CN105448876A (en) | 2016-03-30 |
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