CN105338734A - Ceramic substrate circuit board and manufacturing method thereof - Google Patents
Ceramic substrate circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN105338734A CN105338734A CN201510734507.4A CN201510734507A CN105338734A CN 105338734 A CN105338734 A CN 105338734A CN 201510734507 A CN201510734507 A CN 201510734507A CN 105338734 A CN105338734 A CN 105338734A
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- China
- Prior art keywords
- ceramic substrate
- palladium
- circuit board
- silver
- silver pad
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Abstract
The invention discloses a ceramic substrate circuit board and a manufacturing method thereof. The manufacturing method comprises the following steps: step one, embedding palladium-silver slurry in a ceramic substrate through a sintering process to form a palladium-silver pad; and step two, attaching an antioxidation material on the surface, which is away from the ceramic substrate, of the palladium-silver pad to form an antioxidation layer through an electroplating technology. The ceramic substrate circuit board and the manufacturing method thereof, provided by the invention, can effectively improve the antioxidation performance and the wear resistance of the ceramic substrate circuit board and prolong the service life of the ceramic substrate circuit board; the antioxidation layer is attached to the palladium-silver pad through the electroplating technology so that the structure of the antioxidation layer is more flat and stable, and the overall performance of the ceramic substrate circuit board can be effectively improved; and since a solder tin layer is omitted from between the antioxidation layer and the palladium-silver pad, the thickness of the ceramic substrate circuit board can be effectively reduced, and more design space is provided for electronic products manufactured by use of the circuit board.
Description
Technical field
The present invention relates to electronic circuit field, particularly relate to ceramic substrate circuit board and manufacture method thereof.
Background technology
Ceramic substrate circuit board refers to that Copper Foil is at high temperature bonded directly to the special process plate in aluminium oxide (Al2O3) or aluminium nitride (AlN) ceramic substrate surface (single or double).Made ultra-thin composite base plate has good electrical insulation performance, excellent solderability and high adhesive strength, and can etch various figure as pcb board, there is very large current capacity, ceramic substrate circuit board also has high thermal conduction characteristic, effectively the thermal conductance that high thermoelectric elements produces can be gone out, thus increase stabilization member degree and increase the service life, therefore, ceramic substrate circuit board has become the basic material of high-power electric and electronic circuit structure technology and interconnection technique, be widely used in automobile, oil well, electric power becomes high pressure such as sending, high insulation, high frequency, high temperature, highly reliable, in the electronic product of small size.
Circuit production technique of the prior art is on ceramic substrate, sinter palladium-silver slurry, forms conducting wire and pad, then on circuit and pad, utilize scolding tin to weld aluminium flake, thus carries out anti-oxidant and resistance to wear protection to circuit and pad.This technique by scolding tin welding aluminium flake of the prior art, because scolding tin has surface tension, easily there is out-of-flatness or crooked in the aluminium flake of welding, thus affects the subsequent machining technology of ceramic substrate, affects the overall performance of ceramic substrate circuit board.
Summary of the invention
The object of this invention is to provide a kind of ceramic substrate circuit board and manufacture method thereof.
Ceramic substrate circuit board provided by the present invention, comprise ceramic substrate, be embedded in palladium-silver pad on ceramic substrate and anti oxidation layer by sintering process, described anti oxidation layer is attached to the outer surface of described palladium-silver pad away from described ceramic substrate by electroplating technology; Described anti oxidation layer is that gold or nickel material are made.
The manufacture method of ceramic substrate circuit board provided by the present invention, comprises the steps: step 1, is embedded on ceramic substrate by sintering process by palladium-silver slurry, forms palladium-silver pad; Step 2, by electroplating technology, oxidation-resistant material is attached to the surface of palladium-silver pad away from ceramic substrate, forms anti oxidation layer; Described oxidation-resistant material is metallic gold or nickel.
Ceramic substrate circuit board provided by the present invention and manufacture method thereof, effectively can improve non-oxidizability and the resistance to wear of ceramic substrate circuit board, extend the useful life of ceramic substrate circuit board, by electroplating technology, anti oxidation layer is attached on palladium-silver pad, anti oxidation layer structure is more smooth stable, effectively can improve the overall performance of ceramic substrate circuit board; Owing to eliminating soldering-tin layer between anti oxidation layer and palladium-silver pad, thus effectively can reducing the thickness of ceramic substrate circuit board, providing more design space to utilizing the electronic product of this circuit board fabrication.
Accompanying drawing explanation
Fig. 1 is the manufacture method schematic diagram of the ceramic substrate circuit board described in the embodiment of the present invention two;
Fig. 2 is the manufacture method schematic diagram of the ceramic substrate circuit board described in the embodiment of the present invention three;
Fig. 3 is the manufacture method schematic diagram of the ceramic substrate circuit board described in the embodiment of the present invention four;
Wherein:
1-electrolyte; 2-ceramic substrate circuit board; 3-gold or nickel ion; 4-rectifier; 5-conduit.
Embodiment
For making the object of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment one
The present embodiment provides a kind of ceramic substrate circuit board, comprise ceramic substrate, be embedded in palladium-silver pad on ceramic substrate and anti oxidation layer by sintering process, described anti oxidation layer is attached to the outer surface of described palladium-silver pad away from described ceramic substrate by electroplating technology.It will be understood by those skilled in the art that and be attached on palladium-silver pad by electroplating technology by anti oxidation layer, anti oxidation layer structure is more smooth stable, effectively can improve the overall performance of ceramic substrate circuit board.In addition, compared with scolding tin solder technology of the prior art, owing to eliminating soldering-tin layer between anti oxidation layer and palladium-silver pad, thus effectively can reducing the thickness of ceramic substrate circuit board, providing more design space to utilizing the electronic product of this circuit board fabrication.Again in addition, because palladium just can as catalyst in traditional electroplating technology, and containing palladium composition in palladium-silver slurry, the ceramic substrate circuit board that the present embodiment provides can omit the process of plating palladium when electroplating anti oxidation layer, utilize the characteristic of palladium-silver slurry itself, directly realize plating anti oxidation layer in the electrolytic solution.Further, at the outer surface attachment anti oxidation layer of described palladium-silver pad away from described ceramic substrate, advantageously in routing and the binding technique of carrying out subsequent handling on ceramic substrate, as adopted aluminium material, gold or nickel material or nickel material to carry out routing technique, tension pull out force is better.
Further, described anti oxidation layer is that gold or nickel material are made.It will be understood by those skilled in the art that non-oxidizability and the resistance to wear of gold or nickel material are good, effectively can improve non-oxidizability and the resistance to wear of ceramic substrate circuit board, extend the useful life of ceramic substrate circuit board.
Embodiment two
As shown in Figure 1, the present embodiment provides a kind of manufacture method of ceramic substrate circuit board 2, comprises the steps:
Step 1, by sintering process, palladium-silver slurry is embedded on ceramic substrate, forms palladium-silver pad;
Step 2, by electroplating technology, oxidation-resistant material is attached to the surface of palladium-silver pad away from ceramic substrate, forms anti oxidation layer.
It will be understood by those skilled in the art that and be attached on palladium-silver pad by electroplating technology by anti oxidation layer, anti oxidation layer structure is more smooth stable, effectively can improve the overall performance of ceramic substrate circuit board 2.In addition, compared with scolding tin solder technology of the prior art, owing to eliminating soldering-tin layer between anti oxidation layer and palladium-silver pad, thus effectively can reducing the thickness of ceramic substrate circuit board 2, providing more design space to utilizing the electronic product of this circuit board fabrication.Again in addition, because palladium just can as catalyst in traditional electroplating technology, and containing palladium composition in palladium-silver slurry, the ceramic substrate circuit board 2 that the present embodiment provides can omit the process of plating palladium when electroplating anti oxidation layer, utilize the characteristic of palladium-silver slurry itself, directly in electrolyte 1, realize plating anti oxidation layer.Further, at the outer surface attachment anti oxidation layer of described palladium-silver pad away from described ceramic substrate, advantageously in routing and the binding technique of carrying out subsequent handling on ceramic substrate, as adopted aluminium material, gold or nickel material or nickel material to carry out routing technique, tension pull out force is better.
Described oxidation-resistant material is metallic gold or nickel.It will be understood by those skilled in the art that non-oxidizability and the resistance to wear of gold or nickel are good, effectively can improve non-oxidizability and the resistance to wear of ceramic substrate circuit board 2, extend the useful life of ceramic substrate circuit board 2.
Describedly by electroplating technology, oxidation-resistant material is attached to the surface of palladium-silver pad away from ceramic substrate, the step forming anti oxidation layer comprises:
Step 211, by sintering have the ceramic substrate of palladium-silver pad be inserted into containing gold or nickel ion 3 electrolyte 1 in;
Step 212, described palladium-silver pad is connected electrically in the negative pole of rectifier 4;
Step 213, conduct rectifier 4, complete plating.
It will be appreciated by those skilled in the art that, gold in described electrolyte 1 or nickel ion 3 are as positive pole, sintering has the ceramic substrate of palladium-silver pad as negative pole, when after rectifier 4 conducting, gold in electrolyte 1 or nickel ion 3 because of electromotive force be just, to attracted on negative pole, thus realize the gold-plated of whole circuit board or nickel requirement.
Embodiment three
As shown in Figure 2, the present embodiment provides a kind of manufacture method of ceramic substrate circuit board 2, comprises the steps:
Step 1, by sintering process, palladium-silver slurry is embedded on ceramic substrate, forms palladium-silver pad;
Step 2, by electroplating technology, oxidation-resistant material is attached to the surface of palladium-silver pad away from ceramic substrate, forms anti oxidation layer.
It will be understood by those skilled in the art that and be attached on palladium-silver pad by electroplating technology by anti oxidation layer, anti oxidation layer structure is more smooth stable, effectively can improve the overall performance of ceramic substrate circuit board 2.In addition, compared with scolding tin solder technology of the prior art, owing to eliminating soldering-tin layer between anti oxidation layer and palladium-silver pad, thus effectively can reducing the thickness of ceramic substrate circuit board 2, providing more design space to utilizing the electronic product of this circuit board fabrication.Again in addition, because palladium just can as catalyst in traditional electroplating technology, and containing palladium composition in palladium-silver slurry, the ceramic substrate circuit board 2 that the present embodiment provides can omit the process of plating palladium when electroplating anti oxidation layer, utilize the characteristic of palladium-silver slurry itself, directly in electrolyte 1, realize plating anti oxidation layer.Further, at the outer surface attachment anti oxidation layer of described palladium-silver pad away from described ceramic substrate, advantageously in routing and the binding technique of carrying out subsequent handling on ceramic substrate, as adopted aluminium material, gold or nickel material or nickel material to carry out routing technique, tension pull out force is better.
Described oxidation-resistant material is metallic gold or nickel.It will be understood by those skilled in the art that non-oxidizability and the resistance to wear of gold or nickel are good, effectively can improve non-oxidizability and the resistance to wear of ceramic substrate circuit board 2, extend the useful life of ceramic substrate circuit board 2.
Describedly by electroplating technology, oxidation-resistant material is attached to the surface of palladium-silver pad away from ceramic substrate, the step forming anti oxidation layer comprises:
Step 221, on described palladium-silver pad coating containing gold or the electrolyte 1 of nickel ion 3;
Step 222, connect the positive pole of rectifier 4 in the surface electrical that contacts with air of electrolyte 1 of coating;
Step 223, be connected the negative pole of rectifier 4 at electrolyte 1 with the surface of palladium-silver contact pads;
Step 224, conduct rectifier 4, complete plating.
It will be appreciated by those skilled in the art that, the manufacture method of the ceramic substrate circuit board 2 that the present embodiment provides, except the technique effect of manufacture method with the ceramic substrate circuit board 2 that embodiment one provides, also there is electrolyte 1 demand few, be more applicable for the more level and smooth partially plating gold of coating zone or nickel technique.
Embodiment four
As shown in Figure 3, the present embodiment provides a kind of manufacture method of ceramic substrate circuit board 2, comprises the steps:
Step 1, by sintering process, palladium-silver slurry is embedded on ceramic substrate, forms palladium-silver pad;
Step 2, by electroplating technology, oxidation-resistant material is attached to the surface of palladium-silver pad away from ceramic substrate, forms anti oxidation layer.
It will be understood by those skilled in the art that and be attached on palladium-silver pad by electroplating technology by anti oxidation layer, anti oxidation layer structure is more smooth stable, effectively can improve the overall performance of ceramic substrate circuit board 2.In addition, compared with scolding tin solder technology of the prior art, owing to eliminating soldering-tin layer between anti oxidation layer and palladium-silver pad, thus effectively can reducing the thickness of ceramic substrate circuit board 2, providing more design space to utilizing the electronic product of this circuit board fabrication.Again in addition, because palladium just can as catalyst in traditional electroplating technology, and containing palladium composition in palladium-silver slurry, the ceramic substrate circuit board 2 that the present embodiment provides can omit the process of plating palladium when electroplating anti oxidation layer, utilize the characteristic of palladium-silver slurry itself, directly in electrolyte 1, realize plating anti oxidation layer.Further, at the outer surface attachment anti oxidation layer of described palladium-silver pad away from described ceramic substrate, advantageously in routing and the binding technique of carrying out subsequent handling on ceramic substrate, as adopted aluminium material, gold or nickel material or nickel material to carry out routing technique, tension pull out force is better.
Described oxidation-resistant material is metallic gold or nickel.It will be understood by those skilled in the art that non-oxidizability and the resistance to wear of gold or nickel are good, effectively can improve non-oxidizability and the resistance to wear of ceramic substrate circuit board 2, extend the useful life of ceramic substrate circuit board 2.
Describedly by electroplating technology, oxidation-resistant material is attached to the surface of palladium-silver pad away from ceramic substrate, the step forming anti oxidation layer comprises:
Step 231, the conduit 5 of electrolyte 1 be perfused with containing gold or nickel ion 3 is set in palladium-silver pad upper end;
Step 232, by palladium-silver pad electrical connection rectifier 4 negative pole;
Step 233, electrolyte 1 is electrically connected the positive pole of rectifier 4;
Step 224, conduct rectifier 4, complete plating.
It will be appreciated by those skilled in the art that, the manufacture method of the ceramic substrate circuit board 2 that the present embodiment provides, not only there is the technique effect of the manufacture method of the ceramic substrate circuit board 2 that embodiment one provides, and the less-in-demand advantage of electrolyte 1 that the manufacture method of ceramic substrate circuit board 2 that provides of embodiment two has, also there is electrolyte 1 flowing arrange, the advantage that electrolyte 1 thickness controllability is high, can realize the gold-plated of the rough plane of out-of-flatness or nickel requirement better.
Embodiment five
The present embodiment provides a kind of manufacture method of ceramic substrate circuit board 2, comprises the steps:
Step 1, by sintering process, palladium-silver slurry is embedded on ceramic substrate, forms palladium-silver pad;
Step 2, by electroplating technology, oxidation-resistant material is attached to the surface of palladium-silver pad away from ceramic substrate, forms anti oxidation layer.
It will be understood by those skilled in the art that and be attached on palladium-silver pad by electroplating technology by anti oxidation layer, anti oxidation layer structure is more smooth stable, effectively can improve the overall performance of ceramic substrate circuit board 2.In addition, compared with scolding tin solder technology of the prior art, owing to eliminating soldering-tin layer between anti oxidation layer and palladium-silver pad, thus effectively can reducing the thickness of ceramic substrate circuit board 2, providing more design space to utilizing the electronic product of this circuit board fabrication.Again in addition, because palladium just can as catalyst in traditional electroplating technology, and containing palladium composition in palladium-silver slurry, the ceramic substrate circuit board 2 that the present embodiment provides can omit the process of plating palladium when electroplating anti oxidation layer, utilize the characteristic of palladium-silver slurry itself, directly in electrolyte 1, realize plating anti oxidation layer.Further, at the outer surface attachment anti oxidation layer of described palladium-silver pad away from described ceramic substrate, advantageously in routing and the binding technique of carrying out subsequent handling on ceramic substrate, as adopted aluminium material, gold or nickel material or nickel material to carry out routing technique, tension pull out force is better.
Described oxidation-resistant material is metallic gold or nickel.It will be understood by those skilled in the art that non-oxidizability and the resistance to wear of gold or nickel are good, effectively can improve non-oxidizability and the resistance to wear of ceramic substrate circuit board 2, extend the useful life of ceramic substrate circuit board 2.
Describedly by electroplating technology, oxidation-resistant material is attached to the surface of palladium-silver pad away from ceramic substrate, the step forming anti oxidation layer comprises:
Step 241, one mould is set along the environmental seal of described palladium-silver pad, thus forms a confined space;
Step 242, on described palladium-silver pad coating containing gold or the electrolyte 1 of nickel ion 3;
Step 243, connect the positive pole of rectifier 4 in the surface electrical that contacts with air of electrolyte 1 of coating;
Step 244, be connected the negative pole of rectifier 4 at electrolyte 1 with the surface of palladium-silver contact pads;
Step 245, conduct rectifier 4, complete plating.
It will be appreciated by those skilled in the art that, the manufacture method of the ceramic substrate circuit board 2 that the present embodiment provides, except the technique effect of manufacture method with the ceramic substrate circuit board 2 that embodiment one provides, also there is the advantage that plating shape is more regular, be more applicable for and need local electric regional compare that is gold-plated or nickel many and the situation that shape is more regular.
Last it is noted that above embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to previous embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (8)
1. a ceramic substrate circuit board, it is characterized in that: comprise ceramic substrate, be embedded in palladium-silver pad on ceramic substrate and anti oxidation layer by sintering process, described anti oxidation layer is attached to the outer surface of described palladium-silver pad away from described ceramic substrate by electroplating technology.
2. ceramic substrate circuit board as claimed in claim 1, is characterized in that: described anti oxidation layer is that gold or nickel material are made.
3. a manufacture method for ceramic substrate circuit board, is characterized in that, comprises the steps:
Step 1, by sintering process, palladium-silver slurry is embedded on ceramic substrate, forms palladium-silver pad;
Step 2, by electroplating technology, oxidation-resistant material is attached to the surface of palladium-silver pad away from ceramic substrate, forms anti oxidation layer.
4. manufacture method as claimed in claim 3, is characterized in that: described oxidation-resistant material is metallic gold or nickel.
5. manufacture method as claimed in claim 4, is characterized in that: describedly by electroplating technology, oxidation-resistant material is attached to the surface of palladium-silver pad away from ceramic substrate, and the step forming anti oxidation layer comprises:
Step 211, by sintering have the ceramic substrate of palladium-silver pad be inserted into containing gold or nickel ion electrolyte in;
Step 212, described palladium-silver pad is connected electrically in the negative pole of rectifier;
Step 213, conduct rectifier, complete plating.
6. manufacture method as claimed in claim 5, is characterized in that, before the described step having the ceramic substrate of palladium-silver pad to be inserted in the electrolyte containing gold or nickel ion sintering, further comprising the steps of:
Environmental seal along described palladium-silver pad arranges a mould, thus forms a confined space.
7. manufacture method as claimed in claim 4, is characterized in that:
Step 221, on described palladium-silver pad coating containing gold or the electrolyte of nickel ion;
Step 222, connect the positive pole of rectifier in the surface electrical that contacts with air of electrolyte of coating;
Step 223, be connected the negative pole of rectifier at electrolyte with the surface of palladium-silver contact pads;
Step 224, conduct rectifier, complete plating.
8. manufacture method as claimed in claim 4, is characterized in that: describedly by electroplating technology, oxidation-resistant material is attached to the surface of palladium-silver pad away from ceramic substrate, and the step forming anti oxidation layer comprises:
Step 231, the conduit of electrolyte be perfused with containing gold or nickel ion is set in palladium-silver pad upper end;
Step 232, by palladium-silver pad electrical connection rectifier negative pole;
Step 233, electrolyte is electrically connected the positive pole of rectifier;
Step 224, conduct rectifier, complete plating.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910038127.5A CN109661102B (en) | 2015-11-03 | 2015-11-03 | Ceramic substrate circuit board and method for manufacturing the same |
| CN201510734507.4A CN105338734B (en) | 2015-11-03 | 2015-11-03 | Ceramic substrate circuit board and its manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510734507.4A CN105338734B (en) | 2015-11-03 | 2015-11-03 | Ceramic substrate circuit board and its manufacturing method |
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| CN201910038127.5A Division CN109661102B (en) | 2015-11-03 | 2015-11-03 | Ceramic substrate circuit board and method for manufacturing the same |
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| CN105338734A true CN105338734A (en) | 2016-02-17 |
| CN105338734B CN105338734B (en) | 2019-05-21 |
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| CN201910038127.5A Active CN109661102B (en) | 2015-11-03 | 2015-11-03 | Ceramic substrate circuit board and method for manufacturing the same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135081A (en) * | 2017-12-21 | 2018-06-08 | 昆山福烨电子有限公司 | A kind of ceramic substrate circuit board |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101219588A (en) * | 2007-01-05 | 2008-07-16 | 株式会社URi精镀 | Plating type double metal piece and its manufacturing method |
| JP2009026982A (en) * | 2007-07-20 | 2009-02-05 | Sit:Kk | Electronic device and manufacturing method therefor |
| CN101409275A (en) * | 2007-11-28 | 2009-04-15 | 上海长丰智能卡有限公司 | Double-interface smart card module and loading belt |
| CN102110616A (en) * | 2009-12-25 | 2011-06-29 | 华东光电集成器件研究所 | Method for realizing thin film multilayer wiring on low temperature cofired ceramic (LTCC) substrate |
| CN103037626A (en) * | 2012-06-11 | 2013-04-10 | 北京凯迪思电路板有限公司 | Circuit board surface treatment method by electroplating process |
| CN202979463U (en) * | 2012-03-02 | 2013-06-05 | 深圳市明陶材料技术有限公司 | Circuit board with ceramic substrate |
| CN103904172A (en) * | 2014-03-19 | 2014-07-02 | 浙江竞达齐泰科技有限公司 | Method for welding LED chip to ceramic body through ultrasonic waves at normal temperature |
| CN104080273A (en) * | 2014-07-04 | 2014-10-01 | 中国航天科技集团公司第五研究院第五一三研究所 | LCCC ceramic transfer base |
| CN205491441U (en) * | 2015-11-03 | 2016-08-17 | 畅博电子(上海）有限公司 | ceramic substrate circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI336220B (en) * | 2003-06-20 | 2011-01-11 | Japan Circuit Ind Co Ltd | A method of forming a high density printed wiring board for mounting a semiconductor |
-
2015
- 2015-11-03 CN CN201510734507.4A patent/CN105338734B/en active Active
- 2015-11-03 CN CN201910038127.5A patent/CN109661102B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101219588A (en) * | 2007-01-05 | 2008-07-16 | 株式会社URi精镀 | Plating type double metal piece and its manufacturing method |
| JP2009026982A (en) * | 2007-07-20 | 2009-02-05 | Sit:Kk | Electronic device and manufacturing method therefor |
| CN101409275A (en) * | 2007-11-28 | 2009-04-15 | 上海长丰智能卡有限公司 | Double-interface smart card module and loading belt |
| CN102110616A (en) * | 2009-12-25 | 2011-06-29 | 华东光电集成器件研究所 | Method for realizing thin film multilayer wiring on low temperature cofired ceramic (LTCC) substrate |
| CN202979463U (en) * | 2012-03-02 | 2013-06-05 | 深圳市明陶材料技术有限公司 | Circuit board with ceramic substrate |
| CN103037626A (en) * | 2012-06-11 | 2013-04-10 | 北京凯迪思电路板有限公司 | Circuit board surface treatment method by electroplating process |
| CN103904172A (en) * | 2014-03-19 | 2014-07-02 | 浙江竞达齐泰科技有限公司 | Method for welding LED chip to ceramic body through ultrasonic waves at normal temperature |
| CN104080273A (en) * | 2014-07-04 | 2014-10-01 | 中国航天科技集团公司第五研究院第五一三研究所 | LCCC ceramic transfer base |
| CN205491441U (en) * | 2015-11-03 | 2016-08-17 | 畅博电子(上海）有限公司 | ceramic substrate circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135081A (en) * | 2017-12-21 | 2018-06-08 | 昆山福烨电子有限公司 | A kind of ceramic substrate circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109661102A (en) | 2019-04-19 |
| CN105338734B (en) | 2019-05-21 |
| CN109661102B (en) | 2021-10-26 |
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Effective date of registration: 20220831 Address after: Building 2, No. 383, Xingye Road, Pinghu Economic Development Zone, Jiaxing City, Zhejiang Province, 314200 Patentee after: PINGHU WEIGEBOER ELECTRICAL APPLIANCE Co.,Ltd. Address before: 1st and 2nd Floor, No. 36 Factory Building, No. 215, Debao Road, Pudong New Area, Shanghai, 200131 Patentee before: TRANSPO ELECTRONICS SHANGHAI LTD. |