CN207938589U - Has the semiconductor package of adapter cable - Google Patents
Has the semiconductor package of adapter cable Download PDFInfo
- Publication number
- CN207938589U CN207938589U CN201820519162.XU CN201820519162U CN207938589U CN 207938589 U CN207938589 U CN 207938589U CN 201820519162 U CN201820519162 U CN 201820519162U CN 207938589 U CN207938589 U CN 207938589U
- Authority
- CN
- China
- Prior art keywords
- adapter cable
- lead
- chip
- semiconductor package
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
The utility model discloses a kind of semiconductor packages of tool adapter cable, it includes lead frame, chip, plural adapter cable and an at least lead, the lead frame includes bearing seat and several pins, the chip is installed on the bearing seat, adapter cable described in plural item is set to the top surface of the chip, the top surface of the chip is additionally provided with a plurality of pad zones, and the lead is electrically connected between the pin and adapter cable；And/or the lead is electrically connected between the adapter cable and pad zone；And/or the lead is electrically connected between the pad zone and pin.Plural adapter cable can be designed as a variety of different shapes in the utility model, then be set to the top surface of the chip, thereby shorten the distance of lead connection, reduce due to wire breaking or contact with each other short-circuit and cause to seal yield decreasing hazard rate.
Description
Technical field
The utility model is related to a kind of semiconductor package, more particularly to a kind of semiconductor packages knot of tool adapter cable
Structure belongs to this conductor package structure technical field.
Background technology
As shown in Figure 1, for the schematic diagram of existing emitted semiconductor assembly package structure comprising lead frame 11, chip 12, at least
There is a bearing seat 111 and several pins 112, the chip 12 to be set on the bearing seat 111 for one lead 13, the lead frame 11,
Each 13 both ends of lead point are connected to pad zone opposite on the pin 112 and the chip 12.Follow-up packaging operation can utilize
Adhesive body is coated on aforementioned components, only exposes 112 part Naked of the pin.However in this structure, due to 12 length of lead
It is long, it in manufacture procedure of adhesive, is easy to happen and caves in, or the colloid poured into is pulled apart, cause the situation of electrical open circuit to occur, lead
Encapsulation yield is caused to decline.
Utility model content
It is existing to overcome the main purpose of the utility model is to provide a kind of semiconductor package of tool adapter cable
The deficiency of technology.
For the aforementioned purpose of utility model of realization, the technical solution adopted in the utility model includes：
The utility model embodiment provides a kind of semiconductor package of tool adapter cable comprising lead frame, core
Piece, plural adapter cable and an at least lead, the lead frame include bearing seat and several pins, the chip installation
In on the bearing seat, adapter cable described in plural item is set to the top surface of the chip, and the top surface of the chip is additionally provided with
A plurality of pad zones, the lead are electrically connected between the pin and adapter cable；And/or the lead is electrically connected
Between the adapter cable and pad zone；And/or the lead is electrically connected between the pad zone and pin.
Further, the adapter cable is straight line and/or camber line, and without directly between adjacent two adapter cables
Contact, to avoid short circuit condition occurs.
Further, the adapter cable is formed by connecting by a plurality of line segment, and adjacent and connection two lines section is not same
On one straight line.
Preferably, the line segment is straight line and/or camber line.
Further, dielectric adhesion layer is additionally provided between the adapter cable and the top surface of chip.
Compared with prior art, include the advantages of the utility model：
(1) plural adapter cable can be designed as a variety of different shapes, then be set to the top surface of the chip, thereby shorten
The distance of lead connection reduces due to wire breaking or contacts with each other short-circuit and cause to seal yield decreasing hazard rate.
(2) it can be shortened using length due to lead, lead usage amount can be reduced, save lead material cost；
(3) plural adapter cable can adopt etching mode making, form the chip top surface, reduce processing cost.
Description of the drawings
Fig. 1 is the structural schematic diagram of existing semiconductor assembly structure；
Fig. 2 is the vertical view of the semiconductor package of tool adapter cable in the utility model first embodiment；
Fig. 3 is the vertical structure schematic diagram for the semiconductor package that the utility model first embodiment has adapter cable；
Fig. 4 is the vertical view of lead frame, chip and adapter cable in the utility model second embodiment.
Reference sign：Lead frame -11, bearing seat -111, pin -112, chip -12, lead -13, lead frame -2,
Bearing seat -21, pin -22, chip -3, pad zone -31, adapter cable -4, adapter cable -4a, line segment -41, line segment -42, line
Section -43, lead -5, adhesion layer-A.
Specific implementation mode
In view of deficiency in the prior art, inventor is able to propose that this practicality is new through studying for a long period of time and largely putting into practice
The technical solution of type.The technical solution, its implementation process and principle etc. will be further explained as follows.
The utility model embodiment provides a kind of semiconductor package of tool adapter cable comprising lead frame, core
Piece, plural adapter cable and an at least lead, the lead frame include bearing seat and several pins, the chip installation
In on the bearing seat, adapter cable described in plural item is set to the top surface of the chip, and the top surface of the chip is additionally provided with
A plurality of pad zones, the lead are electrically connected between the pin and adapter cable；And/or the lead is electrically connected
Between the adapter cable and pad zone；And/or the lead is electrically connected between the pad zone and pin.
Further, the adapter cable is straight line and/or camber line, and without directly between adjacent two adapter cables
Contact, to avoid short circuit condition occurs.
Further, the adapter cable is formed by connecting by a plurality of line segment, and adjacent and connection two lines section is not same
On one straight line.
Preferably, the line segment is straight line and/or camber line.
Further, dielectric adhesion layer is additionally provided between the adapter cable and the top surface of chip.
The technical solution, its implementation process and principle etc. will be further explained in conjunction with attached drawing as follows.
First embodiment
As shown in Figures 2 and 3, it is respectively the vertical view and vertical structure schematic diagram of the utility model.It is led with switching
The semiconductor package of line, including a lead frame 2, a chip 3, plural adapter cable 4 and an at least lead 5.
The lead frame 2 includes a bearing seat 21 and a plurality of pins 22, which is the placement place of the chip 3.
A plurality of pins 22 are distributed in around the bearing seat 21, and the pin 22 can be contacted with bearing seat 21 in initial processing procedure, but follow-up
After encapsulation is cut, a plurality of pins 22 and the bearing seat 21 can't contact with each other each other.
The chip 3 is set on the bearing seat 21, and the top surface of chip is insulating layer, but still with the weld pad of a plurality of Naked dew
Area 31.There is line related to be connected with the circuit inside chip 3 for the pad zone 31.The adapter cable 4 is set to the chip 3 top
On the insulating layer of face.The adapter cable 4 can adopt etching mode making, to reduce processing cost.The utility model is to utilize the switching
Conducting wire 4 shortens the use length for the lead 5 for being responsible for being electrically connected.
The plural item adapter cable 4 is between each other not in contact with to avoid short circuit in the present embodiment.In addition the switching is led
Line 4 is in the present embodiment straight line, but is not limited thereto or camber line.
Furthermore in the present embodiment between plural item adapter cable 4 and the 3 top surface insulating layer of chip, it is equipped with non-conductive
Adhesion layer A, adhesion layer A can be the glutinous brilliant material (Die Attach Film, DAF) of film or insulation gluing etc., it is ensured that plural number
The item adapter cable 4 can be closely attached on the 3 top surface insulating layer of chip.
In addition, the lead 5 is responsible for the plain conductor being electrically connected.The lead 5 is responsible for being electrically connected the pin 22 and being somebody's turn to do
The adapter cable 4 of adapter cable 4 and the pad zone 31 or the pad zone 31 and 22 3 kinds of the pin are wherein at least
It is a kind of.Since the adapter cable 4 is distributed in 3 top surface of chip, relatively can directly reduce by the connection of pad zone 31 in contrast
Answer the distance of pin 22.
Second embodiment
As shown in figure 4, adapter cable 4a can be variously-shaped, such as adapter cable 4a is alternatively non-linear shape, such as
Shown in Fig. 4, adapter cable 4a includes a plurality of line segments 41,42,43, and adjacent and connection two lines section does not exist always same
Line, as shown in the figure, the line segment 41 of adapter cable 4a, line segment 42 and line segment 43 be connected after be in ㄈ fonts.Certain line segment 41,
42, at least one shape such as 43 or straight line, camber line is constituted.
In summary, the semiconductor package of the utility model tool adapter cable, is to utilize to be set to chip
The plural adapter cable of top surface, shortens the length for subsequently using lead, has following several specific effects：
(1) plural adapter cable can be designed as a variety of different shapes, then be set to the top surface of the chip, thereby shorten
The distance of lead connection reduces due to wire breaking or contacts with each other short-circuit and cause to seal yield decreasing hazard rate；
(2) it can be shortened using length due to lead, lead usage amount can be reduced, save lead material cost；
(3) plural adapter cable can adopt etching mode making, form the chip top surface, reduce processing cost.
It should be appreciated that above-described embodiment is only the technical concepts and features for illustrating the utility model, it is ripe its object is to allow
The personage for knowing technique can understand the content of the utility model and implement according to this, can not limit the utility model with this
Protection domain.It is all according to equivalent change or modification made by the spirit of the present invention essence, should all cover in the utility model
Protection domain it is interior.
Claims (6)
1. a kind of semiconductor package of tool adapter cable, it is characterised in that led including lead frame, chip, plural item switching
Line and at least a lead, the lead frame include bearing seat and several pins, and the chip is installed on the bearing seat,
Adapter cable described in plural item is set to the top surface of the chip, and the top surface of the chip is additionally provided with a plurality of pad zones, institute
Lead is stated to be electrically connected between the pin and adapter cable；And/or the lead be electrically connected at the adapter cable with
Between pad zone；And/or the lead is electrically connected between the pad zone and pin.
2. having the semiconductor package of adapter cable according to claim 1, it is characterised in that：Adjacent two switchings
Nothing is in direct contact between conducting wire.
3. having the semiconductor package of adapter cable according to claim 1, it is characterised in that：The adapter cable is straight
Line and/or camber line.
4. having the semiconductor package of adapter cable according to claim 1, it is characterised in that：The adapter cable is by more
Line segment is formed by connecting, and adjacent and connection two lines section is not on the same line.
5. having the semiconductor package of adapter cable according to claim 4, it is characterised in that：The line segment is straight line
And/or camber line.
6. having the semiconductor package of adapter cable according to claim 1, it is characterised in that：The adapter cable and core
Dielectric adhesion layer is additionally provided between the top surface of piece.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820519162.XU CN207938589U (en) | 2018-04-12 | 2018-04-12 | Has the semiconductor package of adapter cable |
| TW107205108U TWM565878U (en) | 2018-04-12 | 2018-04-19 | Semiconductor package structure with adapting wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820519162.XU CN207938589U (en) | 2018-04-12 | 2018-04-12 | Has the semiconductor package of adapter cable |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207938589U true CN207938589U (en) | 2018-10-02 |
Family
ID=63656677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820519162.XU Active CN207938589U (en) | 2018-04-12 | 2018-04-12 | Has the semiconductor package of adapter cable |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207938589U (en) |
| TW (1) | TWM565878U (en) |
-
2018
- 2018-04-12 CN CN201820519162.XU patent/CN207938589U/en active Active
- 2018-04-19 TW TW107205108U patent/TWM565878U/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWM565878U (en) | 2018-08-21 |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |