CN105379116A - Electronic component and method for producing same - Google Patents
Electronic component and method for producing same Download PDFInfo
- Publication number
- CN105379116A CN105379116A CN201380078265.7A CN201380078265A CN105379116A CN 105379116 A CN105379116 A CN 105379116A CN 201380078265 A CN201380078265 A CN 201380078265A CN 105379116 A CN105379116 A CN 105379116A
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- electronic unit
- interarea
- circuit substrate
- frame component
- shield member
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 claims description 95
- 238000000034 method Methods 0.000 claims description 40
- 238000013316 zoning Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 238000000605 extraction Methods 0.000 description 23
- 238000009434 installation Methods 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000001259 photo etching Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000004744 fabric Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000007261 regionalization Effects 0.000 description 4
- 238000010897 surface acoustic wave method Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 241000278713 Theora Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012407 engineering method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 208000007578 phototoxic dermatitis Diseases 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02913—Measures for shielding against electromagnetic fields
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1078—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a foil covering the non-active sides of the SAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Provided are: an electronic component that has superior electromagnetic shielding properties at an electronic component unit body and that effects increased compactness of the electronic component itself; and a method for producing the electronic component. The electronic component (1) is such that there are formed: a functional circuit at one surface of a circuit board comprising a piezoelectric board (1) or the like; a signal wire (3a) electrically connected to the functional circuit; and a ground wire (3b) that is electrically connected to a ground potential and is electrically connected to the functional circuit. A frame member (7) is provided in a manner so as to encircle the functional circuit and in a manner so as to secure a region with respect to the outer edge of the first primary surface of the circuit board, the ground wire (3b) reaches from the inside to the outside of the frame member (7), a shield member (10) is provided in a manner so as to reach from the second primary surface of the circuit board through the side surface to the region of the first primary surface, and the electronic component is electrically connected to the ground wire (3b) at the outside of the frame member (7).
Description
Technical field
The present invention relates on circuit substrate, be formed with functional circuit electronic unit and manufacture method thereof, more specifically, relate to the electronic unit and manufacture method thereof that possess electromagnetic shielding structure.
Background technology
In the past, in order to realize the miniaturization of electronic equipment, adopt the method by flip-chip joint etc., electronic unit being installed on installation base plate more.Such as, in following patent documentation 1, disclose the acoustic surface wave device of the example as such electronic unit.
In the acoustic surface wave device described in patent documentation 1, piezoelectric substrate is formed with the electrode structure comprising IDT (InterDigitalTranceducer, interdigital transducer).By this electrode structure, achieve the functional circuit played a role as surface acoustic wave device.
In addition, the electronic unit described in patent documentation 1 is engaged by flip-chip and is installed in installation base plate.In the case, the face constituting functional circuit of piezoelectric substrate is configured to opposed with installation base plate.
At first technical literature
Patent documentation
Patent documentation 1:JP JP 2005-117151 publication
Summary of the invention
The problem that invention will solve
In the electronic unit described in patent documentation 1, require consumingly to carry out electromagnetic shielding to above-mentioned functions circuit.In this electronic unit, the face being formed with functional circuit of piezoelectric substrate is configured to opposed with installation base plate.Therefore, in the past, the shield member formed on installation base plate for carrying out electromagnetic shielding to functional circuit is needed.
On the other hand, also known a kind of resin material by having conductivity forms sealant with the method for overlay electronic parts.In the case, in electronic component side, electromagnetic shielding can be carried out to the functional circuit part in electronic unit.But, the above-mentioned resin material layer with conductivity for realizing electro-magnetic screen function must be formed.Therefore, there is the problem that the outside dimension of electronic unit, especially thickness increase.
The object of the invention is to, provide a kind of electromagnetic wave shielding of electronic unit monomer excellent, and electronic unit and the manufacture method thereof of the miniaturization of electronic unit self can be realized.
Solve the means of problem
Electronic unit involved in the present invention possesses circuit substrate, functional circuit, signal routing, ground connection wiring, frame component and shield member.Circuit substrate has the side that the 1st and the 2nd mutually opposing interarea is connected with by the 1st and the 2nd interarea.Functional circuit is formed at the 1st interarea of described circuit substrate.Signal routing is formed at the 1st interarea of described circuit substrate, and is electrically connected with described functional circuit.
Ground connection wiring has the wiring portion of the 1st interarea being formed at described circuit substrate, is electrically connected, and is electrically connected with earthing potential with described functional circuit.
Guarantee region between the outer peripheral edges that frame component is provided in described 1st interarea of described frame component and described circuit substrate and surround described functional circuit.
In the present invention, ground connection wiring is configured to arrive outside from the inner side of frame component.In addition, described shield member is configured to the described region in the outside of the described frame component of the 1st interarea arriving described circuit substrate from the 2nd interarea of described circuit substrate via side, and described shield member comprises conductive material and is electrically connected with the wiring of described ground connection in the described region in the outside of described frame component.
In certain specific mode of electronic unit involved in the present invention, also possess spaced walls, the outer peripheral edges that this spaced walls is configured to from the outer peripheral edges of described frame component towards described 1st interarea extend.By described spaced walls, the described region in the outside of described frame component is split into the 1st zoning and the 2nd zoning.Be configured with the wiring of described ground connection in described 1st zoning, described signal routing is configured to be connected with described 2nd zoning.
In other specific modes of electronic unit involved in the present invention, described shield member is configured to the 2nd interarea of coated described circuit substrate and whole of described side.
In another specific mode of electronic unit involved in the present invention, also possess lid component, this lid component engages with described frame component, makes the peristome of closed described frame component.
In another specific mode of electronic unit involved in the present invention, described frame component have described signal routing faced by the 1st through hole and described ground connection wiring faced by the 2nd through hole, described electronic unit also possesses the 1st and the 2nd conductive member being filled in the described 1st and the 2nd through hole.
In other specific modes of electronic unit involved in the present invention, described lid component has the 3rd and the 4th through hole be connected with the described 1st and the 2nd through hole, and the described 1st and the 2nd conductive member is formed as being connected with the described 3rd and the 4th through hole respectively.
The manufacture method of electronic unit involved in the present invention possesses following operation.
Operation (A), prepares the circuit substrate with the side that the 1st and the 2nd mutually opposing interarea is connected with by the 1st and the 2nd interarea;
Operation (B), described 1st interarea of described circuit substrate forms functional circuit;
Operation (C), on described 1st interarea of described circuit substrate, is formed and the signal routing that is electrically connected of functional circuit and to be electrically connected with functional circuit and the ground connection be connected with earthing potential is connected up;
Operation (D), described 1st interarea of described circuit substrate forms frame component, makes to surround described functional circuit and guarantee region between described frame component and the outer peripheral edges of described circuit substrate; With
Operation (E), forms the shield member comprising conductive material, makes this shield member arrive the region in the outside of the frame component of described 1st interarea via described side from the 2nd interarea of described circuit substrate, and is electrically connected with the wiring of described ground connection.
In certain specific mode of the manufacture method of electronic unit involved in the present invention, operation (A) ~ operation (E) is carried out at female circuit substrate, female circuit substrate is arranged and forms multiple electronic unit formation part, shield member is made to arrive between adjacent electronic unit component part, while the female circuit substrate and described shield member that form described multiple electronic unit formation part are cut off, be cut to each electronic unit.
In the manufacture method of electronic unit involved in the present invention other specific modes another, also possess and form the operation that lid component makes the opening of closed described frame component.
In another specific mode of the manufacture method of electronic unit involved in the present invention, also possess the spaced walls that the outer peripheral edges side that forms described 1st interarea from described frame component towards described circuit substrate extends, making is the operation of the 1st and the 2nd zoning by described Region dividing by described spaced walls.Form described spaced walls, such that the wiring of described ground connection is positioned at described 1st zoning, described signal routing is positioned at described 2nd zoning.
Invention effect
In electronic unit involved in the present invention, surround functional circuit and be provided with frame component, and shield member is arranged to the region in the outside arriving frame component from the 2nd interarea via side as described above, therefore, it is possible to effectively do not carry out electromagnetic shielding to functional circuit with causing the maximization of electronic unit.Therefore, in installation base plate side, do not need to arrange the shield member for carrying out electromagnetic shielding to electronic unit.
Accompanying drawing explanation
Fig. 1 (a) is the vertical view of the manufacturing process for illustration of first embodiment of the present invention, and Fig. 1 (b) and Fig. 1 (c) is each profile along the B1-B1 line in Fig. 1 (a) and C1-C1 line.
Fig. 2 (a) is the vertical view of the manufacturing process for illustration of first embodiment of the present invention, and Fig. 2 (b) and Fig. 2 (c) is each profile along the B2-B2 line in Fig. 2 (a) and C2-C2 line.
Fig. 3 (a) is the vertical view of the manufacturing process for illustration of the 1st execution mode of the present invention, and Fig. 3 (b) is the profile of the part along the B3-B3 line in Fig. 3 (a).
Fig. 4 (a) and Fig. 4 (b) is the front cross-sectional view of each operation of the manufacture method of electronic unit for illustration of the 1st execution mode of the present invention.
Fig. 5 (a) and Fig. 5 (b) is the front cross-sectional view of each operation of the manufacture method of electronic unit for illustration of the 1st execution mode of the present invention.
Fig. 6 (a) and Fig. 6 (b) is the front cross-sectional view of each operation of the manufacture method of electronic unit for illustration of the 1st execution mode of the present invention.
Fig. 7 is the vertical view of the manufacture method of electronic unit for illustration of the 1st execution mode of the present invention.
Fig. 8 (a) and Fig. 8 (b) is the profile along the A4-A4 line in Fig. 7 and B4-B4 line.
Fig. 9 is the vertical view of the manufacture method of electronic unit for illustration of the 1st execution mode of the present invention.
Figure 10 (a) is the vertical view of the manufacturing process for illustration of the electronic unit involved by the 1st execution mode of the present invention, and Figure 10 (b) and Figure 10 (c) is each profile along the B5-B5 line in Figure 10 (a) and C5-C5 line.
Figure 11 (a) is the vertical view of the manufacturing process for illustration of the electronic unit involved by the 2nd execution mode of the present invention, and Figure 11 (b) and Figure 11 (c) is each profile along the B6-B6 line in Figure 11 (a) and C6-C6 line.
Figure 12 (a) is the vertical view of the manufacture method for illustration of the electronic unit involved by the 2nd execution mode involved in the present invention, and Figure 12 (b) and Figure 12 (c) is each profile along the B7-B7 line in Figure 12 (a) and C7-C7 line.
Figure 13 is the profile of the manufacturing process for illustration of the electronic unit involved by the 2nd execution mode of the present invention.
Figure 14 (a) and Figure 14 (b) is each front cross-sectional view of the manufacture method for illustration of the electronic unit involved by the 2nd execution mode of the present invention.
Figure 15 (a) and Figure 15 (b) is each front cross-sectional view of the manufacture method for illustration of the electronic unit involved by the 2nd execution mode of the present invention.
Figure 16 (a) and Figure 16 (b) is each front cross-sectional view of the manufacture method for illustration of the electronic unit involved by the 2nd execution mode of the present invention.
Figure 17 (a) and Figure 17 (b) is each front cross-sectional view of the manufacture method for illustration of the electronic unit involved by the 2nd execution mode of the present invention.
Figure 18 (a) is the vertical view of the manufacture method for illustration of the electronic unit involved by the 3rd execution mode of the present invention, and Figure 18 (b) and Figure 18 (c) is each profile along the B8-B8 line in Figure 18 (a) and C8-C8 line.
Figure 19 is the vertical view of the manufacture method of electronic unit for illustration of the 4th execution mode of the present invention.
Figure 20 (a) ~ Figure 20 (c) is each profile along the A9-A9 line in Figure 19, B9-B9 line and C9-C9 line.
Figure 21 is the vertical view of the manufacture method for illustration of the electronic unit involved by the 4th execution mode of the present invention.
Figure 22 (a) ~ Figure 22 (c) is each profile along the A10-A10 line in Figure 21, B10-B10 line and C10-C10 line.
Figure 23 is the vertical view of the manufacture method for illustration of the electronic unit involved by the 4th execution mode of the present invention.
Figure 24 (a) ~ Figure 24 (c) is each profile along the A11-A11 line in Figure 23, B11-B11 line and C11-C11 line.
Figure 25 is the vertical view of the manufacture method for illustration of the electronic unit involved by the 4th execution mode of the present invention.
Figure 26 is the vertical view of the manufacture method for illustration of the electronic unit involved by the 5th embodiment of the present invention.
Figure 27 (a) ~ Figure 27 (c) is each profile along the A12-A12 line in Figure 26, B12-B12 line and C12-C12 line.
Figure 28 (a) is the vertical view of the manufacture method for illustration of the electronic unit involved by the 5th execution mode of the present invention, and Figure 28 (b) and Figure 28 (c) is each profile of B13-B13 line in (a) and C13-C13 line.
Embodiment
Below, by referring to accompanying drawing, the specific embodiment of the present invention is described, carrys out clear and definite the present invention.
With reference to Fig. 1 ~ Figure 10, the manufacture method of electronic unit of the present invention and electronic unit are described.
In the present embodiment, as described later, the acoustic surface wave device shown in Figure 10 is made to electronic unit.
As shown in Fig. 1 (a), prepare female piezoelectric substrate 1.As piezoelectric substrate 1, can use and comprise LiTaO
3etc. the piezoelectric substrate of suitable piezoelectric.
At the 1st interarea and upper surface of female piezoelectric substrate 1, by entire surface film forming is carried out to the metal film comprising Al etc., and carries out pattern formation by photoetching.Thus, the electrode structure shown in Fig. 1 (a) ~ (c) is formed.This electrode structure comprise be made up of a pair comb teeth shape electrode IDT2, cloth line electrode 3 and pad electrode 4a, 4b.Cloth line electrode 3 comprises signal routing 3a and ground connection wiring 3b.In addition, in this stage, shield wiring 5 is formed to surround 1 the surface acoustic wave device part comprising multiple IDT2 as functional circuit.On pad electrode 4a, 4b, as described later, the 1st, the 2nd conductive member 8a, the 8b used as protruding (bump) is formed.That is, pad electrode 4a, 4b play a role as the knitting layer becoming protruding lower metal layer (underbumpmetallayers).
Then, at the upper surface coating photoresist of piezoelectric substrate 1, and pattern formation is carried out by photoetching.As photoresist, can the suitable photoresist such as use sense photosensitiveness polyimide resin.Formed by this pattern, form the frame component 7 shown in Fig. 2 (a) ~ (c).Frame component 7 has rectangular box-like shape.The 1st through hole 7a and the 2nd through hole 7b is formed at the corner part of frame component 7.In the inside of the 1st through hole 7a, pad electrode 4a exposes at least partially.Pad electrode 4a is connected with the signal routing 3a being connected to signal potential in cloth line electrode 3.On the other hand, in the inside of the 2nd through hole 7b, pad electrode 4b exposes at least partially.Pad electrode 4b and the ground connection the being connected to earthing potential 3b that connects up is connected.
Then, the part beyond coated above-mentioned 1st, the 2nd through hole 7a, 7b is carried out with resist.After this, in the 1st, the 2nd through hole 7a, 7b, metal is filled by plating.As metal, can use with the suitable metal such as Ni, Cu alloy that is main component.After this, resist is peeled off.
As described above, as shown in Fig. 3 (a), (b), in the inside of the 1st, the 2nd through hole 7a, 7b, form the 1st, the 2nd conductive member 8a, the 8b played a role as projection or protruding lower metal layer.When playing a role as projection, expect that the height the 1st, the 2nd conductive member 8a, 8b being formed as conductive member 8a, 8b compared with the height of frame component 7 is higher.Thereby, it is possible to make engaging by flip-chip the installation carried out and becoming easy of the electronic unit finally obtained.
Then, as shown in Fig. 4 (a), dicing tape (dicingtape) 9 is pasted from the upper surface side of piezoelectric substrate 1.In Fig. 4 (a), show the part identical with the cross sectional portion shown in Fig. 3 (b).In addition, in Fig. 4 (b), the cross sectional portion suitable with the part along Fig. 2 (c) is illustrated.
As dicing tape 9, the lower surface of an interarea can be used as to be the known dicing tape of bonding plane.The lower surface of above-mentioned dicing tape 9 is pasted on the 1st, the 2nd conductive member 8a, 8b and frame component 7.As shown in Fig. 4 (a) and (b), in this condition, at the lower surface of dicing tape 9 and form space X and space Y between female piezoelectric substrate 1 and frame component 7.
Then, dicing tape 9 is not cut and female piezoelectric substrate 1 is cut into each electronic unit unit.By cutting, the sealing comprising the space X of IDT2 in inside is maintained, and produces peristome in space Y.In addition, as shown in Fig. 5 (a) and (b), female piezoelectric substrate is split into the piezoelectric substrate 1A of each electronic unit unit.Piezoelectric substrate 1A is equivalent to circuit substrate in addition.
Then, do not peel off dicing tape 9 and from the lower face side coating electrically conductive paste of piezoelectric substrate 1A, at the cut surface of space Y and piezoelectric substrate 1A and after being configured with conductive extractum as the lower surface of the 2nd interarea, make it solidify by heat or cooling etc.Like this, as shown in Fig. 6 (a) and (b), can once form shield member 10 in the given position of multiple electronic unit.
As above-mentioned conductive extractum, the constituent comprising conductive material in thermohardening type resin, thermoplastic resin or various chemosetting resin can be used in.
Fig. 6 (a) and (b) are each profiles with Fig. 5 (a) and (b) suitable part.Shield member 10 covers the lower surface as the 2nd interarea of piezoelectric substrate 1A.In addition, shield member 10 is filled in the adjacent space between piezoelectric substrate 1A, 1A.Therefore, shield member 10 arrives upper surface 1a from the lower surface of piezoelectric substrate 1A via side.Shield member 10, on the upper surface 1a as the 1st interarea of piezoelectric substrate 1A, arrives the region 1c being provided with the outside of the part of frame component 7.But, shield member 10 does not arrive than frame component 7 region 1d more in the inner part.
By the formation of above-mentioned shield member 10, connect up 3b and shield wiring 5 of shield member 10 and the ground connection being connected to earthing potential is electrically connected.In addition, the pad electrode 4a be connected with signal routing 3a does not expose in the space Y in the outside as frame component 7, and is not electrically connected with shield member 10.
Then, a part for above-mentioned shield member 10 is cut into each electronic unit unit.In the case, preferably dicing tape 9 is not peeled off from electronic unit.That is, as shown in Fig. 8 (a) and (b), between piezoelectric substrate 1A, 1A shield member 10 is cut adjacent.Like this, the shield member 10A of each electronic unit unit is formed.
In addition, Fig. 7 omits dicing tape 9, represents the diagrammatic top view being formed with the state of shield member 10 as shown in Fig. 6 (a) and (b).
Fig. 9 schematically shows the vertical view above-mentioned shield member 10 being cut into the state after multiple shield member 10A.At this, eliminate the diagram of dicing tape 9.
After this, electronic unit is peeled off from dicing tape 9.Like this, the electronic unit 11 of the 1st execution mode shown in Figure 10 (a) ~ (c) can be obtained.
In electronic unit 11, on the upper surface 1a of the piezoelectric substrate 1A as circuit substrate, constitute the functional circuit with multiple IDT2.In the present embodiment, the filter of ladder type circuit structure is formed.The opposing party, in electronic unit 11, shield member 10A is constituting the upper surface of piezoelectric substrate 1A of functional circuit, covers whole of the lower surface 1b as the 2nd interarea of piezoelectric substrate 1A.In addition, also conductively-closed component 10A is coated for 4 side entirety of piezoelectric substrate 1A.And, on the upper surface 1a of piezoelectric substrate 1A, arrive region 1c ground and be formed with shield member 10A.Therefore, it is possible to reliably functional circuit is carried out electromagnetic shielding relative to outside by shield member 10A.
On the other hand, when the installation of electronic unit 11, can by electronic unit 11 from shown in Figure 10 (b) and (c) towards overturning, by flip-chip engage engineering method be arranged on installation base plate.In the case, even if do not arrange shield member in installation base plate side, in the mounted state, functional circuit also can surround by conductively-closed component 10A.Therefore, as installation base plate, without the need to preparing the installation base plate of complicated structure, without the need to arranging the shield member of overlay electronic parts 11 respectively with electronic unit 11.
And then in the side, face being formed with functional circuit of piezoelectric substrate 1A, shield member 10A is formed lowlyer than the upper end of above-mentioned frame component 7.Therefore, even if be provided with shield member 10A, the thickness of electronic unit 11 also less increases.Therefore, it is possible to realize the low dwarfing (lowprofile) of electronic unit 11.
Figure 11 (a) is the vertical view of the 2nd execution mode of the present invention, and Figure 11 (b) and (c) are the profile along the B6-B6 line in Figure 11 (a) and C6-C6 line respectively.In the electronic unit 21 of present embodiment, above piezoelectric substrate 1A, be formed with lid component 22.At this, in the upper surface 1a side of piezoelectric substrate 1A, shield member 10B is arranged to arrive region 1c in a same manner as in the first embodiment.But, shield member 10B is formed as having the outstanding frame 10B1 given prominence to upward from the part of the side covering piezoelectric substrate 1A.The region surrounded at this outstanding frame 10B1 is formed with lid component 22.
The upper surface of lid component 22 is set as than the 1st, the upper end of the 2nd conductive member 8a, 8b is lower.In addition, the lower surface of lid component 22 and the upper-end contact of frame component 7.Lid component 22 is made up of insulative resin.Owing to being provided with the seal cavity surrounded by piezoelectric substrate 1, frame component 7 and lid component 22, therefore in the present embodiment, the moisture-proof etc. in electronic unit 21 can be improved, the electrical characteristic of the functional circuit in seal cavity can be made to stablize.
In addition, when comprising IDT etc. and operationally becoming the functional circuit of the element of pyrotoxin, cause because of heating the temperature of piezoelectric substrate to rise, there is the problem of the electrical characteristic change of electronic unit 11.Particularly, when configuring element in the seal cavity sealed by piezoelectric substrate 1A, frame component 7 and lid component 22, the temperature of the piezoelectric substrate caused by heating rises and becomes large.But because ground connection wiring 3b is formed continuously from by the inner side in space sealed to outside on the 1st interarea of piezoelectric substrate 1A, the heat therefore in seal cavity is delivered to the outside of seal cavity via ground connection wiring 3b.By the heat trnasfer that this ground connection wiring 3b carries out, the temperature of the functional circuit formed on the 1st interarea of piezoelectric substrate 1A can be suppressed to rise, the variation of the electrical characteristic caused by temperature of electronic unit 11 can be made to stablize.Preferably the pyroconductivity of the thermal conductivity ratio piezoelectric substrate 1A of ground connection wiring 3b is high in the case.
Other structures are identical with the 1st execution mode.In the electronic unit 21 of the 2nd execution mode, also can advance low dwarfing in a same manner as in the first embodiment, and realize good electro-magnetic screen function.
With reference to Figure 12 ~ Figure 17, the manufacture method of the electronic unit 21 of the 2nd execution mode is described.
As shown in Figure 12 (a) ~ (c), on female piezoelectric substrate 1, form electrode structure and frame component 7 in a same manner as in the first embodiment.After this, photoresist sheet is bonded on frame component 7, and carries out pattern formation by photoetching.Thereby, it is possible to form lid component 22.In addition, on lid component 22, also carry out above-mentioned pattern formation, to form the 3rd and the 4th through hole 22a, the 22b (with reference to Figure 13) be connected with aforesaid 1st, the 2nd through hole 7a, 7b.
After this, in the 1st, the 2nd through hole 7a, 7b, fill metal by plating in a same manner as in the first embodiment.Like this, as shown in figure 13, the 1st, the 2nd conductive member 8a, 8b can be formed.
Then, as shown in Figure 14 (a) and (b), dicing tape 9 is pasted on upper surface.After this, dicing tape 9 is not cut and piezoelectric substrate 1 is cut into each electronic unit unit.Like this, as shown in Figure 15 (a) and (b), female piezoelectric substrate is split into multiple piezoelectric substrate 1A.Then, as shown in Figure 16 (a) and (b), from the lower face side coating shield member 10 of piezoelectric substrate 1A, and it is made to solidify.After this, as shown in Figure 17 (a) and (b), be divided into each electronic unit unit by cutting.Finally peel off electronic unit from dicing tape 9.Like this, the electronic unit 21 of the 2nd execution mode can be obtained.
Figure 18 (a) is the vertical view of the electronic unit 31 represented involved by the 3rd execution mode of the present invention, and Figure 18 (b) and (c) are the profile along the B8-B8 line in Figure 18 (a) and C8-C8 line respectively.
Present embodiment and the 2nd execution mode difference are, lid component 32 extends to the outer peripheral edges of electronic unit 31.That is, in the 2nd execution mode, shield member 10B has outstanding frame 10B1, in this outstanding frame 10B1, be configured with lid component 22.In contrast, do not form outstanding frame 10B1.In other words, be equivalent in the electronic unit 1 of the 1st execution mode, added the structure of above-mentioned lid component 32.
The manufacturing process of the electronic unit 31 of the 3rd execution mode can carry out substantially samely with the 2nd execution mode.But, when by cutting shield member 10B shield member 10 being cut into each electronic unit unit, female lid component also being cut, forms above-mentioned lid component 32.In the present embodiment, because the side tegmentum component 32 of the 1st, the 2nd conductive member 8a, 8b with external electrical connections covers, therefore, it is possible to suppress undesirable short circuit.
Be described with reference to the manufacture method of Figure 19 ~ Figure 25 to the electronic unit 41 of the 4th execution mode.Figure 19 is the vertical view of the electronic unit 41 representing the 4th execution mode, and Figure 20 (a) ~ (c) is the profile along the A9-A9 line in Figure 19, B9-B9 line and C9-C9 line.First be described with reference to the manufacture method of Figure 21 ~ Figure 25 to electronic unit 41.
First, female piezoelectric substrate forms electrode structure in a same manner as in the first embodiment.As shown in figure 21, this electrode structure has multiple IDT2, signal routing 3a, ground connection wiring 3b and pad electrode (padelectrode) 4a, 4b.
And then, in the present embodiment, as electrode structure, be formed with rectangular box-like supply lines 42c.Signal-powered line 42a is formed, to be connected with the pad electrode 4a as signal terminal from rectangular box-like supply lines 42c.In addition, ground connection supply lines 42b is extended from supply lines 42c towards the pad electrode 4b be connected with earthing potential.
And then, be formed with extraction electrode 43 to be electrically connected with ground connection supply lines 42b.In addition, signal-powered line 42a is electrically connected with extraction electrode 43 via supply lines 42c and ground connection supply lines 42b.
In addition, above-mentioned extraction electrode 43 extends abreast with a mutually opposing opposite side of rectangular box-like supply lines 42c.The direction that extraction electrode 43 extends is set to Y-direction, the direction in the piezoelectric substrate face orthogonal with Y-direction is set to X-direction.At a pair avris that this is mutually opposing, there is no signalization supply lines 42a.That is, signal-powered line 42a is electrically connected with the part of the supply lines 42c being positioned at all the other opposite side.
The electrode structure comprising above-mentioned signal-powered line 42a, ground connection supply lines 42b and extraction electrode 43 can be formed by utilizing photoetching to carry out pattern in a same manner as in the first embodiment.
Then, as shown in Figure 23 and Figure 24 (a) ~ (c), in a same manner as in the first embodiment, frame component 7C is formed by the pattern of photoresist.Frame component 7C has rectangular box-like frame member body.This rectangular box-like frame member body is arranged to surround functional circuit.In addition, at the corner part of this rectangular box-like frame member body, the 1st, the 2nd through hole 7a, 7b is formed in a same manner as in the first embodiment.But, in the present embodiment, spaced walls (partitionwall) 7C1 outstanding to Y-direction is formed.Spaced walls 7C1 extends to the ora terminalis of female piezoelectric substrate 1 from the corner part of rectangular box-like frame member body.
Owing to being provided with spaced walls 7C1, therefore the region in the outside of the frame member body of frame component 7 is divided into the 1st region D and the 2nd region E.At this, the 1st region D refers to, along the region between spaced walls 7C1,7C1 that Y-direction extends.2nd region E refers to, along the region in the outside of the spaced walls 7C1 of Y-direction extension.The extraction electrode 43 be connected with aforesaid earthing potential is configured with at the 2nd region E.That is, in the 2nd region E, ground connection supply lines 42b and extraction electrode 43 are electrically connected.In other words, the wiring portion be connected with earthing potential is formed to arrive outside from the inner side of frame component 7C.
Owing to being provided with above-mentioned spaced walls 7C1, therefore as described later, the shield member 10 comprising conductive material does not arrive the 1st region D.Therefore, it is possible to prevent undesirable short circuit.
In the manufacture method of present embodiment, also after defining above-mentioned electrode structure, form frame component 7 in the same manner as the 2nd and the 3rd execution mode.But, the frame component 7 comprising above-mentioned spaced walls 7C1 is formed.Then, use signal-powered line 42a and ground connection supply lines 42b, form the 1st, the 2nd conductive member 8a, 8b by electrolytic plating method.Owing to using this electrolytic plating method, therefore, it is possible to easily form the 1st, the 2nd thicker conductive member 8a, 8b of thickness.Then, dicing tape is pasted from upper surface.
After this, female piezoelectric substrate is cut.When this female piezoelectric substrate cutting, the part be not included in the part that dotted line F1, F2 of Figure 25 surround in the region that little by little rule G1, G2 surround is not cut.During this external cutting, by cutting the region removing little by little rule G1, G2 and surround.That is, the part between the adjacent extraction electrode 43 removing adjacent electronic unit.Extraction electrode 43 exposes at cut section.
After above-mentioned cutting, under the state do not peeled off from dicing tape, in the same manner as the 1st ~ 3rd execution mode, from lower face side coating electrically conductive paste, and it is made to solidify.Like this, shield member is formed.After this, by cutting, by the shield member part between adjacent electronic unit and lid cutting of members.As described above, the electronic unit 41 shown in Figure 19 and Figure 20 can be obtained.
In the electronic unit 41 of present embodiment, be also provided with lid component, therefore, it is possible to effectively prevent undesirable short circuit of the 1st, the 2nd conductive member 8a, 8b.In addition, in the present embodiment, shield member 10 is also formed in a same manner as in the first embodiment, therefore, it is possible to reliably carry out electromagnetic shielding to functional circuit.But, as shown in Figure 20 (c), at the aforesaid side extended in X direction, do not form shield member 10.Even if in this case, also because other 2 side conductively-closed components 10 are coated, therefore, it is possible to carry out electromagnetic shielding to functional circuit fully.
Figure 26 and Figure 27 (a) ~ (c) is each profile of the vertical view of the electronic unit 51 represented involved by the 5th execution mode of the present invention, A12-A12 line along in Figure 26, B12-B12 line, C12-C12 line.In the present embodiment, also in a same manner as in the fourth embodiment, the 1st, the 2nd conductive member 8a, 8b can be formed by metallide.
Be described with reference to the manufacture method of Figure 28 to present embodiment.On female piezoelectric substrate 1, form electrode structure in a same manner as in the first embodiment.But, in the present embodiment, as shown in Figure 28 (a) ~ (c), be not only formed with signal routing 3a, ground connection wiring 3b, pad electrode 4a, 4b at multiple IDT2, be also formed with supply lines 52 and extraction electrode 53.In the present embodiment, the extraction electrode 53 also double part doing supply lines 52.That is, extraction electrode 53 is formed as the Y-direction upper end arriving Figure 28 (a).In addition, extraction electrode 53 is formed as crossing between adjacent electronic unit.Supply lines 52 has the supply lines part 52a extended in X direction.One end of supply lines part 52a is set to connect a pair extraction electrode 53.Thus, by supply lines part 52a and extraction electrode 53, rectangular box-like supply lines is constituted.At supply lines part 52a, be connected with signal-powered line 42a.This is identical with the situation of the 4th execution mode.On the other hand, ground connection supply lines 42b is connected with at extraction electrode 53.
5th execution mode is except the structure of supply lines is as described above except difference, identical with the 4th execution mode.
In the manufacture method of present embodiment, also after defining above-mentioned electrode structure, form frame component 7C in a same manner as in the fourth embodiment.In the present embodiment, also form frame component 7C in a same manner as in the fourth embodiment make that there is spaced walls 7C1.
Then, use photoresist, form frame component in a same manner as in the fourth embodiment by photoetching.Then, in the present embodiment, make metal accumulation in pad electrode 4a, 4b and extraction electrode 53 by plating.Thus, the 1st, the 2nd conductive member 8a, 8b is formed.And then, in plating operation, on extraction electrode 53, form the metal film 54 shown in Figure 27 (a) and (b).
After this, come beyond the part residing for coated 1st, the 2nd conductive member 8a, 8b by resist, and then coating metal film is carried out stacked to make the thickness of the 1st, the 2nd conductive member 8a, 8b thickening.In Figure 27 (a), this coating metal film does not illustrate especially.
After this, dicing tape is pasted from upper surface, female piezoelectric substrate is cut in a same manner as in the fourth embodiment.When cutting, cutting partially of the extraction electrode 53 between the electronic unit that removing leap is adjacent.Therefore, extraction electrode 53A exposes at section.
After this, in the same manner as the 1st ~ 4th execution mode, from lower face side coating electrically conductive paste, and make its hot curing, form shield member.After this, by cutting, by the shield member part between adjacent electronic unit and lid cutting of members.Like this, the electronic unit of present embodiment can be obtained.
In the present embodiment, also in a same manner as in the fourth embodiment, the 1st, the 2nd conductive member 8a, 8b can be formed by metallide.
In addition, in the 1st ~ 5th above-mentioned execution mode, functional circuit is set to form ladder type filter, but in the present invention, functional circuit is not limited to this filter, also can be that appropriately combined filter is carried out to vertical coupled resonators mode filter, horizontal coupled resonators mode filter etc., be not limited to the functional circuit part that make use of the elastic waves such as surface acoustic wave in addition.That is, can apply the present invention to have the part of the various functional circuits needing electromagnetic shielding.
In addition, as circuit substrate, be not limited to above-mentioned piezoelectric substrate 1, the electronic unit employing insulative substrate, semiconductor substrate can also be applied the present invention to.
Symbol description
1... piezoelectric substrate
1A... piezoelectric substrate
1a... upper surface
1b... lower surface
1c... region
1d... region
2...IDT
3... cloth line electrode
3a... signal routing
3b... ground connection is connected up
4a, 4b... pad electrode
5... shield wiring
7... frame component
7C... frame component
7C1... spaced walls
7a, 7b... the 1st, the 2nd through hole
8a, 8b... the 1st, the 2nd conductive member
9... dicing tape
10,10A, 10B... shield member
10B1... outstanding frame
11,21... electronic unit
22... lid component
22a, 22b... the 3rd, the 4th through hole
31... electronic unit
32... lid component
41... electronic unit
The signal-powered line of 42a...
42b... ground connection supply lines
42c... supply lines
43... extraction electrode
52... supply lines
52a... supply lines part
53... extraction electrode
53A... extraction electrode
54... metal film
Claims (10)
1. an electronic unit, possesses:
Circuit substrate, it has the side that the 1st mutually opposing interarea and the 2nd interarea are connected with by the 1st interarea and the 2nd interarea;
Functional circuit, it is formed at the 1st interarea of described circuit substrate;
Signal routing, it is formed at the 1st interarea of described circuit substrate, and is electrically connected with described functional circuit;
Ground connection is connected up, and it has the wiring portion of the 1st interarea being formed at described circuit substrate, is electrically connected, and is electrically connected with earthing potential with described functional circuit; With
Frame component, guarantees region between its outer peripheral edges being provided in the 1st interarea of described frame component and described circuit substrate and surrounds described functional circuit,
Described ground connection wiring is configured to arrive outside from the inner side of described frame component,
Described electronic unit also possesses shield member, this shield member is configured to the described region in the outside of the described frame component of the 1st interarea arriving described circuit substrate from the 2nd interarea of described circuit substrate via side, and described shield member comprises conductive material and is electrically connected with the wiring of described ground connection in the described region in the outside of described frame component.
2. electronic unit according to claim 1, wherein,
Also possess spaced walls, the outer peripheral edges that this spaced walls is configured to from the outer peripheral edges of described frame component towards described 1st interarea extend,
By described spaced walls, the described region in the outside of described frame component is split into the 1st zoning and the 2nd zoning, and be configured with the wiring of described ground connection in described 1st zoning, described signal routing is configured to be connected with described 2nd zoning.
3. electronic unit according to claim 1 and 2, wherein,
Described shield member is configured to the 2nd interarea of coated described circuit substrate and whole of described side.
4. the electronic unit according to any one of claims 1 to 3, wherein,
Also possess lid component, this lid component engages the peristome to close described frame component with described frame component.
5. the electronic unit according to any one of Claims 1 to 4, wherein,
Described frame component have described signal routing faced by the 1st through hole and described ground connection wiring faced by the 2nd through hole, described electronic unit also possesses the 1st conductive member and the 2nd conductive member that are filled in described 1st through hole and the 2nd through hole.
6. electronic unit according to claim 4, wherein,
Described lid component has the 3rd through hole and the 4th through hole that are connected with described 1st through hole and the 2nd through hole, and described 1st conductive member and the 2nd conductive member are formed as being connected with described 3rd through hole and the 4th through hole respectively.
7. a manufacture method for electronic unit, possesses following operation:
Operation (A), prepares the circuit substrate with the side that the 1st mutually opposing interarea and the 2nd interarea are connected with by the 1st interarea and the 2nd interarea;
Operation (B), described 1st interarea of described circuit substrate forms functional circuit;
Operation (C), on described 1st interarea of described circuit substrate, is formed and the signal routing that is electrically connected of functional circuit and to be electrically connected with functional circuit and the ground connection be connected with earthing potential is connected up;
Operation (D), described 1st interarea of described circuit substrate forms frame component, makes to surround described functional circuit and guarantee region between described frame component and the outer peripheral edges of described circuit substrate; With
Operation (E), forms the shield member comprising conductive material, makes this shield member arrive the region in the outside of the frame component of described 1st interarea via described side from the 2nd interarea of described circuit substrate, and is electrically connected with the wiring of described ground connection.
8. the manufacture method of electronic unit according to claim 7, wherein,
Carry out described operation (A) ~ operation (E) at female circuit substrate, female circuit substrate arranged and forms multiple electronic unit formation part, make shield member arrive between adjacent electronic unit component part,
While the female circuit substrate and described shield member that form described multiple electronic unit formation part are cut off, be cut to each electronic unit.
9. the manufacture method of the electronic unit according to claim 7 or 8, wherein,
Also possess and form the operation that lid component makes the opening of closed described frame component.
10. the manufacture method of the electronic unit according to any one of claim 7 ~ 9, wherein,
Also possess the spaced walls that the outer peripheral edges side that forms described 1st interarea from described frame component towards described circuit substrate extends, making is the operation of the 1st zoning and the 2nd zoning by described Region dividing by described spaced walls,
Form described spaced walls, such that the wiring of described ground connection is positioned at described 1st zoning, described signal routing is positioned at described 2nd zoning.
Applications Claiming Priority (1)
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| PCT/JP2013/069419 WO2015008351A1 (en) | 2013-07-17 | 2013-07-17 | Electronic component and method for producing same |
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| US (1) | US9654081B2 (en) |
| KR (1) | KR101804496B1 (en) |
| CN (1) | CN105379116B (en) |
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| CN107210727A (en) * | 2015-03-27 | 2017-09-26 | 株式会社村田制作所 | Electronic unit |
| CN110050338A (en) * | 2016-12-07 | 2019-07-23 | 株式会社村田制作所 | Electronic component and its manufacturing method |
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| WO2016125753A1 (en) * | 2015-02-03 | 2016-08-11 | 株式会社村田製作所 | Surface acoustic wave device assembly |
| WO2017110994A1 (en) * | 2015-12-25 | 2017-06-29 | 株式会社村田製作所 | High frequency module |
| US10263170B1 (en) | 2017-11-30 | 2019-04-16 | International Business Machines Corporation | Bumped resonator structure |
| US10305015B1 (en) | 2017-11-30 | 2019-05-28 | International Business Machines Corporation | Low loss architecture for superconducting qubit circuits |
| JP6819649B2 (en) * | 2018-04-26 | 2021-01-27 | 株式会社村田製作所 | Elastic wave device |
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Also Published As
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| KR101804496B1 (en) | 2017-12-04 |
| US9654081B2 (en) | 2017-05-16 |
| US20160126931A1 (en) | 2016-05-05 |
| CN105379116B (en) | 2017-09-05 |
| WO2015008351A1 (en) | 2015-01-22 |
| KR20160019525A (en) | 2016-02-19 |
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