WO2019119188A1 - Magnetic compatibility brain ultrasonic stimulation device and manufacturing method therefor - Google Patents

Abstract

Disclosed are a magnetic compatibility brain ultrasonic stimulation device and a manufacturing method therefor, relating to the technical field of ultrasonic stimulation devices. The magnetic compatibility brain ultrasonic stimulation device comprises a coupling device (6) and a transducing device (1), wherein the transducing device (1) comprises a housing (11), a piezoelectric material component (2) and a cable (3); the piezoelectric material component (2) comprises a piezoelectric block array (200); the piezoelectric block array (200) comprises piezoelectric blocks (20) and insulators (910, 920) for connecting adjacent piezoelectric blocks (20); and the surface of the piezoelectric block array (200) is provided with a conductor layer (233), and a front surface thereof is provided with electrode dividing grooves of a plurality of positive conductive layers (221), each positive conductive layer (221) is electrically connected to a positive pole of the cable (3), and negative conductive layers (222) are connected to a negative pole (31). The manufacturing method is used to manufacture the magnetic compatibility brain ultrasonic stimulation device. The magnetic compatibility brain ultrasonic stimulation device and method can explore and verify the therapeutic effect of ultrasound on brain diseases of animals, and the device is simple to operate and easy to use, does not generate radio-frequency interference in magnetic resonance imaging, and has good imaging quality.

Description

Magnetic compatibility brain ultrasonic stimulation device and manufacturing method thereof Technical field

The invention belongs to the technical field of ultrasonic stimulation devices, and in particular relates to a magnetic compatibility brain ultrasonic stimulation device and a manufacturing method thereof.

Background technique

With the continuous increase of patients with brain diseases such as depression and Parkinson's disease, the diagnosis and treatment equipment for brain diseases has become a hot spot in medical research. Today's brain treatment mainly includes drugs and stimulation by external stimulation devices, external stimulation. It can be realized by a light stimulation device, an electrical stimulation device, a magnetic stimulation device, and an ultrasonic stimulation device. Ultrasound stimulation is gaining more and more attention due to its safety, non-invasiveness, effectiveness and real-time. Many laboratories in the world are currently conducting ultrasound stimulation devices to treat brain diseases, and have begun ultrasound stimulation experiments on animals (rats, rabbits and monkeys) to explore and verify the therapeutic effects of ultrasound on animal brain diseases.

Ultrasound is a mechanical wave generated by vibration of a wafer (sound source) and is caused to propagate by compressing and expanding the medium. Medical ultrasound generally refers to sound waves having a frequency in the range of 20 kHz to 10 MHz. Because ultrasound has less attenuation in human tissue, and the three acoustic effects such as wave effect, mechanical effect and thermal effect of ultrasound can be used to achieve the diagnosis and treatment effect. The advantage of ultrasound nerve stimulation and regulation is its non-invasive nature. The latest scientific evidence for the neuromodulation of ultrasound at the molecular, cellular, animal, and human brain levels strongly demonstrates that ultrasound can penetrate the human skull non-invasively, effectively regulate synaptic plasticity, neuronal regulation, and deep brain nucleus. In the prior art, the transducer is susceptible to radio frequency interference during magnetic resonance imaging, which affects the imaging quality.

technical problem

The object of the present invention is to overcome the above deficiencies of the prior art, and to provide a magnetic compatible brain ultrasonic stimulation device and a manufacturing method thereof, wherein the magnetic compatibility brain ultrasonic stimulation device does not generate radio frequency interference during magnetic resonance imaging after being powered on. The image quality is good.

Technical solution

The technical solution of the present invention is: a magnetic compatible brain ultrasonic stimulation device, comprising a coupling device and a transducing device, the transducing device comprising a housing, a piezoelectric material component and a cable, wherein the piezoelectric material component is disposed on In the housing, the coupling device is connected to the housing;

The piezoelectric material component includes an array of piezoelectric blocks including an array of piezoelectric blocks, adjacent to the piezoelectric blocks being separated by a spacer, the piezoelectric block array further comprising An insulator filled in the spacer and used to connect adjacent ones of the piezoelectric blocks;

The surface of the piezoelectric block array is provided with a conductor layer, and the front surface of the piezoelectric block array is provided with electrode dividing grooves for dividing at least a part of the conductor layer on the front surface of the piezoelectric block array into a plurality of positive conductive layers, each The positive conductive layers are respectively disposed on the front surface of the plurality of piezoelectric blocks, the conductive layer on the back surface of the piezoelectric block array is a negative conductive layer, and the negative conductive layer is simultaneously connected to the back faces of the plurality of piezoelectric blocks, and each of the The positive conductive layer is electrically connected to the positive electrode of the cable, and the negative conductive layer is electrically connected to the negative electrode of the cable.

Optionally, each of the positive conductive layers is provided with a conductive conductive layer, and an anode of the cable is connected to the connected conductive layer; and/or the cable is a coaxial cable.

Optionally, the piezoelectric block includes an edge piezoelectric block located at an edge of the piezoelectric block array and a transducing piezoelectric block located inside the edge piezoelectric block, and the positive conductive layer is disposed on the transducing piezoelectric a front surface of the block, at least one side of the edge piezoelectric block, a front conductor layer and a conductor layer on the back surface of the piezoelectric block array, and a negative electrode of the cable is connected to at least one of the edge piezoelectric blocks Front conductor layer; and/or,

An electrode dividing groove is disposed on the back surface of the piezoelectric block array, and a conductive layer for connecting the back electrode of each piezoelectric block array is disposed on the back surface of the piezoelectric block array.

Optionally, the coupling device includes a coupling housing connected to the housing, a front end of the coupling housing is provided with a sound-permeable membrane, and the piezoelectric material component faces the sound-permeable membrane, and the coupling housing is inside the coupling housing Set with a coupling agent.

Optionally, the coupling housing is conical or cylindrical; and/or the sound permeable membrane is spherically connected to the front end of the coupling housing.

Optionally, the coupling housing is coupled to the front end of the housing, and the coupling depth of the coupling housing and the housing is adjustable.

Optionally, the coupling housing is screwed to the housing, or the coupling housing is sleeved on the housing and a gap is formed between the coupling housing and the housing.

Optionally, the coupling housing is provided with a card slot for mating with the magnetic resonance gradient coil; and/or the coupling housing and the housing are made of bakelite or epoxy.

The invention also provides a method for manufacturing a magnetic compatible brain ultrasonic stimulation device, comprising the following steps:

Preparing a coupling device, a housing, a piezoelectric material component, and a cable;

Providing the piezoelectric material component in the housing, connecting the coupling device to the housing;

Wherein, preparing the piezoelectric material component comprises the following steps:

Preparing a piezoelectric block array step: preparing a plurality of array-arranged piezoelectric blocks and an insulator for connecting adjacent ones of the piezoelectric blocks, connecting the insulators to adjacent ones of the piezoelectric blocks to form a pressure Electric block array,

a step of preparing a conductive layer: providing a conductor layer on a surface of the piezoelectric block array, and disposing at least a part of the conductor layer on the front surface of the piezoelectric block array into a plurality of positive conductive layers on a front surface of the piezoelectric block array The electrode dividing groove, the conductor layer on the back surface of the piezoelectric block array is a negative electrode conductive layer simultaneously connected to the back surface of the plurality of piezoelectric blocks;

Connecting the cable: electrically connecting the positive electrode of the cable to each of the positive conductive layers, and electrically connecting the negative electrode of the cable to the negative conductive layer.

Optionally, before connecting the positive pole of the cable, a conductive layer simultaneously connected to each of the positive conductive layers is disposed on a front surface of the piezoelectric block array, and an anode of the cable is connected to the Connect the conductive layer.

Optionally, in the step of preparing the conductive layer, the method further includes: dividing the piezoelectric block at the edge of the piezoelectric block array into edge piezoelectric blocks, and the conductive layer of the front side, the side surface, and the back side of the edge piezoelectric block The negative conductive layer is connected, and the negative electrode of the cable is connected to the conductive layer on the front side of at least one of the edge piezoelectric blocks.

Optionally, the piezoelectric material component is placed in the housing, and after the cable is connected to the piezoelectric material component, a coupling shell having a sound-permeable membrane is connected at the front end of the housing connection, and is coupled A couplant is placed in the outer casing.

Optionally, in the step of preparing the piezoelectric block array, the following steps are included:

Forming a piezoelectric sheet, opening a first partition in a first direction on a front surface of the piezoelectric sheet, filling an insulator in the first partition; opening and opening in a second direction on a front surface of the piezoelectric sheet a second compartment intersecting the first compartments, wherein the second compartments are filled with an insulator;

Removing a set thickness of the material on the back side of the piezoelectric sheet, so that the first spacer and the second spacer divide the piezoelectric sheet into mutually independent piezoelectric blocks, and the adjacent piezoelectric blocks are separated by Said insulation connection.

Optionally, in the step of preparing the conductive layer, the following steps are included:

Depositing a conductive layer on the surface of the piezoelectric block array, and forming a first slit and a second slit intersecting at a front surface of the piezoelectric block array and having a depth of cut greater than or equal to a thickness of the conductive layer as an electrode division a slot, the first slot and the second slot are respectively disposed along the first slot and the second slot, the first slot and the second slot conductively conducting a portion of the front surface of the piezoelectric block array The layer is divided into a plurality of the positive conductive layers, and the first and second slits simultaneously divide the plurality of array blocks of the piezoelectric block array into transducing piezoelectric blocks.

Optionally, after the first slot and the second slot are disposed on the surface of the piezoelectric block array, the piezoelectric block array is pressed into a curved shape, and the piezoelectric block array has the first One side of the grooving and the second grooving is an inner curved surface or an outer curved surface;

Alternatively, the piezoelectric block array having the first slit and the second slit is pressed into a spherical shape, and one side of the first block and the second slit of the piezoelectric block array is an inner spherical surface or Outer sphere.

Beneficial effect

The invention provides a magnetic compatibility brain ultrasonic stimulation device and a manufacturing method thereof, and the magnetic compatibility brain ultrasonic stimulation device can be supplemented with a matched ultrasonic electronic system and a magnetic resonance system to accurately perform ultrasound on an animal brain causative cell nuclei Stimulate and use the magnetic resonance system to monitor the position, intensity and effect of the stimulus to explore and verify the therapeutic effect of ultrasound on the brain disease of the animal. It is easy to operate and easy to use. It does not generate radio frequency interference during magnetic resonance imaging. Image quality good.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings to be used in the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without paying any creative work.

1 is a perspective exploded view of a magnetic compatibility brain ultrasonic stimulation device according to an embodiment of the present invention;

2 is a perspective exploded view of a magnetic compatibility brain ultrasonic stimulation device according to an embodiment of the present invention;

3 is a perspective view of a piezoelectric block array in a magnetic compatibility brain ultrasonic stimulation device (when no conductive layer is provided and when an electrode is not formed);

4 is a perspective view of a piezoelectric material component (after providing a conductive layer and opening an electrode dividing groove) in a magnetic compatible brain ultrasonic stimulation device according to an embodiment of the present invention;

Figure 5 is a perspective view of the piezoelectric material member of Figure 4 after the matching layer is provided;

6 is a schematic perspective view of the piezoelectric material member of FIG. 4 after the conductive layer is disposed and connected to the cable;

7 is a perspective view showing a magnetic compatibility brain ultrasonic stimulation device in a preparation process according to an embodiment of the present invention;

8 is a perspective view of a piezoelectric sheet in a method of manufacturing a magnetic compatible brain ultrasonic stimulation device according to an embodiment of the present invention;

Figure 9 is a perspective view showing the first spacer of the piezoelectric sheet of Figure 8;

Figure 10 is a perspective view showing the first spacer of the piezoelectric sheet of Figure 9 filled with an insulating polymer;

Figure 11 is a perspective view showing the second spacer of the piezoelectric sheet of Figure 10;

Figure 12 is a perspective view showing the second spacer of the piezoelectric sheet of Figure 11 filled with an insulating polymer;

Figure 13 is a perspective view showing the piezoelectric element array after the back surface material of the piezoelectric sheet of Figure 12 is removed;

Figure 14 is a perspective view showing the surface of the piezoelectric block array of Figure 13 after the conductive layer is disposed;

Figure 15 is a perspective view showing the electrode dividing groove provided on the front surface of the piezoelectric block array of Figure 14;

Figure 16 is another perspective view showing the electrode dividing groove provided on the front surface of the piezoelectric block array of Figure 14;

17 is a schematic plan view showing a method of manufacturing a magnetic compatibility brain ultrasonic stimulation device according to an embodiment of the present invention, in which a piezoelectric block array is pressed by a mold;

FIG. 18 is a perspective view showing a method of manufacturing a magnetic compatibility brain ultrasonic stimulation device according to an embodiment of the present invention, in which a piezoelectric material component is placed in a casing and a cable is connected.

Embodiments of the invention

The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It is to be noted that when an element is referred to as being "fixed" or "in" another element, it can be directly on the other element or the central element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or the central element.

It should also be noted that the left, right, upper, lower, and the like orientations in the embodiments of the present invention are merely relative concepts or referenced to the normal use state of the product, and should not be considered as limiting. .

As shown in FIG. 1 to FIG. 7 , a magnetic compatibility brain ultrasonic stimulation device according to an embodiment of the present invention includes a transducer device 1 and a coupling device 6 , and the transducer device 1 includes a housing 11 , a piezoelectric material component 2 , and The cable 3, the piezoelectric material member 2 is disposed in the housing 11, and the coupling device 6 is coupled to the front end of the housing 11, and the cable 3 is extendable from the rear end of the housing 11 and connected to the piezoelectric material member 2.

The piezoelectric material component 2 includes a piezoelectric block array 200 including an array of piezoelectric blocks 20, the adjacent piezoelectric blocks 20 being separated by a spacer, and the piezoelectric block array 200 further comprising a filling block Insulating spacers for connecting adjacent piezoelectric blocks 20 (such as insulating polymers 910, 920 as shown in FIGS. 10 and 12); insulating polymers may be connected to the respective piezoelectric blocks 20 on the one hand, and It is used to suppress crosstalk interference between the piezoelectric blocks 20.

The surface of the piezoelectric block array 200 is provided with a conductor layer (which may be a sputtered metal conductor layer), and the front surface of the piezoelectric block array 200 is provided with at least a part of the conductor layer for dividing the front surface of the piezoelectric block array 200 into a plurality of positive conductive layers. The electrode zoning of the layer 221 is disposed on the front surface of each of the plurality of piezoelectric blocks 20, the conductive layer on the back surface of the piezoelectric block array 200 is the negative electrode conductive layer 222, and the negative electrode conductive layer 222 is simultaneously connected to the plurality of piezoelectric blocks. The back surface of 20 is connected, and each positive conductive layer 221 is electrically connected to the positive electrode 32 of the cable 3, and the negative conductive layer 222 is electrically connected to the negative electrode of the cable 3. Optionally, the cable 3 is a coaxial cable. At least one cable 3 (coaxial cable) is required to connect the piezoelectric material component 2, and radio frequency interference is not generated during magnetic resonance imaging, and the imaging quality is good.

Optionally, each of the positive conductive layers 221 is provided with a conductive layer 23, and the positive electrode 32 of the cable 3 (coaxial cable) is connected to the conductive layer 23, and the conductive layer 23 can be simultaneously covered on each of the positive conductive layers 221 .

In this embodiment, the piezoelectric block 20 includes an edge piezoelectric block 22 at the edge of the piezoelectric block array 200 and a transducing piezoelectric block 21 located inside the edge piezoelectric block 22. The positive conductive layer 221 is disposed on the transducing piezoelectric block. On the front side of the 21, the front surface of the transducing piezoelectric block 21 has a positive electrode conductive layer 221, that is, the piezoelectric block 20 provided with the positive electrode conductive layer 221 is a transducing piezoelectric block 21. The side surface of at least one edge piezoelectric block 22, the conductor layer 223 on the front side are electrically connected to the conductor layer (negative electrode conductive layer 222) on the back surface of the piezoelectric block array 200, and the negative electrode 31 of the cable 3 is connected to at least one of the edge piezoelectric blocks 22 The conductor layer 223 on the front side allows the negative electrode of the cable 3 to be electrically conducted to the negative conductive layer 222 at the same time.

Alternatively, the conductor layer (negative electrode conductive layer 222) on the back side of the piezoelectric block array 200 may continue to add the matching layer 5 and the acoustic lens to increase the transmission efficiency and focusing effect of the probe. The function of the matching layer 5 is to ensure that the acoustic energy can be output more efficiently on the one hand, and as a substrate of the composite material on the other hand, to protect the piezoelectric material and the insulating electrode. The acoustic lens can increase the focus of the probe. In a specific application, the matching layer may not be added, and a protective layer may be added after the transducer is prepared.

In a specific application, electrode dividing grooves may be disposed on the back surface of the piezoelectric block array 200, and electrodes on the back surface of each piezoelectric block array 200 may be connected by providing a conductive layer to facilitate wiring. That is, the front and back sides of the piezoelectric block array 200 may be provided with electrode dividing grooves. Of course, the electrode dividing grooves may be provided only on the front surface of the piezoelectric block array 200.

Optionally, the coupling device 6 includes a coupling housing 61 connected to the housing 11. The front end of the coupling housing 61 is provided with a sound-permeable membrane 62. The piezoelectric material component 2 faces the sound-permeable membrane 62, and the coupling housing 61 is provided with a coupling agent. .

Alternatively, the coupling housing 61 may have a conical shape or a cylindrical shape. Of course, the coupling housing 61 may also have other suitable shapes; and/or the sound-transmitting membrane 62 may be connected in a curved shape (for example, a spherical shape or a curved surface). The front end of the outer casing 61 is coupled. In a specific application, the shape of the piezoelectric material (piezoelectric material member 2) is not limited to a rectangular shape, and may be other shapes such as a circular shape. The shape of the coupling housing 61 is not limited to the tapered housing, but may be a cylindrical housing or the like.

Optionally, the coupling housing 61 is coupled to the front end of the housing 11 , and the coupling depth of the coupling housing 61 and the housing 11 is adjustable.

Optionally, the coupling housing 61 is screwed to the housing 11 , or the coupling housing 61 is sleeved on the housing 11 and has a gap between the coupling housing 61 and the housing 11 , and the coupling housing 61 and the housing 11 can be adjusted. the distance.

Optionally, the coupling housing 61 is provided with a card slot for mating with the magnetic resonance gradient coil, and the magnetic resonance gradient coil can be sleeved at the card slot. On the one hand, it is ensured that the magnetic resonance gradient coil is closer to the measured portion, and on the other hand, the probe acoustic head is prevented from being caught in the magnetic resonance gradient coil. Both aspects guarantee better magnetic compatibility.

Alternatively, the coupling housing 61 and the housing 11 may be made of a magnetic compatibility material such as bakelite or epoxy resin to further ensure magnetic compatibility.

Optionally, a rear cover 12 is connected to the rear end of the housing 11. The housing 11 can be filled with a package adhesive. After the housing 11 is installed, the package is filled and the back cover 12 is added to prepare a final transducer. The electrode is sputtered at the front end of the transducer to conduct the element electrode. The back cover 12 may be provided with a through hole through which the cable 3 passes.

In a specific application, an animal suffering from a brain disease such as depression (for example, a rabbit) may be placed in a magnetic resonance apparatus, and the above-mentioned magnetic compatible brain ultrasonic stimulation device is used to perform precise ultrasonic stimulation on the brain mass of the diseased animal and simultaneously The stimulation was observed using a magnetic resonance imaging device. The device accurately positions the stimulus for easy portability and operation without any interference with magnetic resonance imaging.

The embodiment of the invention further provides a method for manufacturing a magnetic compatibility brain ultrasonic stimulation device, which can be used for manufacturing the above-mentioned magnetic compatibility brain ultrasonic stimulation device, comprising the following steps:

Preparing the coupling device 6, the housing 11, the piezoelectric material part 2 and the cable 3;

The piezoelectric material component 2 is disposed in the housing 11, the coupling device 6 is coupled to the housing 11;

Wherein, preparing the piezoelectric material part 2 comprises the following steps:

The piezoelectric block array 200 is prepared by: preparing a plurality of arrays of piezoelectric blocks 20 and insulating materials for connecting adjacent piezoelectric blocks 20, and connecting the insulators between adjacent piezoelectric blocks 20 to form piezoelectric blocks. Array 200,

a step of preparing a conductive layer: a conductor layer is disposed on a surface of the piezoelectric block array 200, and an electrode for dividing at least a part of the conductor layer on the front surface of the piezoelectric block array 200 into a plurality of positive conductive layers 221 is disposed on a front surface of the piezoelectric block array 200 Dividing the groove, the conductor layer on the back of the piezoelectric block array 200 is a negative electrode conductive layer 222 simultaneously connected to the back surface of the plurality of piezoelectric blocks 20;

Connecting the cable 3: electrically connecting the positive electrode 32 of the cable 3 to each of the positive conductive layers 221, and electrically connecting the negative electrode of the cable 3 to the negative conductive layer 222, at least one cable 3 (coaxial cable) is required The piezoelectric material part 2 can be connected, and radio frequency interference is not generated during magnetic resonance imaging, and the imaging quality is good.

Optionally, before connecting the positive pole of the cable 3, a conductive layer 23 is formed on the front surface of the piezoelectric block array 200, and the conductive layer 23 is connected to the positive conductive layer 221 at the same time. On the layer 221, the positive electrode 32 of the cable 3 is connected to the conductive layer 23 so that the positive electrode 32 of the cable 3 is electrically connected to each of the positive conductive layers 221 .

Optionally, in the step of preparing the conductive layer, the method further comprises: dividing the piezoelectric block 20 at the edge of the piezoelectric block array 200 into the edge piezoelectric block 22, and the conductive layer 223 of the front side, the side surface and the back side of the edge piezoelectric block 22 The negative conductive layer 222 is connected to connect the negative electrode 31 of the cable 3 to the conductive layer 223 on the front side of at least one of the edge piezoelectric blocks 22. In this embodiment, the piezoelectric block 20 includes an edge piezoelectric block 22 at the edge of the piezoelectric block array 200 and a transducing piezoelectric block 21 located inside the edge piezoelectric block 22. The positive conductive layer 221 is disposed on the transducing piezoelectric block. On the front side of the 21, the front surface of the transducing piezoelectric block 21 has a positive electrode conductive layer 221, that is, the piezoelectric block 20 provided with the positive electrode conductive layer 221 is a transducing piezoelectric block 21. The side surface of at least one edge piezoelectric block 22, the conductive layer 223 on the front side are electrically connected to the conductor layer on the back surface of the piezoelectric block array 200, and the negative electrode of the cable 3 is connected to the conductor layer 223 on the front surface of at least one of the edge piezoelectric blocks 22, thereby The negative electrode of the cable 3 can be electrically conducted to the negative conductive layer at the same time.

Optionally, after the piezoelectric material part 2 is placed in the housing 11 and the cable 3 is connected to the piezoelectric material part 2, the coupling housing 61 having the sound-permeable membrane 62 at the front end is connected to the housing 11 and coupled A coupling agent is disposed in the outer casing 61. The coupling housing 61 can be screwed to the front end of the housing 11, or the coupling housing 61 can also be disposed with a small gap from the housing 11, and the distance between the front end of the coupling housing 61 and the front end of the housing 11 can be adjusted.

Optionally, in the step of preparing the piezoelectric block array 200, the following steps are included:

As shown in FIG. 8 to FIG. 12, a piezoelectric sheet is prepared. A first spacer 901 is opened in a first direction on a front surface of the piezoelectric sheet 210, and an insulator 910 is filled in the first spacer 901. a second partition 902 perpendicularly intersecting the first partition 901 is formed in the second direction, and the second partition is filled with the insulator 920;

As shown in FIG. 13, the material of the set thickness of the back surface of the piezoelectric sheet 210 is removed, so that the insulators in the first spacer 901 and the second spacer 902 separate the piezoelectric sheet 210 into mutually independent piezoelectric blocks 20. The adjacent piezoelectric blocks 20 are connected by an insulator.

In a specific application, as shown in Figs. 8 to 13, a ceramic piezoelectric sheet 210 can be taken and cut into a set size. As shown in FIG. 9, the first slit is formed along the lateral direction of the piezoelectric sheet to form the first partition 901. The interval of the cutting and the depth of the cut can be determined by the acoustic characteristics of the transducer, and the cut M-row piezoelectric ceramic column . As shown in FIG. 10, an insulating polymer 910 is added to the first spacer 901, and the insulating polymer 910 can be connected to the piezoelectric ceramic column on the one hand and the suppression between the array elements (ie, the piezoelectric block 20) on the other hand. Crosstalk interference. As shown in FIG. 11, the second slit is formed along the longitudinal direction of the piezoelectric sheet after the insulating polymer 910 is added in the first partition 901, and the interval between the cutting and the depth of the cut can be changed by the transducer. The acoustic characteristics determine that the N columns of ceramic columns that are cut are determined by the matrix of the design elements. As shown in FIG. 12, an insulating polymer 920 is added to the second spacer 902. The insulating polymer 920 can be connected to the N rows of piezoelectric ceramic columns on the one hand and to suppress crosstalk interference between the elements on the other hand. As shown in FIG. 13, the excess piezoelectric material on the bottom surface of the piezoelectric sheet filled with the insulating polymer 920 is ground, and the piezoelectric sheet filled with the insulating polymer 920 is at least ground to the first partition 901 and the second. The bottom surface of the spacer 902 prepares a two-dimensional M*N array composite (piezo block array 200) for the transducer, and each piezoelectric block 20 can be completely separated by an insulating polymer. As shown in FIG. 14, the surface sputter electrode of the two-dimensional M*N array composite prepared above was formed into a conductor layer. As shown in FIGS. 15 and 16, the composite material (piezoelectric block array 200) in which the electrodes are sputtered is divided into electrodes along the grooving position, and when the electrodes are divided, the electrode dividing grooves (including the first intersecting grooves 801 and the first intersecting portions) The second slit 802) has a certain depth of cut to ensure that the material is not broken when the curved surface is formed. The electrode dividing groove is provided along the partition, and the electrode dividing groove forms a plurality of positive conductive layers 221 on the front surface of the piezoelectric block array 200. The partitions can be arranged in a crisscross manner, and the electrode dividing grooves can also be arranged in a crisscross manner. That is, the depth of the electrode dividing groove is larger than the thickness of the conductor layer and smaller than the thickness of the spacer, and the negative conductive layer 222 cut to the back surface of the piezoelectric block array 200 is avoided. It can be understood that when the electrode dividing groove is opened, only part or all of the conductor layer on the partition and a part of the insulation in the groove are removed. In a specific application, the width of the electrode dividing groove may be less than or equal to the width of the groove. As shown in FIG. 5, a matching layer 5 is added to the bottom of the composite material (piezoelectric block array 200), and the thickness of the matching layer 5 satisfies the thickness required for acoustic performance. The function of the matching layer 5 is to ensure that the acoustic energy can be output more efficiently on the one hand, and to protect the piezoelectric material and the insulating electrode as a substrate of the composite material on the other hand. As shown in Fig. 17, the material prepared above was pressed into a curved surface using a mold/clamp.

Optionally, in the step of preparing the conductive layer, the following steps are included:

The surface of the piezoelectric block array 200 is sputtered with a conductive layer, and the first slit 801 and the second slit 802 intersecting at the front surface of the piezoelectric block array 200 and having a depth of cut greater than or equal to the thickness of the conductive layer are used as electrode dividing grooves. The first slot 801 and the second slot 802 are respectively disposed along the first slot 901 and the second slot 902. The first slot 801 and the second slot 802 divide a portion of the conductive layer on the front surface of the piezoelectric block array 200 into a plurality of positive conductive layers 221, and the first slits 801 and the second slits 802 simultaneously divide the plurality of array blocks of the piezoelectric block array 200 into the transducing piezoelectric blocks 21;

Further, a conductive layer 23 is formed on the front surface of the piezoelectric block array 200 to be in contact with each of the positive conductive layers 221 . Specifically, after the first slit 801 and the second slit 802 are disposed on the surface of the piezoelectric block array 200, the piezoelectric block array 200 is pressed into a curved shape, and the piezoelectric block array 200 has a first slit 801 and One side of the second slit 802 is an inner curved surface or an outer curved surface;

Alternatively, the piezoelectric block array 200 having the first slit 801 and the second slit 802 is pressed into a spherical shape, and one side of the piezoelectric block array 200 having the first slit 801 and the second slit 802 is an inner spherical surface or Outer sphere. When the electrode is divided, it has a certain depth of cut to ensure that the material is not broken when the curved surface or the spherical surface is formed.

In this embodiment, the spherical composite piezoelectric composite wires are bonded (the electrodes of the back array elements are all connected before the lead wires, and the surface of all the array elements are covered by the conductive polymer), and the positive and negative electrodes are taken out by the coaxial shielded cable wires. .

As shown in Fig. 18, after the outer casing 11 is installed, the inner casing 11 is filled and the rear cover 12 is added to prepare a final transducer (finally, the electrode is sputtered at the front end of the transducer, and the electrode of the array element is turned on).

The transducer is coupled to the coupling housing 61. The front end of the coupling housing 61 is a sound-permeable membrane 62. Various coupling agents can be added to the coupling housing 61. The outer cylindrical surface of the housing 11 and the inner cylindrical surface of the coupling housing 61 in the transducer may be a threaded fit or a small clearance fit. By adjusting the fitting depth of the housing 11 and the coupling housing 61, the depth of the focus stimulation can be adjusted. .

A magnetic compatibility brain ultrasonic stimulation device and a method of manufacturing the same according to embodiments of the present invention, the magnetic compatibility brain ultrasonic stimulation device includes an ultrasonic transducer (housing 11, piezoelectric material component 2 and cable 3) and coupling Device 6. The ultrasonic probe (piezoelectric material part 2) in the ultrasonic transducer can be prepared as a spherical single-element surface focusing transducer by using a composite material, and the coupling device 6 is used to add a coupling agent to ensure that the ultrasonically enters the stimulated tissue efficiently and can adjust the coupling. Device 6 is used to adjust the depth of focus. The magnetic compatibility brain ultrasound stimulation device can be supplemented with a matched ultrasound electronic system and a magnetic resonance system to perform precise ultrasonic stimulation on the animal brain causative cell nuclei, and use a magnetic resonance system to monitor the position, intensity and effect of the stimulation to explore And verifying the therapeutic effect of ultrasound on animal brain diseases, the operation is simple, easy to use, no radio frequency interference occurs during magnetic resonance imaging, and the imaging quality is good.

The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the spirit and scope of the present invention should be included in the scope of the present invention. Inside.

Claims (15)

1. A magnetic compatible brain ultrasonic stimulation device, comprising: a coupling device and a transducer device, the transducer device comprising a housing, a piezoelectric material component and a cable, the piezoelectric material component being disposed on the shell In the body, the coupling device is coupled to the housing;

   The piezoelectric material component includes an array of piezoelectric blocks including an array of piezoelectric blocks, adjacent to the piezoelectric blocks being separated by a spacer, the piezoelectric block array further comprising An insulator filled in the spacer and used to connect adjacent ones of the piezoelectric blocks;

   The surface of the piezoelectric block array is provided with a conductor layer, and the front surface of the piezoelectric block array is provided with electrode dividing grooves for dividing at least a part of the conductor layer on the front surface of the piezoelectric block array into a plurality of positive conductive layers, each The positive conductive layers are respectively disposed on the front surface of the plurality of piezoelectric blocks, the conductive layer on the back surface of the piezoelectric block array is a negative conductive layer, and the negative conductive layer is simultaneously connected to the back faces of the plurality of piezoelectric blocks, and each of the The positive conductive layer is electrically connected to the positive electrode of the cable, and the negative conductive layer is electrically connected to the negative electrode of the cable.
2. The magnetic compatibility brain ultrasonic stimulation device according to claim 1, wherein each of the positive conductive layers is provided with a conductive layer, and an anode of the cable is connected to the connected conductive layer; Or, the cable is a coaxial cable.
3. A magnetic compatibility brain ultrasonic stimulation device according to claim 1, wherein said piezoelectric block comprises an edge piezoelectric block located at an edge of said piezoelectric block array and a transmutation located inside said edge piezoelectric block a piezoelectric block, the positive conductive layer is disposed on a front surface of the transducing piezoelectric block, and a side surface of at least one of the edge piezoelectric blocks, a conductive layer on the front surface, and a conductive layer on a back surface of the piezoelectric block array are electrically connected, a negative electrode of the cable is connected to a conductor layer on a front surface of at least one of the edge piezoelectric blocks; and/or

   An electrode dividing groove is disposed on the back surface of the piezoelectric block array, and a conductive layer for connecting the back electrode of each piezoelectric block array is disposed on the back surface of the piezoelectric block array.
4. A magnetic compatibility brain ultrasonic stimulation device according to claim 3, wherein said coupling means comprises a coupling housing coupled to said housing, said front end of said coupling housing being provided with a sound permeable membrane, said The piezoelectric material member faces the sound-permeable membrane, and a coupling agent is disposed in the coupling housing.
5. A magnetic compatibility brain ultrasonic stimulation device according to claim 4, wherein said coupling housing is conical or cylindrical; and/or said sound permeable membrane is spherically connected to said coupling housing Front end.
6. The magnetic compatibility brain ultrasonic stimulation device according to claim 4, wherein the coupling housing is connected to the front end of the housing, and the coupling depth of the coupling housing and the housing is adjustable. .
7. A magnetic compatibility brain ultrasonic stimulation device according to claim 4, wherein said coupling housing is screwed to said housing, or said coupling housing is sleeved in said housing and said There is a gap between the coupling housing and the housing.
8. A magnetic compatibility brain ultrasonic stimulation device according to claim 4, wherein said coupling housing is provided with a card slot for mating with a magnetic resonance gradient coil; and/or said coupling housing and housing are Made of bakelite or epoxy.
9. A method for manufacturing a magnetic compatible brain ultrasonic stimulation device, comprising the steps of:

   Preparing a coupling device, a housing, a piezoelectric material component, and a cable;

   Providing the piezoelectric material component in the housing, connecting the coupling device to the housing;

   Wherein, preparing the piezoelectric material component comprises the following steps:

   Preparing a piezoelectric block array step: preparing a plurality of array-arranged piezoelectric blocks and an insulator for connecting adjacent ones of the piezoelectric blocks, connecting the insulators to adjacent ones of the piezoelectric blocks to form a pressure Electric block array,

   a step of preparing a conductive layer: providing a conductor layer on a surface of the piezoelectric block array, and disposing at least a part of the conductor layer on the front surface of the piezoelectric block array into a plurality of positive conductive layers on a front surface of the piezoelectric block array The electrode dividing groove, the conductor layer on the back surface of the piezoelectric block array is a negative electrode conductive layer simultaneously connected to the back surface of the plurality of piezoelectric blocks;

   Connecting the cable: electrically connecting the positive electrode of the cable to each of the positive conductive layers, and electrically connecting the negative electrode of the cable to the negative conductive layer.
10. A method of manufacturing a magnetic compatibility brain ultrasonic stimulation device according to claim 9, wherein before the positive electrode of the cable is connected, a layer is provided on the front surface of the piezoelectric block array simultaneously with each A conductive layer in contact with the positive conductive layer is connected, and an anode of the cable is connected to the connected conductive layer.
11. The method of manufacturing a magnetic compatibility brain ultrasonic stimulation device according to claim 9, wherein in the step of preparing the conductive layer, the method further comprises: dividing the piezoelectric block at the edge of the piezoelectric block array into edge pressure An electric block, a conductive layer of the front side, the side surface and the back side of the edge piezoelectric block is connected to the negative electrode conductive layer, and a negative electrode of the cable is connected to a conductive layer on a front surface of at least one of the edge piezoelectric blocks.
12. A method of manufacturing a magnetic compatibility brain ultrasonic stimulation device according to claim 9, wherein said piezoelectric material member is placed in said housing and a cable is connected to said piezoelectric material member Thereafter, a coupling outer casing having a sound-permeable membrane is attached to the front end of the casing, and a coupling agent is disposed in the coupling outer casing.
13. The method of manufacturing a magnetic compatibility brain ultrasonic stimulation device according to claim 9, wherein in the step of preparing the piezoelectric block array, the method comprises the following steps:

    Forming a piezoelectric sheet, opening a first partition in a first direction on a front surface of the piezoelectric sheet, filling an insulator in the first partition; opening and opening in a second direction on a front surface of the piezoelectric sheet a second compartment intersecting the first compartments, wherein the second compartments are filled with an insulator;

    Removing a set thickness of the material on the back side of the piezoelectric sheet, so that the first spacer and the second spacer divide the piezoelectric sheet into mutually independent piezoelectric blocks, and the adjacent piezoelectric blocks are separated by Said insulation connection.
14. The method of manufacturing a magnetic compatibility brain ultrasonic stimulation device according to claim 9, wherein in the step of preparing the conductive layer, the method comprises the steps of:

    Depositing a conductive layer on the surface of the piezoelectric block array, and forming a first slit and a second slit intersecting at a front surface of the piezoelectric block array and having a depth of cut greater than or equal to a thickness of the conductive layer as an electrode division a slot, the first slot and the second slot are respectively disposed along the first slot and the second slot, the first slot and the second slot conductively conducting a portion of the front surface of the piezoelectric block array The layer is divided into a plurality of the positive conductive layers, and the first and second slits simultaneously divide the plurality of array blocks of the piezoelectric block array into transducing piezoelectric blocks.
15. A method of manufacturing a magnetic compatibility brain ultrasonic stimulation device according to claim 14, wherein after the first slit and the second slit are provided on the surface of the piezoelectric block array, the piezoelectric The block array is pressed into a curved surface, and one side of the first block and the second cut groove of the piezoelectric block array is an inner curved surface or an outer curved surface;

    Alternatively, the piezoelectric block array having the first slit and the second slit is pressed into a spherical shape, and one side of the first block and the second slit of the piezoelectric block array is an inner spherical surface or Outer sphere.