CN102867899B - Light emitting diode packaging module - Google Patents
Light emitting diode packaging module Download PDFInfo
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- CN102867899B CN102867899B CN201110184666.3A CN201110184666A CN102867899B CN 102867899 B CN102867899 B CN 102867899B CN 201110184666 A CN201110184666 A CN 201110184666A CN 102867899 B CN102867899 B CN 102867899B
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Abstract
A light emitting diode packaging module comprises a support, a light emitting diode chip, fluorescent powder adhesives, a packaging adhesive body and a packaging lens. The bottom of the light emitting diode chip is welded at the center of the support, and the fluorescent powder adhesives are dispensed and coated on the upper surface of the light emitting diode chip to form a fluorescent powder adhesive layer. The light emitting diode packaging module is characterized in that the packaging lens is mounted on the light emitting diode chip, the packaging adhesive body is filled between the packaging lens and the fluorescent powder adhesive layer, a light exiting surface of the packaging lens is a non-continuous curved surface, the non-continuous curved surface on the packaging lens comprises a top curved surface and a side wall curved surface, and the inner wall of the packaging lens is a hemispherical light entering surface. The light emitting diode packaging module has the advantages that a traditional packaging method is changed, the packaging lens with the light exiting surface comprising the two curved surfaces is used for directly packaging the LED chip, unevenness of a light source of the LED chip is improved by mixing light, and space color evenness of the white LED packaging module is enhanced.
Description
Technical field
The present invention relates to a kind of LED source, particularly a kind of LED encapsulation module that can realize high spatial color homogeneity.
Background technology
LED lens can be divided into lens and secondary lens application point.Lens are directly used in and are encapsulated on LED chip support, while protect IC, also ensure light extraction efficiency.Secondary lens for by light refraction to preset objective plane, the light distribution, color temperature distribution etc. of whole LED are designed, to meet different application requirements.
LED chip is one block of very little solid, and its two electrodes will just can be seen under the microscope, and after adding electric current, it just can be luminous.In manufacture craft; except welding two of a chip electrode; thus outside extraction positive and negative electrode; also to protect chip and two electrodes simultaneously; so need a lens packages; and pour into silica gel at lens and chip chamber, both deriving visible ray efficiently, is also well protect chip.Traditional lens are hemispherical lenss, and lens exiting surface is hemisphere curved surface, and the curved surface center of circle is at LED chip center, so light extraction efficiency is high, lens are also easy to make.But because the fluorescent material coating method that traditional white light LEDs uses is gravity flow die coating method, namely the direct mixture by fluorescent material and colloid sprays to LED chip surface, allow phosphor gel flow freely, until the surface of colloid reaches balance, be then heating and curing.Gravity flow die coating method has its advantage: spot gluing equipment and technique simply, general pneumatic spot gluing equipment; But this fluorescent material painting method, due to it, exciting light is different everywhere, often easily yellow light ring is formed for the luminous relatively many horizontal electrode LED chips in side, and yellow light ring be there will be equally for positive luminous more vertical electrode LED chip, the good white light LEDs of color quality cannot be obtained.
Improve quality of lighting, a lot of company improves from fluorescent powder coating technique.Lumileds company proposes the fluorescent material coating method of shape-preserving coating, and it covers the consistent fluorescent material thin layer of a layer thickness at the chip surface of falling stake, improves photochromic stability and the uniformity of white light LEDs; Shape-preserving coating can be realized by electrophoresis technique, also can be realized by solution-evaporation.No matter which kind of mode realizes, and all can have complex process, realize difficulty, control overflow is high, high in cost of production drawback, and because the near field exciting method that fluorescent material contacts with chip adds the backscattering loss of exciting light, reduce the light efficiency of white light LEDs.In addition, also someone proposes a kind of far field excitation mode, and phosphor powder layer can be reduced the absorption of LED chip to fluorescent material rear orientation light away from chip, and larger distance also can improve the colour stability of fluorescent material simultaneously.The color space uniformity that diffusant or dispersive medium also can improve white light LEDs is introduced in LED chip package module.But diffusant can affect the light efficiency of LED module, the color space uniformity and light efficiency can not be taken into account simultaneously.
No matter be study novel fluorescent material coating method, still mix nano particle, relative to current situation, LED module, or cost can increase much, or light efficiency reduces, and is unfavorable for the marketization.
Summary of the invention
Object of the present invention is for the defect existed in prior art, and the color space caused for traditional fluorescent material coating method " gravity flow die coating method " is uneven, provides a kind of LED encapsulation module.The present invention includes: support, light-emitting diode chip for backlight unit, phosphor gel, packing colloid and package lens, light-emitting diode chip for backlight unit bottom welding is heart place in the bracket, the upper surface point glue coating phosphor gel of light-emitting diode chip for backlight unit forms fluorescent material glue-line, it is characterized in that described package lens is arranged on light-emitting diode chip for backlight unit, packing colloid is filled with between package lens and fluorescent material glue-line, the exiting surface of package lens is discontinuous surfaces, discontinuous surfaces in package lens is made up of top curve surface and sidewall curved surface two continuous curve surfaces, the inwall of package lens is hemisphere incidence surface.
Support is high power LED support, chip heat can be derived, and all material is by 260 DEG C of reflow solderings, and scolding tin in light-emitting diode chip for backlight unit base point, is welded on carriage center place.
The top curve surface of package lens and sidewall curved surface are free form surface or sphere, two curved surfaces control beam exit direction respectively, to obtain the light energy distribution of different lighting demand, comprise and improve the color space uniformity or obtain equiluminous illumination, but be not limited to above two kinds of Energy distribution.When the top curve surface of package lens and sidewall curved surface are sphere, the centre of sphere of its sphere is positioned on rotation axes of symmetry.
The principle of fluorescent powder type white light LEDs is that a blue light part that chip sends is absorbed by yellow fluorescent powder and gives off gold-tinted again, and another part blue light mixes in space with reradiative gold-tinted and just defines white light.And the distribution of blue light that the die coating method that flows automatically easily causes chip to send distributes with the gold-tinted that fluorescent material sends and does not mate, the white light color that such mixing produces is just uneven, even may because wide-angle place gold-tinted be too much, still present yellow after yellow blue light, namely there is yellow light ring at so-called hot spot edge.In order to improve the quality of lighting of white light LEDs, intermediate rays by the zone line of the light refraction of wide-angle to objective plane, can be refracted to wide-angle place, realize mixed light by the LED using package lens of the present invention to encapsulate.Lens exiting surface is made up of two curved surfaces, top curve surface and sidewall curved surface, by deflection of light to the field of illumination of presetting, can have higher control compared to traditional hemispherical lens.Top curve surface can by original radiation at the light refraction of zone line to wide-angle place, high angle scattered light is refracted to zone line by side wall surface, and after such mixed light, light quality can improve a lot, control the target area of light radiation simultaneously, also easily realize equiluminous illumination.
Package lens of the present invention is rotationally symmetric body, and its rotation axes of symmetry is overlapping with the center line of lens.Its light extraction efficiency is high, is about 95% of conventional hemispherical lens, and from system, eliminate a part of secondary optical design, so load the LED information display system of these lens, efficiency increases on the contrary on the whole.The angle of divergence or the radius that change top curve surface and sidewall curved surface (when being free form surface, change the angle of divergence; When being sphere, change radius), the effect of mixed light is just different.The intersection of top curve surface and sidewall curved surface and the angle of vertical direction also alterable.Lens material is organic or inorganic material 300nm ~ 800nm wavelength light to high transmission rate, comprise polymetylmethacrylate or PC Merlon or glass or epoxy resin or silica gel, but be not limited to above-mentioned different materials, ranges of indices of refraction is 1.3 ~ 2.5.
Advantage of the present invention changes traditional method for packing, the package lens forming light-emitting area by two curved surfaces is adopted directly to encapsulate LED chip, improved the unevenness of LED chip light source by light mixing, improve the spatial color uniformity of white-light LED encapsulation module.
Accompanying drawing explanation
The package lens structural representation of Fig. 1 embodiment one;
The package lens perspective view of Fig. 2 embodiment one;
The package lens structural representation of Fig. 3 embodiment two;
The package lens perspective view of Fig. 4 embodiment two;
The package lens structural representation of Fig. 5 embodiment three;
The package lens perspective view of Fig. 6 embodiment three;
The package lens sectional structure schematic diagram of Fig. 7 embodiment one.
In figure: the free form surface of 1 indent, 2 free form surfaces, 3 hemisphere incidence surfaces, 4 spheres, 5 free form surfaces, 6 spheres, 7 spheres, 8 package lens, 9 blue-light LED chips, the 10 fluorescent material glue-lines applied from flow point glue, 11 silica gel, the 12 support schematic diagrames encapsulated.
Embodiment
Embodiment one
Embodiments of the invention are further illustrated below in conjunction with accompanying drawing:
See Fig. 1, Fig. 2, Fig. 7, the light-emitting diode chip for backlight unit of the present embodiment is blue-light LED chip 9, the upper surface of blue-ray LED light-emitting diode chip for backlight unit 9 is the fluorescent material glue-line 10 applied from flow point glue, the top curve surface of the present embodiment package lens 8 is the free form surface 1 of indent, sidewall curved surface is also free form surface 2, package lens 8 is arranged on blue-ray LED light-emitting diode chip for backlight unit 9, the inwall of package lens 8 is hemisphere incidence surface 3, package lens 8 is rotationally symmetric body, i.e. round symmetric lens, its rotation axes of symmetry is overlapping with the center line of lens.The silica gel 11 of encapsulation is filled with between package lens 8 and the fluorescent material glue-line 10 applied from flow point glue.The material of package lens 8 is PMMA polymethyl methacrylate materials 300nm ~ 800nm wavelength light to high transmission rate, and ranges of indices of refraction is 1.3 ~ 2.5.
Embodiment two
Embodiment two is identical with embodiment one, and the sphere 4 of difference is the top curve surface of package lens 8 to be radius be 20mm, sidewall curved surface is free form surface 5, and the centre of sphere of the top sphere 4 of package lens 8 is positioned on rotation axes of symmetry, see Fig. 3, Fig. 4.
Embodiment three
Embodiment three is identical with embodiment one, the sphere 6 of difference is the top curve surface of package lens 8 to be radius be 4mm, sidewall curved surface is the sphere 7 of radius 8mm, and the top sphere 6 of package lens 8 and the centre of sphere of sidewall sphere 7 are positioned on rotation axes of symmetry, see Fig. 5, Fig. 6.
Claims (2)
1. a LED encapsulation module, comprise: support, light-emitting diode chip for backlight unit, phosphor gel, packing colloid and package lens, light-emitting diode chip for backlight unit bottom welding is heart place in the bracket, the upper surface point glue coating phosphor gel of light-emitting diode chip for backlight unit forms fluorescent material glue-line, described package lens is arranged on light-emitting diode chip for backlight unit, packing colloid is filled with between package lens and fluorescent material glue-line, it is characterized in that the exiting surface of described package lens is discontinuous surfaces, discontinuous surfaces in package lens is made up of top curve surface and sidewall curved surface two continuous curve surfaces, two curved surfaces control beam exit direction respectively, described package lens is rotationally symmetric body, its rotation axes of symmetry is overlapping with the center line of lens, the inwall of package lens is hemisphere incidence surface.
2. LED encapsulation module according to claim 1, it is characterized in that the top curve surface of described package lens and sidewall curved surface are sphere, the centre of sphere of its sphere is positioned on rotation axes of symmetry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110184666.3A CN102867899B (en) | 2011-07-04 | 2011-07-04 | Light emitting diode packaging module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201110184666.3A CN102867899B (en) | 2011-07-04 | 2011-07-04 | Light emitting diode packaging module |
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| Publication Number | Publication Date |
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| CN102867899A CN102867899A (en) | 2013-01-09 |
| CN102867899B true CN102867899B (en) | 2015-07-08 |
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| CN201110184666.3A Active CN102867899B (en) | 2011-07-04 | 2011-07-04 | Light emitting diode packaging module |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107170734A (en) * | 2017-06-06 | 2017-09-15 | 南昌大学 | The LED encapsulation structure and its method for packing of a kind of direct chip on board |
| CN108807359A (en) * | 2018-07-26 | 2018-11-13 | 中山市光圣半导体科技有限责任公司 | A kind of LED component and manufacturing method |
| CN112467009A (en) * | 2020-11-13 | 2021-03-09 | 中山市仟选照明科技有限公司 | Novel full-light-transmission LED processing technology |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201527988U (en) * | 2009-02-13 | 2010-07-14 | 广东昭信光电科技有限公司 | Encapsulation structure applied on a guide type light-emitting diode device |
| CN201568890U (en) * | 2009-11-12 | 2010-09-01 | 上海彩煌光电科技有限公司 | Lens of LED light source with free curve surface |
| CN202134573U (en) * | 2011-07-04 | 2012-02-01 | 刘胜 | Light emitting diode packaging module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100649765B1 (en) * | 2005-12-21 | 2006-11-27 | 삼성전기주식회사 | Led package and back light unit using the same |
| US8136967B2 (en) * | 2008-03-02 | 2012-03-20 | Lumenetix, Inc. | LED optical lens |
| CN102042515B (en) * | 2009-10-15 | 2013-12-25 | 富准精密工业(深圳)有限公司 | Light emitting diode module |
| CN101702424A (en) * | 2009-10-23 | 2010-05-05 | 广东昭信光电科技有限公司 | LED encapsulation structure with functions of integrated light distribution and heat dissipation |
| CN101950788A (en) * | 2010-08-13 | 2011-01-19 | 重庆大学 | Power type white LED based on fluorescence lens |
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2011
- 2011-07-04 CN CN201110184666.3A patent/CN102867899B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201527988U (en) * | 2009-02-13 | 2010-07-14 | 广东昭信光电科技有限公司 | Encapsulation structure applied on a guide type light-emitting diode device |
| CN201568890U (en) * | 2009-11-12 | 2010-09-01 | 上海彩煌光电科技有限公司 | Lens of LED light source with free curve surface |
| CN202134573U (en) * | 2011-07-04 | 2012-02-01 | 刘胜 | Light emitting diode packaging module |
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