CN105420671A - 一种电子产品基材表面超硬镀膜方法 - Google Patents

一种电子产品基材表面超硬镀膜方法 Download PDF

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CN105420671A
CN105420671A CN201510763830.4A CN201510763830A CN105420671A CN 105420671 A CN105420671 A CN 105420671A CN 201510763830 A CN201510763830 A CN 201510763830A CN 105420671 A CN105420671 A CN 105420671A
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substrate surface
base material
film coating
electronic product
super
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邵宜健
黄绵利
赵章林
梁信斌
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ZHEJIANG TRILLION GAME TECHNOLOGY Co Ltd
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ZHEJIANG TRILLION GAME TECHNOLOGY Co Ltd
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Publication of CN105420671A publication Critical patent/CN105420671A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/083—Oxides of refractory metals or yttrium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/10—Glass or silica
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

本发明属于表面处理工艺，尤其涉及一种电子产品基材表面超硬镀膜方法，包括下述步骤：1）将正常硬度的基材放至镀膜型腔中，开启真空泵，抽取镀膜型腔中的气体，使镀膜型腔中的气压低于1.0*10-5PA；2）将基材表面活化使其疏松，同时充氩气将固态靶材Ti3O5和SiO2气化后依序涂覆在基材表面，并进入基材表面疏松层均匀排布；3）最后，Ti3O5和SiO2材料在基材表面形成一层致密坚硬的保护层。本发明利用光学镀膜涂层的高致密性特性，通过镀膜机离子源作用及抽真空等级使得基材表面活化疏松，将靶材SiO2、Ti3O5均匀依附在产品表面，从而提高产品表面1-3H的硬度。

Description

一种电子产品基材表面超硬镀膜方法
技术领域
本发明属于表面处理工艺，尤其涉及一种电子产品基材表面超硬镀膜方法。
背景技术
目前，为了提高手感，制作通讯、娱乐等电子产品外壳的基材一般处理的比较光滑，一不小心就容易滑下掉落，如果基材表面硬度不够，就会产生细缝甚至裂开；因此，需要采用专门工艺提高基材表面硬度，而现有的基材表面处理工艺（如喷涂、hardcoating涂布、强化等），处理后其表面硬度只能达到3~4H，再提升硬度空间有限，使产品表面抗硬度和刮伤能力达到一定空间后再无法提升。
发明内容
本发明为了解决上述现有技术中存在的缺陷和不足，提供了一种通过离子源及抽真空，将靶材均匀依附在产品基材表面提高产品基材表面硬度的电子产品基材表面超硬镀膜方法。
本发明的技术方案：一种电子产品基材表面超硬镀膜方法，包括下述步骤：
1）将正常硬度的基材放至镀膜型腔中，开启真空泵，抽取镀膜型腔中的气体，使镀膜型腔中的气压低于1.0*10-5PA；
2）将基材表面活化使其疏松，同时充氩气将固态靶材Ti3O5和SiO2气化后依序涂覆在基材表面，依序涂覆在基材表面，并进入基材表面疏松层均匀排布；
3）最后，Ti3O5和SiO2材料在基材表面形成一层致密坚硬的保护层。
优选地，所述步骤1）中抽取真空时间为30-120分钟。
优选地，所述步骤2）中利用离子源作用使得基材表面活化疏松。
优选地，所述步骤2）冲氩气的时间为40-80分钟。
优选地，所述步骤3）中在基材表面形成的保护层的硬度比正常基材表面提高1-3H的硬度。
本发明中采用的镀膜机为光学镀膜机，利用光学镀膜涂层的高致密性特性，通过镀膜机离子源作用及抽真空等级使得基材表面活化疏松，将靶材SiO2、Ti3O5均匀依附在产品表面，从而提高产品表面1-3H的硬度。
具体实施方式
下面结合具体实施例对本发明作进一步详细的说明，但并不是对本发明保护范围的限制。
一种电子产品基材表面超硬镀膜方法，包括下述步骤：将一定硬度的基材（如3H750G）放至于光学镀膜机的镀膜型腔中，开启真空泵，抽取镀膜型腔中的气体，使镀膜型腔中的气压低于1.0*10-5PA，根据真空度需要，抽取真空时间为30分钟~120分钟不等，利用离子源作用，将基材表面活化使其疏松，同时充氩气将固态靶材Ti3O5和SiO2气化后依序涂覆在基材表面，并进入基材表面疏松层均匀排布，一定时间后（约40~80分钟），Ti3O5和SiO2材料将在基材表面形成一层致密坚硬的保护层，达到抗硬度能力。
本发明中采用的镀膜机为光学镀膜机，利用光学镀膜涂层的高致密性特性，通过镀膜机离子源作用及抽真空等级使得基材表面活化疏松，将靶材SiO2、Ti3O5均匀依附在产品表面，从而提高产品表面1-3H的硬度。

Claims (5)

1.一种电子产品基材表面超硬镀膜方法，其特征在于：其包括下述步骤：1）将正常硬度的基材放至镀膜机的镀膜型腔中，开启真空泵，抽取镀膜型腔中的气体，使镀膜型腔中的气压低于1.0*10-5PA；
2）将基材表面活化使其疏松，同时充氩气将固态靶材Ti3O5和SiO2气化后依序涂覆在基材表面，并进入基材表面疏松层均匀排布；
3）最后，Ti3O5和SiO2材料在基材表面形成一层致密坚硬的保护层。
2.根据权利要求1所述的一种电子产品基材表面超硬镀膜方法，其特征在于：所述步骤1）中抽取真空时间为30-120分钟。
3.根据权利要求1所述的一种电子产品基材表面超硬镀膜方法，其特征在于：所述步骤2）中利用离子源作用使得基材表面活化疏松。
4.根据权利要求1所述的一种电子产品基材表面超硬镀膜方法，其特征在于：所述步骤2）冲氩气的时间为40-80分钟。
5.根据权利要求1所述的一种电子产品基材表面超硬镀膜方法，其特征在于：所述步骤3）中在基材表面形成的保护层的硬度比正常基材表面提高1-3H的硬度。
CN201510763830.4A 2015-11-11 2015-11-11 一种电子产品基材表面超硬镀膜方法 Pending CN105420671A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111040473A (zh) * 2019-11-26 2020-04-21 广东盈骅新材料科技有限公司 亚氧化钛黑色颜料及其制备方法
CN112430798A (zh) * 2020-12-04 2021-03-02 无锡鑫巨宏智能科技有限公司 Hdpe塑料光学产品表面镀膜加硬的方法

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JP2003268542A (ja) * 2002-03-18 2003-09-25 Ulvac Japan Ltd 成膜装置及び成膜方法
CN101153380A (zh) * 2006-09-27 2008-04-02 宝山钢铁股份有限公司 有机预涂金属板上SiOx镀层的真空制备方法
CN104498876A (zh) * 2014-12-25 2015-04-08 江西昌佳鑫科技有限公司 摄像头盖板的真空镀膜方法
CN104561899A (zh) * 2014-12-25 2015-04-29 江西昌佳鑫科技有限公司 真空镀膜摄像头盖板及其制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003268542A (ja) * 2002-03-18 2003-09-25 Ulvac Japan Ltd 成膜装置及び成膜方法
CN101153380A (zh) * 2006-09-27 2008-04-02 宝山钢铁股份有限公司 有机预涂金属板上SiOx镀层的真空制备方法
CN104498876A (zh) * 2014-12-25 2015-04-08 江西昌佳鑫科技有限公司 摄像头盖板的真空镀膜方法
CN104561899A (zh) * 2014-12-25 2015-04-29 江西昌佳鑫科技有限公司 真空镀膜摄像头盖板及其制备方法

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111040473A (zh) * 2019-11-26 2020-04-21 广东盈骅新材料科技有限公司 亚氧化钛黑色颜料及其制备方法
CN111040473B (zh) * 2019-11-26 2021-02-23 广东盈骅新材料科技有限公司 亚氧化钛黑色颜料及其制备方法
CN112430798A (zh) * 2020-12-04 2021-03-02 无锡鑫巨宏智能科技有限公司 Hdpe塑料光学产品表面镀膜加硬的方法

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Application publication date: 20160323