CN102033135B - Integrated microfluidic chip interface mould - Google Patents

Integrated microfluidic chip interface mould Download PDF

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CN102033135B
CN102033135B CN 201010500815 CN201010500815A CN102033135B CN 102033135 B CN102033135 B CN 102033135B CN 201010500815 CN201010500815 CN 201010500815 CN 201010500815 A CN201010500815 A CN 201010500815A CN 102033135 B CN102033135 B CN 102033135B
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microfluidic chip
boss
mold
male
interface
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CN 201010500815
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CN102033135A (en
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苑伟政
张峰
常洪龙
郝思聪
丁继亮
谢建兵
陈方璐
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西北工业大学
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Abstract

本发明公开了一种一体式微流控芯片接口,属于微流控芯片领域。 The present invention discloses an integrated microfluidic chip interface, belonging to microfluidic chips. 该接口包括封接于微流控芯片4之上的水平基体1和位于水平基体1上的若干凸台2;所述的凸台2内有连接管道3,连接管道3使微流控芯片4上的微通道与外界连通。 The interface includes a seal on the plurality of projections 2 on a microfluidic chip level matrix over 41 and the horizontal base; connecting pipe 3 2 of the boss, the connecting duct 3 of the micro-fluidic chip 4 the microchannel communicates with the outside. 此外,本发明还公开了接口的基于模具的制作方法以及其使用方法。 Further, the present invention also discloses a manufacturing method using a mold and a method based interface. 本发明提出的一体式微流控芯片接口无需使用胶粘剂,即可实现外部宏观系统与微流控芯片系统的连接,密封效果好,而且不会造成微通道堵塞。 The present invention is integrally made of the microfluidic chip interface without using an adhesive, it can be achieved with the system connected to external macro microfluidic chip systems, good sealing effect, but without causing blockage microchannel. 其制作方法,通过接口模具可实现一体式微流控芯片接口的批量化加工。 Its production method, through the interface may be implemented integrally mold batch processing microfluidic chip interface.

Description

一体式微流控芯片接口模具[0001] 一、所属领域:[0002] 本发明涉及一种一体式微流控芯片接口、接口模具及接口制作、使用方法,属于微流控芯片领域。 Microfluidic chip interface integrally mold [0001] First, the art: [0002] The present invention relates to microfluidic chips An integrated microfluidic chip interfaces, interfaces and interface mold making, use, belong. 二、背景技术:[0003] 微流控芯片又称微流控芯片实验室,指的是在一块几平方厘米的芯片上构建的化学或生物实验室。 II. Background art: [0003] The microfluidic chip also known laboratory microfluidic chip, refers built on a chip of several square centimeters chemical or biological laboratory. 它把化学和生物等领域中所涉及的样品制备、反应、分离、检测,细胞培养、分选、裂解等基本操作单元集成到一块很小的芯片上,由微通道形成网络,以可控流体贯穿整个系统,用以实现常规化学或生物实验室的各种功能。 It biological sample preparation and chemical fields involved in the reaction, separation, detection, cell culture, separation, cracking and other basic operating unit integrated into a small chip, forming a network of microchannels, fluid controlled throughout the system, to achieve the various functions of a conventional chemical or biological laboratory. [0004] 微流控芯片中的通道或构件的尺度为几十到几百微米,承载流体的体积为10_9〜IO-18L0微流控芯片的微尺度,决定了微泵、注射器等外部宏观系统到微流控芯片必须有特定的微流控芯片接口。 [0004] Scale microfluidic chip channel member or tens to hundreds of micrometers, the volume of carrier fluid is 10_9~IO-18L0 microscale microfluidic chip, determines the micropump, syringes, etc. The external macro system the microfluidic chip must have a specific microfluidic chip interface. 微流控芯片接口可以实现多种功能,包括流体引入、试样引入等。 Microfluidic chip interface may perform various functions, including the introduction of a fluid, such as the introduction sample. 实现外部宏观系统与微流控芯片系统的芯片接口,是一个重要的问题。 Achieve external macro system and chip interface microfluidic chip system, it is an important issue. [0005] 参阅图1,专利号为ZL200420055251.1的专利文献“一种带有毛细管-微流控芯片接口的微流控芯片”中,毛细管穿过橡胶塞与微流控芯片上的微通道连通,橡胶塞与微流控芯片之间用胶粘剂封接。 [0005] Referring to Figure 1, Patent Document Patent No. ZL200420055251.1 to "a capillary with - microfluidic chip microfluidic chip interface", the capillary microchannels through the rubber stopper and on the microfluidic chip communication between the rubber plug and the microfluidic chip with an adhesive seal. 这种基于胶粘剂的毛细管-微流控芯片接口的缺点是:胶粘剂容易通过毛细管与橡胶塞或橡胶塞与微流控芯片之间的间隙渗入微流控芯片内部,造成微通道堵塞。 Such capillary-based adhesive - shortcomings microfluidic chip interfaces are: adhesive easily penetrates inside the microfluidic chip through a gap between the capillary tube and a rubber stopper and a rubber stopper or microfluidic chip, resulting in clogging of the microchannels. 三、发明内容:[0006] 本发明的目的是:为克服现有技术中微流控芯片接口使用胶粘剂时,胶粘剂容易渗入微流控芯片内部的不足,本发明提出一种一体式微流控芯片接口,无需使用胶粘剂,即可实现外部宏观系统与微流控芯片系统的连接。 III SUMMARY OF THE INVENTION: [0006] The object of the present invention are: to overcome the prior art when the microfluidic chip interface using an adhesive, the adhesive easily penetrates the interior of insufficient microfluidic chip, the present invention proposes An integrated microfluidic chip interface, without using an adhesive, can be achieved with the system connected to external macro microfluidic chip system. [0007] 本发明的技术方案是:参阅图2,图3,一种一体式微流控芯片接口,包括封接于微流控芯片4上的水平基体I和位于水平基体I上的若干凸台2 ;所述的凸台2内有连接管道3,连接管道3使微流控芯片4上的微通道与外界连通。 [0007] aspect of the present invention: FIG. 2, FIG. 3, An integrated microfluidic chip interface, comprising a seal on the plurality of bosses horizontal microfluidic substrate I on 4 control chip and the horizontal base I 2; connecting conduit inside the boss 23, the connection pipe 3 on the outside of the micro channel and the microfluidic chip 4 communicates. [0008] 该一体式微流控芯片接口材料为聚二甲基硅氧烷(PDMS)、聚酰亚胺(PI)或聚苯乙烯(PS)。 [0008] The integrated microfluidic chip interface material is polydimethylsiloxane (PDMS), polyimide (PI) or polystyrene (PS). [0009] 参阅图4,一种一体式微流控芯片接口模具,依次包括带有连接管道阳模微柱的底板17,凸台阴模孔板9和水平基体围堰6 ;所述的带有连接管道阳模微柱的底板17上排布若干连接管道阳模微柱10,其横截面与连接管道3的横截面一致;所述的凸台阴模孔板9厚度等于凸台2的厚度,其上布有若干与连接管道阳模微柱10相对应的凸台阴模孔8,凸台阴模孔8的横截面与凸台2横截面的外轮廓一致;所述水平基体围堰6的厚度不小于水平基体I的厚度;所述连接管道阳模微柱10、带有连接管道阳模微柱的底板17、凸台阴模孔板9、水平基体围堰6可以是一体式结构,也可以是通过定位销连接的分体式结构。 [0009] Referring to Figure 4, An integrated microfluidic chip interface mold, comprising a base sequence having a male connecting duct 17 microcolumns boss female die 9 and the horizontal base plate 6 cofferdam; with the 17 the arrangement 10, a plurality of same micro-column connecting duct male connecting duct cross section and the cross section of the connecting conduit 3 male microcolumn plate; the boss die plate 9 a thickness equal to the thickness of the projection of the table 2 , which fabric has a number of bosses of the female die orifice male connection line 10 corresponding to the micro-column 8, consistent cross-sectional outer contour of the female die orifice 8 of the boss with the boss 2 is a cross-section; said horizontal base cofferdam the thickness of not less than 6 thickness of the horizontal base I; the micro-column connecting duct male mold 10, the bottom plate is connected with the male conduit 17 microcolumns boss die plate 9, the level of the base body 6 may be integrally cofferdam structure, by the positioning pin may be connected split structure. [0010] 一体式微流控芯片接口模具材料为聚甲基丙烯酸甲酯(PMMA),聚碳酸酯(PC)、聚对苯二甲酸乙二醇酯(PET)或镍。 [0010] The microfluidic chip interface integrally mold material is polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET) or nickel.

[0011] 一种利用上述模具制作一体式微流控芯片接口的方法,包括如下步骤: [0011] A method for integrally microfluidic chip interface making use of the mold, comprising the steps of:

[0012] 步骤1:按质量比或体积比为5:1〜15:1,分别量取PDMS预聚体和固化剂,倒入容器中,搅拌5〜10分钟,充分混合; [0012] Step 1: mass or volume ratio of 5: 1~15: 1, were weighed PDMS prepolymer and a curing agent, into the container, stirred for 5 to 10 minutes, mixed well;

[0013] 步骤2:将步骤I制作的PDMS放入真空干燥箱中抽真空,去除气泡; [0013] Step 2: Step I fabricated PDMS placed in a vacuum oven evacuated to remove air bubbles;

[0014] 步骤3:将上述的一体式微流控芯片接口模具置于水平实验台,将步骤2制作的PDMS倒入模具中,静置24〜48小时,待PDMS固化;或根据需要,将模具和PDMS —起放入恒温箱中,加速PDMS固化; [0014] Step 3: The above-described microfluidic chip interface integrally mold placed on a horizontal bench, step 2 produced the PDMS was poured into a mold, allowed to stand for 24~48 hours, to be cured PDMS; or as needed, the mold and PDMS - play into an incubator, PDMS curing accelerator;

[0015] 步骤4:脱模,把固化后的PDMS和模具分离; [0015] Step 4: releasing, the PDMS mold and separated after curing;

[0016] 步骤5:根据需要,将脱模后的PDMS切割成与微流控芯片配对的合适块体,即形成一体式微流控芯片接口。 [0016] Step 5: If necessary, after releasing the PDMS block was cut with a suitable mating microfluidic chip, i.e. formed integrally microfluidic chip interface.

[0017] 一种上述一体式微流控芯片接口的使用方法,包括如下步骤: [0017] A method of using the above-described micro-fluidic chip integrated interface, comprising the steps of:

[0018] 步骤1:用紫外线照射或氧等离子体处理一体式微流控芯片接口,然后将其贴合在微流控芯片上,静置24〜48小时,或放入恒温箱中加热I〜10小时; [0018] Step 1: treated with UV irradiation or oxygen plasma integrally microfluidic chip interface, which is then bonded on a microfluidic chip, left 24~48 hours, or placed in an incubator heated I~10 hour;

[0019] 步骤2:将连接微管15 —端插入一体式微流控芯片接口的连接管道3内,另一端与外部宏观系统16相连,实现外部宏观系统与微流控芯片系统的连接。 [0019] Step 2: Connect microtubule 15-- 3 inserted into one end of the microfluidic chip interfaces connecting duct, the other end is connected to external macro system 16 to achieve the connection with the external macro system microfluidic chip system.

[0020] 有益效果: [0020] beneficial effects:

[0021] 本发明的有益效果是:一体式微流控芯片接口,无需使用胶粘剂,即可实现外部宏观系统与微流控芯片系统的连接,密封效果好,而且不会造成微通道堵塞。 [0021] Advantageous effects of the present invention are: one microfluidic chip interface, without using an adhesive, can be achieved with the system connected to external macro microfluidic chip systems, good sealing effect, but without causing blockage microchannel. 本发明提出的一体式微流控芯片接口制作方法,通过接口模具可实现一体式微流控芯片接口的批量化加工。 One proposed by the present invention method for fabricating microfluidic chip interface, enabling batch processing integrated micro-fluidic chip die interface through the interface.

[0022] 下面结合附图和实施例对本发明进一步说明。 Figures and examples further illustrate the present invention [0022] The following binding.

[0023] 四、附图说明(附图在文字中的引用说明) [0023] IV. BRIEF DESCRIPTION OF (referenced in the text description of the drawings)

[0024] 图1是现有技术中的毛细管-微流控芯片接口示意图 [0024] FIG. 1 is a prior art capillary - a schematic view of a microfluidic chip interface

[0025] 图2是实施例1中的一体式微流控芯片接口示意图 [0025] FIG. 2 is a microfluidic chip interface integrated in Example 1 is a schematic view of

[0026]图3是实施例1中的带有一体式微流控芯片接口的微流控芯片剖面图 [0026] FIG. 3 is a cross-sectional view of a microchip integrated microfluidic chip interfaces for flow control in Example 1

[0027] 图4是实施例1中的一体式微流控芯片接口模具示意图 [0027] FIG. 4 is a schematic view of one microfluidic chip interface of the mold in Example 1

[0028] 图5是实施例1中的制作一体式微流控芯片接口时步骤4完成后的结构示意图 [0028] FIG. 5 is a schematic view of the structure of Example 1 are fabricated integrally microfluidic chip interface Step 4 embodiment is completed

[0029] 图6是实施例1中的一体式微流控芯片接口与外部宏观系统连接示意图 [0029] FIG. 6 is integrally microfluidic chip interface with external macro system in Example 1 is a schematic view of the connection

[0030] 图7是实施例2中的一体式微流控芯片接口示意图 [0030] FIG. 7 is integrally microfluidic chip interface in Example 2 is a schematic view of embodiment

[0031]图8是实施例2中的带有一体式微流控芯片接口的微流控芯片剖面图 [0031] FIG. 8 is a cross-sectional view of the microchip 2 with integrated microfluidic chip interface flow control embodiment

[0032] 图9是实施例2中的一体式微流控芯片接口模具示意图 [0032] FIG. 9 is a schematic view of one mold microfluidic chip interface in Example 2

[0033] 图10是实施例2中的制作一体式微流控芯片接口时步骤4完成后的结构示意图 [0033] FIG. 10 is a schematic view of the structure of Example 2 produced when one microfluidic chip interface Step 4 embodiment is completed

[0034] 图11是实施例2中的一体式微流控芯片接口与外部宏观系统连接示意图 [0034] FIG. 11 is integrally microfluidic chip interface to the external system in Example 2 Macro connection diagram

[0035] 图12是实施例3中的一体式微流控芯片接口示意图 [0035] FIG. 12 is a schematic view of one microfluidic chip interface of Example 3

[0036]图13是实施例3中的带有一体式微流控芯片接口的微流控芯片剖面图 [0036] FIG. 13 is a sectional view of the microfluidic chip of Example 3 with an integrated microfluidic chip interface embodiment

[0037] 图14是实施例3中的一体式微流控芯片接口模具示意图 [0037] FIG. 14 is a schematic view of one microfluidic chip interface of the mold in Example 3

[0038] 图15是实施例3中的制作一体式微流控芯片接口时步骤4完成后的结构示意图 [0038] FIG. 15 is a schematic view of the structure when prepared in Example 3 integrally microfluidic chip interface Step 4 embodiment is completed

[0039] 图16是实施例3中的一体式微流控芯片接口与外部宏观系统连接示意图[0040] 图中,1-水平基体,2-凸台,3-连接管道,4-微流控芯片,5-定位销,6_水平基体围堰,7-定位固定孔,8-凸台阴模孔,9-凸台阴模孔板,10-连接管道阳模微柱,11-连接管道阳模微柱固定孔,12-连接管道阳模微柱固定孔板,13-底板,14-切割线,15-连接微管,16-外部宏观系统,17-带有连接管道阳模微柱的底板。 [0039] FIG. 16 is integrally Example 3 microfluidic chip interface to the external connection diagram macroscopic systems [0040] FIG embodiment, the base level of 1-, 2- boss connecting duct 3-, 4- microfluidic chip , 5-pin, a horizontal base cofferdam 6_, 7-positioning and fixing holes of the female die orifice boss 8-, 9- boss die orifice, 10 micro-column connecting duct male die, the male connection pipe 11- micro-pillared mold fixing hole, 12 micro-column connecting duct male fixing plate, 13 base plate, 14 cutting line 15 connected to microtubules, 16 external macro system, 17 with the male connecting duct microcolumns floor. 五、具体实施方式:[0041] 实施例1:[0042] 参照图2,图3,本实施例提供了一种材料为PDMS的二端口一体式微流控芯片接口,包括封接于微流控芯片4上的水平基体I和位于水平基体I上的两个凸台2 ;所述的凸台2内有连接管道3,连接管道3使微流控芯片4上的微通道与外界连通。 V. DETAILED DESCRIPTION: [0041] Example 1: [0042] Referring to FIG. 2, FIG. 3, the present embodiment provides a PDMS material is a two-port integrated microfluidic chip interface, comprising a seal on the microfluidic I and the level of the horizontal base substrate 2 on the two bosses on the chip 4 I; the boss 2 has the connection pipe 3, the connection pipe 3 so microfluidic microchannel communicates with the outside world on 4. 其中,水平基体I尺寸为:长度为40mm,宽度为20mm,厚度为2mm凸台2为圆管状,圆管外径为5mm,高度为6mm ;连接管道3内径为2mm。 Wherein the horizontal base I dimensions: length 40mm, width of 20mm, thickness 2mm circular tubular boss 2, tube outer diameter of 5mm, 6mm in height; inner diameter of the connecting conduit 3 is 2mm. [0043] 参阅图4,本实施例中使用的一体式微流控芯片接口模具材料为PMMA,依次包括带有连接管道阳模微柱的底板17,凸台阴模孔板9和水平基体围堰6 ;所述的带有连接管道阳模微柱的底板17上排布有圆柱状连接管道阳模微柱10阵列,其直径为2mm ;所述的凸台阴模孔板9厚度为6mm,其上布有与连接管道阳模微柱10相对应的凸台阴模孔8,凸台阴模孔8的直径为5mm ;所述水平基体围堰6的厚度为3mm ;所述连接管道阳模微柱10、带有连接管道阳模微柱的底板17、凸台阴模孔板9、水平基体围堰6为一体式结构。 [0043] Referring to Figure 4, integrated microfluidic chip interface material used in the mold 17, the boss 9 and a horizontal die plate according to the present embodiment is a matrix cofferdam PMMA, comprising a base sequence having a male connecting duct microcolumns 6; said base plate having a male connecting duct 17 on the micro-columns is arranged with a cylindrical connecting duct 10 micro-column array of male mold having a diameter of 2mm; the boss die plate 9 with a thickness of 6mm, cloth on which the male die and the connecting pipe 10 corresponding to the micro-column boss die orifice 8, die hole diameter of the boss 8 is 5mm; the horizontal base 6 in a thickness of 3mm cofferdam; said male connecting conduit - mode column 10, conduit 17 is connected with the male mold plate microcolumns boss die plate 9, the base level of the cofferdam is a unitary structure 6. [0044] 利用上述模具制作本实施例中一体式微流控芯片接口的方法,包括如下步骤:[0045] 步骤1:按质量比为10: 1,分别量取PDMS预聚体和固化剂,倒入烧杯,搅拌5分钟,充分混合;[0046] 步骤2:将步骤I制作的PDMS放入真空干燥箱中抽真空,去除气泡;[0047] 步骤3:将上述的一体式微流控芯片接口模具置于水平实验台,将步骤2制作的PDMS倒入模具中,静置24小时,待PDMS固化;[0048] 步骤4:脱模,把固化后的PDMS和模具分离;[0049] 步骤5:参阅图5,将脱模后的PDMS按切割线14切割形成本实施例中的二端口一体式微流控芯片接口。 [0044] Production of the present using the mold method integrally microfluidic chip interfaces embodiment, comprising the steps of: [0045] Step 1: a mass ratio of 10: 1 were weighed PDMS prepolymer and a curing agent, pour into a beaker, stirred for 5 minutes, mixed well; [0046] step 2: step I fabricated PDMS placed in a vacuum oven evacuated to remove air bubbles; [0047] step 3: the above-described microfluidic chip interface integrally mold placed on a horizontal bench, step 2 produced the PDMS was poured into a mold, allowed to stand for 24 hours to be cured PDMS; [0048] step 4: release, and the PDMS mold after curing separated; [0049] step 5: Referring to Figure 5, the PDMS after release by cutting the cutting line 14 is formed in this embodiment of the two-port integrated microfluidic chip interface. [0050] 使用本实施例中一体式微流控芯片接口的方法,包括如下步骤:[0051] 步骤1:用紫外线照射处理一体式微流控芯片接口,然后将其贴合在微流控芯片上,静置24小时。 [0050] Use integrally microfluidic chip interfaces in the present embodiment, comprising the steps of: [0051] Step 1: ultraviolet irradiation treatment with one microfluidic chip interface, which is then bonded on the microfluidic chip, for 24 hours. [0052] 步骤2:参阅图6,将连接微管15 —端插入二端口一体式微流控芯片接口的连接管道3内,另一端与外部宏观系统16相连,实现外部宏观系统与微流控芯片系统的连接。 [0052] Step 2: Referring to Figure 6, the connection microtubule 15-- end into a two-port integrated micro 3-fluidic chip interface connecting duct connected to the other end of the external macro system 16, to achieve external macro system and the microfluidic chip system connection. [0053] 具体实施例2:[0054] 参照图7,图8,本实施例提供了一种材料为PDMS的四端口一体式微流控芯片接口,包括封接于微流控芯片4上的水平基体I和位于水平基体I上的四个凸台2 ;所述的凸台2内有连接管道3,连接管道3使微流控芯片4上的微通道与外界连通。 [0053] Specific Example 2: [0054] Referring to FIG. 7, FIG. 8, the present embodiment provides a four-port PDMS material is integrally microfluidic chip interface, comprising a seal on the level of the control chip microfluidic 4 the horizontal base I and the four bosses I base 2; connecting pipe 3, that the connecting duct 3 microfluidic microchannel communicates with the outside 4 of the boss 2. 其中,水平基体I尺寸为:长度为90mm,宽度为40mm,厚度为3mm ;凸台2为圆管状,圆管外径为6mm,高度为8mm ;连接管道3内径为3mm。 Wherein the horizontal base I dimensions: length 90mm, width of 40mm, a thickness of 3mm; circular tubular boss 2, tube outer diameter of 6mm, 8mm in height; inner diameter of the connecting conduit 3 is 3mm. [0055] 参阅图9,本实施例中使用的一体式微流控芯片接口模具材料为PC,依次包括底板13、连接管道阳模微柱固定孔板12、凸台阴模孔板9和水平基体围堰6;所述的连接管道阳模微柱固定孔板12上布有连接管道阳模微柱固定孔11,其外径为3mm,外径为3mm的连接管道阳模微柱10装配于连接管道阳模微柱固定孔11中;所述的凸台阴模孔板9厚度为8mm,其上布有与连接管道阳模微柱10相对应的凸台阴模孔8,凸台阴模孔8的直径为6mm ;所述水平基体围堰6的厚度为3mm ;所述底板13、连接管道阳模微柱固定孔板12、凸台阴模孔板9、水平基体围堰6为分体式结构,它们通过四个定位固定孔7中的定位销5装配在一起。 [0055] Referring to Figure 9, one microfluidic chip interface mold material used in the present embodiment is a PC, includes a base plate 13 in turn, micro-column connecting duct male fixing plate 12, the boss die plate 9 and the horizontal base cofferdam 6; said male connecting conduit 12 microcolumns fixing plate fixing hole cloth duct male connector 11 micro-column, an outer diameter of 3mm, outer diameter of the micro-column connecting duct male die 10 is fitted to the 3mm male connecting duct fixing hole 11 in the micro-column; the boss die plate 9 with a thickness of 8mm, which cloth the boss of the female die orifice male connection line 10 corresponding to the micro-column 8, the female boss die diameter of 6mm hole 8; the thickness of the horizontal base 6 for cofferdam 3mm; the bottom plate 13, the micro-column connecting duct male fixing plate 12, the boss die plate 9, the base level of the cofferdam 6 split structure, which are assembled together by the positioning pins 5 in the fixing hole 7 is positioned four.

[0056] 利用上述模具制作本实施例中一体式微流控芯片接口的方法,包括如下步骤: [0056] The present production method using the mold integrally microfluidic chip interfaces embodiment, comprising the steps of:

[0057] 步骤1:按质量比为12: 1,分别量取PDMS预聚体和固化剂,倒入烧杯,搅拌8分钟,充分混合; [0057] Step 1: a mass ratio of 12: 1 were weighed PDMS prepolymer and a curing agent, poured into a beaker, stirred for 8 minutes, mixed well;

[0058] 步骤2:将步骤I制作的PDMS放入真空干燥箱中抽真空,去除气泡; [0058] Step 2: Step I fabricated PDMS placed in a vacuum oven evacuated to remove air bubbles;

[0059] 步骤3:将上述的一体式微流控芯片接口模具置于水平实验台,将步骤2制作的PDMS倒入模具中,静置36小时,待PDMS固化; [0059] Step 3: The above-described microfluidic chip interface integrally mold placed on a horizontal bench, step 2 produced the PDMS was poured into a mold, allowed to stand for 36 hours to be cured PDMS;

[0060] 步骤4:脱模,把固化后的PDMS和模具分离; [0060] Step 4: releasing, the PDMS mold and separated after curing;

[0061] 步骤5:参阅图10,将脱模后的PDMS按切割线14切割形成本实施例中的四端口一体式微流控芯片接口。 [0061] Step 5: Referring to Figure 10, the PDMS after release by cutting the cutting line 14 is formed in the present embodiment a four port integrated microfluidic chip interface embodiment.

[0062] 使用本实施例中一体式微流控芯片接口的方法,包括如下步骤: [0062] Using the present method integrally microfluidic chip interfaces embodiment, comprising the steps of:

[0063] 步骤1:用氧等离子体处理一体式微流控芯片接口,然后将其贴合在微流控芯片上,静置36小时ο [0063] Step 1: treated with oxygen plasma integrally microfluidic chip interface, which is then bonded on a microfluidic chip, allowed to stand 36 hours ο

[0064] 步骤2:参阅图11,将连接微管15 —端插入四端口一体式微流控芯片接口的连接管道3内,另一端与外部宏观系统16相连,实现外部宏观系统与微流控芯片系统的连接。 [0064] Step 2: Referring to Figure 11, the connecting microtubules 15-- end into a four port integrally micro 3-fluidic chip interface connecting duct connected to the other end of the external macro system 16, to achieve external macro system and the microfluidic chip system connection.

[0065] 具体实施例3: [0065] DETAILED Example 3:

[0066] 参照图12,图13,本实施例提供了一种材料为PDMS的多端口一体式微流控芯片接口,包括封接于微流控芯片4上的水平基体I和位于水平基体I上的19个凸台2 ;所述的凸台2内有连接管道3,连接管道3使微流控芯片4上的微通道与外界连通。 [0066] Referring to FIG. 12, FIG. 13, the present embodiment provides a material for the PDMS multi-port integrated microfluidic chip interface, comprising a seal on the microfluidic chip level matrix I on the 4 and the horizontal base I the boss 19 2; connecting pipe 3, the pipe 3 is connected with the outside of the micro-channel microfluidic chip on the boss 4 communicating 2. 其中,水平基体I为直径为100mm,厚度为3mm的圆盘,凸台2为圆管状,圆管外径为6mm,高度为6mm ;连接管道3内径为4_。 Wherein the horizontal base I having a diameter of 100mm, disc thickness of 3mm, the boss 2 is a circular pipe, tube outer diameter of 6mm, a height of 6mm; inner diameter of the connection pipe 3 4_.

[0067] 参阅图14,本实施例中使用的一体式微流控芯片接口模具材料为镍,依次包括底板13、连接管道阳模微柱固定孔板12、凸台阴模孔板9和水平基体围堰6 ;所述的连接管道阳模微柱固定孔板12上布有连接管道阳模微柱固定孔11,其外径为4mm,外径为4mm的连接管道阳模微柱10装配于连接管道阳模微柱固定孔11中;所述的凸台阴模孔板9厚度为6mm,其上布有与连接管道阳模微柱10相对应的圆柱状凸台阴模孔8,凸台阴模孔8的直径为6mm ;所述水平基体围堰6的厚度为5mm ;所述底板13、连接管道阳模微柱固定孔板12、凸台阴模孔板9、水平基体围堰6为分体式结构,它们通过四个定位固定孔7中的定位销5装配在一起。 [0067] Referring to Figure 14, one microfluidic chip interface mold material used in the present embodiment is nickel, in turn includes a bottom plate 13, the micro-column connecting duct male fixing plate 12, the boss die plate 9 and the horizontal base cofferdam 6; said male connecting conduit 12 microcolumns fixing plate fixing hole cloth duct male connector 11 micro-column, an outer diameter of 4mm, outer diameter of the micro-column connecting duct male die 10 is fitted to the 4mm fixing hole connecting duct 11 in the male mold micro-column; the boss die plate 9 with a thickness of 6mm, and the cloth on which the male mold micro-column connecting duct 10 corresponding to the cylindrical projections 8 of the female die orifice, protrusion diameter orifice die station 8 to 6mm; cofferdam thickness of the horizontal base 6 of 5mm; the bottom plate 13, the micro-column connecting duct male fixing plate 12, the boss die plate 9, the base level of the cofferdam 6 is a split structure, which are assembled together by the positioning pins 5 in the fixing hole 7 is positioned four.

[0068] 利用上述模具制作本实施例中一体式微流控芯片接口的方法,包括如下步骤: [0068] The present production method using the mold integrally microfluidic chip interfaces embodiment, comprising the steps of:

[0069] 步骤1:按质量比为8: 1,分别量取PDMS预聚体和固化剂,倒入烧杯,搅拌10分钟,充分混合; [0069] Step 1: a mass ratio of 8: 1, respectively, weighed PDMS prepolymer and a curing agent, is poured into a beaker, stirred for 10 minutes, mixed well;

[0070] 步骤2:将步骤I制作的PDMS放入真空干燥箱中抽真空,去除气泡;[0071] 步骤3:将上述的一体式微流控芯片接口模具置于水平实验台,将步骤2制作的PDMS倒入模具中,静置48小时,待PDMS固化;[0072] 步骤4:脱模,把固化后的PDMS和模具分离;[0073] 步骤5:参阅图15,将脱模后的PDMS按切割线14切割形成本实施例中的多端口一体式微流控芯片接口。 [0070] Step 2: Step I fabricated PDMS placed in a vacuum oven evacuated to remove air bubbles; [0071] Step 3: The above-described microfluidic chip interface integrally mold placed on a horizontal bench, prepared in step 2 PDMS is poured into molds and allowed to stand for 48 hours to be cured PDMS; [0072] step 4: release, and the PDMS mold after curing separated; [0073] step 5: Referring to Figure 15, after the release of PDMS cutting line 14 formed by cutting the multi-port embodiment of the present embodiment is integrally microfluidic chip interface. [0074] 使用本实施例中一体式微流控芯片接口的方法,包括如下步骤:[0075] 步骤1:用氧等离子体处理一体式微流控芯片接口,然后将其贴合在微流控芯片上,放入温度为65摄氏度的恒温箱中加热2小时;[0076] 步骤2:参阅图16,将连接微管15 —端插入多端口一体式微流控芯片接口的连接管道3内,另一端与外部宏观系统16相连,实现外部宏观系统与微流控芯片系统的连接。 [0074] Using the method in Example integrally microfluidic chip interface of the present embodiment, comprising the steps of: [0075] Step 1: using an oxygen plasma treatment integrally microfluidic chip interface, which is then bonded on a microfluidic chip placed in a temperature of 65 ° C incubator for 2 hours; [0076] step 2: Referring to Figure 16, the connecting tube 15 micro - terminal 3 is inserted into the multi-port connection pipe integrally microfluidic chip interface, the other end the system 16 is connected to external macro, macro system and the external connection achieve microfluidic chip system.

Claims (2)

1.一种一体式微流控芯片接口模具,该模具所用于的一体式微流控芯片接口包括封接于微流控芯片(4)之上的水平基体(I)和位于水平基体(I)上的若干凸台(2);所述的凸台(2)内有连接管道(3),连接管道(3)使微流控芯片(4)上的微通道与外界连通;其特征在于:依次包括带有连接管道阳模微柱的底板(17),凸台阴模孔板(9)和水平基体围堰(6);所述的带有连接管道阳模微柱的底板(17)上排布若干连接管道阳模微柱(10),其横截面与连接管道(3)的横截面一致;所述的凸台阴模孔板(9)厚度等于凸台(2)的厚度,其上布有若干与连接管道阳模微柱(10)相对应的凸台阴模孔(8),凸台阴模孔(8)的横截面与凸台(2)横截面的外轮廓一致;所述水平基体围堰(6)的厚度不小于水平基体(I)的厚度;所述连接管道阳模微柱(10)、带有连接管道阳模微柱的底板(17)、凸台阴模孔板(9)、水平基体围堰(6) 1. An integrated microfluidic chip interface a mold for the integral micro-fluidic chip interface includes a seal on the top of the microfluidic chip (4) horizontal base (I) and the horizontal base (I) on several bosses (2); said boss has (2) the connecting pipe (3), the connection pipe (3) microfluidic chips with the outside world on the microchannel (4) in communication; wherein: sequentially comprising a base plate with a connecting duct microcolumns male die (17), the boss die plate (9) and the cofferdam horizontal base (6); said bottom plate mold having a male connecting duct microcolumns (17) uniform cross section arranged in a plurality of connections (10), the cross section of the connecting pipe (3) of the male pipe microcolumns; the boss die plate (9) is equal to the thickness of the boss (2) has a thickness which cloth several connecting pipes male mold microcolumns (10) corresponding to the projections of the female die orifice (8), the cross-sectional projection of the female die orifice (8) of the boss (2) the cross-sectional outer profile of the same; the thickness of the cofferdam horizontal base (6) is not less than the thickness of the horizontal base (I); said male connecting conduit microcolumns (10), the bottom plate is connected with the male mold microcolumns pipe (17), the female boss die plate (9), a horizontal base cofferdam (6) 为一体式结构或者通过定位销连接的分体式结构。 An integrated structure or separate structure connected by a positioning pin.
2.一种如权利要求1所述的一体式微流控芯片接口模具,其特征在于:材料为聚甲基丙烯酸甲酯、聚碳酸酯、聚对苯二甲酸乙二醇酯或镍。 2. A microfluidic chip interface integrally mold according to claim 1, wherein: the material is polymethyl methacrylate, polycarbonate, polyethylene terephthalate or nickel.
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