CN104586430B - Ultrasonic probe and manufacturing method for ultrasonic probe - Google Patents

Ultrasonic probe and manufacturing method for ultrasonic probe Download PDF

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Publication number
CN104586430B
CN104586430B CN201510025483.5A CN201510025483A CN104586430B CN 104586430 B CN104586430 B CN 104586430B CN 201510025483 A CN201510025483 A CN 201510025483A CN 104586430 B CN104586430 B CN 104586430B
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described
piezoelectric chip
electrode
matching layer
row electrode
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CN201510025483.5A
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Chinese (zh)
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CN104586430A (en
Inventor
周丹
王文娟
陈露露
张欣欣
欧阳波
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深圳市理邦精密仪器股份有限公司
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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe

Abstract

The invention relates to the technical field of ultrasonic imaging equipment and discloses an ultrasonic probe and a manufacturing method for the ultrasonic probe. The ultrasonic probe comprises a piezoelectric crystal plate, wherein row electrodes are arranged on the front surface of the piezoelectric crystal plate; matching layers are pasted to a plurality of rows of electrodes; each row electrode passes through the side wall of the piezoelectric crystal plate and extends to two sides of the rear surface of the piezoelectric crystal plate to form an edge-covering electrode; column electrodes are arranged on the rear surface of the piezoelectric crystal plate; transverse cutting grooves are formed between adjacent row electrodes; longitudinal cutting grooves are formed between adjacent column electrodes; the edge-covering electrodes and the column electrodes are connected to leads; the leads are connected to a circuit board. The ultrasonic probe is simple in structure; the cost and the process difficulty are reduced; the production efficiency of the ultrasonic probe is improved; the batch production is achieved; the condition that the process difficulty of the ultrasonic probe is additionally increased by the introduction of a conductive component can be avoided; the positions of the leads connected to the edge-covering electrodes and the column electrodes are not located on the ultrasonic propagation path; the reduction of the acoustic performance of the probe caused by the introduction of structures such as an electric connection plate is avoided; the imaging effect of the ultrasonic probe is improved.

Description

Ultrasonic probe and manufacture method thereof

Technical field

The present invention relates to the technical field of supersonic imaging device, particularly relate to ultrasonic probe and manufacture method thereof.

Background technology

Ultra sonic imaging is the detection and diagnostic means being widely used at present, its have lossless, inexpensive, convenient with And the advantage such as reliable.The ultrasonic signal produced by ultrasonic probe, at light tight media, is received not The information such as intensity, frequency, time and phase place of institute's reflectance ultrasound ripple signal in transparent object body, and to reception Signal process, thus obtain the detected light tight media interior structural acoustic characteristic distribution of reflection Visual image.

Use one dimensional linear array or the ultrasonic probe of convex battle array, it is possible to obtain the two dimension of detected internal structure of body is cut Face image, in order to obtain apparent visible image detail, such as, improves the performance of probe elevation direction, Or in order to present the stereo-picture of detected internal structure of body, then need to use the ultrasonic spy of rectangular array Head carries out launching and receiving ultrasonic signals, mainly includes that array is tieed up in 1.25 dimensions, 1.5 dimensions, 1.75 peacekeepings 2 Ultrasonic probe.But, use the ultrasonic probe of these rectangular arrays, then significantly increase the array number of array Amount, furthermore, it is desirable to the two end electrodes of comprised for each array element piezoelectric chip is led on probe circuit, this Sample, the array element quantity of tremendous amount adds technology difficulty and manufacturing cost, and each array element is effectively with reliably Circuit connects draws one of key technology having become rectangular array ultrasonic probe.

In prior art, the connection of array element electrode is drawn mainly following two mode.

First kind of way, configures flexible circuit board on one or two paths in the path, front-end and back-end of array element Or substrate or ground connection Copper Foil, as Chinese patent CN101797166A and CN103210665A announces Method.This mode is the highest to the required precision of array element cutting and bonding alignment process, directly influences Produce production efficiency and the yield rate of probe, and, the thickness of the ultrasonic probe institute placement substrate in which Ultrasonic wave propagation path produces impact, and such as, the thickness of flexible circuit board typically will not be less than 25 microns, Introduce electric connecting sheet (as flexible PCB, ground connection Copper Foil etc. electrification interconnection function accessory) thickness with And then can greatly reduce sensitivity and the bandwidth of probe in order to the bondline thickness of bonding electric connecting sheet, and visit Head frequency is the highest, and electric connecting sheet and bondline thickness are more serious on the impact of sonde response characteristic, reduce further The quality of ultrasonic probe ultra sonic imaging.

The second way, increases conductive member in ultrasonic probe, utilizes conductive member to connect array element, such as Embedding lenticular wire in back lining materials or arrange the wiring hole injecting conducting resinl in array element, this mode makes to surpass The structure of sonic probe and process complications, need the conductive member retrofit introduced, and between array element Need exactitude position, so that ultrasonic probe is difficult to mass production.

Summary of the invention

It is an object of the invention to provide ultrasonic probe, it is intended to solve the production of ultrasonic probe of the prior art The problem that efficiency is low, image quality is poor and is difficult to batch production.

The present invention is achieved in that ultrasonic probe, including piezoelectric chip, the front surface of described piezoelectric chip Being provided with the row electrode of multiple rows of lateral arrangement, multiple rows of described row electrode is arranged separately, and at multiple rows of described row electricity Matching layer it is bonded with on extremely;Each described row electrode sidewall by described piezoelectric chip, extends to described pressure The both sides of electricity wafer back surface, form bound edge electrode;The rear surface of described piezoelectric chip is provided with multiple rows of longitudinal cloth The row electrode put, multiple rows of described row electrode between the bound edge electrode of both sides, described piezoelectric chip rear surface, And arrange separately;

Having horizontal grooving between adjacent described row electrode, the front end of described horizontal grooving runs through described upward Matching layer;Having longitudinal grooving between adjacent described row electrode, the rear end of described longitudinal grooving runs through described The rear surface of piezoelectric chip;

Connecting lead wire on the bound edge electrode and row electrode of described piezoelectric chip rear surface, described lead-in wire is connected to Circuit board.

Present invention also offers the manufacture method of ultrasonic probe, comprise the following steps:

1), on the front surface of described piezoelectric chip, the row electrode of multiple rows of lateral arrangement, multiple rows of described row are coated Electrode is arranged separately, the two ends of each the described row electrode sidewall by described piezoelectric chip, extends to institute State the both sides of piezoelectric chip rear surface, form bound edge electrode;On the row electrode of described piezoelectric chip front surface Bonding matching layer;Coating rear electrode on described piezoelectric chip rear surface, described rear electrode is positioned at described piezoelectricity Between the bound edge electrode of wafer back surface both sides;

2), from the front surface of described piezoelectric chip, carry out transverse cuts, form multiple horizontal grooving, described Laterally grooving is formed between adjacent row electrode, and runs through described matching layer, the rear end of described horizontal grooving It is formed in described piezoelectric chip;Carry out longitudinally cutting from the rear surface of described piezoelectric chip, formed multiple vertical To grooving, described rear electrode is divided into multiple row electrode being longitudinally arranged by multiple described longitudinal groovings, multiple Described row electrode is arranged separately;

3), connecting lead wire, described lead-in wire company on the bound edge electrode and row electrode of described piezoelectric chip rear surface Connect on circuit boards.

Present invention also offers the manufacture method of ultrasonic probe, comprise the following steps:

1), on the front surface of described piezoelectric chip coating before electrode, the two ends of described front electrode pass through described The sidewall of piezoelectric chip, extends to the both sides of described piezoelectric chip rear surface, forms bound edge body;In described pressure The rear surface coating rear electrode of electricity wafer, described rear electrode is positioned at the bound edge of described piezoelectric chip front surface both sides Between body;Bonding matching layer on the front electrode of described piezoelectric chip front surface, table after described piezoelectric chip On the rear electrode in face, bonding conduction solves matching layer;

2), from the front surface of described piezoelectric chip, carry out transverse cuts, form multiple horizontal grooving, multiple Described matching layer is run through in the front end of described horizontal grooving, and its rear end is formed in solution matching layer, multiple described horizontal strokes To grooving, front electrode is divided into the row electrode of multiple lateral arrangement, and described bound edge body is divided into multiple bag Limit electrode;Carry out longitudinally cutting from the rear surface of described piezoelectric chip, form multiple longitudinal grooving, Duo Gesuo Stating longitudinal grooving and described rear electrode is divided into multiple row electrode being longitudinally arranged, multiple described row electrodes are alternate Every layout;

3), connecting lead wire, described lead-in wire company on the bound edge electrode and row electrode of described piezoelectric chip rear surface Connect on circuit boards.

The ultrasonic probe that the present invention provides, forms row electrode and row electrode on piezoelectric chip, forms multiple battle array Multiple array elements are electrically connected with on circuit boards by unit by lead-in wire;Structure of ultrasonic is simple, it is possible to reduce Cost and technology difficulty, be greatly improved the production efficiency of ultrasonic probe, it is possible to realizes batch production, can keep away Exempt to introduce conductive member, the extra process complexity increasing ultrasonic probe;It addition, be connected to bound edge electrode and The position of the lead-in wire on row electrode is not on ultrasonic wave propagation path, it is to avoid the structures such as similar introducing electric connecting sheet Cause probe acoustical behavior to reduce, thus be greatly improved the imaging effect of ultrasonic probe.

Accompanying drawing explanation

Fig. 1 is the schematic perspective view arranging row electrode on the piezoelectric chip that the embodiment of the present invention one provides;

Fig. 2 is the three-dimensional signal arranging row electrode and rear electrode on the piezoelectric chip that the embodiment of the present invention one provides Figure;

Fig. 3 is the schematic perspective view of bonding matching layer on the piezoelectric chip that the embodiment of the present invention one provides;

Fig. 4 is the ultrasonic probe matrix array and array element contact conductor thereof formed after structure shown in Fig. 3 is cut Schematic perspective view;

Fig. 5 is the schematic perspective view arranging front electrode on the piezoelectric chip that the embodiment of the present invention two provides;

Fig. 6 is the three-dimensional signal arranging front electrode and rear electrode on the piezoelectric chip that the embodiment of the present invention two provides Figure;

Fig. 7 is that on the piezoelectric chip that the embodiment of the present invention two provides, the solid of bonding matching layer and solution matching layer is shown It is intended to;

Fig. 8 is the ultrasonic probe matrix array and array element contact conductor thereof formed after structure shown in Fig. 7 is cut Schematic perspective view.

Detailed description of the invention

In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and reality Execute example, the present invention is further elaborated.Only should be appreciated that specific embodiment described herein Only in order to explain the present invention, it is not intended to limit the present invention.

Below in conjunction with specific embodiment, the realization of the present invention is described in detail.

As shown in Fig. 1~8, the preferred embodiment provided for the present invention.

The ultrasonic probe that the present embodiment provides includes piezoelectric chip 101, for the piezoelectric chip 101 of ultrasonic probe For, it is after by the excitation of electric pulse, then can be respectively from two surface courts respectively of piezoelectric chip 101 External radiation ultrasound wave.Set piezoelectric chip 101 towards the surface of detected object as front surface, ordinary circumstance Under, use coupling structure that the front surface of piezoelectric chip 101 is launched and received ultrasonic signal peak power Transmission;Be oppositely arranged with front surface on piezoelectric chip 101 for rear surface, general use the back structure will The ultrasonic absorption of the rear surface of piezoelectric chip 101 falls.

The piezoelectric chip 101 that the present embodiment provides is in rectangular-shaped, certainly, as other embodiments, piezoelectricity Wafer 101 can also be square body shape, or other different form, depending on being the most visually actually needed.

The front surface of piezoelectric chip 101 is provided with the row electrode 100 of multiple rows of horizontal expansion, this many seniority among brothers and sisters electrode 100 Arranging separately, the two ends of many seniority among brothers and sisters electrodes 100, respectively by the sidewall of piezoelectric chip 101, extend to pressure The both sides of electricity wafer 101 rear surface, form multiple bound edge electrode 103 arranged separately.Bound edge electrode 103 As the extension of row electrode 100, it is formed as one with row electrode 100, say, that each row electrode 100 have been correspondingly formed two bound edge electrodes 103.

In the rear surface of piezoelectric chip 101, it is provided with multiple rows of row electrode 104 extended longitudinally, arranges electricity more Pole 104 is arranged separately, is formed between the bound edge electrode 103 of both sides, piezoelectric chip 101 rear surface, this Sample, row electrode 100 with row electrode 104 spatially, then forms the state being mutually perpendicular to arrange.

Many seniority among brothers and sisters electrode 100 of piezoelectric chip 101 is bonded with matching layer, and at many seniority among brothers and sisters electrodes 100 Between be formed with horizontal grooving 109, so, for many seniority among brothers and sisters electrodes 100, be then formed with multiple rows of horizontal stroke To grooving 109.Laterally the front end of grooving 109 runs through matching layer upward, and so, matching layer is the most multiple Laterally grooving 109 is cut into multiple matching layer bar, and each matching layer bar is with the most corresponding row electrode 100 even Logical, certainly, also connect with two bound edge electrodes 103 of this row electrode 100 correspondence;Horizontal grooving 109 Rear end is formed in piezoelectric chip 101, and namely laterally grooving 109 does not cuts through piezoelectric chip 101, so, Can ensure that the integrity of each row electrode 104 on piezoelectric chip 101 rear surface.

In the present embodiment, between many arrangement electrodes 104, it is formed with multiple longitudinal grooving 106, longitudinal grooving The rear end of 106 runs through the rear surface of piezoelectric chip 101 backwards.

Connecting lead wire 105 on bound edge electrode 103 on piezoelectric chip 101 rear surface and row electrode 104, Two bound edge electrodes 103 at each seniority among brothers and sisters electrode 100 two ends are at least connected with a lead-in wire 105, respectively arrange electrode It is at least connected with a lead-in wire 105 on 104, so, utilizes and be connected to bound edge electrode 103 and row electrode 104 On PCB or the FPC circuit board of lead-in wire 105 and ultrasonic probe be electrically connected with.

The ultrasonic probe of above-mentioned offer, by forming many seniority among brothers and sisters electrodes 100 at the front surface of piezoelectric chip 101, And the two ends of each seniority among brothers and sisters electrode 100 extend to the both sides of rear surface of piezoelectric chip 101, it is correspondingly formed multiple Bound edge electrode 103, by multiple horizontal groovings 109, will rank electrode 100 independent more;At piezoelectric chip The rear surface of 101 is formed with many arrangement electrodes 104, by multiple rows of longitudinal grooving 106, will arrange electrode 104 more Independent, thus, piezoelectric chip 101 is formed multiple array element, and, by lead-in wire 105 by multiple array elements It is electrically connected with on circuit boards.

The structure of ultrasonic of above-mentioned formation is simple, it is possible to reduces cost and technology difficulty, is greatly improved ultrasonic The production efficiency of probe, it is possible to realize batch production, can avoid introducing conductive member, additionally increases ultrasonic The process complexity of probe;It addition, the lead-in wire 105 being connected on bound edge electrode 103 and row electrode 104 Position is not on ultrasonic wave propagation path, it is to avoid the probe acoustical behavior fall that similar introducing electric connecting sheet is caused Low, thus it is greatly improved the imaging effect of ultrasonic probe.

The matching layer being bonded on piezoelectric chip 101 front surface row electrode 100 includes conduction matching layer 107, Further, the thickness of the bonding glue-line between conduction matching layer 107 and row electrode 100 is generally less than 2 microns, In this manner it is ensured that row electrode 100 and conduction matching layer 107 between in electrical contact.

In the present embodiment, conduction matching layer 107 can be metal or the material such as graphite or conductivity ceramics is made, Or, it is also possible to it is the complex of these materials composition.It addition, matching layer can be single layer structure, as only Including conduction matching layer 107, certainly, as other embodiments, matching layer can also be multiple structure, its It is arranged on the non-adjacent matching layer on conduction matching layer 107 including conduction matching layer 107 and at least one of which 108, certainly, this non-adjacent matching layer 108 can be conduction, or non-conductive.

As the presently preferred embodiments, owing to being bonded with conduction on the row electrode 100 of piezoelectric chip 101 front surface Joining layer 107, so, the rear end being formed at the longitudinal grooving 106 between adjacent row electrode 104 is passed through backwards Wear the rear surface of piezoelectric chip 101, and piezoelectric chip 101 is run through in the front end of longitudinal grooving 106, is formed at In conduction matching layer 107, under the effect of conduction matching layer 107, it is ensured that each row electrode 100 itself Electrical communication.

Or, when the matching layer being formed on piezoelectric chip 101 front surface is non-conductive matching layer, now, Piezoelectric chip 101 then will not be run through in the front end of longitudinal grooving 106, and it is formed in piezoelectric chip 101, this Sample, longitudinal grooving 106 then will not cut through piezoelectric chip 101, thus before ensureing to be formed at piezoelectric chip 101 The integrity of the row electrode 100 on surface.

As other embodiments, the row electrode 104 of piezoelectric chip 101 rear surface is bonded with solution matching layer 112, the rear surface of piezoelectric chip 101 is run through in the rear end of longitudinal grooving 106, wears to solving in matching layer 112, And run through solution matching layer 112.The metal that solution matching layer 112 uses acoustic impedance to be more than piezoelectric chip 101 is made, This solution matching layer 112 so that piezoelectric chip 101 rear surface radiation ultrasound wave more forward end reflection, Strengthen ultrasonic listening signal intensity.

When above-mentioned solution matching layer 112 solves matching layer 112 for conduction, now, after horizontal grooving 109 End can pass whole piezoelectric chip 101, and namely laterally grooving 109 runs through whole piezoelectric chip 101, and During laterally the rear end of grooving 109 is formed at conduction solution matching layer 112, so, horizontal grooving 109 then will not Run through conduction and solve matching layer 112, utilize conduction to solve the electric action of matching layer 112, it is ensured that respectively to arrange electricity The electrical communication of pole 104 itself.

After the lead-in wire 105 on bound edge electrode 103 and row electrode 104 is connected with circuit board, solve in conduction The rear surface perfusion back lining materials of matching layer 112, forms backing layer, forms the agent structure of ultrasonic probe; Or, when not being bonded with solution matching layer 112 on the row electrode 104 of piezoelectric chip 101 rear surface, then On the rear surface of piezoelectric chip 101, directly it is perfused with back lining materials, forms backing layer.

The thickness solving the bonding glue-line between matching layer 112 and row electrode 104 is generally less than 2 microns, so, Can ensure that row electrode 104 and conduction solve between matching layer 112 in electrical contact.

The present embodiment additionally provides the manufacture method of ultrasonic probe, specifically comprises the following steps that

1), with reference to shown in Fig. 1~3, the front surface at piezoelectric chip 101 is coated with many seniority among brothers and sisters electrodes 100, This many seniority among brothers and sisters electrode 100 is arranged separately, and each two ends ranking electrode 100, by piezoelectric chip 101 Sidewall, extends to the both sides of piezoelectric chip 101 rear surface, forms bound edge electrode 103;At piezoelectric chip 101 Rear surface on coat rear electrode 102, this rear electrode 102 is positioned at the bag of both sides, piezoelectric chip 101 rear surface Between limit electrode 103, and and bound edge electrode 103 between there is insulating regions;Before piezoelectric chip 101 Bonding matching layer on row electrode 100 on surface;

2), with reference to shown in Fig. 4, along the X direction, carry out from the front surface of piezoelectric chip 101 laterally Cutting, forms multiple horizontal grooving 109, and laterally grooving 109 is formed between adjacent row electrode 100; Row electrode 100 cuts through matching layer, and incision piezoelectric chip 101, the pressure that the rear end of horizontal grooving 109 is formed In electricity wafer 101;Along the Y direction, carrying out longitudinally cutting from the rear surface of piezoelectric chip 101, formation is many Individual longitudinal grooving 106, and rear electrode 102 is divided into multiple being longitudinally arranged by the plurality of longitudinal grooving 106 Row electrode 104, the plurality of row electrode 104 is arranged separately;

3), connect on the bound edge electrode 103 on the rear surface of piezoelectric chip 101 and row electrode 104 and draw Line 105, two bound edge electrodes 103 at each seniority among brothers and sisters electrode 100 two ends are at least connected with a lead-in wire 105, respectively arrange It is at least connected with a lead-in wire 105 on electrode 104, so, utilizes and be connected to bound edge electrode 103 and row electrode Lead-in wire 105 on 104, is connected with PCB or the FPC circuit board of ultrasonic probe.

The ultrasonic probe that above-mentioned manufacture method is formed, by formed many seniority among brothers and sisters electrode 100 and arrange more Electrode 104, forms multiple array element on piezoelectric chip 101, and, by lead-in wire 105 by multiple array elements It is electrically connected with circuit board;Structure of ultrasonic after formation is simple, it is possible to reduce cost and technology difficulty, It is greatly improved the production efficiency of ultrasonic probe, it is possible to realize batch production, can avoid introducing conductive member, The extra process complexity increasing ultrasonic probe;It addition, be connected on bound edge electrode 103 and row electrode 104 The position of lead-in wire 105 not on ultrasonic wave propagation path, it is to avoid the similar structures such as electric connecting sheet that introduce cause Probe acoustical behavior reduces, thus is greatly improved the imaging effect of ultrasonic probe.

For the ultrasonic probe of above-mentioned offer, set the line number of row electrode 100 as N row, row electrode 104 Columns is M row, and so, this ultrasonic probe forms N*M array element, according to the number of N and M, then Can form the ultrasonic probe of relative dimension, such as 1.5 dimensions, 1.75 dimensions, 2 dimensions etc., concrete dimension is actual Depending on needs.

As other embodiments, additionally provide the manufacture method of ultrasonic probe, specifically comprise the following steps that

1), with reference to shown in Fig. 5~7, electrode 110 before the front surface of piezoelectric chip 101 is coated with, front electricity The two ends of pole 110 sidewall by piezoelectric chip 101, extends to the both sides of piezoelectric chip 101 rear surface, Form bound edge body 111;Coating rear electrode 102 on the rear surface of piezoelectric chip 101, rear electrode 102 is positioned at Between the bound edge body 111 of both sides, piezoelectric chip 101 rear surface, and and bound edge body 111 between there is insulation Region;Bonding matching layer on row electrode 100 on piezoelectric chip 101 front surface;At piezoelectric chip 101 On the rear electrode 102 of rear surface, bonding conduction solves matching layer 112;

2), with reference to shown in Fig. 8, along the X direction, carry out from the matching layer of piezoelectric chip 101 front surface Transverse cuts, forms multiple horizontal grooving 109, and the plurality of horizontal grooving 109 runs through piezoelectric chip 101, and Its rear end is placed in conduction and solves in matching layer 112;Front electrode 110 is divided into many by the plurality of horizontal grooving 109 The row electrode 100 of individual lateral arrangement, and bound edge body 111 is divided into multiple independence by multiple horizontal grooving 109 Bound edge electrode 103;Along the Y direction, carry out longitudinally cutting from the rear surface of piezoelectric chip 101, formed Multiple longitudinal groovings 106, and rear electrode 102 is divided into multiple being longitudinally arranged by the plurality of longitudinal grooving 106 Row electrode 104, the plurality of row electrode 104 is arranged separately;

3), connect on the bound edge electrode 103 on the rear surface of piezoelectric chip 101 and row electrode 104 and draw Line 105, two bound edge electrodes 103 at each row electrode 100 two ends are at least connected with a lead-in wire 105, respectively arrange electricity It is at least connected with a lead-in wire 105 on pole 104, so, utilizes and be connected to bound edge electrode 103 and row electrode 104 On lead-in wire 105, be connected with PCB or the FPC circuit board of ultrasonic probe.

In two kinds of above-mentioned manufacture methods, can obtain, according to different settings, can obtaining ultrasonic Probe, and, the matching layer being arranged on piezoelectric chip 101 front surface row electrode 100 includes conduction coupling Layer 107, this conduction matching layer 107 is bonding is expert on electrode 100, so, in step 2) in, longitudinally cut Groove 106 then runs through piezoelectric chip 101, and its front end is placed in conduction matching layer 107, namely longitudinal grooving 106 will not run through conduction matching layer 107, so, utilize conduction matching layer 107 to can ensure that each row electrode 100 electrical communication own.

And in the step 3 of above two manufacture method) in, after lead-in wire 105 is connected with circuit board, in conduction Solve the rear surface perfusion back lining materials of matching layer 112, form backing layer;Or, when after piezoelectric chip 101 When not being bonded with solution matching layer 112 on the row electrode 104 on surface, then directly after piezoelectric chip 101 It is perfused with back lining materials on surface, forms backing layer.

The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all at this Any amendment, equivalent and the improvement etc. made within bright spirit and principle, should be included in the present invention Protection domain within.

Claims (9)

1. ultrasonic probe, it is characterised in that include that piezoelectric chip, the front surface of described piezoelectric chip are provided with many The row electrode of row's lateral arrangement, multiple rows of described row electrode is arranged separately, and is glued on multiple rows of described row electrode It is connected to matching layer;Each described row electrode sidewall by described piezoelectric chip, extends to described piezoelectric chip The both sides of rear surface, form bound edge electrode;The rear surface of described piezoelectric chip is provided with multiple rows of row being longitudinally arranged Electrode, multiple rows of described row electrode is between the bound edge electrode of both sides, described piezoelectric chip rear surface and alternate Every layout;
Having horizontal grooving between adjacent described row electrode, the front end of described horizontal grooving runs through described upward Matching layer;Having longitudinal grooving between adjacent described row electrode, the rear end of described longitudinal grooving runs through described The rear surface of piezoelectric chip, described matching layer includes being bonded in leading on described piezoelectric chip front surface row electrode Electricity matching layer, the front end of described longitudinal grooving is run through the front surface of described piezoelectric chip, is placed in described conduction Join in layer;
Connecting lead wire on the bound edge electrode and row electrode of described piezoelectric chip rear surface, described lead-in wire is connected to Circuit board.
2. ultrasonic probe as claimed in claim 1, it is characterised in that the rear end of described horizontal grooving is placed in In described piezoelectric chip.
3. ultrasonic probe as claimed in claim 1, it is characterised in that the rear surface of described piezoelectric chip Being bonded with conduction on row electrode and solve matching layer, the rear table of described piezoelectric chip is run through in the rear end of described horizontal grooving Face, is placed in described conduction and solves in matching layer.
4. ultrasonic probe as claimed in claim 1, it is characterised in that described matching layer includes non-adjacent Joining layer, described non-adjacent matching layer is bonded on described conduction matching layer.
5. ultrasonic probe as claimed in claim 3, it is characterised in that the rear table of described conduction solution matching layer It is perfused with back lining materials on face, forms backing layer.
6. the manufacture method of ultrasonic probe, it is characterised in that comprise the following steps:
1), on the front surface of piezoelectric chip, the row electrode of multiple rows of lateral arrangement, multiple rows of described row electrode are coated Arrange that the two ends of each the described row electrode sidewall by described piezoelectric chip extends to described pressure separately The both sides of electricity wafer back surface, form bound edge electrode;On the row electrode of described piezoelectric chip front surface bonding Matching layer;Coating rear electrode on described piezoelectric chip rear surface, described rear electrode is positioned at described piezoelectric chip Between the bound edge electrode of both sides, rear surface;
2), from the front surface of described piezoelectric chip, carry out transverse cuts, form multiple horizontal grooving, described Laterally grooving is formed between adjacent row electrode, and runs through described matching layer, the rear end of described horizontal grooving It is formed in described piezoelectric chip;Carry out longitudinally cutting from the rear surface of described piezoelectric chip, formed multiple vertical To grooving, described rear electrode is divided into multiple row electrode being longitudinally arranged by multiple described longitudinal groovings, multiple Described row electrode is arranged separately;
3), connecting lead wire, described lead-in wire company on the bound edge electrode and row electrode of described piezoelectric chip rear surface Connect on circuit boards.
7. the manufacture method of ultrasonic probe as claimed in claim 6, it is characterised in that described matching layer bag Include the conduction matching layer being bonded on multiple described row electrode, in above-mentioned steps 2) in, described longitudinal grooving Front end run through described piezoelectric chip, be formed in described conduction matching layer.
8. the manufacture method of ultrasonic probe, it is characterised in that comprise the following steps:
1), on the front surface of piezoelectric chip electrode before coating, the two ends of described front electrode are by described piezoelectricity The sidewall of wafer, extends to the both sides of described piezoelectric chip rear surface, forms bound edge body;In described piezo crystals Sheet rear surface coating rear electrode, described rear electrode be positioned at described piezoelectric chip front surface both sides bound edge body it Between;Bonding matching layer on the front electrode of described piezoelectric chip front surface, in described piezoelectric chip rear surface On rear electrode, bonding conduction solves matching layer;
2), from the front surface of described piezoelectric chip, carry out transverse cuts, form multiple horizontal grooving, multiple Described matching layer is run through in the front end of described horizontal grooving, and its rear end is formed in solution matching layer, multiple described horizontal strokes To grooving, front electrode is divided into the row electrode of multiple lateral arrangement, and described bound edge body is divided into multiple bag Limit electrode;Carry out longitudinally cutting from the rear surface of described piezoelectric chip, form multiple longitudinal grooving, Duo Gesuo Stating longitudinal grooving and described rear electrode is divided into multiple row electrode being longitudinally arranged, multiple described row electrodes are alternate Every layout;
3), connecting lead wire, described lead-in wire company on the bound edge electrode and row electrode of described piezoelectric chip rear surface Connect on circuit boards.
9. the manufacture method of the ultrasonic probe as shown in claim 8, it is characterised in that described matching layer bag Include the conduction matching layer being bonded on multiple described row electrode, in above-mentioned steps 2) in, described longitudinal grooving Front end run through described piezoelectric chip, be formed in described conduction matching layer.
CN201510025483.5A 2015-01-19 2015-01-19 Ultrasonic probe and manufacturing method for ultrasonic probe CN104586430B (en)

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CN103300889B (en) * 2013-05-17 2015-04-29 深圳市理邦精密仪器股份有限公司 Ultrasonic array probe signal acquisition component and preparation method thereof, and probe

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