CN105419673A - Conductive floor glue - Google Patents
Conductive floor glue Download PDFInfo
- Publication number
- CN105419673A CN105419673A CN201511008753.8A CN201511008753A CN105419673A CN 105419673 A CN105419673 A CN 105419673A CN 201511008753 A CN201511008753 A CN 201511008753A CN 105419673 A CN105419673 A CN 105419673A
- Authority
- CN
- China
- Prior art keywords
- floor glue
- electrically
- conducting floor
- glue
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention belongs to the building material technology field, and concretely provides conductive floor glue. The conductive floor glue is prepared from the following raw materials, by weight, 68-88% of elastic polymer emulsion, 10-30% of rosin, 0.2-0.5% of multifunctional auxiliary agent, 0.3-0.7% of thickening agent, 0.3-0.5% of surfactant, 0.2-0.5% of antifoaming agent, 0.2-0.6% of conductive fiber and 0.1-0.3% of antiseptic. The preparation method for the conductive floor glue comprises the following steps: the raw materials are weighed according to the above mass percents; the raw materials are added in a high-speed mixer in order in the following sequence: the elastic polymer emulsion, the rosin, the multifunctional auxiliary agent, the thickening agent, the surfactant, the antifoaming agent, the conductive fiber and the antiseptic; the raw materials are stirred and mixed fully and uniformly, and conductive floor glue is prepared. Compared with the prior art, the conductive floor glue has advantages of strong bonding capability, good conductive performance, large coating area and the like, the stability is high, the flexibility is good, and the conductive floor glue is convenient to use and can replace traditional floor adhesives for buildings.
Description
[technical field]
The invention belongs to building material technical field, specifically a kind of electrically-conducting floor glue.
[background technology]
The building site plate adhesive of current widespread use, be mainly water-soluble polyethylene formal class tackiness agent and water-soluble condensed aldehyde adhesive stick, such tackiness agent long-time interior volatile gases that constantly can discharge formaldehyde etc. and be harmful to after a procedure, drastically influence the health of environment and indoor occupant, and electroconductibility is bad.In addition, existing another kind of electrically-conducting floor glue commercially forms for preparation of raw material with polymer emulsion, carbon dust, and the viscosifying power of such electrically-conducting floor glue is general, and perveance is not high yet.Therefore, if can provide a kind of viscosifying power strong, conduct electricity very well, electrically-conducting floor glue that surface covered is large, to substitute traditional building site plate adhesive, will have very important significance.
[summary of the invention]
Object of the present invention is exactly will solve above-mentioned deficiency and provide a kind of electrically-conducting floor glue, have viscosifying power strong, conduct electricity very well, the advantage such as surface covered is large, and good stability, snappiness is good, easy to use, alternative traditional building site plate adhesive.
Design a kind of electrically-conducting floor glue for achieving the above object, this electrically-conducting floor glue is made up of following raw material by mass percentage:
As preferably, this electrically-conducting floor glue is made up of following raw material by mass percentage:
Described electro-conductive fiber is one or both mixtures in polypropylene-base carbon fiber, asphalt base carbon fiber.
Described defoamer is water drain silica, hydrophobic type polyol or polyether modified siloxane.
Described thickening material is polymeric amide.
Described thickening material also can be polyacrylate and polyacrylamide.
Described tensio-active agent is sodium dodecylbenzenesulfonate and ammoniacal liquor.
Described tensio-active agent also can be in sodium stearate, potassium stearate, calcium stearate one or more.
Described sanitas is sorbate or benzoate.
The preparation method of this electrically-conducting floor glue, comprise the following steps: by above-mentioned mass percent, take each raw material, each raw material is dropped into high-speed mixer successively by following sequencing: elastomeric polymer emulsion, rosin, multifunctional assistant, thickening material, tensio-active agent, defoamer, electro-conductive fiber, sanitas, after being fully uniformly mixed, obtain electrically-conducting floor glue.
The present invention compared with the existing technology, by with elastomeric polymer emulsion, rosin, multifunctional assistant, thickening material, tensio-active agent, defoamer, electro-conductive fiber, sanitas for raw material, through the proportioning of science, various starting material are added in a certain order, electrically-conducting floor glue obtained by sufficient stirring, have viscosifying power strong, conduct electricity very well, the advantage such as surface covered is large, and there is good stability, snappiness is good, easy to use, alternative traditional building site plate adhesive, is worthy of popularization.
[embodiment]
The invention provides a kind of electrically-conducting floor glue, this electrically-conducting floor glue is made up of following raw material by mass percentage: elastomeric polymer emulsion 68-88%, rosin 10-30%, multifunctional assistant 0.2-0.5%, thickening material 0.3-0.7%, tensio-active agent 0.3-0.5%, defoamer 0.2-0.5%, electro-conductive fiber 0.2-0.6%, sanitas 0.1-0.3%.The preparation method of this this electrically-conducting floor glue, comprise the following steps: by above-mentioned mass percent, take each raw material, each raw material is dropped into high-speed mixer successively by following sequencing: elastomeric polymer emulsion, rosin, multifunctional assistant, thickening material, tensio-active agent, defoamer, electro-conductive fiber, sanitas, after being fully uniformly mixed, obtain electrically-conducting floor glue.
Wherein, electro-conductive fiber is one or both mixtures in polypropylene-base carbon fiber, asphalt base carbon fiber.Defoamer is water drain silica, hydrophobic type polyol or polyether modified siloxane.Thickening material is polymeric amide, also can be polyacrylate and polyacrylamide.Tensio-active agent is sodium dodecylbenzenesulfonate and ammoniacal liquor, also can be one or more in sodium stearate, potassium stearate, calcium stearate.Sanitas is sorbate or benzoate.
Below in conjunction with specific embodiment, following further illustrating is done to the present invention:
Embodiment 1
This electrically-conducting floor glue is made up of following raw material by mass percentage, adopts the electrically-conducting floor glue that this proportioning is made, and its viscosifying power is stronger, conductivity is better:
Embodiment 2
This electrically-conducting floor glue is made up of following raw material by mass percentage:
Embodiment 3
This electrically-conducting floor glue is made up of following raw material by mass percentage:
Embodiment 4
This electrically-conducting floor glue is made up of following raw material by mass percentage:
The present invention, by the restriction of above-mentioned embodiment, change, the modification done, substitutes, combines, simplifies under other any does not deviate from spirit of the present invention and principle, all should be equivalent substitute mode, is included within protection scope of the present invention.
Claims (10)
1. an electrically-conducting floor glue, is characterized in that, this electrically-conducting floor glue is made up of following raw material by mass percentage:
2. electrically-conducting floor glue as claimed in claim 1, it is characterized in that, this electrically-conducting floor glue is made up of following raw material by mass percentage:
3. electrically-conducting floor glue as claimed in claim 1, is characterized in that: described electro-conductive fiber is one or both mixtures in polypropylene-base carbon fiber, asphalt base carbon fiber.
4. electrically-conducting floor glue as claimed in claim 1, is characterized in that: described defoamer is water drain silica, hydrophobic type polyol or polyether modified siloxane.
5. electrically-conducting floor glue as claimed in claim 1, is characterized in that: described thickening material is polymeric amide.
6. electrically-conducting floor glue as claimed in claim 1, is characterized in that: described thickening material is polyacrylate and polyacrylamide.
7. electrically-conducting floor glue as claimed in claim 1, is characterized in that: described tensio-active agent is sodium dodecylbenzenesulfonate and ammoniacal liquor.
8. electrically-conducting floor glue as claimed in claim 1, is characterized in that: described tensio-active agent is one or more in sodium stearate, potassium stearate, calcium stearate.
9. electrically-conducting floor glue as claimed in claim 1, is characterized in that: described sanitas is sorbate or benzoate.
10. the preparation method of electrically-conducting floor glue as claimed in any one of claims 1-9 wherein, it is characterized in that, comprise the following steps: by above-mentioned mass percent, take each raw material, each raw material is dropped into high-speed mixer successively by following sequencing: elastomeric polymer emulsion, rosin, multifunctional assistant, thickening material, tensio-active agent, defoamer, electro-conductive fiber, sanitas, after being fully uniformly mixed, obtain electrically-conducting floor glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511008753.8A CN105419673A (en) | 2015-12-29 | 2015-12-29 | Conductive floor glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511008753.8A CN105419673A (en) | 2015-12-29 | 2015-12-29 | Conductive floor glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105419673A true CN105419673A (en) | 2016-03-23 |
Family
ID=55498227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511008753.8A Pending CN105419673A (en) | 2015-12-29 | 2015-12-29 | Conductive floor glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105419673A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1778856A (en) * | 2004-11-26 | 2006-05-31 | 吉林正基科技开发有限责任公司 | Polyaniline conducting adhesive |
| CN1831073A (en) * | 2005-03-07 | 2006-09-13 | 国家淀粉及化学投资控股公司 | Low stress conductive adhesive |
| CN101419851A (en) * | 2007-10-25 | 2009-04-29 | 财团法人工业技术研究院 | Conductivity composite material |
| CN103320056A (en) * | 2013-07-11 | 2013-09-25 | 中国科学院宁波材料技术与工程研究所 | Binder for laminated wood |
-
2015
- 2015-12-29 CN CN201511008753.8A patent/CN105419673A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1778856A (en) * | 2004-11-26 | 2006-05-31 | 吉林正基科技开发有限责任公司 | Polyaniline conducting adhesive |
| CN1831073A (en) * | 2005-03-07 | 2006-09-13 | 国家淀粉及化学投资控股公司 | Low stress conductive adhesive |
| CN101419851A (en) * | 2007-10-25 | 2009-04-29 | 财团法人工业技术研究院 | Conductivity composite material |
| CN103320056A (en) * | 2013-07-11 | 2013-09-25 | 中国科学院宁波材料技术与工程研究所 | Binder for laminated wood |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160323 |
|
| RJ01 | Rejection of invention patent application after publication |