CN105392276A - 一种多补丁的pet载板 - Google Patents

一种多补丁的pet载板 Download PDF

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Publication number
CN105392276A
CN105392276A CN201510917257.8A CN201510917257A CN105392276A CN 105392276 A CN105392276 A CN 105392276A CN 201510917257 A CN201510917257 A CN 201510917257A CN 105392276 A CN105392276 A CN 105392276A
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patch
groove
pet
viscosity
pad
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CN201510917257.8A
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CN105392276B (zh
Inventor
王中飞
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Nantong Meelain Electric Appliance Co., Ltd.
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Suzhou Midas Precision Electronic Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/306Lifting the component during or after mounting; Increasing the gap between component and PCB

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Medical Uses (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

本发明公开了一种多补丁的PET载板,涉及柔性电路板加工技术领域,其包括:PET原膜、高粘补丁条、低粘补丁条;所述PET原膜上设有第一补丁槽和第二补丁槽;所述高粘补丁条贴附在所述第一补丁槽下方,所述第一补丁槽内设有垫片,所述垫片带有粘性,用于和补强片钢片粘贴;所述低粘补丁条贴附在所述第二补丁槽下方;所述高粘补丁条与所述垫片之间的粘力大于所述垫片与补强片钢片之间的粘力。

Description

一种多补丁的PET载板
技术领域
本发明涉及柔性电路板加工技术领域,特别涉及一种多补丁的PET载板。
背景技术
在柔板生产过程中,下游生产商有时希望一块载板上带有两种不同的补强片,以便一个工位可以完成两道贴合工作,而且不同种类的补强片在载板上的高度需要有差别,可以是0.1mm左右的高度差。因此以往的单一补强片的载板无法满足新的要求。
发明内容
本发明要解决的技术问题是:提供一种可在一个工位完成两种不同补强片贴合的载板。
为解决上述技术问题,本发明提供了一种多补丁的PET载板,包括:PET原膜、高粘补丁条、低粘补丁条;所述PET原膜上设有第一补丁槽和第二补丁槽;所述高粘补丁条贴附在所述第一补丁槽下方,所述第一补丁槽内设有垫片,所述垫片带有粘性,用于和补强片钢片粘贴;所述低粘补丁条贴附在所述第二补丁槽下方;所述高粘补丁条与所述垫片之间的粘力大于所述垫片与补强片钢片之间的粘力。
优选的,所述垫片的厚度为0.1mm。
该多补丁PET载板设有两种不同的补丁槽,可放置不同补强片;通过在第一补丁槽内设置垫片,来实现补强片钢片之间的高度差;通过垫片粘力的合适选择,来实现补强片钢片在补丁槽内的固定和转移。
附图说明
图1是本发明的多补丁PET载板的示意图。
图2是图1中的多补丁PET载板的侧视图。
图3是图1中的多补丁PET载板的加工流程图。
图4是图3中的加工流程中卷料的示意图。
图5是图3中的加工流程中带孔中间料的示意图。
具体实施方式
下面结合附图和实施例,对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明,但不用来限制本发明的范围。
如图1至图2所示的多补丁的PET载板,包括:PET原膜1、高粘补丁条4、低粘补丁条5。PET原膜1上设有第一补丁槽2和第二补丁槽3。高粘补丁条4贴附在第一补丁槽2下方,第一补丁槽2内设有垫片6,垫片6带有粘性,用于和补强片钢片粘贴。低粘补丁条5贴附在第二补丁槽3下方。高粘补丁条4与垫片6之间的粘力大于垫片6与补强片钢片之间的粘力。
一般,垫片6的厚度设为0.1mm。
该多补丁PET载板的加工工艺为,如图3至图5所示:
步骤一、将高粘补丁条4、低粘补丁条5分别与PET原膜1贴合,获得卷料10;
步骤二、将步骤一中的卷料通过刀模7冲切出定位孔8,获得带孔中间料11;
步骤三、废料针9除去带孔中间料上的废料;
步骤四、成型刀模10冲切步骤三中的带孔中间料,PET原膜1朝上,且只切断PET原膜1层,获得第一补丁槽2和第二补丁槽3;
步骤五、去除第一补丁槽2和第二补丁槽3中的废料;
步骤六、通过排版治具,将补强片钢片及垫片6分别贴入第一补丁槽2和第二补丁槽3中。
该多补丁PET载板设有两种不同的补丁槽,可放置不同补强片;通过在第一补丁槽内设置垫片,来实现补强片钢片之间的高度差;通过垫片粘力的合适选择,来实现补强片钢片在补丁槽内的固定和转移。
以上实施方式仅用于说明本发明,而并非对本发明的限制,有关技术领域的普通技术人员,在不脱离本发明的精神和范围的情况下,还可以做出各种变化和变型,因此所有等同的技术方案也属于本发明的范畴,本发明的专利保护范围应由权利要求限定。

Claims (2)

1.一种多补丁的PET载板,其特征在于,包括:PET原膜、高粘补丁条、低粘补丁条;所述PET原膜上设有第一补丁槽和第二补丁槽;所述高粘补丁条贴附在所述第一补丁槽下方,所述第一补丁槽内设有垫片,所述垫片带有粘性,用于和补强片钢片粘贴;所述低粘补丁条贴附在所述第二补丁槽下方;所述高粘补丁条与所述垫片之间的粘力大于所述垫片与补强片钢片之间的粘力。
2.如权利要求1所述的多补丁的PET载板,其特征在于,所述垫片的厚度为0.1mm。
CN201510917257.8A 2015-12-11 2015-12-11 一种多补丁的pet载板 Active CN105392276B (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294920A (ja) * 1999-04-05 2000-10-20 Toshiba Chem Corp 多層フレックスリジッド配線板の製造方法と打抜き金型
CN203872454U (zh) * 2014-05-27 2014-10-08 苏州市易德龙电器有限公司 用于控制通孔元件安装位置精度的pcb焊接治具
CN104411097A (zh) * 2014-11-28 2015-03-11 苏州米达思精密电子有限公司 一种补强片载板
CN104640365A (zh) * 2013-11-08 2015-05-20 深圳崇达多层线路板有限公司 印制线路板的阻焊丝印方法
CN205283928U (zh) * 2015-12-11 2016-06-01 苏州米达思精密电子有限公司 一种多补丁的pet载板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294920A (ja) * 1999-04-05 2000-10-20 Toshiba Chem Corp 多層フレックスリジッド配線板の製造方法と打抜き金型
CN104640365A (zh) * 2013-11-08 2015-05-20 深圳崇达多层线路板有限公司 印制线路板的阻焊丝印方法
CN203872454U (zh) * 2014-05-27 2014-10-08 苏州市易德龙电器有限公司 用于控制通孔元件安装位置精度的pcb焊接治具
CN104411097A (zh) * 2014-11-28 2015-03-11 苏州米达思精密电子有限公司 一种补强片载板
CN205283928U (zh) * 2015-12-11 2016-06-01 苏州米达思精密电子有限公司 一种多补丁的pet载板

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Address before: 215104 Suzhou, Suzhou, Jiangsu Luzhi Town, 18 East Road, -4, Suzhou, Suzhou, Wuzhong District Precision Electronics Co., Ltd.

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