CN105346157A - Anti-fake material and preparation method thereof - Google Patents
Anti-fake material and preparation method thereof Download PDFInfo
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- CN105346157A CN105346157A CN201510885241.3A CN201510885241A CN105346157A CN 105346157 A CN105346157 A CN 105346157A CN 201510885241 A CN201510885241 A CN 201510885241A CN 105346157 A CN105346157 A CN 105346157A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/162—Cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q30/00—Commerce
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
Abstract
The invention relates to the anti-fake technology, particularly to an anti-fake material and a preparation method thereof. The anti-fake material is characterized by comprising a lamellate formless silicon module, wherein the formless silicon module adopts a hollow area; the anti-fake material further comprises an ultraviolet fluorescence module; the ultraviolet fluorescence module is embedded into the hollow area. The preparation method comprises the following steps: plating a glass base with an adhesive layer, plating the adhesive layer with a sacrificial layer, plating the sacrificial layer with a formless silicon layer, coating the formless silicon layer with a photo-curing glue, providing an ultraviolet light source, providing a first submerging template, conducting exposure, development, cleaning and etching on the formless silicon layer, providing a cleaning solution, cleaning, coating a mixture of ultraviolet fluorescent powder and the photo-curing glue on the surface of the formless silicon, providing a second submerging template, conducting exposure, development and cleaning, providing a sacrificial layer etching liquid, etching the sacrificial layer, cleaning and filtering. The anti-fake material which adopts multiple materials and is double in anti-fake property and the preparation method of the anti-fake material are provided.
Description
Technical field
The present invention relates to anti-counterfeiting technology, particularly relate to a kind of anti-fake material and preparation method thereof.
Background technology
In existing skill counterfeit-proof tech, greatly mainly with the body and random distribution etc. of watermark, colored fibre, fluorescent ink printing, micro-point or small mark as counterfeit protection measures.
Such as, prior art 1, Chinese patent literature CN102108653A, disclosed a kind of sheet anti-fake material, described sheet anti-fake material adopts the polymorphic structure beyond square; And described sheet anti-fake material is made up of following layer structure: the false proof carrier layer of papery, the false proof carrier of wherein said papery is the paper obtained by least two kinds of composite manufactures of fiber; And false proof layer.Also disclose the preparation method of described sheet anti-fake material and the cheque paper containing this sheet anti-fake material.Sheet anti-fake material of the present invention can obtain possesses the multi-level anti-fraud functional cheque paper such as naked eyes identification, fast machine-readable, analysis expert simultaneously.
For another example, prior art 2, Chinese patent literature CN104610812A, disclosed fluorescence silicon nano particles, as the application of anti-fake mark, prepare fluorescence silicon nano particles by silicon source, the fluorescence silicon nano particles obtained are used as anti-counterfeiting ink to prepare security pattern.Because nano silicon particles has good photoluminescent property, quantum yield is high, and storage stability is good, has good excitation wavelength dependence, and the security pattern of preparation can show the light of different colours under the illumination of different excitation wavelength, can play good antifalse effect.
For another example, prior art 3, Chinese patent literature CN101673341A, disclosed in the present invention relates to anti-counterfeiting technology, particularly relate to a kind of anti-counterfeiting method of micro-points.The method comprises the following steps: (1) provides a kind of micro-point; (2) provide a kind of glue, micro-point is mixed among glue; (3) the mixed atomarius glue of point on carrier; (4) solidified glue; (5) glue of taking pictures drips, and forms original Contrast's picture; (6) original Contrast's picture is stored in background data base; (7) fake certification glue of taking pictures drips, and is formed by than picture; (8) read background data base original Contrast picture, compare with by than picture, make the true and false and judge; Wherein, the glue of taking pictures described in (5) step drips, and takes pictures for amplifying; Fake certification described in (7) step glue of taking pictures drips, and is also to amplify to take pictures.The invention provides the not imitability anti-counterfeiting method of micro-points of one.Corresponding, Chinese patent literature CN102267287A discloses the preparation method of similar a kind of micro-some anti-counterfeiting stamp and realizes the device of the method.The preparation method of micro-some anti-counterfeiting stamp comprises the following steps: S1, provides a kind of micro-some label, provides a kind of ink; S2, mixed ink, mixes with ink by micro-some label; S3, provides at least two shower nozzles, provides object; S4, sprays, by shower nozzle, the ink being mixed with micro-some label is sprayed to subject matter; S5, drying is mixed with the ink of micro-some label; In course of injection, mixed black step is carried out continuously, mixes ink, completes in totally enclosed fluid path to shower nozzle ink supply, injection.The invention provides in a kind of process the preparation method being not easily mixed into the micro-some anti-counterfeiting stamp that impurity, the in real time micro-point of maintenance are evenly distributed in ink and the device realizing the method.
For another example, prior art 4, Chinese patent literature CN1350274A, disclosed a kind of anti-fake mark containing most small mark or pattern and forming method thereof, with the anti-fake mark containing most micro pattern mark, reach the application identified article genuine-fake and prevent from forging.Object qualification method is at least one unique tag according to being formed in object, it contains most micro pattern or mark, and close in mark in the mode of random combine, with as a comparison, qualification method, and have prevent other people from forging and can reach easily identify and qualification and contrast effect.
But, enumerate such as, the body and random distribution etc. of the composite fibre of prior art, fluorescence silicon nano particles, micro-point or small mark are as counterfeit protection measures, it is not the effect that can prevent other people from forging like that to open text narration, along with the progress of science and technology, these technological means all can be cheap imitated, the background data base only had described in prior art 3 that can not copy, but back-end data is also dangerous, the database of enterprise is easy to suffer assault, and need communication security guarantee, still undesirable.Prior art 3 and prior art 4, Xie Shineng solve most of false proof demand, but are all that the anti-fake material that single material is formed easily is imitated, and unified gray tone does not have stereovision and third dimension, still high-end demand can not be met, thus, need constantly to weed out the old and bring forth the new, constantly progress.
Summary of the invention
The object of the invention is to overcome above-mentioned the deficiencies in the prior art part and a kind of anti-fake material with many materials is provided.
The present invention also aims to overcome above-mentioned the deficiencies in the prior art part and a kind of anti-fake material with visible ray and ultraviolet light double anti-forge is provided.
The present invention also aims to overcome above-mentioned the deficiencies in the prior art part and a kind of preparation method of anti-fake material with many materials, double anti-forge is provided.
Object of the present invention can be achieved through the following technical solutions:
A kind of anti-fake material, it is characterized in that: this anti-fake material comprises the amorphous silicon module of sheet, and amorphous silicon module has void region, this anti-fake material also comprises Ultraluminescence module, and Ultraluminescence module is embedded in described void region.
Described anti-fake material, it is characterized in that: described Ultraluminescence module, refer in unit anti-fake material, the summation of each submodule be made up of ultraviolet fluorescent material, discrete distribution between each submodule, described Ultraluminescence module can be a figure or character, also can form a block graphics or character string by most submodules; Described amorphous silicon module, refer in unit anti-fake material, the summation of each submodule be made up of amorphous silicon material, discrete distribution between each submodule, described amorphous silicon module can be a figure or character, also can form a block graphics or character string by most submodules.
Described anti-fake material, is characterized in that: described Ultraluminescence module bottom surface and amorphous silicon module bottom surface in the same plane, described Ultraluminescence module and amorphous silicon module consistency of thickness.
Described anti-fake material, is characterized in that: described Ultraluminescence module bottom surface and amorphous silicon module bottom surface in the same plane, described Ultraluminescence module is larger than amorphous silicon module thickness.
Described anti-fake material, is characterized in that: described Ultraluminescence module is the uniform curing structure among light binding of ultraviolet fluorescence powder; Described ultraviolet fluorescent material is the homogeneous mixture of ultraviolet fluorescence powder and light binding.Ultraviolet fluorescence powder is coordinated with trace active agent by metal (zinc, cadmium) sulfide or rare earth oxide, forms through calcining.
Described anti-fake material, is characterized in that: under visible light, and Ultraluminescence module installation becomes colourless or white, under UV-irradiation, Ultraluminescence module is colored, face and different Ultraluminescence module submodules can be arranged to different colors, and amorphous silicon module is arranged to black; And under visible light, Ultraluminescence module and amorphous silicon module form the first anti-counterfeiting information of black and white or ater; Under UV-irradiation, Ultraluminescence module and amorphous silicon module form colored the second anti-counterfeiting information reflected mutually with black background.
Described anti-fake material, is characterized in that: between the thickness of described laminated structure is 2 to 10 microns.
Object of the present invention can also be achieved through the following technical solutions:
A preparation method for anti-fake material, is characterized in that, comprises the following steps: S110, provides substrate of glass; S120, on the glass substrate face plating adhesion layer; S130, plates sacrifice layer on adhesion layer; S140, plates amorphous si-layer on sacrifice layer; S150, at amorphous si-layer coated thereon light binding; S160, provides ultraviolet light source, provides first to flood template, light binding coating exposure S150 step be coated with; S170, provides developer solution, development; S180, provides pure water, cleaning; S190, provides plasma etching to equip, and etches the amorphous si-layer not having light binding to protect, the neighboring area namely outside void region and each unit anti-fake material; S200, provides cleaning fluid, cleaning, washes the light binding determining silicon layer for the protection of nothing exactly; S210, at amorphous silicon surface coated UV fluorescent material and the mixture of light binding; S220, provides second to flood template, mixture coating exposure S200 step be coated with; S230, development; S240, cleans with pure water; S250, provides sacrificial layer etching liquid, etching sacrificial layer; S260, provides cleaning and filtering to equip and pure water, cleaning, filters; Wherein, S170 step, described in developer solution is provided, developer solution is that tetramethyl adds water; Described development, with developer solution cured portion light binding; S180 step, cleaning, washes S170 development step uncured portion light binding with pure water; There is provided cleaning fluid described in described S200 step, cleaning fluid is acetone.
The preparation method of described a kind of anti-fake material, is characterized in that: S120 step, and described adhesion layer is Cr or Ni or stainless steel, and described plating refers to Vacuum Deposition; S130 step, described sacrifice layer is Al or Cu, and described plating refers to Vacuum Deposition.
The preparation method of described a kind of anti-fake material, is characterized in that: described S150 step, also comprises providing being coated with equipment step, with being coated with method coating.
The preparation method of described a kind of anti-fake material, is characterized in that: described S210 step, also comprises and provide painting equipment step, be coated with spraying method.
The preparation method of described a kind of anti-fake material, is characterized in that: also comprise S215 step, frictioning, provides frictioning to equip, and is scraped off by the mixture that the S210 step on amorphous silicon surface sprays.Frictioning prepares amorphous silicon module and Ultraluminescence module uniform thickness object, that is: described Ultraluminescence module bottom surface and amorphous silicon module bottom surface in the same plane, described Ultraluminescence module and amorphous silicon module consistency of thickness.Frictioning equipment can outsourcing; Also can SMT tin scraping equipment frictioning, do not fill silk screen during work, arranging scrap rubber retracting device under feeding track can complete.
The preparation method of described a kind of anti-fake material, it is characterized in that: described light binding can select positive light binding and negative light binding one wherein, the cured portion light binding that described S170 step is mentioned refers to, exposure or unexposed part light binding, particularly, the part light binding exposed for positive light binding does not solidify, unexposed part light binding solidification; Accordingly, for the part light binding solidification that negative light binding exposes, unexposed part light binding does not solidify.
The preparation method of described a kind of anti-fake material, it is characterized in that: described S110 provides substrate of glass, also comprise and sheet glass be cut into square or rectangle, and chamfering, polishing, cleaning, drying steps, for the thickness of substrate of glass between 0.3 to 0.5 millimeter.
The preparation method of described a kind of anti-fake material, is characterized in that: described S190 step etching amorphous si-layer, gases used is CF6, can certainly increase assist gas.
The preparation method of described a kind of anti-fake material, is characterized in that: described S250 step, provides sacrificial layer etching liquid, and the sacrifice layer plated for S130 step is Al, provides etching solution to be one in hydrochloric acid, NaOH; The sacrifice layer plated for S130 step is Cu, provides etching solution to be the aqueous solution of hydrochloric acid and ferric trichloride.
Anti-fake material involved in the present invention comprises the amorphous silicon module of sheet, this anti-fake material comprises the amorphous silicon module of sheet, amorphous silicon module has void region, and this anti-fake material also comprises Ultraluminescence module, and Ultraluminescence module is embedded in described void region; Under visible light, Ultraluminescence module installation becomes colourless or white, and under UV-irradiation, Ultraluminescence module is colored, face and different Ultraluminescence module submodules can be arranged to different colors, and amorphous silicon module is arranged to black; And under visible light, Ultraluminescence module and amorphous silicon module form the first anti-counterfeiting information of black and white or ater; Under UV-irradiation, Ultraluminescence module and amorphous silicon module form colored the second anti-counterfeiting information reflected mutually with black background; Have various material, and have double anti-forge information under visible ray and ultraviolet light, larger than prior art difficulty in its technique, not easily copy, excellent its is that Ultraluminescence component form distributed data oppositely cannot copy number from electron microscope, comparatively prior art safety.
The preparation method of a kind of anti-fake material involved in the present invention, by the plating of face on the glass substrate adhesion layer, on adhesion layer, plate sacrifice layer, on sacrifice layer, plate amorphous si-layer, at amorphous si-layer coated thereon light binding, ultraviolet light source is provided, provides first to flood template, by the exposure of the light binding coating of coating, development, cleaning, has washed the light binding of void region, has also washed the light binding of the neighboring area outside each unit anti-fake material; There is provided plasma etching to equip, etch the amorphous si-layer not having light binding protect, the neighboring area namely outside void region and each unit anti-fake material, provides cleaning fluid, and cleaning washes the light binding determining silicon layer for the protection of nothing exactly; At amorphous silicon surface coated UV fluorescent material and the mixture of light binding; There is provided second to flood template, exposure, development, with pure water cleaning, only leave the Ultraluminescence module of void region, provide sacrificial layer etching liquid, etching sacrificial layer, provide cleaning and filtering to equip and pure water, cleaning, filter; Technical process is integrally, all linked with one another, and imitation difficulty is large, does not expose with flooding template data, and inventor can not reproduce the case of the present invention that others implements.
Accompanying drawing explanation
Fig. 1 is the front schematic view of the present invention's first and second embodiment.
Fig. 2 is A-A generalized section in Fig. 1 of first embodiment of the invention.
Fig. 3 is A-A generalized section in Fig. 1 of second embodiment of the invention.
Fig. 4 is the schematic diagram of S110 to the S150 step of the present invention's the 3rd and the 4th embodiment.
Fig. 5 is the schematic diagram of S160 to the S180 step of the present invention's the 3rd and the 4th embodiment.
Fig. 6 is the schematic diagram of the S190 step of the present invention's the 3rd and the 4th embodiment.
Fig. 7 is the schematic diagram of the S200 step of the present invention's the 3rd and the 4th embodiment.
Fig. 8 is the schematic diagram of the S210 step of the present invention's the 3rd and the 4th embodiment.
Fig. 9 is the schematic diagram of the S215 step of third embodiment of the invention.
Figure 10 is the schematic diagram of S220 to the S240 step of third embodiment of the invention.
Figure 11 is P place enlarged diagram in Figure 10 and Figure 12.
Figure 12 is the schematic diagram of S220 to the S240 step of four embodiment of the invention.
Figure 13 is the schematic diagram of the S250 step of the present invention's the 3rd and the 4th embodiment.
Figure 14 is the flow chart of third embodiment of the invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the invention will be further described.
With reference to figure 1, Fig. 2, Fig. 2 is A-A face profile in Fig. 1, first embodiment of the invention is a kind of anti-fake material, this anti-fake material comprises the amorphous silicon module 001 of sheet, amorphous silicon mould 001 piece has void region, this anti-fake material also comprises Ultraluminescence module 002, and Ultraluminescence module 002 is embedded in described void region, and Ultraluminescence module in the present embodiment 002 completely fills described void region.
Described Ultraluminescence module 002, refer in unit anti-fake material 000, the summation of each submodule be made up of ultraviolet fluorescent material, discrete distribution between each submodule, described Ultraluminescence module 002 can be a figure or character, also can form a block graphics or character string by most submodules, in the present embodiment, Ultraluminescence module 002 is one group of character string " Red ", is made up of three submodules " R ", " e ", " d " of discrete distribution; Described amorphous silicon module 001, refer in unit anti-fake material, the summation of each submodule be made up of amorphous silicon material, discrete distribution between each submodule, described amorphous silicon module can be a figure or character, also a block graphics or character string can be formed by most submodules, in the present embodiment, amorphous silicon module 001 is made up of four discrete distribution submodules, i.e. enclosure portion, the enclosure portion on character " e " top, the part of character " d " lower closed portion, in addition character string " Red " surrounding on character " R " top; Unit anti-fake material 000 just refers to an anti-fake material in the present embodiment.
Refer again to Fig. 2, in the present embodiment, described Ultraluminescence module 002 bottom surface and amorphous silicon module 001 bottom surface in the same plane, described Ultraluminescence module 002 and amorphous silicon module 001 consistency of thickness.
Described Ultraluminescence module 002 is the uniform curing structure among light binding of ultraviolet fluorescence powder; Described ultraviolet fluorescent material is the homogeneous mixture of ultraviolet fluorescence powder and light binding.Ultraviolet fluorescence powder is coordinated with trace active agent by metal (zinc, cadmium) sulfide or rare earth oxide, forms through calcining.
Under visible light, Ultraluminescence module 002 is arranged to white, under UV-irradiation, Ultraluminescence module 002 is colored, face and different Ultraluminescence module submodules can be arranged to different colors, in the present embodiment, character string " Red " be same color and, should be appreciated that it also can is different color, in the 3rd embodiment, describe the preparation means of different color submodule; Amorphous silicon module 001 is arranged to black; And under visible light, Ultraluminescence module and amorphous silicon module form the first anti-counterfeiting information of black and white; Under UV-irradiation, Ultraluminescence module and amorphous silicon module form colored the second anti-counterfeiting information reflected mutually with black background.
With reference to figure 1, Fig. 3, Fig. 3 is A-A face profile in Fig. 1, second embodiment of the invention is a kind of anti-fake material, be with the difference of first embodiment of the invention, described Ultraluminescence module 002 bottom surface and amorphous silicon module 001 bottom surface in the same plane, described Ultraluminescence module 002 is larger than amorphous silicon module 001 thickness, and under the present embodiment visible ray, stereoeffect is strengthened.
With reference to figure 4 to Figure 11, Figure 13 to Figure 14, third embodiment of the invention is a kind of preparation method of anti-fake material, i.e. the preparation method of the anti-fake material of preparation described by first embodiment of the invention, and the method comprises the following steps: S110, provides substrate of glass; S120, on the glass substrate face plating adhesion layer; S130, plates sacrifice layer on adhesion layer; S140, plates amorphous si-layer on sacrifice layer; S150, at amorphous si-layer coated thereon light binding; S160, provides ultraviolet light source, provides first to flood template, light binding coating exposure S150 step be coated with; S170, provides developer solution, development; S180, provides pure water, cleaning; S190, provides plasma etching to equip, and etches the amorphous si-layer not having light binding to protect, the neighboring area namely outside void region and each unit anti-fake material; S200, provides cleaning fluid, cleaning, washes the light binding determining silicon layer for the protection of nothing exactly; S210, at amorphous silicon surface coated UV fluorescent material and the mixture of light binding; S215 step, frictioning; S220, provides second to flood template, mixture coating exposure S200 step be coated with; S230, development; S240, cleans with pure water; S250, provides sacrificial layer etching liquid, etching sacrificial layer; S260, provides cleaning and filtering to equip and pure water, cleaning, filters; Wherein, S120 step, described adhesion layer is Cr or Ni or stainless steel, and described plating refers to Vacuum Deposition; S130 step, described sacrifice layer is Al or Cu, and described plating refers to Vacuum Deposition; S170 step, described in developer solution is provided, developer solution is that tetramethyl adds water; Described development, with developer solution cured portion light binding; S180 step, cleaning, washes S170 development step uncured portion light binding with pure water.
Described S150 step, also comprises providing and is coated with equipment step, with being coated with method coating.Described S210 step, also comprises and provides painting equipment step, be coated with spraying method.Described S215 step, frictioning, also comprises and provides frictioning to equip, and is scraped off by the mixture that the S210 step on amorphous silicon surface sprays.Frictioning equipment can outsourcing; Also can SMT tin scraping machine frictioning, do not fill silk screen during work, arranging scrap rubber retracting device under feeding track can complete.
Described light binding can select positive light binding and negative light binding one wherein, the cured portion light binding that described S170 step is mentioned refers to, exposure or unexposed part light binding, particularly, the part light binding exposed for positive light binding does not solidify, unexposed part light binding solidification; Accordingly, for the part light binding solidification that negative light binding exposes, unexposed part light binding does not solidify.
Described S110 provides substrate of glass, also comprises and sheet glass is cut into square or rectangle, and chamfering, polishing, cleaning, drying steps, for the thickness of substrate of glass between 0.3 to 0.5 millimeter.
There is provided cleaning fluid described in described S200 step, cleaning fluid is acetone.
Described S190 step etching amorphous si-layer, gases used is CF6, can certainly increase assist gas.
Described S250 step, provides sacrificial layer etching liquid, and the sacrifice layer plated for S130 step is Al, provides etching solution to be one in hydrochloric acid, NaOH; The sacrifice layer plated for S130 step is Cu, provides etching solution to be the aqueous solution of hydrochloric acid and ferric trichloride.
Refer again to Fig. 4, it is the schematic diagram of S110 to the S150 step of the present embodiment, adhesion layer 102 is plated on substrate of glass 101, sacrifice layer 103 is plated on adhesion layer 102, amorphous si-layer 104 is plated on sacrifice layer 103, at amorphous si-layer 104 coated thereon light binding 105, become the first semi-finished product 100 for next step processing; Refer again to Fig. 5, it is the schematic diagram of S160 to the S180 step of the present embodiment, ultraviolet light source 999 is provided, provides first to flood template 901, the light binding coating of the first semi-finished product 100 is exposed, developer solution is provided, development, provides pure water, cleaning, the light binding 105 of the first semi-finished product 100 only leaves the light binding 201 had cured by the part of protection amorphous si-layer 104, becomes the second semi-finished product 200 for next step processing; Refer again to Fig. 6, it is the schematic diagram of the S190 step of the present embodiment, S190, plasma etching is provided to equip, etch the amorphous si-layer 104 not having light binding to protect, namely etch away the neighboring area outside void region 301 and each unit anti-fake material, exposed portion sacrifice layer 103, become the 3rd semi-finished product 300 for next step processing; Refer again to Fig. 7, it is the schematic diagram of the S200 step of the present embodiment, cleaning fluid is provided, the light binding 201 that the part washing the 3rd semi-finished product 300 protection amorphous si-layer 104 has cured, sacrifice layer 103 only stays amorphous module 001, becomes the 4th semi-finished product 400 for next step processing; Refer again to Fig. 8, it is the schematic diagram of the S210 step of the present embodiment, at amorphous silicon surface coated UV fluorescent material and the mixture 501 of light binding, in fact the surface of sacrifice layer also must together coating process could be implemented, the present embodiment adopts spraying method, when amorphous si-layer is very thin, also can adopt and be coated with, void region also can fill, selection is coated with and is just equal to replacement and does not have substantive difference with spraying, as long as filled up void region, there is no any difference, become the 5th semi-finished product 500 for next step processing; Refer again to Fig. 9, be the schematic diagram of the S215 step of embodiment, frictioning, also comprises and provides frictioning to equip, and is scraped off by the mixture that the S210 step on amorphous silicon surface sprays, and becomes the 5th semi-finished product 500a for next step processing; Referring again to Figure 10, is the schematic diagram of S220 to the S240 step of the present embodiment.There is provided second to flood template 902a, the mixture coating of the 5th semi-finished product 500a is exposed, development, with pure water cleaning, so far, sacrifice layer 103 only leaves multiple units anti-fake material 000, become the 6th semi-finished product 600a for next step processing, besides say that different Ultraluminescence module submodules can be arranged to the method for different colors, first be coated with on amorphous silicon surface with the mixture 501 of a submodule ultraviolet fluorescence powder and light binding, second floods the void region exposure that template 902a only has this submodule corresponding, development, clean with pure water, be coated with on amorphous silicon surface with the mixture 501 of another submodule ultraviolet fluorescence powder and light binding again, second floods the void region exposure that template 902a only has this submodule corresponding, development, clean with pure water, until complete all submodules are arranged, like this, different submodules just can use different ultraviolet fluorescence powder, under UV-irradiation, different dacron color is just presented to realize different submodule, refer again to Figure 13, be the schematic diagram of the S250 step of the present embodiment, provide sacrificial layer etching liquid, etching sacrificial layer, so far, one group of multiple units anti-fake material 000 just prepares, and provides cleaning and filtering to equip and pure water, cleaning, filters, just can be applied to industry and suffer.
Figure 14 is the flow chart of third embodiment of the invention.
With reference to figure 4 to Fig. 8, Figure 11 to Figure 13, it is four embodiment of the invention, be preparation second embodiment of the invention be anti-fake material method, namely prepare Ultraluminescence module 002 bottom surface and amorphous silicon module 001 bottom surface in the same plane, the anti-fake material that described Ultraluminescence module 002 is larger than amorphous silicon module 001 thickness, the method comprises the following steps: S110, provides substrate of glass; S120, on the glass substrate face plating adhesion layer; S130, plates sacrifice layer on adhesion layer; S140, plates amorphous si-layer on sacrifice layer; S150, at amorphous si-layer coated thereon light binding; S160, provides ultraviolet light source, provides first to flood template, light binding coating exposure S150 step be coated with; S170, provides developer solution, development; S180, provides pure water, cleaning; S190, provides plasma etching to equip, and etches the amorphous si-layer not having light binding to protect, the neighboring area namely outside void region and each unit anti-fake material; S200, provides cleaning fluid, cleaning, washes the light binding determining silicon layer for the protection of nothing exactly; S210, at amorphous silicon surface coated UV fluorescent material and the mixture of light binding; S220, provides second to flood template, mixture coating exposure S200 step be coated with; S230, development; S240, cleans with pure water; S250, provides sacrificial layer etching liquid, etching sacrificial layer; S260, provides cleaning and filtering to equip and pure water, cleaning, filters; Wherein, S120 step, described adhesion layer is Cr or Ni or stainless steel, and described plating refers to Vacuum Deposition; S130 step, described sacrifice layer is Al or Cu, and described plating refers to Vacuum Deposition; S170 step, described in developer solution is provided, developer solution is that tetramethyl adds water; Described development, with developer solution cured portion light binding; S180 step, cleaning, washes S170 development step uncured portion light binding with pure water.
Described S150 step, also comprises providing and is coated with equipment step, with being coated with method coating.Described S210 step, also comprises and provides painting equipment step, be coated with spraying method.Described S215 step, frictioning, also comprises and provides frictioning to equip, and is scraped off by the mixture that the S210 step on amorphous silicon surface sprays.Frictioning equipment can outsourcing; Also can SMT tin scraping machine frictioning, do not fill silk screen during work, arranging scrap rubber retracting device under feeding track can complete.
Described light binding can select positive light binding and negative light binding one wherein, the cured portion light binding that described S170 step is mentioned refers to, exposure or unexposed part light binding, particularly, the part light binding exposed for positive light binding does not solidify, unexposed part light binding solidification; Accordingly, for the part light binding solidification that negative light binding exposes, unexposed part light binding does not solidify.
Described S110 provides substrate of glass, also comprises and sheet glass is cut into square or rectangle, and chamfering, polishing, cleaning, drying steps, for the thickness of substrate of glass between 0.3 to 0.5 millimeter.
There is provided cleaning fluid described in described S200 step, cleaning fluid is acetone.
Described S190 step etching amorphous si-layer, gases used is CF6, can certainly increase assist gas.
Described S250 step, provides sacrificial layer etching liquid, and the sacrifice layer plated for S130 step is Al, provides etching solution to be one in hydrochloric acid, NaOH; The sacrifice layer plated for S130 step is Cu, provides etching solution to be the aqueous solution of hydrochloric acid and ferric trichloride.
Refer again to Fig. 4, it is the schematic diagram of S110 to the S150 step of the present embodiment, adhesion layer 102 is plated on substrate of glass 101, sacrifice layer 103 is plated on adhesion layer 102, amorphous si-layer 104 is plated on sacrifice layer 103, at amorphous si-layer 104 coated thereon light binding 105, become the first semi-finished product 100 for next step processing; Refer again to Fig. 5, it is the schematic diagram of S160 to the S180 step of the present embodiment, ultraviolet light source 999 is provided, provides first to flood template 901, the light binding coating of the first semi-finished product 100 is exposed, developer solution is provided, development, provides pure water, cleaning, the light binding 105 of the first semi-finished product 100 only leaves the light binding 201 had cured by the part of protection amorphous si-layer 104, becomes the second semi-finished product 200 for next step processing; Refer again to Fig. 6, it is the schematic diagram of the S190 step of the present embodiment, S190, plasma etching is provided to equip, etch the amorphous si-layer not having light binding to protect, namely etch away the neighboring area outside void region 301 and each unit anti-fake material, exposed portion sacrifice layer 103, become the 3rd semi-finished product 300 for next step processing; Refer again to Fig. 7, it is the schematic diagram of the S200 step of the present embodiment, cleaning fluid is provided, the light binding 201 that the part washing the 3rd semi-finished product 300 protection amorphous si-layer 104 has cured, sacrifice layer 103 only stays amorphous module 001, becomes the 4th semi-finished product 400 for next step processing; Refer again to Fig. 8, it is the schematic diagram of the S210 step of the present embodiment, at amorphous silicon surface coated UV fluorescent material and the mixture 501 of light binding, in fact the surface of sacrifice layer also must together coating process could be implemented, the present embodiment adopts spraying method, when amorphous si-layer is very thin, also can adopt and be coated with, void region also can fill, selection is coated with and is just equal to replacement and does not have substantive difference with spraying, as long as filled up void region, there is no any difference, become the 5th semi-finished product 500 for next step processing; Refer again to Figure 12, it is the schematic diagram of S220 to the S240 step of the present embodiment, it is the schematic diagram of S220 to the S240 step of the present embodiment, there is provided second to flood template 902, the mixture coating of the 5th semi-finished product 500 is exposed, development, clean with pure water, so far, sacrifice layer 103 only leaves multiple units anti-fake material 000, become the 6th semi-finished product 600 for next step processing; Refer again to Figure 13, be the schematic diagram of the S250 step of the present embodiment, provide sacrificial layer etching liquid, etching sacrificial layer, so far, one group of multiple units anti-fake material 000 just prepares, and provides cleaning and filtering to equip and pure water, cleaning, filters, just can be applied to industry and suffer.
The non-setting procedure figure of the present embodiment, with reference to Figure 14, can just not have frictioning step.
Claims (14)
1. an anti-fake material, is characterized in that: this anti-fake material comprises the amorphous silicon module of sheet, and amorphous silicon module has void region, and this anti-fake material also comprises Ultraluminescence module, and Ultraluminescence module is embedded in described void region.
2. anti-fake material according to claim 1, it is characterized in that: described Ultraluminescence module, refer in unit anti-fake material, the summation of each submodule be made up of ultraviolet fluorescent material, discrete distribution between each submodule, described Ultraluminescence module can be a figure or character, also can form a block graphics or character string by most submodules; Described amorphous silicon module, refer in unit anti-fake material, the summation of each submodule be made up of amorphous silicon material, discrete distribution between each submodule, described amorphous silicon module can be a figure or character, also can form a block graphics or character string by most submodules.
3. anti-fake material according to claim 1, is characterized in that: described Ultraluminescence module bottom surface and amorphous silicon module bottom surface in the same plane, described Ultraluminescence module and amorphous silicon module consistency of thickness.
4. anti-fake material according to claim 1, is characterized in that: described Ultraluminescence module bottom surface and amorphous silicon module bottom surface in the same plane, described Ultraluminescence module is larger than amorphous silicon module thickness.
5. anti-fake material according to claim 1, is characterized in that: described Ultraluminescence module is the uniform curing structure among light binding of ultraviolet fluorescence powder; Described ultraviolet fluorescent material is the homogeneous mixture of ultraviolet fluorescence powder and light binding.
6. anti-fake material according to claim 1, it is characterized in that: under visible light, Ultraluminescence module installation becomes colourless or white, under UV-irradiation, Ultraluminescence module is colored, face and different Ultraluminescence module submodules can be arranged to different colors, amorphous silicon module is arranged to black.
7. anti-fake material according to claim 1, is characterized in that: between the thickness of described laminated structure is 2 to 10 microns.
8. a preparation method for anti-fake material, is characterized in that, comprises the following steps:
S110, provides substrate of glass;
S120, on the glass substrate face plating adhesion layer;
S130, plates sacrifice layer on adhesion layer;
S140, plates amorphous si-layer on sacrifice layer;
S150, at amorphous si-layer coated thereon light binding;
S160, provides ultraviolet light source, provides first to flood template, light binding coating exposure S150 step be coated with;
S170, provides developer solution, development;
S180, provides pure water, cleaning;
S190, provides plasma etching to equip, and etches the amorphous si-layer not having light binding to protect;
S200, provides cleaning fluid, cleaning;
S210, at amorphous silicon surface coated UV fluorescent material and the mixture of light binding;
S220, provides second to flood template, mixture coating exposure S200 step be coated with;
S230, development;
S240, cleans with pure water;
S250, provides sacrificial layer etching liquid, etching sacrificial layer;
S260, provides cleaning and filtering to equip and pure water, cleaning, filters;
Wherein, S170 step, described in developer solution is provided, developer solution is that tetramethyl adds water; Described development, with developer solution cured portion light binding; S180 step, cleaning, washes S170 development step uncured portion light binding with pure water; There is provided cleaning fluid described in described S200 step, cleaning fluid is acetone.
9. the preparation method of a kind of anti-fake material according to claim 8, is characterized in that: described S150 step, also comprises providing being coated with equipment step, with being coated with method coating.
10. the preparation method of a kind of anti-fake material according to claim 8, is characterized in that: described S210 step, also comprises and provide painting equipment step, be coated with spraying method.
The preparation method of 11. a kind of anti-fake materials according to claim 10, is characterized in that: also comprise S215 step, frictioning, provides frictioning to equip, scraped off by the mixture that the S210 step on amorphous silicon surface sprays.
The preparation method of 12. a kind of anti-fake materials according to claim 8, it is characterized in that: described light binding can select positive light binding and negative light binding one wherein, the cured portion light binding that described S170 step is mentioned refers to, exposure or unexposed part light binding, particularly, the part light binding exposed for positive light binding does not solidify, unexposed part light binding solidification; Accordingly, for the part light binding solidification that negative light binding exposes, unexposed part light binding does not solidify.
The preparation method of 13. a kind of anti-fake materials according to claim 8, it is characterized in that: described S110 provides substrate of glass, also comprise and sheet glass be cut into square or rectangle, and chamfering, polishing, cleaning, drying steps, for the thickness of substrate of glass between 0.3 to 0.5 millimeter.
The preparation method of 14. a kind of anti-fake materials according to claim 8, is characterized in that: described S190 step etching amorphous si-layer, gases used is CF6.
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