CN105405895A - 一种低存储电荷快恢复二极管芯片 - Google Patents
一种低存储电荷快恢复二极管芯片 Download PDFInfo
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- CN105405895A CN105405895A CN201510951716.4A CN201510951716A CN105405895A CN 105405895 A CN105405895 A CN 105405895A CN 201510951716 A CN201510951716 A CN 201510951716A CN 105405895 A CN105405895 A CN 105405895A
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- 238000011084 recovery Methods 0.000 claims abstract description 34
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 71
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- 239000011521 glass Substances 0.000 claims description 19
- 238000002161 passivation Methods 0.000 claims description 18
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- GVVPGTZRZFNKDS-JXMROGBWSA-N geranyl diphosphate Chemical compound CC(C)=CCC\C(C)=C\CO[P@](O)(=O)OP(O)(O)=O GVVPGTZRZFNKDS-JXMROGBWSA-N 0.000 description 12
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
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- 241001125929 Trisopterus luscus Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electrodes Of Semiconductors (AREA)
- Recrystallisation Techniques (AREA)
Abstract
Description
Claims (10)
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CN201510951716.4A CN105405895B (zh) | 2015-12-17 | 2015-12-17 | 一种低存储电荷快恢复二极管芯片 |
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CN105405895A true CN105405895A (zh) | 2016-03-16 |
CN105405895B CN105405895B (zh) | 2018-10-02 |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106571402A (zh) * | 2016-11-18 | 2017-04-19 | 吉林瑞能半导体有限公司 | 一种快恢复功率二极管及其制造方法 |
CN106971942A (zh) * | 2017-03-16 | 2017-07-21 | 江阴新顺微电子有限公司 | 一种n+p‑结构快恢复二极管芯片的制造方法 |
CN107293598A (zh) * | 2016-11-25 | 2017-10-24 | 扬州国宇电子有限公司 | 一种低反向恢复电荷平面快恢复二极管芯片 |
CN109638083A (zh) * | 2018-12-29 | 2019-04-16 | 捷捷半导体有限公司 | 一种快恢复二极管及其制备方法 |
CN109671625A (zh) * | 2017-10-13 | 2019-04-23 | 华润微电子(重庆)有限公司 | 快恢复二极管的制备方法 |
CN109686666A (zh) * | 2018-12-26 | 2019-04-26 | 常州星海电子股份有限公司 | 一种快恢复芯片制作方法 |
CN110620139A (zh) * | 2019-09-03 | 2019-12-27 | 常山弘远电子有限公司 | 一种ac-dc高压续流二极管芯片结构 |
CN113113324A (zh) * | 2021-04-07 | 2021-07-13 | 捷捷半导体有限公司 | 一种钝化层制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1044737A (zh) * | 1988-12-14 | 1990-08-15 | 克里研究公司 | 碳化硅超快速高温整流二极管 |
US5432360A (en) * | 1993-02-24 | 1995-07-11 | Samsung Electronics Co., Ltd. | Semiconductor device including an anode layer having low density regions by selective diffusion |
JP2003347418A (ja) * | 2002-05-23 | 2003-12-05 | Nissan Motor Co Ltd | 半導体装置およびその製造方法 |
JP2011205040A (ja) * | 2010-03-26 | 2011-10-13 | Brainvision Inc | 半導体基板および光電変換素子ならびにそれらの製造方法 |
CN103578978A (zh) * | 2013-10-17 | 2014-02-12 | 北京时代民芯科技有限公司 | 一种基于硅基键合材料的高压快恢复二极管制造方法 |
-
2015
- 2015-12-17 CN CN201510951716.4A patent/CN105405895B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1044737A (zh) * | 1988-12-14 | 1990-08-15 | 克里研究公司 | 碳化硅超快速高温整流二极管 |
US5432360A (en) * | 1993-02-24 | 1995-07-11 | Samsung Electronics Co., Ltd. | Semiconductor device including an anode layer having low density regions by selective diffusion |
JP2003347418A (ja) * | 2002-05-23 | 2003-12-05 | Nissan Motor Co Ltd | 半導体装置およびその製造方法 |
JP2011205040A (ja) * | 2010-03-26 | 2011-10-13 | Brainvision Inc | 半導体基板および光電変換素子ならびにそれらの製造方法 |
CN103578978A (zh) * | 2013-10-17 | 2014-02-12 | 北京时代民芯科技有限公司 | 一种基于硅基键合材料的高压快恢复二极管制造方法 |
Non-Patent Citations (1)
Title |
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蔡杏山: "《电子元器件检测轻松入门》", 31 January 2014, 机械工业出版社 * |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106571402A (zh) * | 2016-11-18 | 2017-04-19 | 吉林瑞能半导体有限公司 | 一种快恢复功率二极管及其制造方法 |
CN106571402B (zh) * | 2016-11-18 | 2024-03-29 | 吉林瑞能半导体有限公司 | 一种快恢复功率二极管及其制造方法 |
CN107293598A (zh) * | 2016-11-25 | 2017-10-24 | 扬州国宇电子有限公司 | 一种低反向恢复电荷平面快恢复二极管芯片 |
CN106971942A (zh) * | 2017-03-16 | 2017-07-21 | 江阴新顺微电子有限公司 | 一种n+p‑结构快恢复二极管芯片的制造方法 |
CN109671625A (zh) * | 2017-10-13 | 2019-04-23 | 华润微电子(重庆)有限公司 | 快恢复二极管的制备方法 |
CN109686666A (zh) * | 2018-12-26 | 2019-04-26 | 常州星海电子股份有限公司 | 一种快恢复芯片制作方法 |
CN109638083A (zh) * | 2018-12-29 | 2019-04-16 | 捷捷半导体有限公司 | 一种快恢复二极管及其制备方法 |
CN109638083B (zh) * | 2018-12-29 | 2024-04-05 | 捷捷半导体有限公司 | 一种快恢复二极管及其制备方法 |
CN110620139A (zh) * | 2019-09-03 | 2019-12-27 | 常山弘远电子有限公司 | 一种ac-dc高压续流二极管芯片结构 |
CN113113324A (zh) * | 2021-04-07 | 2021-07-13 | 捷捷半导体有限公司 | 一种钝化层制作方法 |
CN113113324B (zh) * | 2021-04-07 | 2024-02-06 | 捷捷半导体有限公司 | 一种钝化层制作方法 |
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Inventor after: Yang Yong Inventor after: Jin Yinping Inventor after: Ma Wenli Inventor after: Yao Weiming Inventor after: Yang Dangli Inventor after: Wang Yuanzheng Inventor after: Tan Dexi Inventor before: Yang Yong Inventor before: Ma Wenli Inventor before: Yao Weiming Inventor before: Yang Dangli Inventor before: Wang Yuanzheng Inventor before: Tan Dexi |
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