CN105351762A - LED (Light Emitting Diode) module with excellent radiating performance - Google Patents
LED (Light Emitting Diode) module with excellent radiating performance Download PDFInfo
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- CN105351762A CN105351762A CN201510865603.2A CN201510865603A CN105351762A CN 105351762 A CN105351762 A CN 105351762A CN 201510865603 A CN201510865603 A CN 201510865603A CN 105351762 A CN105351762 A CN 105351762A
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- led
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- wire
- constant current
- pcb board
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses an LED (Light Emitting Diode) module with excellent radiating performance, which comprises a PCB (Printed Circuit Board) composite piece and a plastic piece, wherein the PCB composite piece comprises PCBs, a wire injection molding piece, a wire and LED constant current components; the wire injection molding piece is fixed with the PCBs by screws; the wire is fixed in the wire injection molding piece; the LED constant current components are welded on the PCBs; and the plastic piece and the PCB composite piece are integrally produced by an injection molding die. When the LED module with excellent radiating performance is energized, heat energy emitted by the LED constant current components and other electron components are rapidly conducted to the high thermal conductivity plastic piece, then heat conduction happens between the high thermal conductivity plastic piece and air or other heat conduction medium, and the junction temperature of the LED constant current components and other electron components can be kept at a very low level, so that the performance of the LED module is improved, the service life is prolonged, the carbon emission is reduced, and the environment-friendly value and economic value are high.
Description
Technical field
The present invention relates to a kind of LED module, be specifically related to the LED module that a kind of heat dispersion is splendid, belong to LED device technical field.
Background technology
The same with conventional light source, semiconductor light-emitting-diode also can produce heat during operation, how much it depends on overall luminous efficiency, under powering up energy outside, the radiation recombination generation electroluminescent in electronics and hole, the light radiated near PN junction also needs just can arrive in air through the semiconductor medium of wafer itself and encapsulation medium, combination current injection efficiency, radioluminescence quantum efficiency, wafer exterior light extraction efficiency etc., quite a few energy is had mainly to change into heat with the form of the lattice vibration of non-radiative recombination generation, and the rising of chip temperature, then non-radiative recombination can be strengthened, further weakening luminous efficiency, usual by LED(light emitting diode in the market) be encapsulated again by necessarily regularly arranged together, add some water-proofing treatment composition LED module, existing its shell of LED module is divided into two kinds of versions, one is that monolithic construction form, two is for upper-lower casing fit form, wherein monolithic construction form has good sealing property, but its heat conductivility is poor, and radiating effect is not good enough, reduce the service life of LED module, split-type structural form solves the problems referred to above, but its sealing property is difficult to again be guaranteed.
Summary of the invention
(1) technical problem that will solve
For solving the problem, the present invention proposes the LED module that a kind of heat dispersion is splendid, improving the performance of product, increasing the service life, reduce carbon emission, there is the very high value of environmental protection and economic worth.
(2) technical scheme
The LED module that heat dispersion of the present invention is splendid, comprises pcb board sub-assembly and working of plastics; Described pcb board sub-assembly comprises pcb board, and the wire moulding be screwed with pcb board, and is fixed on the wire in wire moulding, and is welded in the LED constant current components and parts on pcb board; Described working of plastics and PCB sub-assembly are made into integration by injection mold.
Further, described wire moulding offers the screw hole assembled with screw.
Further, described working of plastics is wrapped in outside pcb board sub-assembly by the injection mold that injection machine is provided with after heating.
As preferred embodiment, described working of plastics is made up of high conductive plastic material.
(3) beneficial effect
Compared with prior art, the LED module that heat dispersion of the present invention is splendid, during energising, the heat energy that LED constant current components and parts and other electronic devices and components send all is led on this high heat-conducting plastic part rapidly, and again with air and other heat-conducting medium generation heat transfer, enable the junction temperature of LED constant current components and parts and other electronic devices and components remain on very low temperature always; Thus improve the performance of LED module product of the present invention, increase the service life, reduce carbon emission, there is the very high value of environmental protection and economic worth.
Accompanying drawing explanation
Fig. 1 is sectional structure schematic diagram of the present invention.
Parts in accompanying drawing are labeled as: 1-wire, 2-wire moulding, 3-PCB plate, 4-LED constant current components and parts, 5-working of plastics, 6-screw hole.
Detailed description of the invention
The LED module that heat dispersion is as shown in Figure 1 splendid, comprises pcb board sub-assembly and working of plastics 5; Described pcb board sub-assembly comprises pcb board 3, and passes through the fixing wire moulding 2 of screw (not shown) with pcb board 3, and is fixed on the wire 1 in wire moulding 2, and is welded in the LED constant current components and parts 4 on pcb board 3; Described working of plastics 5 is made into integration by injection mold with PCB sub-assembly 3.
Wherein, described wire moulding 2 offers the screw hole 6 assembled with screw (not shown).
Described working of plastics 5 is wrapped in outside pcb board 3 sub-assembly by the injection mold that injection machine is provided with after heating.
Described working of plastics 5 is made up of high conductive plastic material.
The LED module that heat dispersion of the present invention is splendid, first professional injection mold is offered, then LED constant current components and parts are welded on pcb board, with full dog point socket set, pcb board and wire moulding are are below connected and composed plate PCB sub-assembly, by injection mold, pcb board sub-assembly is wrapped up after working of plastics being heated with injection machine again, pcb board and components and parts all above are all closely linked with this high heat-conducting plastic part, when LED module product energising of the present invention, the heat energy that LED constant current components and parts and other electronic devices and components send all is led on this high heat-conducting plastic part rapidly, and again with air and other heat-conducting medium generation heat transfer, enable the junction temperature of LED constant current components and parts and other electronic devices and components remain on very low temperature always, thus improve the performance of LED module product of the present invention, increase the service life, reduce carbon emission, there is the very high value of environmental protection and economic worth.
Embodiment recited above is only be described the preferred embodiment of the present invention, not limits the spirit and scope of the present invention.Under the prerequisite not departing from design concept of the present invention; the various modification that this area ordinary person makes technical scheme of the present invention and improvement; all should drop into protection scope of the present invention, the technology contents of request protection of the present invention, all records in detail in the claims.
Claims (4)
1. the LED module that heat dispersion is splendid, is characterized in that: comprise pcb board sub-assembly and working of plastics; Described pcb board sub-assembly comprises pcb board, and the wire moulding be screwed with pcb board, and is fixed on the wire in wire moulding, and is welded in the LED constant current components and parts on pcb board; Described working of plastics and PCB sub-assembly are made into integration by injection mold.
2. the LED module that heat dispersion according to claim 1 is splendid, is characterized in that: described wire moulding offers the screw hole assembled with screw.
3. the LED module that heat dispersion according to claim 1 is splendid, is characterized in that: described working of plastics is wrapped in outside pcb board sub-assembly by the injection mold that injection machine is provided with after heating.
4. the LED module that heat dispersion according to claim 1 is splendid, is characterized in that: described working of plastics is made up of high conductive plastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510865603.2A CN105351762A (en) | 2015-12-02 | 2015-12-02 | LED (Light Emitting Diode) module with excellent radiating performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510865603.2A CN105351762A (en) | 2015-12-02 | 2015-12-02 | LED (Light Emitting Diode) module with excellent radiating performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105351762A true CN105351762A (en) | 2016-02-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510865603.2A Pending CN105351762A (en) | 2015-12-02 | 2015-12-02 | LED (Light Emitting Diode) module with excellent radiating performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105351762A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050089522A (en) * | 2004-03-05 | 2005-09-08 | 럭스피아 주식회사 | Package base of led |
| CN201462525U (en) * | 2009-06-10 | 2010-05-12 | 深圳市日上光电有限公司 | Waterproof LED lighting module |
| CN201909192U (en) * | 2010-09-26 | 2011-07-27 | 邓建伟 | Improved LED (light-emitting diode) module |
| CN202141020U (en) * | 2011-07-15 | 2012-02-08 | 上海嘉塘电子有限公司 | Self-cooling LED (Light Emitting Diode) module structure |
| CN202209638U (en) * | 2011-07-21 | 2012-05-02 | 深圳市镭泰光电科技有限公司 | Light-emitting diode (LED) module and illumination device |
| CN102478170A (en) * | 2011-07-27 | 2012-05-30 | 深圳市日上光电有限公司 | Full-plastic-packaged light emitting diode (LED) module |
| CN204099946U (en) * | 2014-07-30 | 2015-01-14 | 深圳市光科照明有限公司 | A kind of New LED module |
-
2015
- 2015-12-02 CN CN201510865603.2A patent/CN105351762A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050089522A (en) * | 2004-03-05 | 2005-09-08 | 럭스피아 주식회사 | Package base of led |
| CN201462525U (en) * | 2009-06-10 | 2010-05-12 | 深圳市日上光电有限公司 | Waterproof LED lighting module |
| CN201909192U (en) * | 2010-09-26 | 2011-07-27 | 邓建伟 | Improved LED (light-emitting diode) module |
| CN202141020U (en) * | 2011-07-15 | 2012-02-08 | 上海嘉塘电子有限公司 | Self-cooling LED (Light Emitting Diode) module structure |
| CN202209638U (en) * | 2011-07-21 | 2012-05-02 | 深圳市镭泰光电科技有限公司 | Light-emitting diode (LED) module and illumination device |
| CN102478170A (en) * | 2011-07-27 | 2012-05-30 | 深圳市日上光电有限公司 | Full-plastic-packaged light emitting diode (LED) module |
| CN204099946U (en) * | 2014-07-30 | 2015-01-14 | 深圳市光科照明有限公司 | A kind of New LED module |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160224 |
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| WD01 | Invention patent application deemed withdrawn after publication |