CN105376944A - Processing technology for improving density of printed board - Google Patents
Processing technology for improving density of printed board Download PDFInfo
- Publication number
- CN105376944A CN105376944A CN201510770222.6A CN201510770222A CN105376944A CN 105376944 A CN105376944 A CN 105376944A CN 201510770222 A CN201510770222 A CN 201510770222A CN 105376944 A CN105376944 A CN 105376944A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- filler opening
- slurry
- filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a processing technology for improving the density of a printed board. The method comprises the following steps: taking a copper-clad plate, determining the size of the copper-clad plate and carrying out cutting to obtain the cut copper-clad plate; drilling a filling opening into the copper-clad plate and then carrying out a copper deposition operation on the copper-clad plate; taking an insulating material to fabricate filling slurry matched with the filling opening, and stuffing the filling slurry into the filling opening of the copper-clad plate; taking the obtained copper-clad plate, drilling, carrying out the copper deposition operation again, taking the fabricated circuit diagram and carrying out a hot-pressing operation on the copper surface of the copper-clad plate, so as to obtain a circuit copper-clad plate; and putting the circuit copper-clad plate into an etching agent, taking out the circuit copper-clad plate, flushing the circuit copper-clad plate with clean water, and carrying out a solder resist operation and a screen printing operation to obtain a PCB. The filling opening stops a conducting hole with slurry of the insulating material or conductive material slurry; copper plating is carried out on the hole surface; a bonding pad is fabricated through image transfer and is directly welded on the surface; the hole wall can conduct electricity; and components can also be welded on the hole surface.
Description
Technical field
The present invention relates to PCB field, especially a kind of processing technology improving printed board density.
Background technology
Along with the development of electronic information technology, electronic product is towards lightweight, microminiaturization, high speed future development, the wiring area of PCB, live width and line-spacing etc. are by unavoidable past less closeer trend development, in order to adapt to this development trend, and derive the different design concept of form and the manufacture method of technique in the past.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of processing technology improving printed board density.
The present invention is the technical scheme solving the problems of the technologies described above employing:
Improve a processing technology for printed board density, method step is as follows:
A. get copper-clad plate, determine the size of copper-clad plate, cut, obtain the copper-clad plate after cutting;
B. boring filler opening by obtaining copper-clad plate in step a, then heavy copper operation being carried out to copper-clad plate;
C. get insulating material and make the filling slurry supporting with described filler opening, filling slurry is filled in the filler opening of the copper-clad plate obtained in step b;
D. get the copper-clad plate obtained in step c, boring, again carries out heavy copper operation, gets the circuit diagram completed, carry out hot press operation with copper-clad plate copper face, obtain circuit copper-clad plate;
E. etchant is put in the circuit copper-clad plate obtained in steps d, take out, clear water rinses, and carries out welding resistance operation and silk-screen operation, obtains pcb board.
Further, in described step c, use semi-automatic filling perforation machine to carry out padding to described filler opening, semi-automatic filling machine cylinder pressure is more than or equal to 6.5kg/cm2, and the filling mouth distance filler opening of described semi-automatic filling machine is 5mm.
Further, after filling slurry being filled in filler opening in described step c, use ceramic grinding trigger to polish to filling slurry, fill slurry end face and flush with the aperture of filler opening.
Further, the scraper carrying out silk-screen operation use in described step e needs to use 2CM thickness, the scraper of 75 degree; The half tone carrying out silk-screen operation selects 18T, and described half tone bottom surface is stained with aluminium flake, and filler opening offered by aluminium flake, and aluminium sheet filler opening diameter is more than or equal to 0.1mm than copper-clad plate filler opening diameter.
Beneficial effect of the present invention is:
1. filler opening utilizes the slurry of insulating material or electric conducting material slurry to be clogged by via, then copper facing is carried out at hole surface, pad is made by image transfer, directly in surface soldered, hole wall not only can conduct electricity but also can carry out welding component at hole surface, by the design size adopting this technique can effectively reduce PCB.
2. filler opening adopts the realization of fill process to decrease the less closeer problem of PCB layout area, live width and line-spacing, reduces the distance between Kong Yukong, narrows down to 16mil, improve wiring space by original 28mil.This technique constantly plays its indispensable effect on some high-end products, and especially applied widely on the products such as blind buried via hole, HDI, these products have related to communication, military affairs, aviation, power supply, network etc. industry.
3. by adopting the present invention, in the process of producing pcb board, eliminate in conventional procedure and pass through to arrange the processing step that pad carries out components and parts welding separately, enormously simplify the production procedure of PCB, reduce the difficulty that PCB assembles components and parts simultaneously, improve the production efficiency of PCB.Solve the problem solving wire and wiring simultaneously, the plane that smooth is provided.
Embodiment
Improve a processing technology for printed board density, method step is as follows:
A. get copper-clad plate, determine the size of copper-clad plate, cut, obtain the copper-clad plate after cutting;
B. boring filler opening by obtaining copper-clad plate in step a, then heavy copper operation being carried out to copper-clad plate;
C. get insulating material and make the filling slurry supporting with described filler opening, filling slurry is filled in the filler opening of the copper-clad plate obtained in step b, semi-automatic filling perforation machine is used to carry out padding to described filler opening, semi-automatic filling machine cylinder pressure is more than or equal to 6.5kg/cm2, the filling mouth distance filler opening of described semi-automatic filling machine is 5mm, after filling slurry is filled in filler opening, use ceramic grinding trigger to polish to filling slurry, fill slurry end face and flush with the aperture of filler opening;
D. get the copper-clad plate obtained in step c, boring, again carries out heavy copper operation, gets the circuit diagram completed, carry out hot press operation with copper-clad plate copper face, obtain circuit copper-clad plate;
E. etchant is put in the circuit copper-clad plate obtained in steps d, take out, clear water rinses, and carry out welding resistance operation and silk-screen operation, the scraper that silk-screen operation uses needs to use 2CM thickness, the scraper of 75 degree; The half tone carrying out silk-screen operation selects 18T, and described half tone bottom surface is stained with aluminium flake, and filler opening offered by aluminium flake, and aluminium sheet filler opening diameter is more than or equal to 0.1mm than copper-clad plate filler opening diameter, obtains pcb board.
Filler opening utilizes the slurry of insulating material or electric conducting material slurry to be clogged by via, then copper facing is carried out at hole surface, pad is made by image transfer, directly in surface soldered, hole wall not only can conduct electricity but also can carry out welding component at hole surface, by the design size adopting this technique can effectively reduce PCB.
Filler opening adopts the realization of fill process to decrease the less closeer problem of PCB layout area, live width and line-spacing, reduces the distance between Kong Yukong, narrows down to 16mil, improve wiring space by original 28mil.This technique constantly plays its indispensable effect on some high-end products, and especially applied widely on the products such as blind buried via hole, HDI, these products have related to communication, military affairs, aviation, power supply, network etc. industry.
By adopting the present invention, in the process of producing pcb board, eliminate in conventional procedure and pass through to arrange the processing step that pad carries out components and parts welding separately, enormously simplify the production procedure of PCB, reduce the difficulty that PCB assembles components and parts simultaneously, improve the production efficiency of PCB.Solve the problem solving wire and wiring simultaneously, the plane that smooth is provided.
Claims (4)
1. improve a processing technology for printed board density, it is characterized in that: method step is as follows:
A. get copper-clad plate, determine the size of copper-clad plate, cut, obtain the copper-clad plate after cutting;
B. boring filler opening by obtaining copper-clad plate in step a, then heavy copper operation being carried out to copper-clad plate;
C. get insulating material and make the filling slurry supporting with described filler opening, filling slurry is filled in the filler opening of the copper-clad plate obtained in step b;
D. get the copper-clad plate obtained in step c, boring, again carries out heavy copper operation, gets the circuit diagram completed, carry out hot press operation with copper-clad plate copper face, obtain circuit copper-clad plate;
E. etchant is put in the circuit copper-clad plate obtained in steps d, take out, clear water rinses, and carries out welding resistance operation and silk-screen operation, obtains pcb board.
2. the processing technology of raising printed board density according to claim 1, it is characterized in that: in described step c, semi-automatic filling perforation machine is used to carry out padding to described filler opening, semi-automatic filling machine cylinder pressure is more than or equal to 6.5kg/cm2, and the filling mouth distance filler opening of described semi-automatic filling machine is 5mm.
3. the processing technology of raising printed board density according to claim 1, is characterized in that: after filling slurry being filled in filler opening in described step c, uses ceramic grinding trigger to polish to filling slurry, fills slurry end face and flush with the aperture of filler opening.
4. the processing technology of raising printed board density according to claim 1, is characterized in that: the scraper carrying out silk-screen operation use in described step e needs to use 2CM thickness, the scraper of 75 degree; The half tone carrying out silk-screen operation selects 18T, and described half tone bottom surface is stained with aluminium flake, and filler opening offered by aluminium flake, and aluminium sheet filler opening diameter is more than or equal to 0.1mm than copper-clad plate filler opening diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510770222.6A CN105376944A (en) | 2015-11-11 | 2015-11-11 | Processing technology for improving density of printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510770222.6A CN105376944A (en) | 2015-11-11 | 2015-11-11 | Processing technology for improving density of printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105376944A true CN105376944A (en) | 2016-03-02 |
Family
ID=55378621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510770222.6A Pending CN105376944A (en) | 2015-11-11 | 2015-11-11 | Processing technology for improving density of printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105376944A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103118506A (en) * | 2013-01-22 | 2013-05-22 | 金悦通电子（翁源）有限公司 | Electroplating hole filling method for via hole on bonding pad |
| CN103384453A (en) * | 2013-07-11 | 2013-11-06 | 电子科技大学 | Processing method of inner-layer reliable hole and line of printed circuit |
| CN103491728A (en) * | 2013-09-30 | 2014-01-01 | 电子科技大学 | Method for processing blind holes and fine lines of printed circuit board |
| US20140196939A1 (en) * | 2012-05-16 | 2014-07-17 | Ngk Spark Plug Co., Ltd. | Wiring board |
-
2015
- 2015-11-11 CN CN201510770222.6A patent/CN105376944A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140196939A1 (en) * | 2012-05-16 | 2014-07-17 | Ngk Spark Plug Co., Ltd. | Wiring board |
| CN103118506A (en) * | 2013-01-22 | 2013-05-22 | 金悦通电子（翁源）有限公司 | Electroplating hole filling method for via hole on bonding pad |
| CN103384453A (en) * | 2013-07-11 | 2013-11-06 | 电子科技大学 | Processing method of inner-layer reliable hole and line of printed circuit |
| CN103491728A (en) * | 2013-09-30 | 2014-01-01 | 电子科技大学 | Method for processing blind holes and fine lines of printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160302 |