KR20130119392A - Ultrasonic transducer, ultrasonic probe, and ultrasound image diagnosis apparatus - Google Patents

Abstract

PURPOSE: An ultrasonic transducer, an ultrasound probe, and an ultrasound diagnostic apparatus are provided to transmit an electric signal to each of piezoelectric elements through a side surface electrode, thereby facilitating the application to a two-dimensional alignment structure. CONSTITUTION: An ultrasonic transducer includes multiple piezoelectric elements (121), separate electrodes, side surface electrodes, and a side surface substrate (131). The multiple piezoelectric elements are arranged in at least one row. The separate electrodes are provided at least on any one surface of the upper and lower surfaces of each of the multiple piezoelectric elements. The side surface electrodes are extended toward one side surface of the multiple piezoelectric elements from the separate electrodes, respectively. The side surface substrate is attached to one side surface of the multiple piezoelectric elements, and has wires electrically connecting with the side surface electrodes, respectively.

Description

[0001] Ultrasonic transducer, ultrasonic probe, and ultrasonic diagnostic apparatus [0002]

The present disclosure relates to an ultrasonic transducer, an ultrasonic probe, and an ultrasonic diagnostic apparatus, and more particularly, to an ultrasonic transducer, an ultrasonic probe, and an ultrasonic diagnostic apparatus having an improved electrode connection structure.

An ultrasonic diagnostic apparatus is a device that irradiates an ultrasonic signal from a body surface of a subject toward a desired part in the body and obtains an image related to a defect of a soft tissue or a blood flow by using information of a reflected ultrasonic signal (ultrasonic echo signal) to be. The ultrasonic diagnostic apparatuses are small, inexpensive, real-time displayable, and capable of displaying X-ray images when compared with other image diagnostic apparatuses such as X-ray diagnostic apparatuses, CT scanners (Magnetic Resonance Images) It is widely used for the diagnosis of heart, abdomen, urinary and obstetrics.

The ultrasonic diagnostic apparatus includes an ultrasonic probe for transmitting an ultrasonic signal to a subject in order to obtain an ultrasonic image of the subject and receiving an ultrasonic echo signal reflected from the subject. The ultrasonic probe may include an ultrasonic transducer, a case in which an upper end is opened, a cover coupled to an upper end of the open case, and a direct contact with the surface of the subject. The ultrasonic transducer may be configured to reduce the difference in acoustic impedance between the piezoelectric layer and the object so that ultrasonic waves generated in the piezoelectric layer may be transmitted to the object as much as possible. An acoustic matching layer, an acoustic lens layer for focusing the ultrasonic waves traveling forward of the piezoelectric layer at a specific point, and a sound absorbing layer for preventing the ultrasonic waves from traveling backward of the piezoelectric layer to prevent image distortion. In such transducers, the piezoelectric layer is composed of a plurality of piezoelectric elements that are independently supplied with electrical signals, and electrical wiring for each piezoelectric element is an important factor in determining the characteristics, shape, manufacturing process, and cost of the transducer. It is becoming.

In the present disclosure, an ultrasonic transducer, an ultrasonic probe, and an ultrasonic diagnostic apparatus having improved electrode connection structures for electrical connection to a piezoelectric layer are provided.

According to one aspect of the present invention, an ultrasonic transducer includes: a plurality of piezoelectric elements arranged in at least one row; Individual electrodes on at least one of an upper surface and a lower surface of each of the plurality of piezoelectric elements; Side electrodes extending from the individual electrodes to one side of the plurality of piezoelectric elements, respectively; And a side substrate attached to one side of the plurality of piezoelectric elements, the side substrate including wires electrically connected to the side electrodes.

Side electrodes of the plurality of piezoelectric elements positioned in one column may have different heights.

The height of the side electrodes of the plurality of piezoelectric elements positioned in one column may be gradually decreased or gradually increased in the longitudinal direction of the column.

The wirings of the side substrate may include a first portion facing one side to the side electrodes, a second portion extending to one side end of the side substrate, and a third portion exposed to one side end of the side substrate. have.

The substrate of the side substrate is formed of a material having an anisotropic electrical conductivity having electrical conductivity in the thickness direction and electrical insulation in the surface direction, and the wirings of the side substrate are on the rear surface of the surface contacting the side electrodes of the substrate. Can be provided.

The substrate of the side substrate may be formed of an electrically insulating material, and the wirings of the side substrate may be provided on a surface contacting the side electrodes of the substrate.

The plurality of piezoelectric elements may be spaced apart from each other and arranged in two dimensions in rows and rows, and the side substrate may include a plurality of side substrates inserted into a gap between the columns of the plurality of piezoelectric elements.

The heights of the side electrodes of the piezoelectric elements of the first row may gradually decrease in the longitudinal direction of the column, and the heights of the side electrodes of the piezoelectric elements of the second row adjacent to the first column may gradually increase in the longitudinal direction of the column.

The wires of each of the plurality of side substrates may include a first portion facing the side electrodes one-to-one, a second portion extending to one side end of the side substrate, and a third portion exposed to one side end of the side substrate. A side end at which the third portions of the first side substrate attached to the piezoelectric elements in the first row are exposed and the third portions of the second side substrate attached to the piezoelectric elements in the second row are exposed; The side ends may be in opposite directions from each other.

A first connection substrate electrically connected to the exposed third portions of the first side substrate and a second connection substrate electrically connected to the exposed third portions of the second side substrate may be further provided.

The heights of the side electrodes of the piezoelectric elements of all the rows may all gradually decrease or increase in the same direction.

The wires of each of the plurality of side substrates may include a first portion facing the side electrodes one-to-one, a second portion extending to one side end of the side substrate, and a third portion exposed to one side end of the side substrate. The side ends of the plurality of side substrates to which the third portion is exposed may be in the same direction.

One connection substrate may be further provided to electrically connect the exposed third portions of the plurality of side substrates.

The substrate of the side substrate may be formed of a sound absorbing material.

The substrate of the side substrate may be formed of a flexible material.

Each of the individual electrodes may be a signal electrode provided under each of the plurality of piezoelectric elements, and a common electrode may be provided above the plurality of piezoelectric elements. In this case, the common electrode may further include upper electrodes provided on upper surfaces of each of the piezoelectric elements, and upper electrode plates commonly connected to the upper electrodes on upper surfaces of the upper electrodes.

An acoustic matching layer may be further provided between the upper electrodes and the upper electrode layer, and the acoustic matching layer may be formed of a conductive material, or at least a portion of an outer surface thereof may be coated with a conductive material.

The individual electrodes may be signal electrodes respectively provided on an upper portion of the piezoelectric elements, and a common electrode may be provided below the plurality of piezoelectric elements. In this case, a rear support part provided below the plurality of piezoelectric elements to support the plurality of piezoelectric elements is further provided, and the rear support part is formed of a conductive material to allow electrical connection to the common electrode.

An acoustic matching layer positioned on the plurality of piezoelectric elements may be further provided.

A rear support part may be further provided below the plurality of piezoelectric elements to support the plurality of piezoelectric elements.

A groove corresponding to a gap between the plurality of piezoelectric elements may be formed at a portion of the rear support portion that contacts the plurality of piezoelectric elements.

The rear support portion may be formed of a sound absorbing material at least in contact with the plurality of piezoelectric elements.

According to another aspect of the present invention, an ultrasonic probe includes a plurality of piezoelectric elements arranged in at least one row; Individual electrodes provided on at least one of an upper surface and a lower surface of each of the plurality of piezoelectric elements; Side electrodes extending from the individual electrodes to one side of the plurality of piezoelectric elements, respectively; And a side substrate attached to one side of the plurality of piezoelectric elements, the side substrate having wires for making electrical connections with the side electrodes, respectively. And a housing for accommodating the ultrasonic transducer.

According to another aspect of the present invention, there is provided an ultrasonic diagnostic apparatus comprising: an ultrasonic probe; And a signal processing device for generating an ultrasound image based on the ultrasound echo signal detected by the ultrasound probe, wherein the ultrasound probe comprises: a plurality of piezoelectric elements arranged in at least one column; Individual electrodes provided on at least one of an upper surface and a lower surface of each of the plurality of piezoelectric elements; Side electrodes extending from the individual electrodes to one side of the plurality of piezoelectric elements; And a side substrate attached to one side of the plurality of piezoelectric elements, the side substrate having wires for making electrical connections with the side electrodes, respectively. And a housing for accommodating the ultrasonic transducer.

According to another aspect of the present invention, there is provided a method of manufacturing an ultrasonic transducer, the method including: providing a piezoelectric layer; Forming an electrode layer on at least one surface of the piezoelectric layer; Attaching a support to the lower portion of the piezoelectric layer to form one block; Preparing a plurality of sub blocks by vertically cutting the blocks of the support and the piezoelectric layer at equal intervals; Forming a side electrode electrically connected to an electrode layer of the piezoelectric layer on one side of the cut sub-block of the support and the piezoelectric layer; Forming grooves at equal intervals from the uppermost surface to a portion of the support; Preparing a side substrate having a wiring pattern corresponding to the side electrode of the sub block; Attaching the side substrate to the sub-block in which the groove is formed: arranging and attaching the sub blocks to which the side substrate is attached in a width direction on a support block; And attaching a connection substrate to a side of the support block to which the subblocks are attached.

The method may further include detecting and selecting piezoelectric characteristics for each of the sub blocks to which the side substrate is attached, before the step of attaching the side blocks to which the side substrate is attached is arranged in the width direction on the support block.

The ultrasonic transducer, the ultrasonic probe, and the ultrasonic diagnostic apparatus according to the disclosed embodiments have the following effects.

First, it is possible to give an electrical signal to each of the piezoelectric elements through the side electrode, it is easy to apply to a two-dimensional array structure, and even to a stacked structure.

Second, when manufacturing an ultrasonic transducer, piezoelectric elements are assembled in units of heat, and thus, piezoelectric elements can be detected in units of heat to reduce characteristic dispersion, thereby minimizing variation in performance of the ultrasonic transducer.

1 is a schematic block diagram illustrating an ultrasonic diagnostic apparatus of an embodiment according to the present invention.
2 is a perspective view of an ultrasonic transducer according to an embodiment of the present invention.
3 is an exploded perspective view of the ultrasonic transducer of FIG. 2.
4 illustrates an example of piezoelectric elements of the ultrasonic transducer of FIG. 2.
FIG. 5 illustrates an example in which the first side substrate is attached to the side surfaces of the piezoelectric elements in odd rows in the ultrasonic transducer of FIG. 2.
6 illustrates an example in which the side substrate and the connection substrate are bonded to each other in the ultrasonic transducer of FIG. 2.
FIG. 7 illustrates an example in which a second side substrate is attached to side surfaces of even-numbered piezoelectric elements in the ultrasonic transducer of FIG. 2.
8 illustrates an example in which two connection boards are bonded to a side board in the ultrasonic transducer of FIG. 2.
Figure 9 shows an example in which the side substrate is attached to the side of the piezoelectric elements in the ultrasonic transducer of another embodiment according to the present invention.
Figure 10 shows an example in which the side substrate and the connecting substrate in the ultrasonic transducer of another embodiment according to the present invention.
11 is a perspective view of another embodiment of the ultrasonic transducer according to the present invention.
12 is an exploded perspective view of the ultrasonic transducer of FIG. 11.
FIG. 13 illustrates an example of piezoelectric elements of the ultrasonic transducer of FIG. 11.
FIG. 14 illustrates an example in which the side substrate of FIG. 13 is attached to side surfaces of the piezoelectric elements.
Figure 15 shows an example in which the side substrate is attached to the side of the piezoelectric elements in the ultrasonic transducer of another embodiment according to the present invention.
Figure 16 shows an example in which the side substrate and the connecting substrate in the ultrasonic transducer of another embodiment according to the present invention.
17A to 17K illustrate a method of manufacturing an ultrasonic transducer according to another embodiment according to the present invention.
18A to 18J illustrate a method of manufacturing another ultrasonic transducer according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, like reference numerals refer to like elements, and the size and thickness of each element may be exaggerated for clarity of explanation.

FIG. 1 is a schematic block diagram illustrating an ultrasonic diagnostic apparatus according to an embodiment of the present invention. Referring to FIG.

Referring to FIG. 1, the ultrasound diagnostic apparatus of the present embodiment includes an ultrasound probe 100 and a signal processing device 198. The ultrasound probe 100 may transmit an ultrasound wave 101 to an object (eg, a human body) 199 and an ultrasound transducer 110 that receives an ultrasound wave 102 reflected from the object 199, and an ultrasound wave. It includes a housing 180 for receiving the transducer 110. The ultrasonic probe 100 is electrically connected to the signal processing device 198 through a cable 190. The signal processing apparatus 198 controls the ultrasound probe 100 and generates an image of the object 199 based on an echo signal related to the information of the object detected by the ultrasound probe 100.

2 illustrates an example of the ultrasonic transducer 110 accommodated in the ultrasonic probe 100, and FIG. 3 is an exploded perspective view of the ultrasonic transducer 110 of FIG. 2. For convenience, FIG. 3 shows the first and second connection substrates 135 and 136 omitted. In addition, in FIG. 3, the upper ends of the side substrates 131 are shown to coincide with the upper surfaces of the piezoelectric elements 121, but as shown in FIG. 5, the upper ends of the side substrates 131 may be formed of an acoustic matching layer ( It may extend to coincide with the upper surface of the 140.

2 and 3, the ultrasonic transducer 110 according to the exemplary embodiment of the present invention may include a piezoelectric layer 120, an electrode connection unit 130, and a piezoelectric layer for electrical connection between the piezoelectric layer 120. The acoustic matching layer 140 is disposed on the upper surface of the 120, and the rear support part 150 is disposed on the lower surface of the piezoelectric layer 120.

The piezoelectric layer 120 includes a plurality of piezoelectric elements 121. The plurality of piezoelectric elements 121 operate individually and are arranged in a state spaced apart from each other by aligning m rows and n columns on a two-dimensional plane to exclude mutual interference. In this case, m and n are natural numbers, which may be the same as or different from each other. The plurality of piezoelectric elements 121 includes odd-numbered piezoelectric elements 121a and even-numbered piezoelectric elements 121b. Side electrode patterns of the piezoelectric elements 121a in odd rows and side electrode patterns of the piezoelectric elements 121b in even rows may be different from each other. The side electrode pattern of the piezoelectric elements 121 will be described later.

The electrode connection unit 130 may include side substrates 131 electrically connected to the lower electrodes 124 of the plurality of piezoelectric elements 121, and first and second side electrodes 131 electrically connected to the side substrates 131. The common electrode plates 139 electrically connected to the upper electrodes (123 in FIG. 4) of the plurality of piezoelectric elements 121 through the second connection substrates 135 and 136 and the upper surface of the acoustic bonding layer 140. Include.

The plurality of side substrates 131 are attached to side surfaces of the plurality of piezoelectric elements 121. As described above, as the plurality of piezoelectric elements 121 are arranged to be spaced apart from each other in a row and a column, horizontal gaps 128 and vertical gaps 128 are formed between the plurality of piezoelectric elements 121. Is formed. Thus, the first side substrate 131 is attached to the outer side of the first row of the plurality of piezoelectric elements 121, the remaining side substrates 131 are sandwiched in the horizontal gaps 128 of the plurality of piezoelectric elements 121. Lose. The number of side substrates 131 and the number of columns of the plurality of piezoelectric elements 121 are the same. The side substrates 131 may be formed of a sound absorbing material, such that interference by neighboring piezoelectric elements 121 may be suppressed when the plurality of piezoelectric elements 121 transmit and receive ultrasonic waves. The vertical gaps 129 in which the side substrates 131 are not inserted among the gaps between the plurality of piezoelectric elements 121 may be filled with a sound absorbing material, and interference by neighboring piezoelectric elements 121 may be suppressed. .

The side electrode pattern of the piezoelectric elements 121a in the odd-numbered row and the side electrode pattern of the piezoelectric elements 121b in the even-numbered row may be different. Accordingly, the wiring pattern of the odd-numbered side substrates 131a and the even-side side substrate The wiring patterns of the holes 131b may be different from each other. The wiring patterns of the side substrates 131 will be described later.

The first and second connection substrates 135 and 136 are substrates for integrating the wirings of the side substrates 131, and are attached to the outside of the plurality of piezoelectric elements 121. The first and second connection boards 135 and 136 may be flexible printed circuit boards or rigid printed circuit boards. The first and second connection substrates 135 and 136 may further include a circuit for processing electrical signals input to the piezoelectric elements 121 or electrical signals output from the piezoelectric elements 121. Wires integrated in the first and second connection substrates 135 and 136 are electrically connected to the signal processing device 198 through the cable 190 of FIG. 1.

The acoustic matching layer 140 is provided on the upper surface of the piezoelectric layer 120. The acoustic matching layer 140 may be provided only on the upper surface of each of the piezoelectric elements 121, and may be arranged to be spaced apart from each other. That is, in the acoustic matching layer 140, the horizontal gaps 148 and the vertical gaps 149 corresponding to the horizontal gaps 128 and the vertical gaps 129 between the piezoelectric elements 121 may be formed. have. The acoustic matching layer 140 transmits ultrasonic waves to or from the subject 199 by appropriately matching the acoustic impedance of the piezoelectric layer 120 and the acoustic impedance of the subject (199 in FIG. 1). It is a layer to reduce the loss. The acoustic matching layer 140 may adjust physical parameters such as thickness and acoustic impedance to match the acoustic impedance of the object 199 and the piezoelectric layer 120. For example, the acoustic matching layer 140 may be formed of two layers 141 and 142 having different acoustic impedances. In some cases, the acoustic matching layer 140 may be formed of one layer or three or more layers. An acoustic lens may be further provided on the upper surface of the acoustic matching layer 140 to focus ultrasonic waves traveling forward at a specific point.

An intermediate electrode layer 138 may be formed on an outer surface of the acoustic bonding layer 140 to electrically connect the upper electrodes 123 and the common electrode plate 139 of the plurality of piezoelectric elements 121. The acoustic bonding layer 140 may be formed of a conductive material. In this case, the intermediate electrode layer 138 may be omitted. In addition, when the acoustic bonding layer 140 is formed of a conductive material, the upper electrode 123 provided on the upper surface of each of the plurality of piezoelectric elements 121 may also be omitted.

In the present exemplary embodiment, the acoustic bonding layer 140 is provided on only the upper surface of each of the plurality of piezoelectric elements 121 and is arranged to be spaced apart from each other, but the present disclosure is not limited thereto. For example, the acoustic bonding layer 140 may be attached to the top surface of the plurality of piezoelectric elements 121 as one layer.

The rear support part 150 is a block supporting the piezoelectric layer 120. The upper part 151 of the rear support part 150 may be formed of unit blocks spaced apart from each other to correspond to the plurality of piezoelectric elements 121. That is, the upper portion 151 of the rear support part 150 is recessed so that the horizontal gaps 158 and the vertical gaps extending from the vertical gaps 128 and the horizontal gaps 129 between the piezoelectric elements 121. 159 may be formed. The whole or at least the top 151 of the back support 150 is formed of an insulating material. In addition, the upper portion 151 of the rear support part 150 is formed as a rear sound absorbing layer so as to appropriately control the reflection of the ultrasonic waves generated in the piezoelectric layer 120, thereby preventing the ultrasonic waves from traveling to the rear of the piezoelectric layer 120. Image distortion can be prevented.

FIG. 4 illustrates piezoelectric elements 121 arranged in any one of a plurality of piezoelectric elements 121 arranged in a matrix in the ultrasonic transducer of FIG. 2. Referring to FIG. 4, each of the piezoelectric elements 121 includes a piezoelectric body 122 and an upper electrode 123 and a lower electrode 124 provided on upper and lower surfaces of the piezoelectric body 122. The piezoelectric body 122 is formed of a piezoelectric material in which an electrical signal and an acoustic signal are mutually converted. For example, the piezoelectric body 122 may be formed of a PZNT single crystal made of a solid solution of ceramics, zinc niobate and titanic acid lead zirconate titanate (PZT), a PZMT single crystal made of a solid solution of magnesium niobate and titanate . The piezoelectric body 122 is formed in a columnar shape having at least one side surface. For example, the piezoelectric body 122 may be formed in a rectangular parallelepiped shape. The shape of the piezoelectric body 122 may be modified according to the design. The upper electrode 123 is provided on the upper surface of the piezoelectric body 122. The upper electrode 123 may be a common electrode (or a ground electrode) of the piezoelectric elements 121. The upper electrode 123 of the piezoelectric elements 121 is electrically connected to the upper common electrode plate 138 via the intermediate electrode layer 138 provided on the outer surface of the acoustic matching layer 140.

The lower electrode 124 is provided on the lower surface of the piezoelectric body 122. The lower electrode 124 is an individual electrode provided in each of the piezoelectric elements 121, and may be a signal electrode to which an independent signal is applied. The lower electrode 124 extends to one side of the piezoelectric body 122 to form the side electrode 125. The side electrodes 125 are positioned on the side surfaces of the piezoelectric elements 121 arranged in a line in the same direction. The height H of the side electrodes 125 may be formed differently. As shown in FIG. 4, the height H of the side electrodes 125 may be formed to gradually decrease in the column direction (Y direction). As shown in FIG. 7, the height H of the side electrodes 125 may be gradually increased in the column direction (Y direction). In some cases, the heights H of the side electrodes 125 may be the same.

FIG. 5 illustrates an example in which the first side substrate 131a is attached to the side surfaces of the piezoelectric elements 121a in odd rows among the plurality of piezoelectric elements 121.

Referring to FIG. 5, the odd-numbered piezoelectric elements 121a include side electrodes 125 formed to gradually decrease in the column direction (Y direction).

The first side substrate 131a includes a substrate 1311 and wirings 1312. The substrate 1311 of the present embodiment may be formed of a material having anisotropic electrical conductivity. That is, the substrate 1311 has electrical conductivity in the thickness direction 1315 but has insulating properties in the surface direction 1316. As the substrate 1311 having such anisotropic electrical conductivity, a conductive rubber sheet, an insulating resin sheet containing electrically conductive particles, and the like are known. Further, the substrate 1311 may be formed of a sound absorbing material to suppress interference between neighboring piezoelectric elements 121. An upper end of the substrate 1311 may coincide with an upper end of the acoustic matching layer 140. The lower end of the substrate 1311 may cover at least a portion of the rear support part 150. Both side ends 1312c and 1312d of the substrate 1311 may correspond to both ends of the column direction of the piezoelectric elements 121a in an odd number of rows.

One surface 1311a of the substrate 1311 is in contact with a side surface on which side electrodes 125 of the piezoelectric elements 121a in odd rows are provided. Wirings 1312 corresponding to the side electrodes 125 are provided on the other surface 1311b of the substrate 1311. The wirings 1312 may include a first portion 1312a at least partially overlapping a position of the side electrodes 125, a second portion 1312b extending to the first side end 1311c of the substrate 1311, and a substrate; And a third portion 1312c exposed at the first side end 1311c of 1311. At least a portion of the first portion 1312a of the wirings 1312 overlaps the side electrodes 125 with the substrate 1311 interposed therebetween. Since the substrate 1311 has electrical conductivity in the thickness direction 1315, the side electrodes 125 and the first portion 1312a are electrically connected to each other. Since the substrate 1311 has an insulating property in the surface direction 1316, electrical insulation is maintained between neighboring wires 1312. The second portion 1312b of the wirings 1312 are arranged side by side in the vertical direction (ie, Z direction). As described above, the side electrodes 125 of the odd-numbered piezoelectric elements 121a are arranged in a column direction ( The height H gradually decreases toward the Y direction, thereby securing a space in which the second portion 1312b of the wirings 1312 are to be disposed.

FIG. 6 is an enlarged view of a portion A in FIG. 2, and illustrates an example in which the first side substrate 131a and the first connection substrate 135 are bonded to each other. Referring to FIG. 6, the first connecting substrate 135 is directly attached to the first side end 1312c of the first side substrate 131a. The first connecting substrate 135 is provided with connection terminals 1351 at positions facing the end 1312c of the odd side substrate 131a. Accordingly, the third terminals 1312c of the wires 1312 exposed at the first side end 1312c of the first side substrate 131a are directly aligned with the connection terminals 1351 of the first connection substrate 135. Touch to make an electrical connection.

FIG. 7 illustrates an example in which a second side substrate 131b is attached to side surfaces of even-numbered piezoelectric elements 121b among the plurality of piezoelectric elements 121. Referring to FIG. 7, the even-numbered piezoelectric elements 121b are formed such that the heights of the side electrodes 125 are gradually increased in the column direction (Y direction). Substantially the same as 121a). Meanwhile, the second side substrate 131b is substantially the same as the first side substrate 131a except for the pattern of the wirings 1312 of the substrate 1311. The wirings 1312 of the second side substrate 131b may include a first portion 1312a at least partially overlapping with positions of the side electrodes 125 of the even-numbered piezoelectric elements 121b and a first portion of the substrate 1311. The second portion 1312b may extend to the two side ends 1311d, and the third portion 1312c may be exposed to the second side ends 1311d of the substrate 1311. Here, the second side end 1311d of the substrate 1311 is a side end located on the side opposite to the column direction (Y direction) with respect to the first side end 1311c.

8 illustrates an example of electrical connection between the first and second side substrates 131a and 131b and the first and second connection substrates 135 and 136. Referring to FIG. 8, the side substrates 131 may include first side substrates 131a and second side substrates 131b. The first side substrates 131a are attached to the side surfaces of the piezoelectric elements 121a in odd rows, and the second side substrates 131b are attached to the side surfaces of the piezoelectric elements 121b in even rows. The wirings 1312 of the first side substrates 131a extend toward the first side end 1311c to expose the third portion 1312c to the first side end 1311c as shown in FIG. 5. The wirings 1312 of the second side substrates 131b extend toward the second side end 1311d so that the third portion 1312c is exposed to the second side end 1311d as shown in FIG. 7. The first connecting substrate 135 is attached to the first side end 1311c of the first side substrates 131a, and the connecting terminals 1351 of the first connecting substrate 135 are the first side substrates 131a. Electrical contact with the third portion 1312c of the wirings 1312 exposed at the first side end 1311c of FIG. Similarly, the second connection substrate 136 is attached to the second side end 1311d side of the second side substrates 131b, and the connection terminals 1361 of the second connection substrate 136 are second side substrates ( The third portion 1312c of the wires 1312 exposed at the second side end 1311d of 131b is in electrical contact. As such, the first and second side substrates 131a and 131b are alternately connected to each other and electrically connected to the first and second connection substrates 135 and 136, respectively. 136 may allow a clearance between the connecting terminals 1351, and thus, the first and second connecting substrates 135 and 136 may be connected to the side ends of the first and second connecting substrates 135 and 136. Tolerances can be ensured for attachment.

In this embodiment, all of the first side substrates 131a are electrically connected to the first connection substrate 135, and all of the second side substrates 131b are electrically connected to the second connection substrate 136. However, the present invention is not limited thereto. For example, in FIG. 5, some of the wires 1312 of the first side substrates 131a extend to the first side end 1312c, and the rest of the wires 1312 extend to the second side end 1312d. It may be. In this case, some of the wires 1312 of the first side substrates 131a are electrically connected to the first connection substrate 135, and the rest of the wires 1312 of the first side substrates 131a are The second connection substrate 136 will be electrically connected. Similarly, in FIG. 7, some of the wires 1312 of the second side substrates 131b extend to the first side end 1312c, and the rest of the wires 1312 extend to the second side end 1312d. Can be. In this case, some of the wires 1312 of the second side substrates 131b are electrically connected to the first connection substrate 135, and the rest of the wires 1312 of the second side substrates 131b are electrically connected. The second connection substrate 136 will be electrically connected.

Figure 9 shows an example in which the side substrate is attached to the side of the piezoelectric elements in the ultrasonic transducer of another embodiment according to the present invention. Referring to Figure 9, the ultrasonic transducer of the present embodiment is the same as the above-described embodiment except for the side substrate (131 '). The side substrate 131 'includes a substrate 1311' and wirings 1312 'provided on one surface 1311a' of the substrate 1311 '. The substrate 1311 ′ may be formed of an electrically insulating material. Further, the substrate 1311 ′ may be formed of a sound absorbing material such as a polymer material such as an epoxy resin. One surface 1311a ′ of the substrate 1311 ′ is attached to a side surface on which side electrodes 125 of the piezoelectric elements 121 are provided. Compared to the side substrate 131 described with reference to FIGS. 5 and 7, the substrate 1311 ′ of the present exemplary embodiment is insulated from the substrate 1311 ′, and thus the positions where the wirings 1312 ′ are formed are different. Except that it is substantially the same. In other words, the wirings 1312 'of the present exemplary embodiment are formed on the surface 1311a' where the substrate 1311 'is in contact with the piezoelectric elements 121. The wiring 1312' is formed on the surface 1311a '. The wirings 1312 'include a first portion 1312a' in which at least a portion of the side electrodes 125 of the piezoelectric elements 121 are in direct contact with each other, and a first side end 1311c 'of the substrate 1311'. The second portion 1312b 'may extend to the third portion 1312c' exposed to the first side end 1311c 'of the substrate 1311'. 5 and 7, the wiring patterns of the side substrates 131 ′ may vary depending on the patterns of the side electrodes 125 of the piezoelectric elements 121.

Figure 10 shows an example in which the side substrate and the connecting substrate in the ultrasonic transducer of another embodiment according to the present invention. Referring to FIG. 10, the third portions 1312c of the wirings exposed from the side substrates 131 are all positioned in the same direction, and accordingly, one connection substrate 135 ′ is used. This is different from the example. For example, the side substrates 131 may have the same wiring pattern as the first side substrates 131a described with reference to FIG. 5. Accordingly, all of the third portions 1312c of the wirings 1312 of all the side substrates 131 may be located in the same direction. In addition, the piezoelectric elements 121 in all rows corresponding to the wiring patterns of the side substrates 131 may have a height in the column direction (Y direction), like the piezoelectric elements 121a in the odd rows described with reference to FIG. 5. It may have a pattern of the side electrodes 125 to be smaller. The connection substrate 135 ′ includes connection terminals 1351 ′ provided at the side substrates 131 at a position contacting the third portion 1312c. Accordingly, the lower electrode 124 of all the piezoelectric elements 121 is externally connected to the side electrode 125, the side substrates 131, and one connection substrate 135 ′ extending from the lower electrode 124. Electrical connections are made.

In the above-described embodiments, the side substrates 131 and 131 'are formed so that the side ends thereof coincide with the outer surface of the assembly of the piezoelectric elements 121 arranged in a rectangular shape, so that the connection substrates 135, 136 and 135' are formed. The wires 1312 of the side substrates 131 and 131 'are led to the outside using the lateral direction. However, the connection boards 135, 136, 135 'can be omitted. For example, one side end of the side substrates 131 and 131 'may be extended to the outside of the outer surface of the assembly of the piezoelectric elements 121 arranged in a rectangular shape, and may be directly connected to an external cable.

11 is a perspective view of another ultrasonic transducer 210 according to the present invention, Figure 12 is an exploded perspective view of the ultrasonic transducer 210 of FIG. For convenience, FIG. 12 shows the first and second connection substrates 235 and 236 in an omitted state. In addition, in FIG. 12, the upper ends of the side substrates 231 are shown to coincide with the upper surfaces of the piezoelectric elements 221, but as shown in FIG. It may extend to coincide with the upper surface of 240.

11 and 12, the ultrasonic transducer 210 according to the present embodiment may include a piezoelectric layer 220, an electrode connection portion 230, and a piezoelectric layer 220 for electrical connection between the piezoelectric layer 220. The acoustic matching layer 240 is disposed on the upper surface, and the rear support part 250 is disposed on the lower surface of the piezoelectric layer 220.

The piezoelectric layer 220 includes a plurality of piezoelectric elements 221. The plurality of piezoelectric elements 221 are arranged in a state spaced apart from each other in a row and a column on a two-dimensional plane. The plurality of piezoelectric elements 221 may be divided into units of columns, and electrode patterns of the piezoelectric elements 221a in odd rows and electrode patterns of the piezoelectric elements 221b in even rows may be different from each other.

The electrode connector 230 may include side substrates 231 electrically connected to the upper electrodes 223 of FIG. 13, and first and second side electrodes 231. Second connection substrates 235 and 236 are included.

The plurality of side substrates 231 are attached to side surfaces of the plurality of piezoelectric elements 221. The electrode pattern of the piezoelectric elements 221a in the odd rows and the electrode pattern of the piezoelectric elements 221b in the even rows may be different. Accordingly, the wiring patterns and the even side plates 231b of the odd side substrates 231a may be different. ) May have different wiring patterns.

The first and second connection substrates 235 and 236 are substrates for integrating the wirings of the side substrates 231, and are attached to the outside of the plurality of piezoelectric elements 221. The first connection substrate 235 may be electrically connected to the odd side substrates 231a, and the second connection substrate 236 may be electrically connected to the even side substrates 231b.

The acoustic matching layer 240 is provided on the upper surface of the piezoelectric layer 220. The acoustic matching layer 240 may be provided only on the upper surface of each of the piezoelectric elements 221, and may be arranged to be spaced apart from each other. The acoustic matching layer 240 may be formed of two layers 241 and 242 having different acoustic impedances.

The rear support part 250 is a block supporting the piezoelectric layer 220. The upper part 251 of the rear support part 250 may be formed of unit blocks spaced apart from each other to correspond to the plurality of piezoelectric elements 221. That is, the upper portions 251 of the rear support part 250 have horizontal gaps 258 and vertical gaps 259 corresponding to the vertical gaps 228 and the horizontal gaps 229 between the piezoelectric elements 221. This can be formed. The whole or at least the upper portion 251 of the rear support part 250 is formed of a conductive material. When the piezoelectric layer 220 is supported by the rear support part 250, the lower electrodes (224 of FIG. 14) of the plurality of piezoelectric elements 221 are electrically connected to the rear support part 250, and thus the rear support part. The whole or at least the upper part 251 of the 250 serves as a common electrode of the plurality of piezoelectric elements 221. The lower electrodes 224 of the plurality of piezoelectric elements 221 may be omitted, such that the rear support part 250 may directly function as the lower electrode.

FIG. 13 illustrates piezoelectric elements 221 arranged in any one column among a plurality of piezoelectric elements 221 arranged in a matrix in the ultrasonic transducer 210 of FIG. 12. Referring to FIG. 13, each of the piezoelectric elements 221 includes a piezoelectric element 222 and an upper electrode 223 and a lower electrode 224 provided on upper and lower surfaces of the piezoelectric element 222. The upper electrode 223 is a separate electrode provided in each of the piezoelectric elements 221, and may be a signal electrode to which a signal is independently applied. The lower electrode 224 may be a common electrode of the piezoelectric elements 121. The upper electrode 223 extends to one side of the piezoelectric body 222 to form the side electrode 225. The side electrodes 225 are positioned on the side surfaces of the piezoelectric elements 221 arranged in a line in the same direction. In addition, the heights H of the side electrodes 225 may be formed differently. As shown in FIG. 13, the height H of the side electrodes 225 may be formed to gradually decrease in the column direction (Y direction). The height H of the side electrodes 225 may be formed to gradually increase in the column direction (Y direction). In some cases, the heights H of the side electrodes 225 may be the same.

14 illustrates an example in which the side substrate 231 is attached to the side surface of the piezoelectric elements 221 in the piezoelectric layer 220. Referring to FIG. 14, the side substrate 231 is attached to a side at which side electrodes 225 of the piezoelectric elements 221 are provided.

The side substrate 231 of the present embodiment includes a substrate 2311 and wirings 2312 provided. The substrate 2311 of the present exemplary embodiment may be formed of an anisotropic electrically conductive material having electrical conductivity in the thickness direction 2315 but insulating properties in the surface direction 2316. One surface 2311a of the substrate 2311 is attached to a side on which side electrodes 225 of the piezoelectric elements 221 are provided. The wirings 2312 are provided on the other surface 2311b opposite to one surface 2311a of the substrate 2311. The wirings 2312 include a first portion 2312a at least partially overlapping the side electrodes 225 of the piezoelectric elements 121 and the substrate 2311 therebetween, and a first side end 2311c of the substrate 2311. ) May include a second portion 2312b extending to the second side 2323b and a third portion 2312c exposed to the first side end 2311c of the substrate 2311. Since the substrate 2311 has electrical conductivity in the thickness direction 2315, the side electrodes 225 and the first portion 2312a of the piezoelectric elements 221 are electrically connected to each other. Since the substrate 2311 has an insulating property in the plane direction 2316, electrical insulation is maintained between neighboring wires 2312. Accordingly, the upper electrode 223 of the piezoelectric elements 221 may be connected to the outside through the side substrate 231. The lower electrode 224 of the piezoelectric elements 221 may be connected to the outside through the conductive rear support part 250.

The side electrode pattern of the piezoelectric elements 221 and the wiring pattern of the side substrate 231 shown in FIG. 14 may be understood to be odd-numbered rows, and the side electrode pattern of even-numbered piezoelectric elements 221b of FIG. The wiring pattern of the even side substrate 231b may be changed in substantially the same manner as the example described with reference to FIG. 7. That is, the wiring lines 2312 of the piezoelectric elements of the odd-numbered piezoelectric elements (221a of FIG. 12) are exposed toward one side end 2312c of the substrate 2311 to be electrically connected to the first connecting substrate 235, and the even-numbered piezoelectric elements The wirings 2312 of the fields 221b may be exposed to the other side end opposite to one side end of the substrate 2311 and may be electrically connected to the second connection board 236.

The ultrasonic transducer 210 of the present embodiment is formed by extending the side electrode 225 of the piezoelectric elements 121 from the upper electrode 223, whereby the wiring pattern of the side substrate 230 or the position of the common electrode is Except for being different, it is substantially the same as the ultrasonic transducer 110 of the embodiment described with reference to FIGS.

Figure 15 shows an example in which the side substrate is attached to the side of the piezoelectric elements in the ultrasonic transducer of another embodiment according to the present invention. Referring to FIG. 15, the components of the ultrasonic transducer of the present embodiment except for the side substrate 231 ′ are the same as the embodiments described with reference to FIGS. 11 to 14. The side substrate 231 'includes a substrate 2311' and wirings 2312 'provided on one surface 2311b' of the substrate 2311 '. The substrate 2311 ′ may be formed of an electrically insulating material. One surface 2311a ′ of the substrate 2311 ′ is attached to a side surface on which side electrodes 225 of the piezoelectric elements 221 are provided. The substrate 2311 'of the present embodiment is substantially the same except that the positions where the wirings 2312' are formed are different from those of the side substrate 231 described with reference to FIG. That is, the wirings 2312 'of the present embodiment are formed on the surface 2311a' where the substrate 2311 'is in contact with the piezoelectric elements 221. The wirings 2312 'include a first portion 2312a' in which at least a portion of the side electrodes 225 of the piezoelectric elements 221 directly contact each other, and a first side end 2311c 'of the substrate 2311'. And a second portion 2312b 'extending to the third portion 2312c' exposed to the first side end 2311c 'of the substrate 2311'. Similar to the description with reference to FIG. 14, the wiring patterns of the side substrates 231 ′ may vary depending on the pattern of the side electrodes 225 of the piezoelectric elements 221.

Figure 16 shows an example in which the side substrate and the connecting substrate in the ultrasonic transducer of another embodiment according to the present invention.

Referring to FIG. 16, the ultrasonic transducer of the present embodiment is the same as the embodiment described with reference to FIGS. 12 to 14 except for the electrical connection structure of the lower electrode 224 of the piezoelectric elements 221 ′. . In the present embodiment, the rear support part 250 is formed of an insulating material. Accordingly, the rear support part 250 may not be used as a lower common electrode of the piezoelectric elements 221 ′. Thus, in the present embodiment, the lower electrodes 224 are separately provided below the piezoelectric elements 221 ', and the lower electrodes 224 extend to the side surfaces of the piezoelectric elements 221' and thus the lower side surfaces. An electrode 226 is formed. In addition, a second wiring 2316 corresponding to the lower side electrodes 226 of the piezoelectric elements 221 ′ is provided on one surface 2311 a of the side substrate 231 ″. That is, the second wiring 2316 faces the lower side electrodes 226 of the piezoelectric elements 221 ′ with the substrate 2311 interposed therebetween, and the lower side electrodes (eg, by the electrical anisotropy of the substrate 2311). And electrical connection at the same time. The end of the second wiring 2316 is exposed toward the first side end 2311c of the side substrate 231 ″ like the third portion 2312c of the first wiring 2312. Accordingly, the lower electrodes 224 of the piezoelectric elements 221 ′ may be electrically connected or grounded to the outside through the side substrate and the connection substrate 235 and 236 of FIG. 11.

Next, the manufacturing method of the ultrasonic transducer according to another aspect of the present invention.

17A to 17K illustrate a method of manufacturing an ultrasonic transducer according to an embodiment of the present invention.

First, as shown in FIG. 17A, a flat piezoelectric body 122 is provided. Next, as illustrated in FIG. 17B, electrodes 123 and 124 are provided on the upper and lower surfaces of the piezoelectric body 122 to form the piezoelectric layer 120.

Similarly, as shown in Fig. 17C, a flat acoustic matching layer 140 is provided. The acoustic matching layer 140 may be formed of the first and second layers 141 and 142 having different acoustic impedances. Next, as shown in FIG. 17D, electrodes 138a and 138b are formed on the upper and lower surfaces of the acoustic matching layer 140. Any one of the upper electrode 123 of the piezoelectric layer 120 and the lower electrode 138b of the acoustic matching layer 140 may be omitted.

Next, as shown in FIG. 17E, the piezoelectric layer 120 is attached to the support 151, and the acoustic matching layer 140 is bonded to the upper portion of the piezoelectric layer 120. The upper electrode 123 of the piezoelectric layer 120 and the lower electrode 138b of the acoustic matching layer 140 are bonded.

Next, as shown in FIG. 17F, the blocks of the flat piezoelectric layer 120 and the acoustic matching layer 140 are vertically cut at equal intervals to provide a plurality of sub blocks 160. 17G shows one subblock 160 separated. The sub block 160 has a rectangular parallelepiped shape in one direction.

Next, as shown in FIG. 17H, electrode patterns are formed on side surfaces of the sub block 160. That is, the side electrodes 125 electrically connected to the lower electrode 124 of the piezoelectric body 122 are formed on the side of the piezoelectric body 122, and the side of the acoustic matching layer 140 of the acoustic matching layer 140 is formed. Side electrodes 138c are formed on the upper and lower surfaces to electrically connect the upper electrode 138a and the lower electrode 138b. The upper electrode 138a, the lower electrode 138b, and the side electrode 138c formed on the acoustic matching layer 140 form an intermediate electrode layer 138. As described above, the side electrodes 125 formed on the side of the piezoelectric body 122 may be formed such that their heights are sequentially reduced or increased in the longitudinal direction of the sub-block 160.

Next, as shown in FIG. 17I, grooves 162 are formed in the sub-block 160 at equal intervals in the depth direction. The groove 162 may be formed such that its depth D reaches a portion of the support 151. The piezoelectric elements 121 in the sub block 160 correspond to the piezoelectric elements in the column direction in the embodiment described with reference to FIG. 4.

Next, as shown in FIG. 17J, the side substrate 131 on which the wirings 1312 are provided is bonded to a surface on which the side electrodes 125 of the sub block 160 are formed.

Next, as shown in FIG. 17K, the sub blocks 160 having the side substrate 131 attached thereto are arranged in close contact with the upper surface of the support block 152 and fixed. The support 151 and the support block 152 form a back support 150. The support 151 and the support block 152 may be formed of the same material or different materials. Next, the common electrode plate (139 in FIG. 2) is attached to the upper surface of the acoustic matching layer 140, and the connection substrates (135 and 136 in FIG. 2) are attached to the side ends 1311c of the side substrate 131, An ultrasonic transducer 110 as shown in FIG. 2 is manufactured.

Before attaching the sub-blocks 160 having the side substrate 131 to the support block 152, a step of detecting piezoelectric characteristics by applying a voltage separately may be added. In the conventional method of manufacturing an ultrasonic transducer, the piezoelectric layer is formed by using one piezoelectric material, and it is not easy to uniform the piezoelectric properties throughout the piezoelectric material due to the characteristics of the piezoelectric material. As a result, the conventional ultrasonic transducer in which the piezoelectric elements have a two-dimensional array structure has a problem that the piezoelectric characteristics of the piezoelectric elements are not uniform throughout. On the other hand, according to the manufacturing method of the present embodiment, in manufacturing one ultrasonic transducer 110, the piezoelectric layer 120 is formed by combining the sub-block 160 of the column unit, the sub-block 160 before coupling The sub-block 160 whose piezoelectric characteristics of the piezoelectric element 121 are not uniform than the reference value by being detected in advance in units of) may be discarded, thereby reducing the distribution of piezoelectric characteristics of the piezoelectric elements 121, and thus the ultrasonic transducer. The variation in performance of 110 can be reduced as much as possible.

18A to 18I illustrate a method of manufacturing an ultrasonic transducer according to another embodiment of the present invention.

First, as illustrated in FIG. 18A, a piezoelectric plate 222 having a flat plate shape is provided, and as illustrated in FIG. 18B, electrodes 223 and 224 are provided on upper and lower surfaces of the piezoelectric body 222 to form the piezoelectric layer 220. do.

Next, as shown in Fig. 18C, a flat acoustic matching layer 240 is provided. The acoustic matching layer 240 may be formed of first and second layers 241 and 242 having different acoustic impedances.

Next, as shown in FIG. 18D, the piezoelectric layer 220 is attached to the support 251, and the acoustic matching layer 240 is bonded to the upper portion of the piezoelectric layer 220. The support 251 is formed of a conductive material.

Next, as shown in FIG. 18E, the sub-blocks of the flat piezoelectric layer 220 and the acoustic matching layer 240 are vertically separated at equal intervals. 18F shows one subblock 260 separated.

Next, as shown in FIG. 18G, the side surface of the sub block 260 forms an electrode pattern. That is, side electrodes 225 electrically connected to the upper electrode 223 of the piezoelectric body 222 are formed on the side of the piezoelectric body 222. As described above, the side electrodes 225 formed on the side of the piezoelectric body 222 may be formed such that the height thereof becomes smaller or larger in sequence.

Next, as shown in FIG. 18H, the grooves 262 are formed in the sub block 260 at equal intervals in the depth direction. The groove 262 may be formed such that the depth D reaches a part of the support 251.

Next, as shown in FIG. 18I, the side substrate 231 on which the wirings 2312 are provided is bonded to a surface on which the side electrodes 225 of the sub block 260 are formed.

Next, as shown in FIG. 18J, the sub blocks 260 to which the side substrate 231 is attached are arranged and fixed side by side on the upper surface of the support block 252. The support 251 and the support block 252 form a back support 250. The support 251 and the support block 252 may be formed of the same material or different materials. Next, the connection substrates 235 and 236 of FIG. 11 are attached to the side ends 2311c of the side substrate 231, thereby manufacturing the ultrasonic transducer 210 as illustrated in FIG. 11.

The present invention, the ultrasonic transducer, the ultrasonic probe, and the ultrasonic diagnostic apparatus have been described with reference to the embodiments shown in the drawings for clarity, but this is merely illustrative, and those skilled in the art will appreciate It will be understood that various modifications and other equivalent embodiments are possible. Accordingly, the true scope of the present invention should be determined by the appended claims.

100: ultrasonic pro 110, 210: ultrasonic transducer
120, 220: piezoelectric layer 121, 221: piezoelectric element
122, 222: piezoelectric 123, 223: upper electrode
124, 224 lower electrode 125, 225 side electrode
128, 129, 228, 229: gap 130, 230: electrode connection
131, 231: side substrate 1311, 2311: substrate
1312 and 2312 Wiring 135, 136, 235 and 236 Connection board
139: common electrode plate 140, 240: acoustic matching layer
150, 250: rear support 180: housing
198 Signal processing device 199 Subject

Claims (28)

A plurality of piezoelectric elements arranged in at least one column;
Individual electrodes provided on at least one of an upper surface and a lower surface of each of the plurality of piezoelectric elements;
Side electrodes extending from the individual electrodes to one side of the plurality of piezoelectric elements, respectively; And
And a side substrate attached to one side of the plurality of piezoelectric elements, the side substrate including wires for making electrical connections with the side electrodes, respectively. The method according to claim 1,
Ultrasonic transducers having different heights of side electrodes of a plurality of piezoelectric elements positioned in one row. The method of claim 2,
An ultrasonic transducer having a height of the side electrodes of a plurality of piezoelectric elements positioned in one column gradually decreases or increases in the longitudinal direction of the column. The method according to claim 1,
The wirings of the side substrate include ultrasonic waves including a first portion facing the side electrodes one-to-one, a second portion extending to one side end of the side substrate, and a third portion exposed to one side end of the side substrate. Transducer. 5. The method of claim 4,
The substrate of the side substrate is formed of a material having an anisotropic electrical conductivity having electrical conductivity in the thickness direction and electrical insulation in the surface direction, and the wirings of the side substrate are on the rear surface of the surface contacting the side electrodes of the substrate. Ultrasonic transducers are provided on. 5. The method of claim 4,
The substrate of the side substrate is formed of an electrically insulating material, the wiring of the side substrate is provided on the surface in contact with the side electrodes of the substrate. The method according to claim 1,
The plurality of piezoelectric elements are spaced apart from each other and arranged in two dimensions in rows and columns.
And the side substrate includes a plurality of side substrates inserted into a gap between rows of the plurality of piezoelectric elements. The method of claim 7, wherein
The height of the side electrodes of the piezoelectric elements of the first column is gradually decreased in the longitudinal direction of the column, the height of the side electrodes of the piezoelectric elements of the second column adjacent to the first column is gradually increased in the longitudinal direction of the column. The method of claim 8,
The wires of each of the plurality of side substrates may include a first portion facing the side electrodes one-to-one, a second portion extending to one side end of the side substrate, and a third portion exposed to one side end of the side substrate. Including;
The side ends of the first side substrates attached to the first row of piezoelectric elements are exposed and the side ends of the second side substrates attached to the second row of piezoelectric elements are opposite to each other. Directional Ultrasonic Transducer. 10. The method of claim 9,
And an ultrasonic transducer further including a first connecting substrate in electrical connection with the exposed third portions of the first side substrate and a second connecting substrate in electrical connection with the exposed third portions of the second side substrate. . The method of claim 7, wherein
Ultrasonic transducers whose side electrodes of all rows of piezoelectric elements become smaller or larger in the same direction. 12. The method of claim 11,
The wires of each of the plurality of side substrates may include a first portion facing the side electrodes one-to-one, a second portion extending to one side end of the side substrate, and a third portion exposed to one side end of the side substrate. Including;
Ultrasonic transducers of the plurality of side substrates are exposed in the same direction the side end is exposed. 13. The method of claim 12,
And a connection substrate in electrical connection with the exposed third portions of the plurality of side substrates. The method according to claim 1,
The substrate of the side substrate is an ultrasonic transducer is formed of a sound absorbing material. The method according to claim 1,
The substrate of the side substrate is an ultrasonic transducer is formed of a flexible material. The method according to claim 1,
The individual electrodes are signal electrodes respectively provided below the plurality of piezoelectric elements, and a common electrode is provided above the plurality of piezoelectric elements. 17. The method of claim 16,
The common electrode may further include an upper electrode provided on an upper surface of each of the plurality of piezoelectric elements, and an upper electrode plate provided on an upper surface of the upper electrodes and electrically connected to the upper electrodes in common. . The method of claim 17,
And an acoustic matching layer provided between the upper electrodes and the plurality of piezoelectric elements, wherein the acoustic matching layer is formed of a conductive material or at least a part of an outer surface thereof is coated with a conductive material. The method according to claim 1,
The individual electrodes are signal electrodes respectively provided on the plurality of piezoelectric elements, and a common electrode is provided below the plurality of piezoelectric elements. 20. The method of claim 19,
A rear support part provided below the plurality of piezoelectric elements to support the plurality of piezoelectric elements,
And the rear support part is made of a conductive material to electrically connect to the common electrode. The method according to claim 1,
And an acoustic matching layer positioned on the plurality of piezoelectric elements. The method according to claim 1,
And a rear support part provided below the plurality of piezoelectric elements to support the plurality of piezoelectric elements. 23. The method of claim 22,
And a groove corresponding to a gap between the plurality of piezoelectric elements is formed at a portion of the rear support portion contacting the plurality of piezoelectric elements. 23. The method of claim 22,
The rear support portion is an ultrasonic transducer in which at least a portion contacting the plurality of piezoelectric elements is formed of a sound absorbing material. The ultrasonic transducer of any one of claims 1 to 24; And
And a housing for accommodating the ultrasonic transducer. The ultrasonic probe of claim 25; And
And a signal processing unit for generating an ultrasound image based on the ultrasound echo signal detected by the ultrasound probe. Providing a piezoelectric layer;
Forming an electrode layer on at least one surface of the piezoelectric layer;
Attaching a support to the lower portion of the piezoelectric layer to form one block;
Preparing a plurality of sub blocks by vertically cutting the blocks of the support and the piezoelectric layer at equal intervals;
Forming a side electrode electrically connected to an electrode layer of the piezoelectric layer on one side of the cut sub-block of the support and the piezoelectric layer;
Forming grooves at equal intervals from the uppermost surface to a portion of the support;
Preparing a side substrate having a wiring pattern corresponding to the side electrode of the sub block;
Attaching the side substrate to the sub-block in which the groove is formed:
Attaching the side blocks to which the side blocks are attached in a width direction arranged on a support block; And
And attaching a connection substrate to a side of the support block to which the subblocks are attached. 28. The method of claim 27,
And detecting and selecting piezoelectric properties for each of the sub blocks to which the side substrates are attached, before the step of attaching the side blocks to which the side substrates are attached to the supporting blocks in the width direction.

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