CN105425554B - Resist remover compositions, the preparation method of flat-panel monitor and flat-panel monitor - Google Patents
Resist remover compositions, the preparation method of flat-panel monitor and flat-panel monitor Download PDFInfo
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Abstract
The invention discloses a kind of Resist remover compositions, comprising: the compound (A) indicated by following formula 1；Alkanolamine (B) including primary alkanolamine and tertiary alkanol amine；Primary alconol (C)；And polar non-solute (D)；The method and a kind of flat display substrate that the invention also discloses a kind of for manufacturing flat display substrate,
Description
Technical field
The present invention relates to a kind of Resist remover compositions.More particularly it relates to which corrosion inhibitor stripper combines
Object, the method that flat display substrate is manufactured using the Resist remover compositions and the FPD manufactured by this method
Device substrate, wherein the Resist remover compositions show excellent stripping ability, while making in resist stripping process
The corrosion of metal line is minimized.
Background technique
With the increase to high resolution flat display demand, people have made efforts to improve the pixel of per unit area
Number, for example, reducing the width of wiring by the harsh fabrication schedule of such as dry etching process.Moreover, expanding flat-panel monitor
Need to improve transmission speed of the signal in wiring, this is realized by using copper as wiring raw material, because of the resistivity of copper
It is lower than the resistivity of aluminium.Therefore, high-performance remover must be used in stripping technology.
Specifically, the ability that remover needs to have the residue formed after removal dry ecthing, and have and be directed to hardware cloth
The corrosion resistance of line (especially copper and aluminium).In addition, remover should be economically beneficial for the competitiveness of cost, make
Mass substrate sheet material can be handled by obtaining it.
Usually using water-soluble organic amines or such as gamma-butyrolactons and DMSO such as monoethanolamine, monoisopropanolamines
Organic solvent remove resist.The amine of metal causes corrosion in order to prevent, uses such as catechol, resorcinol, benzo three
A variety of corrosion inhibitors such as azoles, and have proposed the Resist remover compositions containing these corrosion inhibitors.
It is known, however, that conventional photoresist release agent compositions are being shelled in processing or prolonged storage
There are problems in terms of from performance, treating capacity and low stability.For example, Publication No. 10-2006-0117666's is uncensored
A kind of photoresist release agent compositions of Korean Patent Application Publication comprising it is with chemical formula 1 of the invention identical
Compound and organic amine compound as active constituent, and must two or more different corrosion inhibitors prevent
The corrosion of metal line.It is most likely that remaining corrosion inhibitor in wiring after stripping process.In addition, these are anti-
The presence of corrosive agent may cause Resist remover compositions and change colour in long term storage and the deterioration of stripping performance, such as prolong
Long splitting time.
Therefore, it is necessary to a kind of Resist remover compositions, which can overcome leads in correlation
The problem of being encountered in domain, and show excellent anti-corrosion effects and quick and excellent removing property.
[document of related fields]
[patent document]
The uncensored South Korea patent application of Publication No. 10-2006-0117666
Summary of the invention
Therefore, keep the above-mentioned problems in the prior art firmly in mind and make the present invention, and the object of the present invention is to provide
A kind of Resist remover compositions, which has strong removal ability to resist residue, to metal
Wiring (such as copper and aluminium wiring) has excellent corrosion resistance, and can be effectively prevented due to the resist on substrate
The formation of spot caused by residue is contacted with deionized water.
It is a further object of the present invention to provide a kind of methods using composition manufacture flat-panel monitor, and by this
The flat-panel monitor of method manufacture.
To achieve the goals above, one aspect of the present invention provides a kind of Resist remover compositions, comprising:
The compound (A) indicated by following formula 1；
Including primary alkanolamine (primary alkanolamine) and tertiary alkanol amine (tertiary alkanolamine)
Alkanolamine (B)；
Primary alconol (C)；And
Polar non-solute (D)；
[chemical formula 1]
Wherein, R1 to R8 is each independently hydrogen atom or C1~C4 alkyl.
Another aspect of the present invention provides a kind of method for manufacturing flat display substrate, and the method includes using
The Resist remover compositions clean the flat display substrate.
Another aspect of the present invention provides a kind of flat display substrate manufactured by the above method.
Specific embodiment
According to an aspect of the present invention, the present invention provides a kind of Resist remover compositions, including,
The compound (A) indicated by following formula 1；
Alkanolamine (B) including primary alkanolamine and tertiary alkanol amine；
Primary alconol (C)；And
Polar non-solute (D)；
[chemical formula 1]
Wherein, R1 to R8 is each independently hydrogen atom or C1~C4 alkyl.
Hereinafter, will be described in each ingredient.
(A) compound indicated by chemical formula 1；
Resist remover compositions of the invention include the compound (A) indicated by following formula 1:
[chemical formula 1]
Wherein, R1 to R8 is each independently hydrogen atom or C1~C4 alkyl.
In above-mentioned Resist remover compositions, the compound (A) indicated by chemical formula 1 determines to resist metal line
Corrosive nature.
The example of the compound indicated by chemical formula 1 includes 4- methyl -4,5,6,7- tetrahydro -1H- benzo [1,2,3] three
Azoles, 5- methyl -4,5,6,7- tetrahydro -1H- benzo [1,2,3] triazole, 5,6- dimethyl -4,5,6,7- tetrahydro -1H- benzo [1,
2,3] triazole and 4,6- dimethyl -4,5,6,7- tetrahydro -1H- benzo [1,2,3] triazole.These compounds can be used alone or
It is applied in combination.
The dosage of total weight based on Resist remover compositions, the compound indicated by chemical formula 1 (A) is preferably
0.0001wt% to 0.1wt%, more preferably 0.001wt% are to 0.1wt%, and most preferably 0.003wt% is extremely
0.05wt%.When the content of the compound indicated by chemical formula 1 is less than 0.0001wt%, metal line is combined with remover
It may partially be corroded after object contact for a long time.On the other hand, resist of the content of compound (A) greater than 0.1wt% is shelled
It may lead to secondary pollution since the compound is easy to remain on metal line from agent composition, and due to increased costs
And cause cost-performance ratio not high.
(B) include primary alkanolamine and tertiary alkanol amine alkanolamine
Alkanolamine is for enhancing stripping ability and preventing spot from being formed.
The effect of primary alkanolamine be penetrate under a variety of processing conditions (such as dry ecthing or wet etching, ashing or from
In sub- injection processing) in the polymer substrate of the resist of degradation or crosslinking, and destroy polymer substrate intermolecular linkage or point
Sub- internal key.Under the effect, gap is formed in the susceptible part of structure of primary alkanolamine remaining resist on substrate,
Resist is become amorphous polymer gelling, to be readily removable resist from substrate.
The representative example of primary alkanolamine includes but is not limited to monoethanolamine, monoisopropanolamine and 2- (2- amino ethoxy
Base) ethyl alcohol.Primary alkanolamine may be used alone or in combination use.
About tertiary alkanol amine, its effect is prevented when the resist and deionized water that remain on substrate contact
Spot formation.Above-mentioned tertiary alkanol amine can be indicated by following formula 2:
[chemical formula 2]
Wherein, R9, R10 and R11 are each independently the alkyl of 1 to 4 carbon atom or the hydroxyl alkane of 1 to 4 carbon atom
Base, on condition that at least one of R9, R10 and R11 are the hydroxyalkyls of 1 to 4 carbon atom.
For the compound of chemical formula 2, more preferable methyl diethanolamine and dimethylethanolamine.
It about the content ratio between alkanolamine primary in alkanolamine and tertiary alkanol amine, can be adjusted as follows: when needing to improve
When stripping ability, increase the content of primary alkanolamine；When needing to improve greasiness removal, increase the content of tertiary alkanol amine.
Primary alkanolamine and tertiary alkanol amine can be used with the weight ratio of 1:0.1~0.1:1, more preferably with 1:0.2~0.2:1
Weight ratio use.
Total weight based on Resist remover compositions, the content of alkanolamine are preferably 0.01wt% to 10wt%, more
Preferably 1wt% to 8wt%.If the content of alkanolamine is less than 0.01wt%, resist stripping ability is reduced, this will lead to anti-
Erosion agent residue remains on substrate.On the other hand, if the content of alkanolamine is higher than 10wt%, it will lead to the corruption to metal line
Erosion rate quicklys increase.
(C) primary alconol
Primary alconol in Resist remover compositions is used for dissolving cured imaging polymers, and can make anti-in removing
It is readily removable stripping solution with deionized water (DIW) in flushing process after erosion agent, it is anti-to make to dissolve in stripping solution
The reprecipitation for losing agent minimizes.
Preferably, above-mentioned primary alconol includes being selected from glycol monoethyl ether, ethylene glycol monoethyl ether, ethyleneglycol monopropylether, second two
Alcohol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol list isopropyl ether, diethylene glycol monobutyl ether, three second two
Alcohol monomethyl ether, Triethylene glycol ethyl ether, triethylene glycol list isopropyl ether, triethylene glycol butyl ether, poly glycol monomethyl ether, poly- second two
At least one of alcohol monobutyl ether, diethylene glycol, triethylene glycol and isopropyl ethyl glycol aklylene glycol class primary alconol, and be selected from
Tetrahydrofurfuryl alcohol (tetrahydroperfuryl alcohol), hydroxymethylcyclopentene, 4- methylol -1,3- dioxolanes, 2- first
Base -4- methylol -1,3- dioxolanes, 2,2- dimethyl -1,3- dioxolanes -4- methanol, 1,3- propylene glycol, 1,3 butylene glycol
And the non-aklylene glycol class primary alconol of at least one of 1,4- butanediol, 2-methyl cellosolve.
Aklylene glycol class primary alconol and non-aklylene glycol class primary alconol are preferably used with the weight ratio of 1:0.1~0.1:1, and
And it is more preferably used with the weight ratio of 1:0.2~0.2:1.If the weight ratio of primary alconol is within the above range, corrosion inhibitor stripper group
The imaging polymers that object can be easily dissolving cured are closed, and imaging polymers can be prevented flushed after removing
Absorption again in journey, to reduce secondary pollution.
Total weight based on Resist remover compositions, the content of primary alconol are preferably 20wt% to 85wt%, and more excellent
30wt% is selected as to 80wt%.When stripper solution contains the primary alconol of the weight range, can spend during the rinsing process from
Sub- water (DIW) is readily removable the stripper solution.
(D) polar non-solute
In remover combination, polar non-solute (D) promotes the polymerization to degrading or being crosslinked in etching process
The removal of object, and improve the treating capacity of the Resist remover compositions, that is, handle the ability of sheet material.
The effect of polar non-solute is dissolved by the imaging polymers of alkali compounds gelation.That is,
Polar non-solute effectively makes photoresist solvation, assists alkali compounds rapid osmotic into photoresist,
To improve stripping performance.In addition, polar non-solute makes to be gone in removing the flushing process after resist with deionized water
Except remover combination becomes easy, to prevent the adsorbing again of the resist of remover combination and dissolution/attached again as far as possible
?.
Preferably, polar non-solute has neither excessively high only low boiling point, to realize suitable removing energy
Power, and one or more polar non-solutes can be used in combination.
The example for being suitable for the invention polar non-solute includes: pyrrolidone-2 compounds, such as N- methylpyrrole
Alkanone (NMP), N- ethyl pyrrolidone etc.；Imidazolidinone compound, such as 1,3-Dimethyl-2-imidazolidinone, 1,3- dipropyl
Base -2- imidazolone etc.；Lactone compound, such as gamma-butyrolacton；Sulfoxide compound, such as dimethyl sulfoxide (DMSO), ring fourth
Sulfone etc.；Phosphate compound, triethyl phosphate, tributyl phosphate etc.；Carbonate products, such as dimethyl carbonate, carbon
Sour ethyl etc.；And amide compound, such as formamide, N-METHYLFORMAMIDE, N- ethyl-formamide, N, N- dimethyl formyl
Amine, N, N- diethylformamide, acetamide, N- methylacetamide, DMAC N,N' dimethyl acetamide, N, N- dimethylpropionamide, N-
(2- ethoxy) acetamide, 3- methoxyl group-N, N- dimethylpropionamide, 3- (2- ethyl hexyl oxy)-N, N- dimethylpropionamide
With 3- butoxy-N, N- dimethylpropionamide.These compounds may be used alone or in combination use.
Total weight based on Resist remover compositions, the content of polar non-solute (D) be preferably 5wt% extremely
75wt%, and more preferably 10wt% to 60wt%.If polar non-solute is in the content range, corrosion inhibitor stripper group
The effect for the imaging polymers that removal is caused to degrade or be crosslinked by etching etc. can advantageously be played by closing object.
Resist remover compositions of the invention can further comprise in corrosion inhibitor (E) and deionized water (F) extremely
Few one kind.
In Resist remover compositions, corrosion inhibitor (E) can prevent such as metal of aluminium wiring and/or thin copper film
The corrosion of wiring.
The example of corrosion inhibitor includes: monocarboxylic acid, formic acid, acetic acid, propionic acid etc.；Dicarboxylic acids, such as oxalic acid, the third two
Acid, succinic acid, glutamic acid, adipic acid, pimelic acid, maleic acid, fumaric acid, glutaconate etc.；Tricarboxylic acids, such as trimellitic acid,
The third three acid etc.；Organic acid, such as hydroxyacetic acid, lactic acid, salicylic acid, malic acid, tartaric acid, citric acid, gluconic acid and oxo carboxylic
Sour (oxicarboxylic acid)；Organic acid amide ester, such as succinamide ester, malic acid carboxylic acid amide esters, maleic acid
Ester, amides ester, oxalic acid amide esters, malonic acid carboxylic acid amide esters, glutaramide ester, amide ester, lactamide ester, lemon
Lemon acid carboxylic acid amide esters, tartaric acid carboxylic acid amide esters, glycollic acid ester, benzoic acid amides ester and uric acid carboxylic acid amide esters；Azole compounds, such as benzo
Triazole, tolyl-triazole, methyl toluene base triazole, 2,2 '-[[[benzotriazole] methyl] imino group] di-methylcarbinols, 2,2 '-[[[first
Base -1- hydrogen-benzotriazole -1- base] methyl] imino group] double methanol, 2,2 '-[[[ethyl -1- hydrogen-benzotriazole -1- base] first
Base] imino group] di-methylcarbinol, 2,2 '-[[[methyl-1-hydrogen-benzotriazole-1- base] methyl] imino group] di-methylcarbinols, 2,2 '-
[[[methyl-1-hydrogen-benzotriazole-1- base] methyl] imino group] double carboxylic acids, 2,2 '-[[[methyl-1s-hydrogen-benzotriazole-1-
Base] methyl] imino group] double methylamines, 2,2 '-[[[amine -1- hydrogen-benzotriazole -1- base] methyl] imino group] di-methylcarbinols, 4- first
Base-1- hydrogen-benzotriazole and 5- methyl-1-hydrogen-benzotriazole；And symmetrical phenolic compound, such as, 2,6- dimethyl benzenes
Phenol, 2,4,6- pseudocuminol, 2,6- diethyl phenol, 2,6- diethyl -4- methylphenol, 2,6- dipropyl phenol, 2,6-
Dipropyl -4- methylphenol, 2,6 di t butyl phenol, 2,4,6- tri-butyl-phenol and 2,6- di-t-butyl -4- methyl
Phenol, but it is not limited to them.These compounds may be used alone or in combination use.
Total weight based on Resist remover compositions, the content of corrosion inhibitor are preferably 3wt% or less and more excellent
0.001wt% is selected as to 2wt%.In the range, corrosion inhibitor can effectively be prevented in stripping process or DIW flushing process
The only corrosion of the metal line made of aluminum or aluminum alloy and copper or copper alloy.
About the deionized water (F) in Resist remover compositions, the activation of alkali compounds (B) can be promoted to mention
High detachment rate, and can quickly and completely remove remaining organic pollutant and resist solution on substrate.Further,
When deionized water includes in Resist remover compositions, deionized water can make primary alconol be easy to mixed with polar non-solute
It closes, and can make stripper solution that deionized water (DIW) quickly and completely be used to remove in the flushing process after stripping process.
Total weight based on Resist remover compositions, the content of deionized water are preferably 70wt% or less, and
More preferably 1wt% to 45wt%.If deionized water content is greater than 70wt%, Resist remover compositions may be decreased anti-
Agent solvability is lost, and then reduces treating capacity.In addition, when substrate is immersed in wherein for a long time, corrosion inhibitor stripper combination
Object may cause the corrosion of metal line.
Resist remover compositions of the invention can be prepared by mixing mentioned component with above-mentioned amount, for
Mixing is not particularly limited.As long as it is known in the art, any mixed method can be used.
Under normal conditions, it can be realized by submerging and be combined with flat-panel monitor according to the present invention with corrosion inhibitor stripper
Object removes resist.However, such as spraying other technologies can also be used.After with compositions-treated display of the invention,
Even the organic solvent of such as alcohol can be replaced sufficiently to rinse display with water.
According to another aspect of the present invention, the present invention provides a kind of method for manufacturing flat display substrate, described
Method includes flat display substrate being cleaned using Resist remover compositions of the invention, and provide one kind by the party
The flat display substrate of method manufacture.
Resist remover compositions of the invention can be effectively applied in the resist removal process of flat-panel monitor, and
And it is applicable to semiconductor and other electronic equipments.
It is better understood the present invention by following embodiment, following embodiment should not be construed as illustrating and proposing
The limitation present invention.
Embodiment 1 is to embodiment 10 and comparative example 1 to comparative example 5: the preparation of Resist remover compositions
The ingredient shown in the following table 1 is prepared for Resist remover compositions.
Table 1
(unit: wt%)
Remarks): MTBT:4- methyl -4,5,6,7- tetrahydro -1H- benzo [1,2,3] triazole
DMTBT:5,6- dimethyl -4,5,6,7- tetrahydro -1H- benzo [1,2,3] triazole
MDEA:N- methyl diethanolamine
DMEA:N, N- dimethylethanolamine
TEA: triethanolamine
AEE:2- (2- amino ethoxy) ethyl alcohol
EDG: diethylene glycol monoethyl ether
MDG: diethylene glycol monomethyl ether
NMF:N- methylformamide
NEF:N- ethyl-formamide
DMPA:N, N- dimethylpropionamide
NMP:N- methyl pyrrolidone
THFA: tetrahydrofurfuryl alcohol
HMDM:4- methylol -2,2- dimethyl -1,3- dioxolanes
BTA: benzotriazole
TBMP:t- butyl -4- metoxyphenol
MIPA: monoisopropanolamine
Test case: the evaluation of Resist remover compositions performance
The stripping ability of the test Resist remover compositions of test case 1.
In the following experiments, embodiment 1 to embodiment 10 and comparative example 1 to the resist of comparative example 5 is tested to remove
The stripping ability of agent composition.
Typically, Mo/Al/Mo layers and Cu/Ti layers are deposited on the glass substrate using thin film sputtering process.It is photic being formed
After resist pattern, metal film is etched in wet etch process and/or dry-etching method.In order to evaluate removing energy
The Resist remover compositions of embodiment 1 to embodiment 10 and comparative example 1 to comparative example 5 are constantly maintained at 50 by power
DEG C, then glass substrate is immersed in each composition 5 minutes.
Then, the substrate is rinsed 1 minute with deionized water, to remove possible remaining stripper solution on the substrate,
And it is sufficiently dried with nitrogen to remove possible remaining deionized water.At scanning electron microscope (SEM, Hitachi S-4700)
It is detected to observe whether substrate deteriorates or on substrate with the presence or absence of cured resist or dry ecthing residue.As a result it summarizes
In the following table 2.
[evaluation criterion of stripping ability]
◎: very good
Zero: good
Δ: it is medium, partially there is residue
X: it is poor, residue cannot be removed
Test case 2: the anti-stain effect of Resist remover compositions is tested
To in the dirt formed after stripping process when Resist remover compositions and deionized water contact on substrate
Stain is detected.For this purpose, Resist patterning substrate to be immersed in the embodiment 1 for being maintained at 50 DEG C to embodiment 10 and is compared
Compared with 5 minutes in the Resist remover compositions of example 1 to comparative example 5, then substrate is taken out from composition, and is spending
Ionized water contacts it with deionized water 1 minute before cleaning 1 minute.Then, with the abundant dry substrate of nitrogen to remove residual
Deionized water on substrate.Spot is detected under halogen lamp.As a result it is shown in the following table 2.
[evaluation criterion of anti-stain effect]
◎: very good
Zero: good
Δ: medium
X: poor
Test case 3: corrosion resistance of the Resist remover compositions to metal line
Following experiment has been carried out to evaluate embodiment 1 to embodiment 10 and comparative example 1 to the resist of comparative example 5 and remove
Corrosion resistance of the agent composition to metal line.
The substrate of Cu wiring exposure on it is immersed in the embodiment 1 for being maintained at 50 DEG C to embodiment 10 and is compared
Example 1 is into the Resist remover compositions of comparative example 5 10 minutes.Then, substrate is washed and dried, scanning electron microscopy is passed through
Mirror (SEM, Hitachi S-4700) can be carried out detection to the corrosion resistance of Resist remover compositions.As a result it shows in the following table 2.
[evaluation criterion of corrosion resistance]
◎: it is very good, it is corrosion-free
Zero: it is good, it is almost corrosion-free
Δ: it is medium, it is partially corroded, surface roughness changes
×: it is poor, it is corroded and etches
Table 2
From the data of table 2 it will be evident that the corrosion inhibitor stripper of embodiment according to the present invention 1 to embodiment 10 combines
Object shows excellent stripping ability to the substrate for being formed with Mo/Al/Mo wiring or Cu/Ti wiring thereon, and to Cu and Al
Wiring shows excellent corrosion resistance.
In contrast, although the stripping ability of composition of comparative example 1 to comparative example 5 is similar to composition of the invention
Stripping ability, but they show much lower anti-stain effect.Specifically, the comparative example of tertiary alkanol amine is used individually
4 and comparative example 5 composition compared with the composition of embodiment have poor anti-stain effect, this shows primary alkanolamine and uncle
The mixture of alkanolamine prevents the formation of spot in a manner of cooperateing with.Comparative example 1 to comparative example 5 composition stripping ability and
Corrosion resistance score is lower.
Resist remover compositions of the invention with excellent resist stripping ability can be effectively removed against corrosion
Agent, and ensure that metal line (such as aluminium and/or copper) is protected not corroded to the maximum extent.In addition, above-mentioned corrosion inhibitor stripper
Composition prevents from forming spot when the resist residue on substrate is contacted with deionized water.
As described above, disclosing preferred forms of the invention in the accompanying drawings and the description.Although in this specification
Specific term is used, but these terms are only used to describe the present invention, meaning or appended and is not intended to limit the present invention
The scope of the present invention described in claims.Therefore, it will be appreciated by those skilled in the art that from embodiment of the present invention
Various modifications and other equivalent implementations are possible.Therefore, technical scope of the invention should be by the technology of claims
Thought limits.
Claims (11)
1. a kind of Resist remover compositions, comprising:
Based on the total weight of the Resist remover compositions,
The compound (A) of 0.0001wt% to 0.1wt% indicated by following formula 1；
The alkanolamine (B) including primary alkanolamine and tertiary alkanol amine of 0.01wt% to 10wt%；
The primary alconol (C) of 20wt% to 85wt%；And
The polar non-solute (D) of 5wt% to 75wt%；
[chemical formula 1]
Wherein, R1 and R8 is each independently hydrogen atom or C1~C4 alkyl.
2. Resist remover compositions according to claim 1, wherein the compound (A) is selected from by methyl -4 4-,
5,6,7- tetrahydro -1H- benzo [1,2,3] triazole, 5- methyl -4,5,6,7- tetrahydro -1H- benzo [1,2,3] triazole, 5,6- diformazan
Base -4,5,6,7- tetrahydro -1H- benzo [1,2,3] triazole, 4,6- dimethyl -4,5,6,7- tetrahydro -1H- benzo [1,2,3] triazole
And group composed by their combination.
3. Resist remover compositions according to claim 1, wherein the alkanolamine (B) includes that weight ratio is 1:
The primary alkanolamine and tertiary alkanol amine of 0.1~0.1:1.
4. Resist remover compositions according to claim 1, wherein the primary alconol (C) includes that weight ratio is 1:0.1
The aklylene glycol class primary alconol of~0.1:1 and non-aklylene glycol class primary alconol.
5. Resist remover compositions according to claim 3, wherein the primary alkanolamine is selected from by monoethanol
At least one of group composed by amine, isopropanolamine and 2- (2- amino ethoxy) ethyl alcohol；And the tertiary alkanol amine is choosing
At least one of group composed by free methyl diethanol amine, dimethylethanolamine and triethanolamine.
6. Resist remover compositions according to claim 1, wherein the primary alconol (C) is selected from by ethylene glycol list
Methyl ether, ethylene glycol monoethyl ether, ethyleneglycol monopropylether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether,
Diethylene glycol list isopropyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, Triethylene glycol ethyl ether, triethylene glycol list isopropyl
Ether, triethylene glycol butyl ether, poly glycol monomethyl ether, polyethylene glycol monobutyl ether, diethylene glycol, triethylene glycol, isopropyl second two
Alcohol, tetrahydrofurfuryl alcohol, hydroxymethylcyclopentene, 4- methylol -1,3- dioxolanes, 2- methyl -4- methylol -1,3- dioxolanes,
2,2- dimethyl -1,3- dioxolanes -4- methanol, 1,3- propylene glycol, 1,3 butylene glycol, 1,4- butanediol and 2- methoxyl group second
At least one of group composed by alcohol.
7. Resist remover compositions according to claim 1, wherein the polar non-solute (D) be selected from by
Pyrrolidone-2 compounds, imidazolidinone compound, lactone compound, sulfoxide compound, phosphate compound, carbonate compound
Group composed by object, amide compound and their combination.
8. Resist remover compositions according to claim 1 further comprise selected from by corrosion inhibitor and deionization
At least one of group composed by water.
9. Resist remover compositions according to claim 8, wherein based on the Resist remover compositions
Total weight, the dosage of the corrosion inhibitor are 3wt% or less, and the dosage of the deionized water is 70wt% or less.
10. a kind of method for manufacturing flat display substrate, comprising: using according to claim 1 to described in any one of 9
Resist remover compositions rinse the flat display substrate.
11. a kind of flat display substrate manufactured by method described in any one of claim 10.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20140123691 | 2014-09-17 | ||
| KR10-2014-0123691 | 2014-09-17 | ||
| KR1020150095667A KR102392027B1 (en) | 2014-09-17 | 2015-07-06 | A resist stripper composition, a method of manufacturing flat panel displays, and flat panel displays manufactured by the same |
| KR10-2015-0095667 | 2015-07-06 |
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| Publication Number | Publication Date |
|---|---|
| CN105425554A CN105425554A (en) | 2016-03-23 |
| CN105425554B true CN105425554B (en) | 2019-10-25 |
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| CN201510589693.7A Active CN105425554B (en) | 2014-09-17 | 2015-09-16 | Resist remover compositions, the preparation method of flat-panel monitor and flat-panel monitor |
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| KR102414295B1 (en) * | 2016-01-22 | 2022-06-30 | 주식회사 이엔에프테크놀로지 | Photoresist stripper composition |
| EP3519895A4 (en) * | 2016-09-28 | 2020-06-17 | Dow Global Technologies Llc | Solvents for use in the electronics industry |
| CN107957661A (en) * | 2016-10-18 | 2018-04-24 | 东友精细化工有限公司 | Anticorrosive additive stripping liquid controlling composition and the stripping means using its resist |
| CN108508712B (en) * | 2017-02-24 | 2022-03-22 | 东友精细化工有限公司 | Resist stripping liquid composition |
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| KR20060117666A (en) * | 2005-05-13 | 2006-11-17 | 주식회사 엘지화학 | Stripper composition for photoresist |
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