CN105399051A - Method for packaging microfluidic chip with cyclo-olefin copolymer (COC) substrate and COC upper cover - Google Patents
Method for packaging microfluidic chip with cyclo-olefin copolymer (COC) substrate and COC upper cover Download PDFInfo
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- CN105399051A CN105399051A CN201511006070.9A CN201511006070A CN105399051A CN 105399051 A CN105399051 A CN 105399051A CN 201511006070 A CN201511006070 A CN 201511006070A CN 105399051 A CN105399051 A CN 105399051A
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- substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
The invention discloses a method for packaging a microfluidic chip with a cyclo-olefin copolymer (COC) substrate and a COC upper cover. The method comprises the following steps: designing and manufacturing a corresponding mold according to miniature functional components on the substrate of the microfluidic chip, a required fluid space and the position for signal extraction on the substrate, connecting pins into the mold, and carrying out injection molding to obtain the upper cover, with liquid reaction cavities and the pins, of the microfluidic chip; and tightly combining the upper cover with the liquid reaction cavities and the pins with the substrate according to a microwave welding technology. Through implementation of the method provided by the invention, the conventional method for combining the substrate and upper cover of a high-molecular polymer microfluidic chip mainly according to an adhesive technology is changed, that is, the upper cover and the substrate of the COC microfluidic chip can be combined through physical fusion of a surface and an exterior layer according to the microwave welding method, and a packaging effect that closed liquid cavities with completely consistent physical properties are formed can be achieved after solidification.
Description
Technical field
The invention belongs to micro flow chip encapsulation field, particularly a kind of take cyclenes copolymer as the encapsulation technology of the electrochemical microfluidic chip of substrate and upper cover material.
Background technology
Micro flow chip refers on micro-meter scale, certain substrate utilizes micro electronmechanical (MEMS) technology, what injection molding technology and encapsulation technology etc. made comprises sensor, the overall structure of the miniature function such as reactor and respective reaction space and liquid communication pipeline and working fluid inlet and outlet passage.Micro flow chip can realize sampling, dilution, reagent adding, reaction, separation, detection etc. to be integrated on microchip to complete, and can repeatedly use.
This spline structure make the liquid flow in micro flow chip controlled, consume sample and the feature such as reagent is few, analysis speed is fast, it is analyzed while can carrying out up to a hundred samples within even shorter time a few minutes, and can canbe used on line sample process and analyze overall process, again because its volume is little, integrated level is high, cost is low and can be mass-produced, therefore, micro flow chip is in analytical chemistry, biomedicine, medical diagnosis on disease, drug screening, and the fields such as environmental monitoring are widely used.
The material of now main micro flow chip has silicon materials, hyaline-quartz material and high molecular polymer.High molecular polymer wherein, because cost is low, be easy to the advantage such as machine-shaping and batch production, obtains increasing concern.High molecular polymer material conventional at present has polyamide (PI), polymethyl methacrylate (PMMA), Merlon (PC), PETG (PET), dimethyl silicone polymer (PDMS), epoxy resin and polyurethane etc.Need for different detections, select suitable micro flow chip material.
Cyclenes copolymer (CyclicOlefinCopolymer, COC), it is a kind of novel amorphous polyolefins resin, compared to above high molecular polymer, due to the nonpolar of its surface and very high temperature tolerance, its vitrification point is up to 80-180 DEG C, extremely low water absorption rate, almost close to zero, very strong barrier properties for gases, for O
2transmitance 60mm/ (cm
2d), CO
2transmitance 25mm/ (cm
2d), moisture transmission 0.09mm/ (cm
2d), and good optical property, light transmittance is greater than 91%, and birefringence is minimum, the little and corrosion resistance of dispersion, COC is become make the fine material with analytical solution intermediate ion and polar molecule micro flow chip.
Take COC as the method for packing of the micro flow chip of substrate and upper cover be ultraviolet glue method.Its principle utilizes COC to the transmittance of ultraviolet light, is coated with one deck ultraviolet glue at COC upper cover and die substrate junction, after ultra violet lamp assembly, solidifies in ultraviolet glue due to photosensitized reaction, make upper cover and base plate sticky with together with.
The subject matter of ultraviolet glue technology is the tight ness rating and life-span that glue application amount and coating homogeneity all can affect that upper cover is combined with base plate.Due to the analysis of COC micro flow chip is ion in solution and polar molecule, and the ultraviolet glue that have cured knows from experience contact analysis solution, causes the change of solution composition, also shortens the sticky of ultra-violet curing glue and effect simultaneously thus shortens service life of micro flow chip.
Being the problem that substrate and upper cover encapsulation technology are brought for solving above with COC, needing a kind of encapsulation of development tight, lastingly, not destroying the micro-function element structure on substrate, the volume in liquid reactions chamber and the extraction of function element signal can be kept simultaneously.
Summary of the invention
The object of the invention is to overcome the above problem that prior art exists, providing a kind of take cyclenes copolymer as the micro flow chip method for packing of substrate and upper cover.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the present invention is achieved through the following technical solutions:
Take cyclenes copolymer as a micro flow chip method for packing for substrate and upper cover, comprise the following steps:
Step 1) is according to the fluid space of the miniature function on chip egative film and needs, and the position on chip egative film that signal demand is drawn, design and produce corresponding mould, pin is linked in mould, by injection mo(u)lding, obtain the chip upper cover with liquid reactions chamber and pin;
Step 2) utilize upper cover with liquid reactions chamber and pin and chip egative film, be closely linked by microwave joining technology.
The Design of Dies of upper cover not only will be supplied to miniature function on micro-nano-scale and fluid space, and according to the position of signal lead-out wire on chip egative film, pin is linked on mould and needs the position corresponding with the extraction block position of signal on chip egative film.In the process of injection mo(u)lding upper cover, not only need the accurate of liquid reactions cavity volume and position, and need pin to remain on position accurately.
Described microwave joining is under the microwave of 20-40 KHz, in one second, make the COC material of upper cover and chip reach semi-molten simultaneously by the ultrasound lines 1-5 micron top layer on surface thus mutually fuse together and solidify simultaneously, reach upper cover and chip egative film is closely linked.
The invention has the beneficial effects as follows:
By enforcement of the present invention, change between high molecular polymer micro flow chip egative film and upper cover and carry out mainly through adhesion process the method that combines.Make upper cover and chip egative film by together with the extexine physics melted join of surperficial pole by the method for microwave joining, solidify the packaging effect that rear acquisition has the on all four sealing fluid body cavity of physical property.Needing for having detection or response signal to draw micro flow chip, by pin being received the correspondence position in the mould of upper cover, in microwave joining technical process, making the signal lead-out area on pin contact chip egative film.Can ensure that signal passes through pin and draws smoothly outside micro flow chip like this, can ensure that again signal is drawn through and only allow signal to pass through, measure liquid and then can not leak along signal extraction channel.Enforcement of the present invention, is conducive to the micro flow chip that mass production specification, quality are unified, thus for reducing the production cost of micro flow chip, expands the range of application establishing techniques basis of micro flow chip.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present invention.The specific embodiment of the present invention is provided in detail by following examples and accompanying drawing thereof.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide a further understanding of the present invention, and form a application's part, schematic description and description of the present invention, for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 is the electrochemical microfluidic chip egative film comprising microelectrode system that utilization MEMS technology that the present invention uses makes on COC substrate;
Fig. 2 is the shape and size requirement in the liquid reactions chamber that electrochemical microfluidic chip egative film that the present invention uses is corresponding;
Fig. 3 is that the chip-upper cover of the utilization microwave joining technology acquisition that the present invention uses as an example is in conjunction with schematic diagram.
Detailed description of the invention
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the present invention in detail.
The present invention illustrates the process of COC as the encapsulation of micro flow chip egative film and upper cover material as an example using the electrochemical microfluidic chip egative film by using MEMS technology to make acquisition on almost internal stress free COC sheet and the encapsulation comprising the COC upper cover in pin and liquid reactions chamber of using injection molding technology to obtain.
First be the size of the size according to electrochemical microfluidic chip, microelectrode system, position, the volume in liquid reactions chamber, the requirement of shape, as illustrated in fig. 1 and 2, in figure, 11 represent electrical plated pads, and 12 represent microelectrode system.Each microelectrode is long 3 millimeters of cuboid, high 0.5 millimeter, thickness 200 nanometer.Liquid reactions chamber height 220 microns, volume 10 microlitre.Pole, liquid reactions chamber designs and produces corresponding mould accordingly, and corresponding chip egative film power on signal draws the position access pin of block on mould.By injection mo(u)lding, obtain the upper cover with pin and liquid reactions cavity configuration.
Second step is the combination before electrochemical microfluidic chip egative film and upper cover being encapsulated according to specific combination.
3rd step is by microwave joining technology, under 20 KHz ultrasonic oscillations welding, less than in the time of one second, egative film and upper cover by the fusing of the ultrasound lines 1-5 micron thickness on surface mutually sticky with together with, reach the object of combining closely.As shown in Figure 3, in figure, 1 represents upper cover housing, 2 express liquid entrances to the analysis chip finished product of last acquisition, 3 express liquid outlets, and 4 represent upper cover technology pin, and 5 represent detection chip.By the detection of liquid and electrode signal, achieve the expectation function to electrochemical microfluidic chip.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (2)
1. be a micro flow chip method for packing for substrate and upper cover with cyclenes copolymer, it is characterized in that, comprise the following steps:
Step 1) is according to the fluid space of the miniature function on chip egative film and needs, and the position on chip egative film that signal demand is drawn, design and produce corresponding mould, pin is linked in mould, by injection mo(u)lding, obtain the chip upper cover with liquid reactions chamber and pin;
Step 2) utilize upper cover with liquid reactions chamber and pin and chip egative film, be closely linked by microwave joining technology.
2. micro flow chip method for packing according to claim 1, it is characterized in that: described microwave joining is under the microwave of 20-40 KHz, in one second, make the COC material of upper cover and chip reach semi-molten simultaneously by the ultrasound lines 1-5 micron top layer on surface thus mutually fuse together and solidify simultaneously, reach upper cover and chip egative film is closely linked.
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| CN201511006070.9A CN105399051B (en) | 2015-12-29 | 2015-12-29 | Using cyclenes copolymer as substrate and the micro flow chip packaging method of upper cover |
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| CN201511006070.9A CN105399051B (en) | 2015-12-29 | 2015-12-29 | Using cyclenes copolymer as substrate and the micro flow chip packaging method of upper cover |
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| CN105399051A true CN105399051A (en) | 2016-03-16 |
| CN105399051B CN105399051B (en) | 2018-06-22 |
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Citations (5)
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|---|---|---|---|---|
| KR100591862B1 (en) * | 2004-06-17 | 2006-06-26 | 재단법인서울대학교산학협력재단 | The Micro-Electro-Machine Using SiOG Substrate and manufacturing method of the same |
| CN101468506A (en) * | 2008-06-18 | 2009-07-01 | 中国检验检疫科学研究院 | Bulk production method of micro-fluidic chip |
| CN101544350A (en) * | 2009-01-05 | 2009-09-30 | 大连理工大学 | Microstructure used for supersonic bonding of micro-passages of polymer microflow-control chips |
| CN103394382A (en) * | 2013-08-07 | 2013-11-20 | 苏州扬清芯片科技有限公司 | Microfluidic chip with optical filtering characteristics |
| CN203720145U (en) * | 2014-03-13 | 2014-07-16 | 南京洁态环保科技有限公司 | Electrochemical micro-fluidic chip |
-
2015
- 2015-12-29 CN CN201511006070.9A patent/CN105399051B/en active Active
Patent Citations (5)
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| KR100591862B1 (en) * | 2004-06-17 | 2006-06-26 | 재단법인서울대학교산학협력재단 | The Micro-Electro-Machine Using SiOG Substrate and manufacturing method of the same |
| CN101468506A (en) * | 2008-06-18 | 2009-07-01 | 中国检验检疫科学研究院 | Bulk production method of micro-fluidic chip |
| CN101544350A (en) * | 2009-01-05 | 2009-09-30 | 大连理工大学 | Microstructure used for supersonic bonding of micro-passages of polymer microflow-control chips |
| CN103394382A (en) * | 2013-08-07 | 2013-11-20 | 苏州扬清芯片科技有限公司 | Microfluidic chip with optical filtering characteristics |
| CN203720145U (en) * | 2014-03-13 | 2014-07-16 | 南京洁态环保科技有限公司 | Electrochemical micro-fluidic chip |
Non-Patent Citations (2)
| Title |
|---|
| 刘莹 等: ""COC微流控芯片注塑成型微结构复制度研究"", 《塑料工业》 * |
| 王晓东 等: ""聚合物微流控芯片超声波微熔融键合方法"", 《纳米技术与精密工程》 * |
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Denomination of invention: Method for packaging microfluidic chip with cyclo-olefin copolymer (COC) substrate and COC upper cover Effective date of registration: 20190618 Granted publication date: 20180622 Pledgee: Bank of Jiangsu, Limited by Share Ltd, Nanjing Pukou branch Pledgor: NANJING JIETAI ENVIRONMENTAL PROTECTION TECHNOLOGY CO., LTD. Registration number: 2019320000282 |
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Date of cancellation: 20200609 Granted publication date: 20180622 Pledgee: Bank of Jiangsu Limited by Share Ltd. Nanjing Pukou branch Pledgor: NANJING JIETAI ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. Registration number: 2019320000282 |
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Effective date of registration: 20201223 Address after: 215000 No.1, Songhe Road, Luzhi Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Jiangsu Guoji Juneng Environmental Technology Co.,Ltd. Address before: No. 24-88, Qiaolin Industrial Park, Pukou District, Nanjing City, Jiangsu Province, 210000 Patentee before: NANJING JIETAI ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. |
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