CN105355761A - LED phosphor packaging structure with uniform light colors and transparent die therefor - Google Patents

LED phosphor packaging structure with uniform light colors and transparent die therefor Download PDF

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Publication number
CN105355761A
CN105355761A CN201510583663.5A CN201510583663A CN105355761A CN 105355761 A CN105355761 A CN 105355761A CN 201510583663 A CN201510583663 A CN 201510583663A CN 105355761 A CN105355761 A CN 105355761A
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phosphor powder
powder layer
layer
light
led chip
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CN105355761B (en
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王钢
罗滔
张静雯
周烨
陈倩倩
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Sun Yat Sen University
National Sun Yat Sen University
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National Sun Yat Sen University
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Abstract

The invention discloses an LED phosphor packaging structure with uniform light colors and a transparent die therefor. The LED phosphor packaging structure comprises a bracket, an LED chip and a phosphor layer; the phosphor layer is arranged on the top of the bracket; the lower surface of the phosphor layer is a sunken arc-shaped surface; the upper surface of the phosphor layer is plane-shaped; the light ray from the LED chip enters the internal of the phosphor layer from the arc-shaped surface and then the light rays are emitted out from the upper surface of the phosphor layer; and the optical path of inclined incident ray passing through the phosphor layer is equal to the optical path of perpendicular incident ray passing through the phosphor layer. According to the LED phosphor packaging structure, the phenomena of a yellow circle or a blue circle easily generated in the edges of light spots formed by the conventional LED phosphor packaging structure are avoided, and the same light color and uniform distribution of light colors of the emergent rays at different angles are realized; namely, the Lambertian light intensity distribution on the layer of the phosphor packaging structure is realized; and in addition, the LED phosphor packaging structure is simple in structure, easy to produce and relatively low in cost.

Description

A kind of photochromic uniform LED fluorescent powder encapsulating structure and transparent mould thereof
Technical field
The present invention relates to LED fluorescent powder encapsulation field, be specifically related to a kind of photochromic uniform LED fluorescent powder encapsulating structure and transparent mould thereof.
Background technology
In prior art, the fluorescent material major part of LED is directly coated on LED chip, and namely fluorescent material directly contacts with chip, chip at the direct excitated fluorescent powder of near field, the light that chip sends and fluorescent material be stimulated send light complementation form white light.It is this that directly by fluorescent material, the shortcoming be coated on chip is that the amount of fluorescent material in actual mechanical process is wayward, the character that the rising of chip temperature simultaneously directly has influence on fluorescent material changes, cause fluorescent material carbonization, fluorescent material conversion efficiency and light efficiency are reduced.
In order to solve the problem, there is coating method that people adopts territory far away to excite in prior art to improve light extraction efficiency, directly do not contact with LED chip by fluorescent material and be placed on position far away.Now develop the encapsulating structure that fluorescent material does not directly contact with LED chip, this encapsulating structure comprises support and is located at the LED chip on support, LED chip is coated with heat-insulation transparent material layer, phosphor powder layer is coated on heat-insulation transparent material layer, the far field excitation mode that phosphor powder layer and chip separate decreases the loss of phosphor powder layer back-scattering light and chip temperature to the impact of fluorescent material, improves light extraction efficiency.But the hot spot edge that the light that this encapsulating structure LED chip sends is formed after its phosphor powder layer easily produces yellow circle phenomenon, cause the final hot spot produced uneven.Therefore how improving hot spot uniformity is present urgent problem.
Summary of the invention
In order to solve above deficiency, the present invention devises a kind of photochromic uniform LED fluorescent powder encapsulating structure and transparent mould thereof, the hot spot edge that this encapsulating structure overcomes the generation of traditional LED fluorescent powder encapsulating structure easily produces yellow phenomenon of enclosing, and improves the uniformity of the photochromic distribution of LED emergent light.
In order to realize the object of the invention, take two kinds of technical schemes:
Scheme one:
A kind of photochromic uniform LED fluorescent powder encapsulating structure, comprise support, LED chip and phosphor powder layer, described LED chip is in described frame bottom; Described phosphor powder layer is located at described cradle top, and the lower surface of described phosphor powder layer is recessed arcwall face, and the upper surface of described phosphor powder layer is plane; The light that described LED chip sends is incident in described phosphor powder layer from described arcwall face, and penetrates from phosphor powder layer upper surface; Oblique incidence light equals the light path of vertical incidence light by phosphor powder layer center by the light path of phosphor powder layer.
The lower surface of wherein said phosphor powder layer specifically refers to the side of phosphor powder layer near LED chip.
Preferably, also comprise carrier, described carrier is arranged on below described phosphor powder layer, and the upper surface of described carrier and the lower concave curved surface of described phosphor powder layer match and fit; Described carrier is transparent mold layer, and described mold layer is located on the downside of phosphor powder layer; The upper surface of described mold layer is recessed arcwall face, and the lower concave arc surface of itself and described phosphor powder layer matches; The lower surface of described mold layer is plane; Described phosphor powder layer is by pouring into the mode curing molding of fluorescent glue on the arcwall face of mold layer upper surface.
Wherein, described arcwall face is sent out algorithm steps by following stepping and is determined:
A. determine an incident ray, and determine the value of two stepping variablees further, be i.e. described angle of incident light knots modification the horizontal direction deviation angle knots modification Δ a of described phosphor powder layer;
B. with the incident ray l in step a ifor benchmark, increase off-centered angle calculate a refraction point (x on described incident ray and phosphor powder layer i, y i) tangent line t ibetween intersection point (x i+1, y i+1);
C. incident ray is calculated through point (x i+1, y i+1) after refraction through the distance of phosphor powder layer, judge whether identical with center phosphor powder layer thickness, if difference, increase tangent line t iwith the angle delta a of level, if the same record refraction point (x now i+1, y i+1) and tangent line t i+1;
D. repeat step b and c and calculate all refraction points, when calculation procedure 3, if there is total reflection, stop calculating, all refraction points obtained constitute the arcwall face of the lower surface of described phosphor powder layer.
Scheme two:
A kind of photochromic uniform LED fluorescent powder encapsulating structure, comprise support, LED chip and phosphor powder layer, described LED chip is in described frame bottom center; Described phosphor powder layer is located at described frame upper, and the lower surface of described phosphor powder layer is recessed arcwall face, and the minimum point of arcwall face is positioned at the top of LED chip, and the upper surface of described phosphor powder layer is plane; The light that described LED chip sends is incident in described phosphor powder layer from described arcwall face, and the central ray that LED chip sends equals the light path of its marginal ray by phosphor powder layer by the light path of phosphor powder layer.
In above two schemes, light that described LED chip or described LED chip send is after having the absorption of the phosphor powder layer of lower concave arc surface, scattering, and the light intensity I of emergent light is the light distribution of lambert's type relative to angle of emergence θ, namely
I＝I 0cosθ
Wherein, described I 0for the light intensity of this LED chip or LED chip central axis place emergent light, described angle of emergence θ is the angle of emergent light and LED chip or LED chip central axis, and described angular range is 0 °≤θ≤90 °.
Wherein, described arcwall face is sent out algorithm steps by following stepping and is determined:
A. determine an incident ray, and determine the value of two stepping variablees further, be i.e. described angle of incident light knots modification the horizontal direction deviation angle knots modification Δ a of described phosphor powder layer;
B. with the incident ray l in step a ifor benchmark, increase off-centered angle calculate a refraction point (x on described incident ray and phosphor powder layer i, y i) tangent line t ibetween intersection point (x i+1, y i+1);
C. incident ray is calculated through point (x i+1, y i+1) after refraction through the distance of phosphor powder layer, judge whether identical with center phosphor powder layer thickness, if difference, increase tangent line t iwith the angle delta a of level, if the same record refraction point (x now i+1, y i+1) and tangent line t i+1;
D. repeat step b and c and calculate all refraction points, when calculation procedure 3, if there is total reflection, stop calculating, all refraction points obtained constitute the arcwall face of the lower surface of described phosphor powder layer.
Preferably, when the refractive index of described carrier is equal with phosphor powder layer refractive index, arcwall face described in above two schemes
The definition of following formula should be met:
x = h t a n θ + ( d 0 + b + d 0 cosθ ′ ) tanθ ′ y = d 0 cosθ ′ s i n θ sinθ ′ = n
Wherein, described x is the emergent light eye point at described phosphor powder layer upper surface of light when penetrating described phosphor powder layer and the horizontal range of described LED chip central axis; Described y represents the phosphor powder layer thickness that described eye point place is corresponding; Incidence angle when described θ represents that light is injected into described carrier from LED chip; Described d 0the distance of light in phosphor powder layer during expression θ=0; Described h represents θ=0 time from LED chip to the distance at carrier base center; Described n is the refractive index of phosphor powder layer; Described θ ' expression light enters the refraction angle of phosphor powder layer; Described b represents the distance that carrier base center and described phosphor powder layer arcwall face bottom centre locate.
Utilize software to solve and modeling described formula, analyze and draw the phosphor powder layer thickness that eye point of not sharing the same light is corresponding.
The light that the arcuate structure design of described phosphor powder layer makes LED chip or LED chip send equals the light path of light by phosphor powder layer center by light path during phosphor powder layer edge, the light quantity causing edge in emergent light to send equals the blue light amount that center sends, the Light distribation type making emergent light and fluorescent material be stimulated sent is identical, all in the Light distribation of lambert's shape, thus the light that LED is sent is unanimously photochromic.
Further improvement as above-mentioned two schemes:
Preferably, also comprise transparent encapsulated layer, described encapsulated layer is filled between described phosphor powder layer and described LED chip; The upper surface of encapsulated layer and the lower concave curved surface of described phosphor powder layer match and fit.
Described in the light therethrough that described LED chip sends, encapsulated layer enters described phosphor powder layer.
Preferably, described carrier is transparent mold layer, and described mold layer is located on the downside of phosphor powder layer; The upper surface of mold layer is recessed arcwall face, and matches with the lower concave arc surface of described phosphor powder layer; The lower surface of mold layer is plane; Described phosphor powder layer is by pouring into the mode curing molding of fluorescent glue on the arcwall face of mold layer upper surface;
Described in the light therethrough that described LED chip sends, transparent mould layer enters described phosphor powder layer.
Preferably, described carrier is transparent carrier layer, and carrier layer is located at described cradle top; The upper surface of carrier layer and the lower concave curved surface of described phosphor powder layer match and fit, and described phosphor powder layer is fixed on carrier layer upper surface by the mode of coating, thermosetting or bonding; The lower surface of described carrier layer is plane;
Described in the light therethrough that described LED chip sends, carrier layer enters described phosphor powder layer.
The lower surface of wherein said carrier layer specifically refers to the side of carrier layer near described LED chip, and the upper surface of described carrier layer specifically refers to the side of carrier layer next-door neighbour phosphor powder layer.
The Light distribation of light in lambert's type after the absorption, scattering of described phosphor powder layer, forms the photochromic emergent light be evenly distributed from the outgoing of described phosphor powder layer upper surface.
Preferably, also comprise the colloidal silica being coated on described LED chip periphery, described colloidal silica is filled in described mold layer or between carrier layer and LED chip.
Or described colloidal silica is coated LED chip only, the shape of described colloidal silica is semicircle, square or rectangle etc.
Preferably, described carrier layer or mold layer are glass, quartz or PMMA.
Preferably, described support is internal diameter diminishing cavity from top to bottom, and described phosphor powder layer is located at described cavity top; It is seal cavity between cavity and phosphor powder layer.
Preferably, described LED chip is blue chip, and described phosphor powder layer is yellow fluorescence bisque.
The technical scheme of the transparent mould for LED fluorescent powder encapsulating structure of the present invention is as follows: a kind of transparent mould for LED fluorescent powder encapsulating structure, comprise die ontology, described die ontology comprises the lower surface of plane and the upper surface of lower arcs of recesses, and the upper surface of described die ontology is consistent with the lower surface of the phosphor powder layer of above-mentioned LED fluorescent powder encapsulating structure.
Compared with prior art, the optical texture of the present invention according to LED and the performance of encapsulating material, establish optical design model, the optical texture utilizing software emulation means optimal design LED fluorescent powder layer to encapsulate, obtain the concrete radian of phosphor powder layer that lower surface is lower concave arc surface and arcwall face.The light that LED chip sends is incident in phosphor powder layer from arcwall face, the light of different incidence angles degree is by the equivalent optical path of phosphor powder layer, the blue light that LED is sent and fluorescent material the sent gold-tinted that is excited all distributes in lambert's shape, the light distribution of blue light and gold-tinted is consistent, thus emergent light is evenly distributed different angles are photochromic.Overcome Huang circle or blue circle phenomenon that traditional LED fluorescent powder encapsulating structure easily produces, also solve photochromic identical, the photochromic problem that be evenly distributed of emergent light in different angles, namely achieve the light distribution of lambert's type from the aspect of fluorescent powder packaging structure.Structure of the present invention is simple, phosphor powder layer directly can be applied and be located in carrier layer, the uniformity of coating and good reliability, is easy to produce and cost is lower.
Accompanying drawing explanation
fig. 1it is the overall structure signal of embodiments of the invention one figure;
fig. 2it is the overall structure signal of embodiments of the invention four figure;
fig. 3it is design cycle of the present invention figure;
fig. 4that in the present invention, the signal of calculation ratio juris is sent out in stepping figure;
fig. 5the phosphor powder layer optical model corresponding when the refractive index of transparent mould layer or carrier layer is identical with phosphor powder layer refractive index;
fig. 6be fig. 5the phosphor powder layer camber line corresponding to optical model;
fig. 7the phosphor powder layer optical model corresponding when the refractive index of transparent mould layer or carrier layer is different from phosphor powder layer refractive index;
fig. 8be fig. 7the phosphor powder layer arcwall face corresponding to optical model;
fig. 9embodiments of the invention five structural representations figure;
figure 10embodiments of the invention six structural representations figure.
figure 11that existing parallel construction phosphor powder layer and arc face structure phosphor powder layer of the present invention encapsulate spot center and hot spot edge du ' v ';
figure 12that existing parallel construction phosphor powder layer and arc face structure phosphor powder layer of the present invention encapsulate spot center and hot spot edge Δ CCT.
Embodiment
Below in conjunction with accompanying drawingthe specific embodiment of the present invention is described further:
Embodiment one:
Reference accompanying drawing 1shown in, a kind of photochromic uniform LED fluorescent powder encapsulating structure, comprise support 1a, LED chip 2a and phosphor powder layer 3a, described LED chip 2a is positioned at bottom described support 1a and locates; Described phosphor powder layer 3a is set up in described support 1a top, the lower surface of described phosphor powder layer 3a is recessed arcwall face, the upper surface of described phosphor powder layer 3a is the plane being parallel to LED chip 2a, the transverse width of described phosphor powder layer diameter, divided by the distance of phosphor powder layer to chip, is not more than 3.73.Also comprise carrier ( fig. 1in do not draw), described carrier is arranged on below described phosphor powder layer, and the upper surface of described carrier and the lower concave curved surface of described phosphor powder layer match and fit.
Described support 1a comprises internal diameter diminishing cavity from top to bottom, and described phosphor powder layer is set up in described cavity top, and phosphor powder layer and cavity form seal cavity, and wherein said support also can be cup-shaped, bowl-shape or other structures.
The light that described LED chip 2a sends is incident in described phosphor powder layer 3a from described arcwall face, oblique incidence light equals the light path of vertical incidence light by phosphor powder layer 3a by the light path of phosphor powder layer 3a, then forms photochromic equally distributed emergent light from the upper surface outgoing of described phosphor powder layer 3a.
That is, light that LED chip 2a sends is after having the absorption of the phosphor powder layer 3a of lower concave arc surface, scattering, and the light intensity I of emergent light is the light distribution of lambert's type relative to angle of emergence θ, namely
I＝I 0cosθ
Wherein, described I 0for the light intensity of this LED chip central axis place emergent light, described angle of emergence θ is the angle of emergent light and LED chip central axis, and described angular range is 0 °≤θ≤90 °.
Wherein, described LED chip 2a is blue chip, and described phosphor powder layer 3a is yellow fluorescence bisque; In other embodiments, the color of LED chip and fluorescent material also can be to combine other colors sending white light.
Particularly, described arcwall face is sent out algorithm steps by following stepping and is determined:
A. determine an incident ray, and determine the value of two stepping variablees further, be i.e. described angle of incident light knots modification the horizontal direction deviation angle knots modification Δ a of described phosphor powder layer;
B. with the incident ray l in step a ifor benchmark, increase off-centered angle calculate a refraction point (x on described incident ray and phosphor powder layer i, y i) tangent line t ibetween intersection point (x i+1, y i+1);
C. incident ray is calculated through point (x i+1, y i+1) after refraction through the distance of phosphor powder layer, judge whether identical with center phosphor powder layer thickness, if difference, increase tangent line t iwith the angle delta a of level, if the same record refraction point (x now i+1, y i+1) and tangent line t i+1;
D. repeat step b and c and calculate all refraction points, when calculation procedure 3, if there is total reflection, stop calculating, all refraction points obtained constitute the arcwall face of the lower surface of described phosphor powder layer.
Preferably, if the refractive index of described carrier is equal with phosphor powder layer refractive index, the lower surface of so described phosphor powder layer
Arcwall face also should meet following formula definition:
x = h t a n θ + ( d 0 + b + d 0 cosθ ′ ) tanθ ′ y = d 0 cosθ ′ s i n θ sinθ ′ = n
Wherein, described x is the emergent light eye point at described phosphor powder layer upper surface of light when penetrating described phosphor powder layer and the horizontal range of described LED chip central axis; Described y represents the phosphor powder layer thickness that described eye point place is corresponding; Incidence angle when described θ represents that light is injected into described carrier from LED chip; Described d 0the distance of light in phosphor powder layer during expression θ=0; Described h represents θ=0 time from LED chip to the distance at carrier base center; Described n is the refractive index of phosphor powder layer; Described θ ' expression light enters the refraction angle of phosphor powder layer; Described b represents the distance that carrier base center and described phosphor powder layer arcwall face bottom centre locate.
Embodiment two:
The difference of the present embodiment and embodiment one is: also comprise transparent encapsulated layer, and described encapsulated layer is filled between described phosphor powder layer and described LED chip; The upper surface of encapsulated layer and the lower concave arc surface surface of described phosphor powder layer match and fit.The resistance to overturning of LED fluorescent powder encapsulating structure is strengthened.
Other technologies feature is identical with embodiment one, and can reach identical technique effect, is not described in detail at this.
Embodiment three:
The difference of the present embodiment and embodiment one is: described carrier is transparent mold layer, and in this embodiment, mold layer is PMMA, also can be glass or quartz in other embodiments.Described mold layer is located on the downside of phosphor powder layer, and the upper surface of mold layer is recessed arcwall face, and matches with the lower concave arc surface of described phosphor powder layer; The lower surface of mold layer is plane; Described phosphor powder layer is by pouring into the mode curing molding of fluorescent glue on the arcwall face of mold layer upper surface.
Other technologies feature is identical with embodiment one or embodiment two, and can reach identical technique effect, is not described in detail at this.
Embodiment four:
Reference accompanying drawing 2shown in, a kind of photochromic uniform LED fluorescent powder encapsulating structure, comprises support 1, LED chip 2, phosphor powder layer 3 and transparent carrier layer 4.Described clear carrier layer 4 is PMMA, also can be glass or quartz.Described LED chip 2 is positioned at place of described support 1 bottom centre.Described carrier layer 4 is set up in described support 1 top, and the lower surface of described carrier layer 4 is the plane being parallel to LED chip 2, and the upper surface of described carrier layer 4 is recessed arcwall face.Described phosphor powder layer 3 is arranged at above carrier layer 4 along the lower concave arc surface joint of carrier layer 4 by spraying, blade coating, spin coating or the mode such as to stick.The upper surface of phosphor powder layer 3 is the plane being parallel to carrier layer 4 lower surface.Described in the light therethrough that described LED chip 2 sends, carrier layer 4 enters in described phosphor powder layer 3.Incident ray equals the light path of incident ray by phosphor powder layer 3 center by the light path at phosphor powder layer 3 edge, after the absorption, scattering of described phosphor powder layer 3, form photochromic equally distributed emergent light from the upper surface outgoing of described phosphor powder layer 3.Namely the color of the light of emergent light outgoing is from different perspectives identical, and that is, emergent light light intensity is the light distribution of lambert's type relative to the angle of emergence.
Particularly, described arcwall face is sent out algorithm steps by following stepping and is determined:
A. determine an incident ray, and determine the value of two stepping variablees further, be i.e. described angle of incident light knots modification the horizontal direction deviation angle knots modification Δ a of described phosphor powder layer;
B. with the incident ray l in step a ifor benchmark, increase off-centered angle calculate a refraction point (x on described incident ray and phosphor powder layer i, y i) tangent line t ibetween intersection point (x i+1, y i+1);
C. incident ray is calculated through point (x i+1, y i+1) after refraction through the distance of phosphor powder layer, judge whether identical with center phosphor powder layer thickness, if difference, increase tangent line t iwith the angle delta a of level, if the same record refraction point (x now i+1, y i+1) and tangent line t i+1;
D. repeat step b and c and calculate all refraction points, when calculation procedure 3, if there is total reflection, stop calculating, all refraction points obtained constitute the arcwall face of the lower surface of described phosphor powder layer.
Particularly, described LED chip adopts LED blue light source.The half-angle of described LED blue light source luminescence is less than or equal to 75 degree, and chromaticity evaluation is less than or equal to half-angle 75 degree.Described phosphor powder layer adopts YAG fluorescent powder.
In the present embodiment, the thickness d 0=1mm of described phosphor powder layer, phosphor powder layer is to the distance h=10mm of transparent carrier.
Below based on embodiment three or embodiment four, do to describe to the mentality of designing of the phosphor powder layer in the present invention with lower concave arc surface:
Phosphor powder layer of the prior art is parallel construction, optical simulation software TracePro is used to carry out modeling and simulation to its structure, the spot center obtained after Ray tracing, simplation verification show that the phosphor powder layer of parallel construction causes incident blue light to be less than the light path by phosphor powder layer center by light path during phosphor powder layer edge, the blue light at edge than center blue light consume many, so the blue light amount that in emergent light, edge sends is less than the blue light amount that center sends, blue light is caused not have the Light distribation of lambert's shape, and the be stimulated gold-tinted that sends of yellow fluorescent powder is the distribution of lambert's shape, the hot spot edge of formation is caused to produce yellow circle phenomenon.
The yellow phenomenon of enclosing of hot spot edge generation that the present invention is formed to solve parallel construction phosphor powder layer, utilizes step-by-step method to draw design object of the present invention: namely light is identical by the light path of phosphor powder layer from different perspectives, the reference of specific design flow process accompanying drawing 3with accompanying drawing 4shown in: from described design object, draw by changing light angle the camber line meeting target, when center angle of incident light changes time, suppose that the position of the point of camber line is than center angular deflection in the horizontal direction draw this position, calculating is prolonged whether direction is identical with center phosphor powder layer thickness to the distance at fluorescence lamp layers top, and difference then continues to increase horizontal direction angular deflection with this back and forth until find the point in error range; Identical, continuing calculating angle is time camber line position.When with when value is very little, required camber line can be obtained.
The blue light sent due to LED chip is easily subject to the impact different with position and light light path in fluorescent material of fluorescent material shape, in order to realize the photochromic effect be evenly distributed of emergent light, according to above-mentioned design cycle, set up as accompanying drawing 5shown optical model, due to phosphor powder layer and described clear carrier layer or transparent mould be laminated together after be parallel construction, therefore I ' also be θ with the angle of I, if making the light after by fluorescent material is still lambert's light, need to meet the following conditions:
d 0＝d θ
That is, the light intensity I of described emergent light relative to angle of emergence θ (light that LED chip sends enters into the shooting angle of described clear carrier layer or transparent mould) in lambertian distribution, namely
I＝I 0cosθ
The scope of described angle is 0 °≤θ≤90 °; I 0for original incident light intensity, I θfor being lambert's light light intensity of θ with its angle, I and I ' is respectively I 0with I θincident ray light intensity after carrier layer 4 with phosphor powder layer 3, described d 0represent that light is along LED chip central axial direction (i.e. θ=0) distance in phosphor powder layer, d θindicate the distance of light in phosphor powder layer when firing angle is θ.Especially, following formula group is drawn:
x = h t a n θ + ( d 0 + b + d 0 cosθ ′ ) tanθ ′ y = d 0 cosθ ′ s i n θ sinθ ′ = n
Wherein, described x is the eye point of emergent light at described phosphor powder layer upper surface and the horizontal range of described LED chip or LED chip central axis; Described y represents the phosphor powder layer thickness in the y-axis direction that horizontal level x place is corresponding; Described h represents that θ=0 time is from the distance bottom LED chip or LED chip to phosphor powder layer arcwall face; Described n is the refractive index of phosphor powder layer, and the refractive index of described clear carrier layer or described transparent mould layer is identical with the refractive index of phosphor powder layer; Described θ ' expression light enters the refraction angle of phosphor powder layer; Described b represents the distance that place of carrier layer bottom centre locates with described phosphor powder layer arcwall face bottom centre.
Carry out Matlab Program phosphor powder layer camber line according to described formula group, draw as accompanying drawing 6the camber line of concave arc surface under shown remote fluorescent powder layer.Then will accompanying drawing 6shown in the phosphor powder layer shape data corresponding to fluorescent material camber line import 3D modeling software and set up phosphor sheet model, import modeling in model to TracePro afterwards and carry out sunykatuib analysis, utilize Ray tracing method to draw the chromaticity coordinates of emergent light figure, and by changing the concentration, light intensity etc. of fluorescent material, simulate to obtain the chroma difference curve of glossing up margin and center position, final checking obtains the arcwall face structure of the phosphor powder layer of the present embodiment.
When the refractive index of described clear carrier layer or transparent mould layer is different from the refractive index of described phosphor powder layer, according to such as accompanying drawing 3shown design cycle, set up as accompanying drawing 7shown clear carrier layer 4 or the refractive index of mold layer different from phosphor powder layer 3 refractive index when optical model, and use matlab to programme as follows, draw as Fig. 8the camber line of concave arc surface under shown remote fluorescent powder layer.Then will accompanying drawing 8shown in the phosphor powder layer shape data corresponding to fluorescent material camber line import 3D modeling software and set up phosphor sheet model, import modeling in model to TracePro afterwards and carry out sunykatuib analysis, utilize Ray tracing method to draw the chromaticity coordinates of emergent light figure, and by changing the concentration, light intensity etc. of fluorescent material, simulate to obtain the chroma difference curve of glossing up margin and center position, final checking obtains the arcwall face structure of the phosphor powder layer of the present embodiment.
Embodiment five:
Reference accompanying drawing 9shown in, the difference of the present embodiment and embodiment one is: described LED chip 2a periphery is covered with colloidal silica 5a, and described colloidal silica 5a is for the protection of LED chip 2a.
Other technologies feature is identical with embodiment one, and can reach identical technique effect, is not described in detail at this.
Embodiment six:
Reference accompanying drawing 10shown in, the difference of the present embodiment and embodiment four is: described LED chip 2 periphery is covered with colloidal silica 5, and described colloidal silica 5 is for the protection of LED chip 2.
Other technologies feature is identical with embodiment four, and can reach identical technique effect, is not described in detail at this.
Embodiment seven:
The difference of the present embodiment and embodiment three is: described LED chip is covered with the colloidal silica for the protection of LED chip.
Other technologies feature is identical with embodiment three, and can reach identical technique effect, is not described in detail at this.
The shape of the colloidal silica described in embodiment six to seven can be semicircle, square, rectangle or other shapes.
The calculating of Marching algorithm step is adopted to be all after realizing step-by-step method programming by matlab in above embodiment one to seven, generate two fluorescent material arcwall faces by the refractive index input program of model parameter and two kinds of situations, then use Tracepro7.0 to carry out modeling and simulation.Analog result as table 1, table 2, table 3, table 4shown in.
And contrast parallel construction fluorescent powder packaging in prior art and the spot center of arcuate structure fluorescent powder packaging that gone out by program calculation and the du ' v ' at hot spot edge and Δ CCT as Figure 11, figure 12shown in.
table 1scheme (1) phosphor structure spot center and edge color coordinate and duv
Table3Centerandedgecolorcoordinatesandduvwithremotephosphorstructurecase(1)
table 2scheme (1) phosphor structure spot center and edge colour temperature and Δ CCT
Table4CenterandedgecolortemperatureandΔCCTwithremotephosphorstructurecase(1)
table 3scheme (2) phosphor structure spot center and edge color coordinate and du ' v '
Table5Centerandedgecolorcoordinatesanddu’v’withremotephosphorstructurecase(2)
table 4scheme (2) phosphor structure spot center and edge colour temperature and Δ CCT
Table6CenterandedgecolortemperatureandΔCCTwithremotephosphorstructurecase(2)
From figure 11with figure 12in can find out, adopt phosphor powder layer encapsulating structure of the present invention obviously to improve than the color coordinate drift of parallel construction and color temperature difference.Embodiment one is to the color coordinate drift du ' v ' of arcwall face structure relative to parallel construction designed by embodiment seven and the degree of optimization of color temperature shift as table 5with table 6shown in.Compare parallel construction, under different-colour, the chromaticity coordinates drift degree improvement degree of space aberration du ' v ' can reach 5 times in high color temperature part, and the aberration of 75 degree of positions can control about 0.01.
table 5arcuate structure design is relative to the degree of optimization of the color coordinate drift of parallel construction
Table7Arcstructuredesignschemesontheparallelstructurecolorcoordinateoffsetdegreeofoptimization
table 6arcuate structure design is relative to the degree of optimization of the colour temperature deviation of parallel construction
Table8Arcstructuredesignschemesontheparallelstructureoptimizationofcolortemperaturedeviationdegree
As can be seen here, the method suitably optimized by fluorescent material thickness curve, significantly can promote chromatic aberration performance, and can be completely compatible with traditional remote fluorescent powder coating processes, and industrial production realizes simple, and extra cost is little, has stronger actual application value.
The fluorescent powder packaging of existing parallel construction, the fluorescent material light path passed through due to each different exit direction light is different, causes the absorbed blue light in edge more, and therefore hot spot produces yellow circle phenomenon.The present invention, according to nonimaging optics method for designing, devises the phosphor powder layer making optical surface that blue light light path is equal everywhere by the design concept of stepping.This curved surface be only change should layering the plane of incidence realize, the lower surface arcwall face of design phosphor powder layer makes the light that sends from point-source of light identical by the light path of phosphor powder layer, decrease the ratio that edge blue light is absorbed by fluorescent material, promote the uniformity of chromaticity of hot spot.
The present invention devises the phosphor powder layer optical texture under transparent carrier material that is equal with phosphor powder layer refractive index and two kinds of refraction materials such as not respectively, from analog result, colour temperature deviation 75 degree of angle positions does not reduce 43%-98% not etc., chromaticity coordinates du ' v ' offsets and does not reduce 43%-71% not etc., effectively improves the uniformity of chromaticity that white light LEDs long-distance fluorescent powder encapsulating structure produces hot spot.And do not need to change original technique or adopt more Alternative means for packaging technology, industrial production realizes simple, and extra cost is little, has stronger actual application value.
For a transparent mould for LED fluorescent powder encapsulating structure, comprise the lower surface of plane and the upper surface of lower arcs of recesses.
When described transparent mould is for encapsulating the phosphor structure identical with its refractive index, the upper surface of described mould is consistent with the lower surface of the phosphor powder layer of above-mentioned LED fluorescent powder encapsulating structure.Its curved upper surface and describedly to be defined by following formula:
x = h t a n θ + ( d 0 + b + d 0 cosθ ′ ) tanθ ′ y = d 0 cosθ ′ s i n θ sinθ ′ = n
Wherein, described x is the eye point of emergent light at described phosphor powder layer upper surface and the horizontal range of described LED chip central axis; Described y represents the phosphor powder layer thickness that described eye point place is corresponding; Described d 0the distance of light in phosphor powder layer during expression θ=0; Described h represents θ=0 time from LED chip to the distance of described transparent mould bottom centre; Described n is the refractive index of phosphor powder layer; Described θ ' expression light enters the refraction angle of phosphor powder layer; Described b represents the distance that place of transparent mould layer bottom centre locates with described phosphor powder layer arcwall face bottom centre.
The announcement of book and instruction according to the above description, those skilled in the art in the invention can also change above-mentioned execution mode and revise.Therefore, the present invention is not limited to embodiment disclosed and described above, also should fall in the protection range of the claims in the present invention modifications and changes more of the present invention.In addition, although employ some specific terms in this specification, these terms just for convenience of description, do not form any restriction to the present invention.

Claims (10)

1. a photochromic uniform LED fluorescent powder encapsulating structure, comprise support, LED chip and phosphor powder layer, it is characterized in that, described LED chip is in described frame bottom; Described phosphor powder layer is located at described cradle top, and the lower surface of described phosphor powder layer is recessed arcwall face, and the upper surface of described phosphor powder layer is plane;
The light that described LED chip sends is incident in described phosphor powder layer from described arcwall face, and penetrates from phosphor powder layer upper surface; Oblique incidence light equals the light path of vertical incidence light by phosphor powder layer by the light path of phosphor powder layer.
2. a photochromic uniform LED fluorescent powder encapsulating structure, comprises support, LED chip and phosphor powder layer, it is characterized in that, described LED chip is in described frame bottom center; Described phosphor powder layer is located at described cradle top, and the lower surface of described phosphor powder layer is recessed arcwall face, and the minimum point of described arcwall face is positioned at the top of LED chip, and the upper surface of described phosphor powder layer is plane;
The light that described LED chip sends is incident in described phosphor powder layer from described arcwall face, and the central ray that LED chip sends equals the light path of its marginal ray by phosphor powder layer by the light path of phosphor powder layer.
3. LED fluorescent powder encapsulating structure according to claim 1 and 2, is characterized in that, also comprise carrier, and described carrier is arranged on below described phosphor powder layer, and the upper surface of described carrier and the lower concave curved surface of described phosphor powder layer match and fit; Described carrier is transparent mold layer, and described mold layer is located on the downside of phosphor powder layer; The upper surface of described mold layer is recessed arcwall face, and the lower concave arc surface of itself and described phosphor powder layer matches; The lower surface of described mold layer is plane; Described phosphor powder layer is by pouring into the mode curing molding of fluorescent glue on the arcwall face of mold layer upper surface.
4. LED fluorescent powder encapsulating structure according to claim 3, is characterized in that, described arcwall face is determined by the following method:
A. determine an incident ray, and determine the value of two stepping variablees further, namely determine described angle of incident light knots modification the horizontal direction deviation angle knots modification Δ a of described phosphor powder layer;
B. with the incident ray l in step a ifor benchmark, increase off-centered angle calculate a refraction point (x on described incident ray and phosphor powder layer i, y i) tangent line t ibetween intersection point (x i+1, y i+1);
C. incident ray is calculated through point (x i+1, y i+1) after refraction through the distance of phosphor powder layer, judge whether identical with center phosphor powder layer thickness, if difference, increase tangent line t iwith the angle delta a of level, if the same record refraction point (x now i+1, y i+1) and tangent line t i+1;
D. repeat step b and c and calculate all refraction points, as calculation procedure c, if there is total reflection, stop calculating, all refraction points obtained constitute the arcwall face of the lower surface of described phosphor powder layer.
5. LED fluorescent powder encapsulating structure according to claim 3, is characterized in that, when the refractive index of described carrier is equal with phosphor powder layer refractive index, described arcwall face should meet the definition of following formula:
X = h t a n θ + ( d 0 + b + d 0 cosθ ′ ) t a n θ y = d 0 cosθ ′ s i n θ sinθ ′ = n
Wherein, described x is the emergent light eye point at described phosphor powder layer upper surface of light when penetrating described phosphor powder layer and the horizontal range of described LED chip central axis; Described y represents the phosphor powder layer thickness that described eye point place is corresponding; Incidence angle when described θ represents that light is injected into described carrier from LED chip; Described d 0the distance of light in phosphor powder layer during expression θ=0; Described h represents θ=0 time from LED chip to the distance at carrier base center; Described n is the refractive index of phosphor powder layer; Described θ ' expression light enters the refraction angle of phosphor powder layer; Described b represents the distance that carrier base center and described phosphor powder layer arcwall face bottom centre locate.
6. LED fluorescent powder encapsulating structure according to claim 1 and 2, is characterized in that, also comprises transparent encapsulated layer, and described encapsulated layer is filled between described phosphor powder layer and described LED chip; The upper surface of encapsulated layer and the lower concave curved surface of described phosphor powder layer match and fit.
7. LED fluorescent powder encapsulating structure according to claim 3, is characterized in that, described carrier is transparent carrier layer, and described carrier layer is located at described frame upper; The upper surface of described carrier layer and the lower concave curved surface of described phosphor powder layer match and fit, and the lower surface of described carrier layer is plane; Described phosphor powder layer is fixed on carrier layer upper surface by the mode of coating, thermosetting or bonding.
8. the LED fluorescent powder encapsulating structure according to claim 6 or 7, is characterized in that, also comprises the colloidal silica being coated on described LED chip periphery, and described colloidal silica is filled in mold layer or between carrier layer and LED chip.
9. LED fluorescent powder encapsulating structure according to claim 1 and 2, is characterized in that, the transverse width of described phosphor powder layer diameter, divided by the distance of phosphor powder layer to chip, is not more than 3.73.
10. the transparent mould for LED fluorescent powder encapsulating structure, it is characterized in that, comprise die ontology, described die ontology comprises the lower surface of plane and the upper surface of lower arcs of recesses, and the upper surface of described die ontology is consistent with the lower surface of the phosphor powder layer of the LED fluorescent powder encapsulating structure described in any one of claim 1 to 9.
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