CN102867899A - Light emitting diode packaging module - Google Patents
Light emitting diode packaging module Download PDFInfo
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- CN102867899A CN102867899A CN2011101846663A CN201110184666A CN102867899A CN 102867899 A CN102867899 A CN 102867899A CN 2011101846663 A CN2011101846663 A CN 2011101846663A CN 201110184666 A CN201110184666 A CN 201110184666A CN 102867899 A CN102867899 A CN 102867899A
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Abstract
A light emitting diode packaging module comprises a support, a light emitting diode chip, fluorescent powder adhesives, a packaging adhesive body and a packaging lens. The bottom of the light emitting diode chip is welded at the center of the support, and the fluorescent powder adhesives are dispensed and coated on the upper surface of the light emitting diode chip to form a fluorescent powder adhesive layer. The light emitting diode packaging module is characterized in that the packaging lens is mounted on the light emitting diode chip, the packaging adhesive body is filled between the packaging lens and the fluorescent powder adhesive layer, a light exiting surface of the packaging lens is a non-continuous curved surface, the non-continuous curved surface on the packaging lens comprises a top curved surface and a side wall curved surface, and the inner wall of the packaging lens is a hemispherical light entering surface. The light emitting diode packaging module has the advantages that a traditional packaging method is changed, the packaging lens with the light exiting surface comprising the two curved surfaces is used for directly packaging the LED chip, unevenness of a light source of the LED chip is improved by mixing light, and space color evenness of the white LED packaging module is enhanced.
Description
Technical field
The present invention relates to a kind of LED source, particularly a kind of LED encapsulation module that can realize the high spatial color homogeneity.
Background technology
The LED lens can be divided into lens and secondary lens on the application point.Lens are directly used in and are encapsulated on the led chip support, when protecting chip, also guarantee light extraction efficiency.Secondary lens is used for light refraction to default objective plane, the light distribution of whole LED lamp, color temperature distribution etc. is designed, to satisfy different application requirements.
Led chip is a very little solid, and its two electrodes will just can see at microscopically, add electric current after it just can be luminous.On manufacture craft; except will two electrodes of chip being welded; thereby draw outside the positive and negative electrode; also to protect chip and two electrodes simultaneously; so need a lens packages; and pour into silica gel at lens and chip chamber, and both derived efficiently visible light, also be that chip is well protected.Traditional lens are hemispherical lenss, and the lens exiting surface is the hemisphere curved surface, and the curved surface center of circle is at the led chip center, so light extraction efficiency is high, lens also are easy to make.Yet because traditional employed fluorescent material coating method of white light LEDs is the gravity flow die coating method, namely direct mixture with fluorescent material and colloid sprays to the led chip surface, allow phosphor gel flow freely, until the surface of colloid reaches balance, then be heating and curing.The gravity flow die coating method has its advantage: spot gluing equipment and technique are simple, and general pneumatic spot gluing equipment gets final product; But this fluorescent material painting method, because exciting light is different everywhere for they, often easily form yellow light ring for the luminous relatively many horizontal electrode led chips of side, and yellow light ring can appear equally for just luminous more vertical electrode led chip, can't obtain preferably white light LEDs of color quality.
Improve quality of lighting, a lot of companies improve from fluorescent powder coating technique.Lumileds company has proposed the fluorescent material coating method of shape-preserving coating, and it is falling the consistent fluorescent material thin layer of stake chip surface covering a layer thickness, has improved photochromic stability and the uniformity of white light LEDs; Can realize shape-preserving coating by electrophoresis technique, also can realize by the solution evaporation.No matter which kind of mode realizes, complex process all can be arranged, realize that difficult, control requires high, high in cost of production drawback, and because the near field exciting method that fluorescent material contacts with chip has increased the backscattering loss of exciting light, reduce the light efficiency of white light LEDs.In addition, also someone proposes a kind of far field excitation mode, and phosphor powder layer can be reduced led chip to the absorption of fluorescent material rear orientation light away from chip, and larger distance also can be improved the colour stability of fluorescent material simultaneously.In the led chip package module, introduce the color space uniformity that diffusant or dispersive medium also can improve white light LEDs.But diffusant can affect the light efficiency of LED package module, can not take into account simultaneously the color space uniformity and light efficiency.
No matter be the novel fluorescent material coating method of research, still mix nano particle, with respect to present situation, the LED package module, perhaps cost can increase much, and perhaps light efficiency reduces, and is unfavorable for the marketization.
Summary of the invention
Purpose of the present invention is for the defective that exists in the prior art, and is inhomogeneous for the color space that traditional fluorescent material coating method " gravity flow die coating method " causes, and a kind of LED encapsulation module is provided.The present invention includes: support, light-emitting diode chip for backlight unit, phosphor gel, packing colloid and package lens, the light-emitting diode chip for backlight unit bottom welding is at the carriage center place, the upper surface point glue of light-emitting diode chip for backlight unit applies phosphor gel and forms the fluorescent material glue-line, it is characterized in that described package lens is installed on the light-emitting diode chip for backlight unit, be filled with packing colloid between package lens and the fluorescent material glue-line, the exiting surface of package lens is discontinuous surfaces, discontinuous surfaces on the package lens is comprised of top curve surface and two continuous curve surfaces of sidewall curved surface, and the inwall of package lens is the hemisphere incidence surface.
Support is the high power LED support, chip heat can be derived, and all material can pass through 260 ℃ of reflow solderings, and scolding tin on the light-emitting diode chip for backlight unit base point is welded on the carriage center place.
The top curve surface of package lens and sidewall curved surface are free form surface or sphere, two curved surfaces are controlled respectively the light beam exit direction, to obtain the light energy distribution of different lighting demands, comprise and improve the color space uniformity or obtain the equiluminous illumination, but be not limited to above two kinds of Energy distribution.When the top curve surface of package lens and sidewall curved surface were sphere, the centre of sphere of its sphere was positioned on the rotation axes of symmetry.
The principle of fluorescent powder type white light LEDs is that a blue light part that chip sends is absorbed by yellow fluorescent powder and gives off gold-tinted again, and another part blue light mixes in the space with reradiative gold-tinted and just formed white light.And the gold-tinted that blue light distributes and fluorescent material the sends distribution that the gravity flow die coating method easily causes chip to send is not mated, mix like this white light color relation that produces inhomogeneous, even may be because wide-angle place gold-tinted be too much, still present yellow after champac light mixes, namely there is yellow light ring at so-called hot spot edge.In order to improve the quality of lighting of white light LEDs, use the LED of package lens of the present invention encapsulation with the light refraction of the wide-angle zone line to objective plane, intermediate rays to be refracted to the wide-angle place, the realization mixed light.The lens exiting surface is made of two curved surfaces, and top curve surface and sidewall curved surface can with deflection of light to default field of illumination, have higher control than traditional hemispherical lens.Top curve surface can arrive the wide-angle place at the light refraction of zone line with original radiation, side wall surface is refracted to zone line with high angle scattered light, and behind the mixed light, light quality can improve a lot like this, control simultaneously the target area of light radiation, also easily realize the equiluminous illumination.
Package lens of the present invention is rotationally symmetric body, and the center line of its rotation axes of symmetry and lens is overlapping.Its light extraction efficiency is high, for about 95% of traditional hemispherical lens, on system, has omitted a part of secondary optical design, so load the LED system of these lens, efficient increases on the contrary on the whole.The angle of divergence or the radius that change top curve surface and sidewall curved surface (when being free form surface, change the angle of divergence; When being sphere, change radius), the effect of mixed light is just different.The intersection of top curve surface and sidewall curved surface and the angle of vertical direction also can change.Lens material is for having the organic or inorganic material of high transmission rate to 300nm～800nm wavelength light, comprise polymetylmethacrylate or PC Merlon or glass or epoxy resin or silica gel, but be not limited to above-mentioned different materials, ranges of indices of refraction is 1.3～2.5.
Advantage of the present invention is to change traditional method for packing, employing is directly encapsulated led chip by the package lens that two curved surfaces consist of light-emitting area, mix the unevenness of improving the led chip light source by light, improve the spatial color uniformity of white-light LED encapsulation module.
Description of drawings
The package lens structural representation of Fig. 1 embodiment one;
The package lens perspective view of Fig. 2 embodiment one;
The package lens structural representation of Fig. 3 embodiment two;
The package lens perspective view of Fig. 4 embodiment two;
The package lens structural representation of Fig. 5 embodiment three;
The package lens perspective view of Fig. 6 embodiment three;
The package lens sectional structure schematic diagram of Fig. 7 embodiment one.
Among the figure: silica gel, the 12 support schematic diagrames of the free form surface of 1 indent, 2 free form surfaces, 3 hemisphere incidence surfaces, 4 spheres, 5 free form surfaces, 6 spheres, 7 spheres, 8 package lens, 9 blue-light LED chips, the 10 fluorescent material glue-lines from the coating of flow point glue, 11 encapsulation.
Embodiment
Embodiment one
Further specify embodiments of the invention below in conjunction with accompanying drawing:
Referring to Fig. 1, Fig. 2, Fig. 7, the light-emitting diode chip for backlight unit of the present embodiment is the fluorescent material glue-line 10 of upper surface for applying from flow point glue of blue-light LED chip 9, blue-ray LED light-emitting diode chip for backlight unit 9, the top curve surface of the present embodiment package lens 8 is the free form surface 1 of indent, the sidewall curved surface also is free form surface 2, package lens 8 is installed on the blue-ray LED light-emitting diode chip for backlight unit 9, the inwall of package lens 8 is hemisphere incidence surface 3, package lens 8 is rotationally symmetric body, namely justify symmetric lens, the center line of its rotation axes of symmetry and lens is overlapping.Package lens 8 and between the fluorescent material glue-line 10 that flow point glue applies, be filled with the silica gel 11 of encapsulation.The material of package lens 8 is for having the PMMA polymethyl methacrylate materials of high transmission rate to 300nm～800nm wavelength light, ranges of indices of refraction is 1.3～2.5.
Embodiment two
Embodiment two is identical with embodiment one, and difference is that the top curve surface of package lens 8 is that radius is the sphere 4 of 20mm, and the sidewall curved surface is free form surface 5, and the centre of sphere of the top sphere 4 of package lens 8 is positioned on the rotation axes of symmetry, referring to Fig. 3, Fig. 4.
Embodiment three
Embodiment three is identical with embodiment one, difference is that the top curve surface of package lens 8 is that radius is the sphere 6 of 4mm, the sidewall curved surface is the sphere 7 of radius 8mm, and the top sphere 6 of package lens 8 and the centre of sphere of sidewall sphere 7 are positioned on the rotation axes of symmetry, referring to Fig. 5, Fig. 6.
Claims (6)
1. LED encapsulation module, comprise: support, light-emitting diode chip for backlight unit, phosphor gel, packing colloid and package lens, the light-emitting diode chip for backlight unit bottom welding is at the carriage center place, the upper surface point glue of light-emitting diode chip for backlight unit applies phosphor gel and forms the fluorescent material glue-line, it is characterized in that described package lens is installed on the light-emitting diode chip for backlight unit, be filled with packing colloid between package lens and the fluorescent material glue-line, the exiting surface of package lens is discontinuous surfaces, discontinuous surfaces on the package lens is comprised of top curve surface and two continuous curve surfaces of sidewall curved surface, and the inwall of package lens is the hemisphere incidence surface.
2. LED encapsulation module according to claim 1, the top curve surface that it is characterized in that described package lens is free form surface or sphere.
3. LED encapsulation module according to claim 1, the sidewall curved surface that it is characterized in that described package lens is free form surface or sphere, two curved surfaces are controlled respectively the light beam exit direction.
4. LED encapsulation module according to claim 1 is characterized in that described package lens is rotationally symmetric body, and the center line of its rotation axes of symmetry and lens is overlapping.
5. LED encapsulation module according to claim 1 and 2 is characterized in that the top curve surface of described package lens and sidewall curved surface are sphere, and the centre of sphere of its sphere is positioned on the rotation axes of symmetry.
6. LED encapsulation module according to claim 1, it is characterized in that the material of described package lens is for having the organic or inorganic material of high transmission rate to 300nm～800nm wavelength light, comprise PMMA polymethyl methacrylate or PC Merlon or glass or epoxy resin or silica gel, the Refractive Index of Material scope is 1.3～2.5.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110184666.3A CN102867899B (en) | 2011-07-04 | 2011-07-04 | Light emitting diode packaging module |
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| CN201110184666.3A CN102867899B (en) | 2011-07-04 | 2011-07-04 | Light emitting diode packaging module |
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| CN102867899A true CN102867899A (en) | 2013-01-09 |
| CN102867899B CN102867899B (en) | 2015-07-08 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107170734A (en) * | 2017-06-06 | 2017-09-15 | 南昌大学 | The LED encapsulation structure and its method for packing of a kind of direct chip on board |
| CN108807359A (en) * | 2018-07-26 | 2018-11-13 | 中山市光圣半导体科技有限责任公司 | A kind of LED component and manufacturing method |
| CN112467009A (en) * | 2020-11-13 | 2021-03-09 | 中山市仟选照明科技有限公司 | Novel full-light-transmission LED processing technology |
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| CN101950788A (en) * | 2010-08-13 | 2011-01-19 | 重庆大学 | Power type white LED based on fluorescence lens |
| US20110090701A1 (en) * | 2009-10-15 | 2011-04-21 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led lamp |
| CN202134573U (en) * | 2011-07-04 | 2012-02-01 | 刘胜 | Light emitting diode packaging module |
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2011
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| US20070139931A1 (en) * | 2005-12-21 | 2007-06-21 | Samsung Electro-Mechanics Co., Ltd. | LED package and backlight unit using the same |
| US20090219716A1 (en) * | 2008-03-02 | 2009-09-03 | Matthew Weaver | Led optical lens |
| CN201527988U (en) * | 2009-02-13 | 2010-07-14 | 广东昭信光电科技有限公司 | Encapsulation structure applied on a guide type light-emitting diode device |
| US20110090701A1 (en) * | 2009-10-15 | 2011-04-21 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led lamp |
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| CN201568890U (en) * | 2009-11-12 | 2010-09-01 | 上海彩煌光电科技有限公司 | Lens of LED light source with free curve surface |
| CN101950788A (en) * | 2010-08-13 | 2011-01-19 | 重庆大学 | Power type white LED based on fluorescence lens |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107170734A (en) * | 2017-06-06 | 2017-09-15 | 南昌大学 | The LED encapsulation structure and its method for packing of a kind of direct chip on board |
| CN108807359A (en) * | 2018-07-26 | 2018-11-13 | 中山市光圣半导体科技有限责任公司 | A kind of LED component and manufacturing method |
| CN112467009A (en) * | 2020-11-13 | 2021-03-09 | 中山市仟选照明科技有限公司 | Novel full-light-transmission LED processing technology |
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| CN102867899B (en) | 2015-07-08 |
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