CN105436065B - A kind of preparation method of the ultrasonic face battle array probe of ranks addressing - Google Patents
A kind of preparation method of the ultrasonic face battle array probe of ranks addressing Download PDFInfo
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- CN105436065B CN105436065B CN201510817970.5A CN201510817970A CN105436065B CN 105436065 B CN105436065 B CN 105436065B CN 201510817970 A CN201510817970 A CN 201510817970A CN 105436065 B CN105436065 B CN 105436065B
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- 239000000523 sample Substances 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
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- 238000000034 method Methods 0.000 claims abstract description 17
- 239000003822 epoxy resin Substances 0.000 claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 238000004544 sputter deposition Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
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- 230000006872 improvement Effects 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 240000000233 Melia azedarach Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
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- 230000009286 beneficial effect Effects 0.000 description 1
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- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000003759 clinical diagnosis Methods 0.000 description 1
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- 238000005538 encapsulation Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
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- 244000144985 peep Species 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
- B06B2201/50—Application to a particular transducer type
- B06B2201/55—Piezoelectric transducer
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
The invention discloses a kind of preparation method of the ultrasonic face battle array probe of ranks addressing, this method comprises the following steps：1) piezoelectric patches of rectangular shape is chosen；2) upper overturning electrode is plated on piezoelectric patches, last layer electrode is plated respectively in two sides in the piezoelectric patches lower surface both sides parallel with upper surface and piezoelectric patches, and these electrode mutual conductions 3) lower surface of piezoelectric patches is pasted onto on backing, then carry out first time cutting along the direction vertical with lateral electrode in the upper surface of piezoelectric patches；4) fill epoxide-resin glue respectively in every grooving, and the position that there is epoxide-resin glue the upper surface of piezoelectric patches is polished；5) plate the target of last layer rectangular shape to form Top electrode in the upper surface of piezoelectric patches；6) secondary cut is carried out to Top electrode and piezoelectric patches at the position for being covered with Top electrode；7) the first flexible PCB is pasted onto on piezoelectric patches.The inventive method technique is simple, and easy to operate, the probe performance of manufacture is good.
Description
Technical field
The invention belongs to ultrasonic transducer field, more particularly, to the preparation technology and Lian of a kind of ultrasonic face battle array probe
Connect method.
Background technology
Ultrasonic transducer is the device for realizing acoustical signal and electric signal conversion.According to its structure, can be divided into it is one-dimensional, two
Dimension, annular array.Wherein, the ultrasonic transducer (face battle array probe) of two-dimensional array structure can realize 3-D supersonic imaging, face
There is good application prospect in the fields such as bed medical science.At present, with constantly overcritical, the system of face battle array probe to image quality and precision
It is standby also to face the challenge, it is mainly reflected at following 2 points：(1) growth requirement of high frequency, face battle array probe increases per one-dimensional array element number
Plus, exponentially formula increases its total array element number, moreover, array element spacing is inversely proportional with centre frequency, has reached tens micron orders
Not；(2) in clinical diagnosis, it is desirable to which ultrasonic probe is as small as possible, it is easy to implement in ultrasound and peeps.In general, face battle array probe institute
The high frequency to be met, miniature requirement, in specifically design preparation process, be embodied in that array element number increases, array element diminishes,
In terms of spacing narrows, this has reached physics limit prepared by present technique gradually.Preparing high frequency ultrasound probe at present
Research also in the exploratory stage, propose that a simple and effective technological process is a job highly significant.
Ranks addressing face battle array, to each array address, each array element is controlled so as to reach by the index of row and column
Purpose.Show through various theoretical researches and simulation result, the performance of ranks addressing face battle array almost can be suitable with its specification
The performance of ordinary two dimensional face battle array is comparable, and by with the passage of external circuit (channel) number from N22N is reduced to, it is significantly simple
The complexity prepared is changed.At present apparently, this is a kind of feasible solution, but in actual preparation process, is also existed
Problems.Such as, related researcher has designed and produced double-deck orthogonal one-dimensional array to realize that ranks are addressed,
But research show spacing between two layers must very little, if worked in water, can have the two and separate, so fail it is hidden
Suffer from.
The content of the invention
For the disadvantages described above or Improvement requirement of prior art, visited the invention provides a kind of ultrasonic face battle array of ranks addressing
The preparation method of head, its technological process is simple, and connection is reliable.
To achieve the above object, it is proposed, according to the invention, a kind of preparation method of the ultrasonic face battle array probe addressed there is provided ranks,
Characterized in that, this method comprises the following steps：
1) piezoelectric patches of rectangular shape is chosen, wherein, the length on the piezoelectric patches parallel to the rib of x-axis is L1,
The length parallel to the rib of y-axis is L thereon2, the length parallel to the rib of z-axis is L thereon3, and 200≤L3≤400μ
m；
2) hearth electrode of last layer rectangular shape is plated in the lower surface of piezoelectric patches, then in the leading flank and rear side of piezoelectric patches
The lateral electrode of last layer rectangular shape is plated in face respectively, wherein each lateral electrode is contacted with hearth electrode, the hearth electrode and two
Lateral electrode collectively forms a U-shaped structure, and this U-shaped structure covers the complete of the piezoelectric patches lower surface, leading flank and trailing flank
Portion position, then the termination electrode of one layer of rectangular shape is plated respectively in the front-end and back-end of piezoelectric patches upper surface, wherein each end electricity
Pole is contacted with the lateral electrode of respective side respectively and the length on each termination electrode parallel to the rib of x-axis is L1, and this two
Individual termination electrode is parallel to each other, and the hearth electrode, two lateral electrodes and two termination electrodes collectively form bottom electrode；
3) by step 2) the lower surface of hearth electrode be pasted onto on backing, then the upper surface of piezoelectric patches along and lateral electrode
Vertical direction carries out first time cutting, wherein the length direction of every first grooving is each parallel to y-axis and length is L2、
Width is 40~60 μm, every first grooving run through the termination electrode and the piezoelectric patches, adjacent two the first groovings it
Between form the first array element, and the width of each first array element is 150~200 μm；
4) fill epoxide-resin glue respectively in every first grooving, and there is into epoxide-resin glue the upper surface of piezoelectric patches
Position is polished；
5) plate the target of last layer rectangular shape to form Top electrode, the Top electrode in the upper surface of piezoelectric patches
There is spacing with every termination electrode, and thereon parallel to x-axis rib length L4=L1, thereon parallel to the rib of z-axis
Length is L5；
6) secondary cut is carried out to Top electrode and piezoelectric patches at the position for being covered with Top electrode, cut so as to cut out a plurality of second
Groove, wherein the length direction of every second grooving is each parallel to x-axis and its length L6=L1, width be 40~60 μm, often
The depth of the grooving of bar second is L7And L5＜ L7＜ L5+L3, the second array element is formed between adjacent two the second groovings, and often
The width of individual second array element is 150~200 μm；
7) the first flexible PCB is pasted onto on piezoelectric patches, and make printed circuit passage on the first flexible PCB with
The first array element correspondence on piezoelectric patches, then the second flexible PCB is pasted onto on piezoelectric patches, and make on the second flexible PCB
Printed circuit passage it is corresponding with the second array element on piezoelectric patches, so as to form ultrasonic face battle array probe.
Preferably, wherein, described piezoelectric patches is made of lead base piezoceramic material.
Preferably, the piezoelectric patches is made of PZT-5H.
Preferably, step 5) in the material of Top electrode that is plated be gold.
Preferably, step 5) the middle upper surface that the Top electrode is plated in piezoelectric patches using the method sputtered.
Preferably, the sputtering method is radio-frequency sputtering, and the thickness for the Top electrode plated is 100~200nm.
Preferably, the depth of second grooving is 0.6L3~0.8L3。
Preferably, step 7) in, the width of the described one end of first flexible PCB away from piezoelectric patches is more than it close to pressure
The width of one end of electric piece, so that it electrically connects external equipment；The width of the described one end of second flexible PCB away from piezoelectric patches
Degree is more than its width close to one end of piezoelectric patches, so that it electrically connects external equipment.
Preferably, step 7) in, first flexible PCB and the second flexible PCB are gluing by epoxy resin
Paste on piezoelectric patches.
In general, by the contemplated above technical scheme of the present invention compared with prior art, it can obtain down and show
Beneficial effect：
The present invention enormously simplify technological process, by a series of designs and the use of flexible PCB, be easy to rear continued access
Line and encapsulation, the face battle array probe stationary of preparation are good, and good performance can be kept under circumstances, and cheap,
Significantly reduce production cost.
Brief description of the drawings
Fig. 1 (a)~Fig. 1 (f) be respectively in the present invention piezoelectric patches when initial, plated bottom electrode, cutting, encapsulating, plated
Structure change schematic diagram after Top electrode and secondary cut；
Fig. 2 is the structural representation of the flexible PCB of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in each embodiment of invention described below
Not constituting conflict each other can just be mutually combined.
Reference picture 1 (a)~Fig. 1 (f), Fig. 2, the invention provides the technique of the preparation of the face battle array probe of individual layer ranks addressing
Flow.Its technological process is simple, is not only prepared for the face battle array probe of ranks addressing, and design is prepared for matched flexibility
Circuit board external connection, and pass through the test such as accordingly of impedance analysis and echo, it was demonstrated that this is a kind of effective scheme.
Embodiment 1
1) piezoelectric patches of rectangular shape is chosen, wherein, the length on the piezoelectric patches parallel to the rib of x-axis is L1,
The length parallel to the rib of y-axis is L thereon2, the length parallel to the rib of z-axis is L thereon3, and L3=250 μm；Its frequency
Rate is 8MHz, it is preferable that wherein, and described piezoelectric patches is made of lead base piezoceramic material, it is highly preferred that the piezoelectric patches
It is made of PZT-5H.Reference picture 1（ a ）, wherein, x-axis extends in left-right direction, and y-axis extends along the longitudinal direction, z-axis edge
Above-below direction extends.
2) one layer of hearth electrode is paved with the lower surface of piezoelectric patches, then one is paved with respectively in the leading flank and trailing flank of piezoelectric patches
Layer lateral electrode, wherein each lateral electrode is contacted with hearth electrode, the hearth electrode and two lateral electrodes collectively form a U-shaped structure,
And this U-shaped structure covers whole positions of the piezoelectric patches lower surface, leading flank and trailing flank, then in piezoelectric patches upper surface
The termination electrode of one layer of rectangular shape is plated in front-end and back-end respectively, wherein each termination electrode is contacted with the lateral electrode of respective side respectively
And the length on each termination electrode parallel to the rib of x-axis is L1, and the two termination electrodes are parallel to each other, the bottom electricity
Pole, two lateral electrodes and two termination electrodes collectively form bottom electrode；
3) by step 2) the lower surface of hearth electrode be pasted onto on backing, then cut out in the upper surface of piezoelectric patches a plurality of
The first grooving being parallel to each other, wherein the length direction of every first grooving is each parallel to y-axis and length is L2, width it is equal
For 50 μm, every first grooving, which runs through between the termination electrode and the piezoelectric patches, adjacent two the first groovings, forms first
Array element, and the width of each first array element is 170 μm；
4) epoxide-resin glue is filled respectively in every first grooving；
5) plate the target of last layer rectangular shape to form Top electrode, the Top electrode in the upper surface of piezoelectric patches
There is spacing with every termination electrode, and thereon parallel to x-axis rib length L4=L1, thereon parallel to the rib of z-axis
Length is L5；Preferably, step 5) in the material of Top electrode that is plated be gold, the Top electrode is plated using the method for sputtering
In the upper surface of piezoelectric patches.Preferably, the sputtering method is radio-frequency sputtering, and the thickness for the Top electrode plated is 6 μm.
6) secondary cut is carried out to Top electrode and piezoelectric patches at the position for being covered with Top electrode, cut so as to cut out a plurality of second
Groove, wherein the length direction of every second grooving is each parallel to x-axis and its length L6=L1, width be 50 μm, every
The depth of two groovings is L7And L5＜ L7＜ L5+L3, the second array element, and each are formed between adjacent two the second groovings
The width of two array elements is 170 μm, and the depth of second grooving is 200 μm.
7) the first flexible PCB is pasted onto on piezoelectric patches, and make printed circuit passage on the first flexible PCB with
The first array element correspondence on piezoelectric patches, then the second flexible PCB is pasted onto on piezoelectric patches, and make on the second flexible PCB
Printed circuit passage it is corresponding with the second array element on piezoelectric patches, so as to form ultrasonic face battle array probe.Preferably, step 7) in,
The width of the described one end of first flexible PCB away from piezoelectric patches is more than its width close to one end of piezoelectric patches, so as to its electricity
Connect external equipment；The width of the described one end of second flexible PCB away from piezoelectric patches is more than it close to one end of piezoelectric patches
Width, so that it electrically connects external equipment.In addition, first flexible PCB and the second flexible PCB pass through asphalt mixtures modified by epoxy resin
On fat glue piezoelectric patches.
Embodiment 2：
1) piezoelectric patches of rectangular shape is chosen, wherein, the length on the piezoelectric patches parallel to the rib of x-axis is L1,
The length parallel to the rib of y-axis is L thereon2, the length parallel to the rib of z-axis is L thereon3, and L3=200 μm；Its frequency
Rate is 10MHz, it is preferable that wherein, and described piezoelectric patches is made of lead base piezoceramic material, it is highly preferred that the piezoelectricity
Piece is made of PZT-5H.Reference picture 1（ a ）, wherein, x-axis extends in left-right direction, and y-axis extends along the longitudinal direction, z-axis
It is vertically extending.
2) one layer of hearth electrode is paved with the lower surface of piezoelectric patches, then one is paved with respectively in the leading flank and trailing flank of piezoelectric patches
Layer lateral electrode, wherein each lateral electrode is contacted with hearth electrode, the hearth electrode and two lateral electrodes collectively form a U-shaped structure,
And this U-shaped structure covers whole positions of the piezoelectric patches lower surface, leading flank and trailing flank, then in piezoelectric patches upper surface
The termination electrode of one layer of rectangular shape is plated in front-end and back-end respectively, wherein each termination electrode is contacted with the lateral electrode of respective side respectively
And the length on each termination electrode parallel to the rib of x-axis is L1, and the two termination electrodes are parallel to each other, the bottom electricity
Pole, two lateral electrodes and two termination electrodes collectively form bottom electrode；
3) by step 2) the lower surface of hearth electrode be pasted onto on backing, then cut out in the upper surface of piezoelectric patches a plurality of
The first grooving being parallel to each other, wherein the length direction of every first grooving is each parallel to y-axis and length is L2, width it is equal
For 50 μm, every first grooving, which runs through between the termination electrode and the piezoelectric patches, adjacent two the first groovings, forms first
Array element, and the width of each first array element is 150 μm；
4) epoxide-resin glue is filled respectively in every first grooving；Preferably, the glue filled is epoxide-resin glue.
5) plate the target of last layer rectangular shape to form Top electrode, the Top electrode in the upper surface of piezoelectric patches
There is spacing with every termination electrode, and thereon parallel to x-axis rib length L4=L1, thereon parallel to the rib of z-axis
Length is L5；Preferably, step 5) in the material of Top electrode that is plated be gold, the Top electrode is plated using the method for sputtering
In the upper surface of piezoelectric patches.Preferably, the sputtering method is radio-frequency sputtering, and the thickness for the Top electrode plated is 6 μm.
6) secondary cut is carried out to Top electrode and piezoelectric patches at the position for being covered with Top electrode, cut so as to cut out a plurality of second
Groove, wherein the length direction of every second grooving is each parallel to x-axis and its length L6=L1, width be 60 μm, every
The depth of two groovings is L7And L5＜ L7＜ L5+L3, the second array element, and each are formed between adjacent two the second groovings
The width of two array elements is 150 μm, and the depth of second grooving is 150 μm.
7) the first flexible PCB is pasted onto on piezoelectric patches, and make printed circuit passage on the first flexible PCB with
The first array element correspondence on piezoelectric patches, then the second flexible PCB is pasted onto on piezoelectric patches, and make on the second flexible PCB
Printed circuit passage it is corresponding with the second array element on piezoelectric patches, so as to form ultrasonic face battle array probe.Preferably, step 7) in,
The width of the described one end of first flexible PCB away from piezoelectric patches is more than its width close to one end of piezoelectric patches, so as to its electricity
Connect external equipment；The width of the described one end of second flexible PCB away from piezoelectric patches is more than it close to one end of piezoelectric patches
Width, so that it electrically connects external equipment.In addition, first flexible PCB and the second flexible PCB pass through asphalt mixtures modified by epoxy resin
On fat glue piezoelectric patches.
Embodiment 3：
1) piezoelectric patches of rectangular shape is chosen, wherein, the length on the piezoelectric patches parallel to the rib of x-axis is L1,
The length parallel to the rib of y-axis is L thereon2, the length parallel to the rib of z-axis is L thereon3, and L3=400 μm；Its frequency
Rate is 5MHz, it is preferable that wherein, and described piezoelectric patches is made of lead base piezoceramic material, it is highly preferred that the piezoelectric patches
It is made of PZT-5H.Reference picture 1（ a ）, wherein, x-axis extends in left-right direction, and y-axis extends along the longitudinal direction, z-axis edge
Above-below direction extends.
2) one layer of hearth electrode is paved with the lower surface of piezoelectric patches, then one is paved with respectively in the leading flank and trailing flank of piezoelectric patches
Layer lateral electrode, wherein each lateral electrode is contacted with hearth electrode, the hearth electrode and two lateral electrodes collectively form a U-shaped structure,
And this U-shaped structure covers whole positions of the piezoelectric patches lower surface, leading flank and trailing flank, then in piezoelectric patches upper surface
The termination electrode of one layer of rectangular shape is plated in front-end and back-end respectively, wherein each termination electrode is contacted with the lateral electrode of respective side respectively
And the length on each termination electrode parallel to the rib of x-axis is L1, and the two termination electrodes are parallel to each other, the bottom electricity
Pole, two lateral electrodes and two termination electrodes collectively form bottom electrode；
3) by step 2) the lower surface of hearth electrode be pasted onto on backing, then cut out in the upper surface of piezoelectric patches a plurality of
The first grooving being parallel to each other, wherein the length direction of every first grooving is each parallel to y-axis and length is L2, width it is equal
For 80 μm, every first grooving, which runs through between the termination electrode and the piezoelectric patches, adjacent two the first groovings, forms first
Array element, and the width of each first array element is 250 μm；
4) epoxide-resin glue is filled respectively in every first grooving；Preferably, the glue filled is epoxide-resin glue.
5) plate the target of last layer rectangular shape to form Top electrode, the Top electrode in the upper surface of piezoelectric patches
There is spacing with every termination electrode, and thereon parallel to x-axis rib length L4=L1, thereon parallel to the rib of z-axis
Length is L5；Preferably, step 5) in the material of Top electrode that is plated be gold, the Top electrode is plated using the method for sputtering
In the upper surface of piezoelectric patches.Preferably, the sputtering method is radio-frequency sputtering, and the thickness for the Top electrode plated is 10 μm.
6) secondary cut is carried out to Top electrode and piezoelectric patches at the position for being covered with Top electrode, cut so as to cut out a plurality of second
Groove, wherein the length direction of every second grooving is each parallel to x-axis and its length L6=L1, width be 40 μm, every
The depth of two groovings is L7And L5＜ L7＜ L5+L3, the second array element, and each are formed between adjacent two the second groovings
The width of two array elements is 250 μm, and the depth of second grooving is 240 μm.
7) the first flexible PCB is pasted onto on piezoelectric patches, and make printed circuit passage on the first flexible PCB with
The first array element correspondence on piezoelectric patches, then the second flexible PCB is pasted onto on piezoelectric patches, and make on the second flexible PCB
Printed circuit passage it is corresponding with the second array element on piezoelectric patches, so as to form ultrasonic face battle array probe.Preferably, step 7) in,
The width of the described one end of first flexible PCB away from piezoelectric patches is more than its width close to one end of piezoelectric patches, so as to its electricity
Connect external equipment；The width of the described one end of second flexible PCB away from piezoelectric patches is more than it close to one end of piezoelectric patches
Width, so that it electrically connects external equipment.In addition, first flexible PCB and the second flexible PCB pass through asphalt mixtures modified by epoxy resin
On fat glue piezoelectric patches.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, it is not used to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the invention etc., it all should include
Within protection scope of the present invention.
Claims (8)
1. the preparation method of the ultrasonic face battle array probe of a kind of ranks addressing, it is characterised in that this method comprises the following steps：
1) piezoelectric patches of rectangular shape is chosen, wherein, the length on the piezoelectric patches parallel to the rib of x-axis is L1, put down thereon
Row is L in the length of the rib of y-axis2, the length parallel to the rib of z-axis is L thereon3, and 200≤L3≤400μm；
2) hearth electrode of last layer rectangular shape is plated in the lower surface of piezoelectric patches, then in the leading flank and trailing flank point of piezoelectric patches
Not Du last layer rectangular shape lateral electrode, wherein each lateral electrode is contacted with hearth electrode, the hearth electrode and both sides electricity
Pole collectively forms a U-shaped structure, and this U-shaped structure covers whole portions of the piezoelectric patches lower surface, leading flank and trailing flank
Position, then the termination electrode of one layer of rectangular shape is plated respectively in the front-end and back-end of piezoelectric patches upper surface, wherein each termination electrode point
Do not contacted with the lateral electrode of respective side and the length on each termination electrode parallel to the rib of x-axis is L1, and the two ends
Electrode is parallel to each other, and the hearth electrode, two lateral electrodes and two termination electrodes collectively form bottom electrode；
3) by step 2) the lower surface of hearth electrode be pasted onto on backing, then in the upper surface of piezoelectric patches along vertical with lateral electrode
Direction carry out first time cutting, wherein the length direction of every first grooving is each parallel to y-axis and length is L2, width
It it is 40~60 μm, every first grooving runs through shape between the termination electrode and the piezoelectric patches, adjacent two the first groovings
Width into the first array element, and each first array element is 150~200 μm；
4) fill epoxide-resin glue respectively in every first grooving, and the upper surface of piezoelectric patches is had to the position of epoxide-resin glue
Polish；
5) plate the target of last layer rectangular shape to form Top electrode in the upper surface of piezoelectric patches, the Top electrode with it is every
There is spacing in bar termination electrode, and thereon parallel to x-axis rib length L4=L1, it is parallel to the length of the rib of z-axis
L5；
6) secondary cut is carried out to Top electrode and piezoelectric patches at the position for being covered with Top electrode, so that a plurality of second grooving is cut out,
The length direction of wherein every the second grooving is each parallel to x-axis and its length L6=L1, width be 40~60 μm, every
The depth of two groovings is L7And L5＜ L7＜ L5+L3, the second array element, and each are formed between adjacent two the second groovings
The width of two array elements is 150~200 μm；The depth of second grooving is 0.6L3~0.8L3；
7) the first flexible PCB is pasted onto on piezoelectric patches, and makes printed circuit passage and the piezoelectricity on the first flexible PCB
The first array element correspondence on piece, then the second flexible PCB is pasted onto on piezoelectric patches, and make the print on the second flexible PCB
Brush circuit path is corresponding with the second array element on piezoelectric patches, so as to form ultrasonic face battle array probe.
2. the preparation method of the ultrasonic face battle array probe of a kind of ranks addressing according to claim 1, it is characterised in that described
Piezoelectric patches be made of lead base piezoceramic material.
3. the preparation method of the ultrasonic face battle array probe of a kind of ranks addressing according to claim 1, it is characterised in that described
Piezoelectric patches is made of PZT-5H.
4. a kind of preparation method of the ultrasonic face battle array probe of ranks addressing according to claim 1, it is characterised in that step
5) material for the Top electrode plated in is gold.
5. a kind of preparation method of the ultrasonic face battle array probe of ranks addressing according to claim 1, it is characterised in that step
5) Top electrode is plated in the upper surface of piezoelectric patches in using the method for sputtering.
6. the preparation method of the ultrasonic face battle array probe of a kind of ranks addressing according to claim 5, it is characterised in that described
Sputtering method is radio-frequency sputtering, and the thickness for the Top electrode plated is 100~200nm.
7. a kind of preparation method of the ultrasonic face battle array probe of ranks addressing according to claim 1, it is characterised in that step
7) in, the width of the described one end of first flexible PCB away from piezoelectric patches is more than its width close to one end of piezoelectric patches, with
Just it electrically connects external equipment；The width of the described one end of second flexible PCB away from piezoelectric patches is more than it close to piezoelectric patches
The width of one end, so that it electrically connects external equipment.
8. a kind of preparation method of the ultrasonic face battle array probe of ranks addressing according to claim 1, it is characterised in that step
7) in, first flexible PCB and the second flexible PCB are by epoxy resin glue piezoelectric patches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510817970.5A CN105436065B (en) | 2015-11-23 | 2015-11-23 | A kind of preparation method of the ultrasonic face battle array probe of ranks addressing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510817970.5A CN105436065B (en) | 2015-11-23 | 2015-11-23 | A kind of preparation method of the ultrasonic face battle array probe of ranks addressing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105436065A CN105436065A (en) | 2016-03-30 |
| CN105436065B true CN105436065B (en) | 2017-10-31 |
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