CN105437088A - Diamond grinding wheel containing resin binder - Google Patents
Diamond grinding wheel containing resin binder Download PDFInfo
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- CN105437088A CN105437088A CN201410438334.7A CN201410438334A CN105437088A CN 105437088 A CN105437088 A CN 105437088A CN 201410438334 A CN201410438334 A CN 201410438334A CN 105437088 A CN105437088 A CN 105437088A
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- grinding wheel
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- diamond grinding
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- whisker
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Abstract
The invention discloses a diamond grinding wheel containing a resin binder and belongs to the field of super-hard grinding materials. The diamond grinding wheel is composed of the resin binder, grinding tools and other additives. The diamond grinding wheel containing the resin binder is characterized in that the grinding materials include one or more ceramic whisker material, and the ceramic whisker materials are in lap joint naturally in a base body to form a continuous network. The grinding materials are prepared from, by weight, 50%-80% of diamond grinding materials and 20%-50% of silicon carbide crystal whiskers. According to the formula of the grinding wheel, the grinding wheel is prepared from, by mass, 55%-68% of the grinding materials, 30%-40% of the resin binder and 2%-5% of the additives. According to the diamond grinding wheel containing the resin binder, original added silicon carbide particles are replaced by the silicon carbide crystal whiskers in the grinding materials, so that the characteristics of original grinding materials added with the silicon carbide particles that the abrasion resistance is good, and the cost is low are maintained, and meanwhile the heat conductivity of the grinding wheel is improved.
Description
Technical field
The present invention relates to a kind of resin anchoring agent diamond grinding wheel, belong to grinding tool abrasive grinding technical field.
Background technology
Resin anchoring agent diamond grinding wheel realizes efficient, energy-conservation, high-precision and that automation grinding is indispensable instrument.Resin anchoring agent diamond grinding wheel has the advantages such as self-sharpening is good, grinding force is little, but, the poor heat resistance of resin, in grinding process, the heat of high temperature that grinding produces runs up to a certain degree, and resin easily carbonizes, decompose, cause Grain Falling Off, reduce service life of emery wheel and surface accuracy, add resin wheel mechanical property and shape retention poor, workpiece surface quality is affected.
The Chinese invention of the patent No. 20120267405.2 discloses a kind of diamond-resin grinding wheel and preparation method thereof, is characterized in adding ceramic material in filler, makes abrasive material difficult drop-off, also adds metal dust iron powder simultaneously, makes resin matrix rapid heat dissipation; The Chinese invention of the patent No. 20120267147.8 discloses a kind of Polyimide Resin Bonded Diamond Grinding Wheel and preparation method thereof, it adds 2 ~ 5 parts of copper powders in bonding agent, rapid heat dissipation, is conducive to dissipating emery wheel liberated heat in cutting process fast, plays the effect reducing cutting temperature.At present, the heat resistance improving resin anchoring agent diamond grinding wheel is mainly realized by the heat resistance improving resinoid bond, and improve emery wheel heat resistance by the method replacing original ceramic particle with high heat-conducting ceramic fiber have no report.
Summary of the invention
The present invention is in order to solve the problem of above-mentioned resin diamond grinding wheel poor heat resistance, propose a kind of new type resin anchoring agent diamond grinding wheel, the original silicon-carbide particle added is replaced by adding appropriate silicon carbide whisker in diamond abrasive, whisker naturally overlaps in the base and forms connected network, define the high speed passage of heat of heat, not only maintain the features such as the wearability originally adding silicon-carbide particle is good, cost is low, simultaneously adding due to silicon carbide whisker, improve the heat conductivility of emery wheel.
In order to reach foregoing invention object, the technical solution used in the present invention is: a kind of new type resin anchoring agent diamond grinding wheel, is made up of abrasive material, resinoid bond and other additives.Wherein, described abrasive material is made up of diamond abrasive and ceramic whisker, and each constituent mass ratio is: diamond abrasive 50 ~ 80%, ceramic whisker 20 ~ 50%, whisker is overlapped to form contiguous network in the base naturally.
Wherein, described ceramic whisker material selection silicon carbide whisker, aluminium nitride whisker or its mixture.
Wherein, the formula of described emery wheel is (mass percent): abrasive material 55 ~ 68%, resinoid bond 30 ~ 40%, additive 2 ~ 5%.
Wherein, described ceramic whisker draw ratio is 10 ~ 30.
Wherein, the preferred polyimide resin bonding agent of described resinoid bond.
Resin anchoring agent diamond grinding wheel of the present invention, using diamond abrasive and silicon carbide whisker as the main abrasive material of emery wheel, silicon-carbide particle is replaced with silicon carbide whisker, whisker overlaps in the base naturally, forms the network channel of high speed heat conduction, so the present invention's grinding heat energy of output when grinding work piece is derived rapidly, the workpiece that grinding goes out produces without burn, crackle, not only maintain silicon-carbide particle abrasive material wearability good, the advantage that cost is low, its thermal conductivity improves greatly simultaneously.
Detailed description of the invention
Embodiment 1
Take polyimide resin powder 60 parts, copper powder 25 parts, oxide powder and zinc 7 parts, iron oxide red 5 parts, calcium oxide powder 3 parts, mixing 2h in batch mixer; Take the diamond abrasive 50 parts that granularity is 170/200, draw ratio is the aluminium nitride whisker 50 parts of 10, mixes 1h in batch mixer; Take 40 parts, the bonding agent powder mixed, 55 parts, the abrasive material mixed, active carbon 2 parts, furfuryl alcohol 3 parts, mixing 1h in batch mixer.
By atoleine uniform application at molding surface, pour appropriate molding mass into and shakeout, making molding mass thickness even.Mould is put into thermoforming machine, is pressurized to 28MPa, at 215 DEG C of insulation 1h, naturally cool.Take out mould, the on a glass demoulding; The emery wheel of forming is put into baking oven, at 230 DEG C of insulation 1h, naturally cools.The post processing such as to add, put the first edge on a knife or a pair of scissors through machine after, obtain the resin anchoring agent diamond grinding wheel that heat resistance is good.
Embodiment 2
Take polyimide resin powder 55 parts, copper powder 30 parts, oxide powder and zinc 6 parts, iron oxide red 5 parts, calcium oxide powder 4 parts, mixing 2h in batch mixer; Take the diamond abrasive 60 parts that granularity is 170/200, draw ratio is the silicon carbide whisker 40 parts of 15, mixes 1h in batch mixer; Take 37 parts, the bonding agent powder mixed, 60 parts, the abrasive material mixed, furfuryl alcohol 3 parts, mixing 1h in batch mixer.
By atoleine uniform application at molding surface, pour appropriate molding mass into and shakeout, making molding mass thickness even.Mould is put into thermoforming machine, is pressurized to 32MPa, at 215 DEG C of insulation 1h, naturally cool.Take out mould, the on a glass demoulding; The emery wheel of forming is put into baking oven, at 230 DEG C of insulation 1h, naturally cools.The post processing such as to add, put the first edge on a knife or a pair of scissors through machine after, obtain the resin anchoring agent diamond grinding wheel that heat resistance is good.
Embodiment 3
Take polyimide resin powder 40 parts, copper powder 44 parts, oxide powder and zinc 8 parts, iron oxide red 6 parts, calcium oxide powder 2 parts, mixing 2h in batch mixer; Take the diamond abrasive 70 parts that granularity is 170/200, draw ratio is the silicon carbide whisker 30 parts of 20, mixes 1h in batch mixer; Take 35 parts, the bonding agent powder mixed, 62 parts, the abrasive material mixed, furfuryl alcohol 3 parts, mixing 1h in batch mixer.
By atoleine uniform application at molding surface, pour appropriate molding mass into and shakeout, making molding mass thickness even.Mould is put into thermoforming machine, is pressurized to 35MPa, at 215 DEG C of insulation 1h, naturally cool.Take out mould, the on a glass demoulding; The emery wheel of forming is put into baking oven, at 230 DEG C of insulation 1h, naturally cools.The post processing such as to add, put the first edge on a knife or a pair of scissors through machine after, obtain the resin anchoring agent diamond grinding wheel that heat resistance is good.
Embodiment 4
Take polyimide resin powder 30 parts, copper powder 55 parts, oxide powder and zinc 7 parts, iron oxide red 5 parts, calcium oxide powder 3 parts, mixing 2h in batch mixer; Take the diamond abrasive 80 parts that granularity is 170/200, draw ratio is the silicon carbide whisker 20 parts of 30, mixes 1h in batch mixer; Take 30 parts, the bonding agent powder mixed, 66 parts, the abrasive material mixed, Cortex walnut 2 parts, furfuryl alcohol 2 parts, mixing 1h in batch mixer.
By atoleine uniform application at molding surface, pour appropriate molding mass into and shakeout, making molding mass thickness even.Mould is put into thermoforming machine, is pressurized to 38MPa, at 215 DEG C of insulation 1h, naturally cool.Take out mould, the on a glass demoulding; The emery wheel of forming is put into baking oven, at 230 DEG C of insulation 1h, naturally cools.The post processing such as to add, put the first edge on a knife or a pair of scissors through machine after, obtain the resin anchoring agent diamond grinding wheel that heat resistance is good.
Above embodiment is only be described the specific embodiment of the present invention; not scope of the present invention is limited; those skilled in the art can also make multiple amendment on the basis of existing technology; as selected other basic bonding agents such as phenolic resins; other ceramic whiskers such as Ceramics fiber and CBN etc.; under not departing from the present invention and designing the prerequisite of spirit; the various modification that the common engineers and technicians in this area make technical scheme of the present invention and improvement, all should fall into the protection domain that claims of the present invention are determined.
Claims (5)
1. a new type resin anchoring agent diamond grinding wheel, be made up of abrasive material, resinoid bond and other additives, it is characterized in that, described abrasive material is made up of diamond abrasive and ceramic whisker, each constituent mass ratio is: diamond abrasive 50 ~ 80%, ceramic whisker 20 ~ 50%, whisker is overlapped to form contiguous network in the base naturally.
2. resin anchoring agent diamond grinding wheel according to claim 1, is characterized in that, described ceramic whisker material selection silicon carbide whisker, aluminium nitride whisker or its mixture.
3. resin anchoring agent diamond grinding wheel according to claim 1, is characterized in that, the formula of emery wheel is (mass percent): abrasive material 55 ~ 68%, resinoid bond 30 ~ 40%, additive 2 ~ 5%.
4. resin-bonded skive according to claim 2, is characterized in that, described ceramic whisker draw ratio is 10 ~ 30.
5. resin anchoring agent diamond grinding wheel according to claim 1, is characterized in that, the preferred polyimide resin bonding agent of described resinoid bond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410438334.7A CN105437088A (en) | 2014-08-29 | 2014-08-29 | Diamond grinding wheel containing resin binder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410438334.7A CN105437088A (en) | 2014-08-29 | 2014-08-29 | Diamond grinding wheel containing resin binder |
Publications (1)
| Publication Number | Publication Date |
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| CN105437088A true CN105437088A (en) | 2016-03-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201410438334.7A Pending CN105437088A (en) | 2014-08-29 | 2014-08-29 | Diamond grinding wheel containing resin binder |
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| CN (1) | CN105437088A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106914829A (en) * | 2017-04-20 | 2017-07-04 | 郑州磨料磨具磨削研究所有限公司 | A kind of high self-sharpening resin bonding agent diamond coreless grinding wheel and preparation method thereof |
| CN109227419A (en) * | 2018-09-20 | 2019-01-18 | 贵州荣清工具有限公司 | The major diameter manufacturing method that integrally ultra-thin resin-diamond is sliced |
| CN111015529A (en) * | 2020-01-09 | 2020-04-17 | 王健 | Resin grinding wheel and preparation method thereof |
| CN111037479A (en) * | 2019-12-30 | 2020-04-21 | 无锡市星火金刚石工具有限公司 | Grinding wheel for processing PCD blade |
| CN112223131A (en) * | 2020-11-02 | 2021-01-15 | 惠州市新科磨具有限公司 | Wear-resistant sheet resin cutting sheet and preparation method thereof |
| CN115044842A (en) * | 2021-06-24 | 2022-09-13 | 珠海亿特立新材料有限公司 | Production system for preparing high-specific-rigidity aluminum silicon carbide structural part |
| CN115536416A (en) * | 2022-08-28 | 2022-12-30 | 西北工业大学 | High-temperature high-strength high-density SiC/SiC composite material and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06206166A (en) * | 1993-01-11 | 1994-07-26 | Sumitomo Durez Co Ltd | Heat-resistant resin-bonded grinding wheel |
| CN1623731A (en) * | 2003-12-05 | 2005-06-08 | 浙江工业大学 | Whisker-shaped abrasive emery cutter |
| CN102513944A (en) * | 2011-12-29 | 2012-06-27 | 云南光电辅料有限公司 | Resin-bonded grinding tool for processing sapphire crystals and preparation method for resin-bonded grinding tool |
| CN103086733A (en) * | 2013-01-16 | 2013-05-08 | 汕头大学 | AlN whisker/Al2O3 ceramic matrix composite plate substrate and preparation process thereof |
-
2014
- 2014-08-29 CN CN201410438334.7A patent/CN105437088A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06206166A (en) * | 1993-01-11 | 1994-07-26 | Sumitomo Durez Co Ltd | Heat-resistant resin-bonded grinding wheel |
| CN1623731A (en) * | 2003-12-05 | 2005-06-08 | 浙江工业大学 | Whisker-shaped abrasive emery cutter |
| CN102513944A (en) * | 2011-12-29 | 2012-06-27 | 云南光电辅料有限公司 | Resin-bonded grinding tool for processing sapphire crystals and preparation method for resin-bonded grinding tool |
| CN103086733A (en) * | 2013-01-16 | 2013-05-08 | 汕头大学 | AlN whisker/Al2O3 ceramic matrix composite plate substrate and preparation process thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106914829A (en) * | 2017-04-20 | 2017-07-04 | 郑州磨料磨具磨削研究所有限公司 | A kind of high self-sharpening resin bonding agent diamond coreless grinding wheel and preparation method thereof |
| CN106914829B (en) * | 2017-04-20 | 2019-04-12 | 郑州磨料磨具磨削研究所有限公司 | A kind of high self-sharpening resin bonding agent diamond coreless grinding wheel and preparation method thereof |
| CN109227419A (en) * | 2018-09-20 | 2019-01-18 | 贵州荣清工具有限公司 | The major diameter manufacturing method that integrally ultra-thin resin-diamond is sliced |
| CN111037479A (en) * | 2019-12-30 | 2020-04-21 | 无锡市星火金刚石工具有限公司 | Grinding wheel for processing PCD blade |
| CN111015529A (en) * | 2020-01-09 | 2020-04-17 | 王健 | Resin grinding wheel and preparation method thereof |
| CN111015529B (en) * | 2020-01-09 | 2021-06-18 | 王健 | Resin grinding wheel |
| CN112223131A (en) * | 2020-11-02 | 2021-01-15 | 惠州市新科磨具有限公司 | Wear-resistant sheet resin cutting sheet and preparation method thereof |
| CN115044842A (en) * | 2021-06-24 | 2022-09-13 | 珠海亿特立新材料有限公司 | Production system for preparing high-specific-rigidity aluminum silicon carbide structural part |
| CN115536416A (en) * | 2022-08-28 | 2022-12-30 | 西北工业大学 | High-temperature high-strength high-density SiC/SiC composite material and preparation method thereof |
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Application publication date: 20160330 |
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