CN105399051B - Using cyclenes copolymer as substrate and the micro flow chip packaging method of upper cover - Google Patents
Using cyclenes copolymer as substrate and the micro flow chip packaging method of upper cover Download PDFInfo
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- CN105399051B CN105399051B CN201511006070.9A CN201511006070A CN105399051B CN 105399051 B CN105399051 B CN 105399051B CN 201511006070 A CN201511006070 A CN 201511006070A CN 105399051 B CN105399051 B CN 105399051B
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- chip
- upper cover
- egative film
- pin
- micro flow
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
The invention discloses a kind of using cyclenes copolymer as substrate and the micro flow chip packaging method of upper cover, include the following steps：According to the miniature function on chip egative film and the fluid space needed, and the position on chip egative film that signal needs are drawn, corresponding mold is designed and produced, pin is linked into mold, by injection molding, the chip upper cover with liquid reactions chamber and pin is obtained；Using the upper cover with liquid reactions chamber and pin and chip egative film, it is closely linked by microwave joining technology.By the implementation of the present invention, the method being mainly combined between high molecular polymer micro flow chip egative film and upper cover by adhesion process is changed.By the method upper cover of microwave joining and chip egative film by surface pole extexine physics melted join together with, the packaging effect with the completely the same sealing fluid body cavity of physical property is obtained after solidification.
Description
Technical field
It is more particularly to a kind of using cyclenes copolymer as substrate and upper cover material the invention belongs to micro flow chip encapsulation field
The encapsulation technology of electrochemical microfluidic chip.
Background technology
Micro flow chip refers on micro-meter scale, using micro electronmechanical in certain substrate（MEMS）Technology, injection molding skill
The making such as art and encapsulation technology include the miniature functions such as sensor, reactor and respective reaction space and liquid communication
The overall structure of pipeline and working fluid inlet and outlet channel.Micro flow chip can be realized sampling, dilution, reagent adding, anti-
Should, separation, detection etc. be integrated on microchip and complete, and can be used for multiple times.
This spline structure causes the liquid in micro flow chip to flow controllable, consumption sample and reagent are few, analyze speed is fast etc.
Feature, it is analyzed, and can be with canbe used on line while can carrying out a sample up to a hundred within a few minutes or even shorter time
The processing of sample and analysis overall process, then since its is small, integrated level is high, at low cost and can be mass-produced, miniflow
Chip is widely used in fields such as analytical chemistry, biomedicine, medical diagnosis on disease, drug screening, environmental monitorings.
The material of micro flow chip primarily now has silicon materials, hyaline-quartz material and high molecular polymer.Height therein
The advantages that Molecularly Imprinted Polymer is due at low cost, easily processed into type and batch production, has obtained more and more concerns.Often at present
High molecular polymer material has polyamide (PI), polymethyl methacrylate (PMMA), makrolon (PC), gathers to benzene two
Formic acid glycol ester (PET), dimethyl silicone polymer (PDMS), epoxy resin and polyurethane etc..It is needed for different detections,
Select suitable micro flow chip material.
Cyclenes copolymer（Cyclic Olefin Copolymer, COC）, it is a kind of novel amorphous polyolefins resin,
Compared to above high molecular polymer, due to the nonpolar of its surface and very high temperature tolerance, glass transition temperature is up to 80-
180 DEG C, extremely low water absorption rate, nearly close to zero, very strong barrier properties for gases, for O2Transmitance 60mm/ (cm2D),
CO2Transmitance 25mm/ (cm2D), moisture transmission 0.09mm/ (cm2D) it is more than with good optical property, light transmittance
91%, birefringence is minimum, and dispersion is small and corrosion resistance so that COC, which becomes, to be made with analytical solution intermediate ion and polar molecule
The fine material of micro flow chip.
Packaging method using COC as substrate and the micro flow chip of upper cover is ultraviolet glue method.Its principle is to ultraviolet using COC
The transmittance of light is coated with one layer of ultraviolet glue, after ultra violet lamp component, ultraviolet glue in COC upper covers and die substrate junction
It is interior to cure due to photosensitized reaction so that upper cover and bottom plate are glued together with.
The main problem of ultraviolet glue technology is that glue application amount and coating homogeneity can all influence upper cover and combined with bottom plate
Tight ness rating and service life.What it is due to the analysis of COC micro flow chips is ion and polar molecule in solution, and the ultraviolet glue having cured is known from experience
Contact analysis solution causes the change of solution composition, while also shortens the viscous and effect of uv-curable glue so as to shorten micro-
Flow the service life of chip.
To be brought more than solving the problems, such as by substrate and upper cover encapsulation technology of COC, need to develop a kind of encapsulation tightly, hold
Long, it does not destroy micro- function element structure on substrate, while the volume of liquid reactions chamber and function element signal can be kept
It draws.
Invention content
It is an object of the invention to overcome problem above of the existing technology, one kind is provided using cyclenes copolymer as substrate
With the micro flow chip packaging method of upper cover.
To realize above-mentioned technical purpose and the technique effect, the invention is realized by the following technical scheme：
It is a kind of using cyclenes copolymer as substrate and the micro flow chip packaging method of upper cover, include the following steps：
Step 1）It is drawn according to the miniature function on chip egative film and the fluid space needed and signal needs
Position on chip egative film designs and produces corresponding mold, pin is linked into mold, by injection molding, obtains band
There is the chip upper cover of liquid reactions chamber and pin；
Step 2）Using the upper cover with liquid reactions chamber and pin and chip egative film, closely tied by microwave joining technology
It is combined.
The mold design of upper cover will not only be supplied to miniature function and fluid space on micro-nano-scale, but also
According to position of the signal lead-out wire on chip egative film, pin is linked into the extraction needed on mold with signal on chip egative film
Block position corresponding.During injection molding upper cover, the accurate of liquid reactions cavity volume and position is not only needed,
And pin is needed to be maintained at accurate position.
The microwave joining is under the microwave radiation of 20-40 kHz, caused upper cover and the COC materials of chip in one second
Reach semi-molten simultaneously so as to mutually fuse together and solidify simultaneously by the 1-5 microns of surface layers of ultrasound lines on surface, reach
Lid and chip egative film are closely linked.
The beneficial effects of the invention are as follows:
By the implementation of the present invention, change and mainly pass through gluing between high molecular polymer micro flow chip egative film and upper cover
The method that technique is combined.It is melted by the method upper cover of microwave joining with chip egative film by surface pole extexine physics
Change is combined together, and the packaging effect with the completely the same sealing fluid body cavity of physical property is obtained after solidification.For there is detection
Or response signal needs to draw micro flow chip, by the corresponding position being connected to pin in the mold of upper cover, in microwave joining
In technical process so that the signal lead-out area on pin contact chip egative film.It both can guarantee that signal was smooth by pin in this way
It draws outside micro flow chip, and can guarantee that signal is drawn through only allows signal to pass through, and measuring liquid will not then draw along signal
Go out channel to leak.The implementation of the present invention, is conducive to the unified micro flow chip of mass production specification, quality, so as to micro- to reduce
The production cost of chip is flowed, expands the application range establishing techniques basis of micro flow chip.
Above description is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be implemented in accordance with the contents of the specification, below with presently preferred embodiments of the present invention and after attached drawing is coordinated to be described in detail such as.
The specific embodiment of the present invention is shown in detail by following embodiment and its attached drawing.
Description of the drawings
Attached drawing described herein is used to provide further understanding of the present invention, and forms the part of the application, this hair
Bright illustrative embodiments and their description do not constitute improper limitations of the present invention for explaining the present invention.In the accompanying drawings：
Fig. 1 is the electrochemistry for including microelectrode system made on COC substrates with MEMS technology that the present invention uses
Micro flow chip egative film；
Fig. 2 is the shape and size requirement for the corresponding liquid reactions chamber of electrochemical microfluidic chip egative film that the present invention uses；
Fig. 3 is the chip obtained with microwave joining technology-upper cover combination schematic diagram that the present invention is used as example.
Specific embodiment
It is below with reference to the accompanying drawings and in conjunction with the embodiments, next that the present invention will be described in detail.
The present invention in almost internal stress free COC on pieces with MEMS technology with by making the electrochemical microfluidic chip obtained
The encapsulation of the COC upper covers comprising pin and liquid reactions chamber that egative film and utilization injection molding technology obtain is as example explanation
Processes of the COC as the encapsulation of micro flow chip egative film and upper cover material.
It is according to the size of electrochemical microfluidic chip, the size of microelectrode system, position, the body of liquid reactions chamber first
Product, the requirement of shape, as illustrated in fig. 1 and 2,11 represent electrical plated pads in figure, and 12 represent microelectrode system.Each microelectrode is in
Cuboid grows 3 millimeters, 0.5 millimeter high, 200 nanometers of thickness.220 microns of liquid reactions chamber height, 10 microlitres of volume.Liquid accordingly
Reaction chamber pole designs and produces corresponding mold, and corresponds on mold chip egative film power on signal and draw the position access of block and draw
Foot.By injection molding, the upper cover with pin and liquid reactions cavity configuration is obtained.
Second step is the combination before being packaged electrochemical microfluidic chip egative film and upper cover according to specific combination.
Third step is by microwave joining technology, under the welding of 20 kHz ultrasonic oscillations, in the time less than one second
It is interior, it is mutually viscous together in egative film and the fusing of ultrasound lines 1-5 micron thickness that upper cover passes through surface, reach what is combined closely
Purpose.The analysis chip finished product of last acquisition is as shown in figure 3,1 expression upper cover housing, 2 expression liquid inlets, 3 expressions in figure
Liquid outlet, 4 represent upper cover technology pin, and 5 represent detection chip.By the detection of liquid and electrode signal, realize to electricity
The expectation function of chemical micro flow chip.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, that is made any repaiies
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (2)
- It is 1. a kind of using cyclenes copolymer as substrate and the micro flow chip packaging method of upper cover, which is characterized in that include the following steps：Step 1）According to the miniature function on chip egative film and need fluid space and signal needs draw in core Position on piece egative film designs and produces corresponding mold, pin is linked into mold, by injection molding, obtains with liquid The chip upper cover of precursor reactant chamber and pin corresponds to the position access that the chip egative film power on signal draws block on the mold Pin；Step 2）Using the upper cover with liquid reactions chamber and pin and chip egative film, combined closely by microwave joining technology Together.
- 2. micro flow chip packaging method according to claim 1, it is characterised in that：The microwave joining is 20-40 kilo hertzs Under microwave radiation hereby, in one second so that the COC materials of upper cover and chip by the 1-5 microns of surface layers of ultrasound lines on surface simultaneously Reach semi-molten so as to mutually fuse together and solidify simultaneously, reach upper cover and chip egative film is closely linked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511006070.9A CN105399051B (en) | 2015-12-29 | 2015-12-29 | Using cyclenes copolymer as substrate and the micro flow chip packaging method of upper cover |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201511006070.9A CN105399051B (en) | 2015-12-29 | 2015-12-29 | Using cyclenes copolymer as substrate and the micro flow chip packaging method of upper cover |
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| CN105399051A CN105399051A (en) | 2016-03-16 |
| CN105399051B true CN105399051B (en) | 2018-06-22 |
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| CN201511006070.9A Active CN105399051B (en) | 2015-12-29 | 2015-12-29 | Using cyclenes copolymer as substrate and the micro flow chip packaging method of upper cover |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100591862B1 (en) * | 2004-06-17 | 2006-06-26 | 재단법인서울대학교산학협력재단 | The Micro-Electro-Machine Using SiOG Substrate and manufacturing method of the same |
| CN101468506B (en) * | 2008-06-18 | 2012-02-01 | 中国检验检疫科学研究院 | Bulk production method of micro-fluidic chip |
| CN101544350A (en) * | 2009-01-05 | 2009-09-30 | 大连理工大学 | Microstructure used for supersonic bonding of micro-passages of polymer microflow-control chips |
| CN103394382A (en) * | 2013-08-07 | 2013-11-20 | 苏州扬清芯片科技有限公司 | Microfluidic chip with optical filtering characteristics |
| CN203720145U (en) * | 2014-03-13 | 2014-07-16 | 南京洁态环保科技有限公司 | Electrochemical micro-fluidic chip |
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Denomination of invention: Method for packaging microfluidic chip with cyclo-olefin copolymer (COC) substrate and COC upper cover Effective date of registration: 20190618 Granted publication date: 20180622 Pledgee: Bank of Jiangsu, Limited by Share Ltd, Nanjing Pukou branch Pledgor: NANJING JIETAI ENVIRONMENTAL PROTECTION TECHNOLOGY CO., LTD. Registration number: 2019320000282 |
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Date of cancellation: 20200609 Granted publication date: 20180622 Pledgee: Bank of Jiangsu Limited by Share Ltd. Nanjing Pukou branch Pledgor: NANJING JIETAI ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. Registration number: 2019320000282 |
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Effective date of registration: 20201223 Address after: 215000 No.1, Songhe Road, Luzhi Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Jiangsu Guoji Juneng Environmental Technology Co.,Ltd. Address before: No. 24-88, Qiaolin Industrial Park, Pukou District, Nanjing City, Jiangsu Province, 210000 Patentee before: NANJING JIETAI ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. |