CN104080273A - LCCC ceramic transfer base - Google Patents
LCCC ceramic transfer base Download PDFInfo
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- CN104080273A CN104080273A CN201410318938.8A CN201410318938A CN104080273A CN 104080273 A CN104080273 A CN 104080273A CN 201410318938 A CN201410318938 A CN 201410318938A CN 104080273 A CN104080273 A CN 104080273A
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- lccc
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Abstract
The invention provides an LCCC ceramic transfer base used for transferring an LCCC encapsulation device to a printed board. The LCCC ceramic transfer base comprises welding plates, a ceramic substrate and pins, the welding plates and the pins are located on the two sides of the ceramic substrate, the ceramic substrate is made of Al2O3, each edge of the ceramic substrate is 4 mm longer than the corresponding edge of the LCCC encapsulation device, and the ceramic substrate is 1-2 mm thick. Each welding plate is rectangular and 1 mm long and 0.5 mm wide, and the welding plates are formed by printing tungsten metallized sizing on the upper side face of the ceramic substrate. The welding plates are printed after the two ends of each edge of the ceramic substrate are 2 mm shorter, the long edge of each welding plate is perpendicular to the corresponding edge of the ceramic substrate, and the center distance between the welding plates is 1 mm. The pins are made of iron-nickel alloy and are fixedly welded to the lower side face of the ceramic substrate through silver-copper solder, and the pins are cylinders with the diameter of 0.46 mm and the height of 4.6 mm. Three rows of the pins are distributed on each edge of the ceramic substrate according to a printed board wiring handbook.
Description
Technical field
The invention belongs to space technology field, relate in particular to a kind of LCCC pottery adapter.
Background technology
At present, on space flight type product, the application of LCCC packaged chip is all directly on epoxy resin bonded fiber, to raise 0.2mm welding, but this mounting means is in early stage engineer testing proof procedure, LCCC packaging solder joint is after 200 qualification level temperature cycling tests, although electrical property is normal, but after metallographic sectility, observe pin underbead crack and exceeded 50 percent of solder joint pith, there is pin cracking phenomena, can not meet the technical requirement that aerospace electron product surface mounts, therefore in type product application, have serious hidden danger of quality.
Summary of the invention
For addressing the above problem, the invention provides a kind of LCCC pottery adapter, can compensate the thermal expansion coefficient difference between different materials, solve the problem that pin ruptures under high low temperature loop condition.
A kind of LCCC pottery adapter of the present invention, for LCCC packaging is transferred to printed panel, and: described LCCC pottery adapter comprises: pad, ceramic matrix, pin, and described pad and described in
Pin is positioned on two faces of described ceramic matrix;
Wherein:
Described ceramic matrix, material is Al
2o
3, LCCC described in every side ratio
The many 4mm of the corresponding length of side of packaging, thickness is 1-2mm;
Described pad, is rectangle, and long 1mm, wide 0.5mm adopt the printing of tungsten metallization slurry to form at described ceramic matrix upper side; After the two ends, every limit of described ceramic matrix deduct 2mm, print multiple pads, the long limit of each pad is perpendicular to the limit of corresponding ceramic matrix, and the centre distance between pad is 1mm;
Described pin, material is iron-nickel alloy, adopts silver-copper brazing alloy to be welded and fixed with described ceramic matrix downside, is that diameter is 0.46, the high cylinder for 4.6mm; Pin is furnished with three rows by printed panel wiring handbook on every limit of ceramic matrix.
Further, the invention provides a kind of production procedure of ceramic matrix, this ceramic matrix is the ceramic matrix in above-mentioned LCCC pottery adapter; The production procedure of described ceramic matrix comprises:
Step 1, carries out curtain coating to alumina powder, obtains curtain coating material;
Step 2, is sliced into single ceramic chips by curtain coating material, and this single ceramic chips is rushed after chamber and punching are processed and adopted
Carry out hole metallization filling with tungsten metallization, obtain the ceramics that is filled with tungsten metallization slurry;
Step 3, carries out surface printing interconnection line figure to being filled with the ceramics of tungsten metallization slurry, obtains individual layer printed matter;
Step 4, through location, lamination, carry out high temperature sintering after forming single green part after earnestly, forms ripe porcelain piece by 6 individual layers;
Step 5, determines the pad locations of ripe porcelain piece, and pad is carried out to nickel plating, soldering and gold-plated rear acquisition ceramic matrix.
Further, described pad also needs through nickel plating and gold-plated processing after adopting the printing of tungsten metallization slurry to form.
Further, described pin also needs through nickel plating, gold-plated and edging processing after adopting silver-copper brazing alloy to be welded and fixed.
Beneficial effect of the present invention is:
The present invention is by having adopted with the Ceramic Art Design of packaging same material a ceramic adapter, instead of direct as prior art packaging is directly welded on printed panel, thermal stress, mechanical stress and the external stress of scolder are not born by solder joint entirely, and jointly born by ceramic adapter and solder joint, and lead-in wire in ceramic adapter pin also can discharge certain stress, can compensate the thermal expansion coefficient difference between different materials, prevent that solder joint ruptures in interface in the time of thermal cycle.
LCCC packaging solder joint of the present invention is after 200 qualification level temperature cycling tests, after metallographic sectility, observe pin underbead crack and all do not exceed 25 percent of solder joint pith, meet the technical requirement that aerospace electron product surface mounts, solved the problem that pin ruptures under high low temperature loop condition.
Brief description of the drawings
Fig. 1 is LCCC pottery adapter finished product schematic diagram of the present invention;
Fig. 2 is the schematic diagram that is related to of the ceramic matrix of LCCC of the present invention pottery adapter and pad;
Fig. 3 is the pin arrangement schematic diagram of LCCC pottery adapter of the present invention.
Embodiment
Fig. 1 is LCCC pottery adapter finished product schematic diagram of the present invention.As shown in Figure 1, LCCC pottery adapter is divided into three parts: pad (1), ceramic matrix (2), pin (3).
Fig. 2 is the schematic diagram that is related to of the ceramic matrix of LCCC of the present invention pottery adapter and pad.As shown in Figure 2, LCCC pottery adapter is of a size of the LCCC device length of side and grows 4mm, and thickness is 1.5mm left and right.Ceramic matrix production technology is introduced: after alumina powder jointed preparation completes, carry out curtain coating, curtain coating material is sliced into single ceramic chips, behind punching/chamber, adopt tungsten metallization to carry out hole metallization filling, then adopt tungsten metallization slurry to carry out surface printing interconnection line figure, after multilayer completes, form single green part through location, lamination, after earnestly, carry out again high temperature sintering, form ripe porcelain piece, riper porcelain piece is carried out to nickel plating.Pottery inside is totally 6 layers of cabling (determine the number of plies of cabling according to number of leads or density, know and arrange that 6 layers of cabling effect are best herein through experiment), the about 0.25mm of every layer thickness, and gross thickness is 1.5mm.
Pad production technology is introduced: the top pads forming in the printing of tungsten metallization slurry, and through nickel plating, gold-platedly complete final pad.The long 1mm of bottom pad, wide 0.5mm, centre-to-centre spacing 1mm.On ceramic matrix, form Bondingpaddesign comparative maturity with tungsten nickel gold, according to printed panel wiring rule printing pad in prior art.
Fig. 3 is the pin arrangement schematic diagram of LCCC pottery adapter of the present invention.Bottom legs production technology is introduced: the iron-nickel alloy that pin material selection strength ratio is higher, be used for supporting ceramics seat and device weight, be highly 4.6mm, diameter 0.46mm, put in order as each three rows in four sides, ceramic member and pin adopt silver-copper brazing alloy high-temperature soldering, carry out that nickel plating is gold-plated, form single ceramic adapter finished product after edging after completing, and arrange pin according to printed panel wiring rule in prior art.
Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art are when making according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (4)
1. a LCCC pottery adapter, for LCCC packaging is transferred to printed panel, is characterized in that,
Described LCCC pottery adapter comprises: pad, ceramic matrix, pin, and described pad and described pin are positioned on two faces of described ceramic matrix;
Wherein:
Described ceramic matrix, material is Al
2o
3, the many 4mm of the corresponding length of side of LCCC packaging described in every side ratio, thickness is 1-2mm;
Described pad, is rectangle, and long 1mm, wide 0.5mm adopt the printing of tungsten metallization slurry to form at described ceramic matrix upper side; After the two ends, every limit of described ceramic matrix deduct 2mm, print multiple pads, the long limit of each pad is perpendicular to the limit of corresponding ceramic matrix, and the centre distance between pad is 1mm;
Described pin, material is iron-nickel alloy, adopts silver-copper brazing alloy to be welded and fixed with described ceramic matrix downside, is that diameter is 0.46, the high cylinder for 4.6mm; Pin is furnished with three rows by printed panel wiring handbook on every limit of ceramic matrix.
2. a production procedure for ceramic matrix, is characterized in that, this ceramic matrix is the ceramic matrix in LCCC pottery adapter claimed in claim 1; The production procedure of described ceramic matrix comprises:
Step 1, carries out curtain coating to alumina powder, obtains curtain coating material;
Step 2, is sliced into single ceramic chips by curtain coating material, and this single ceramic chips is rushed after chamber and punching are processed and adopts tungsten metallization to carry out hole metallization filling, obtains the ceramics that is filled with tungsten metallization slurry;
Step 3, carries out surface printing interconnection line figure to being filled with the ceramics of tungsten metallization slurry, obtains individual layer printed matter;
Step 4, through location, lamination, carry out high temperature sintering after forming single green part after earnestly, forms ripe porcelain piece by 6 individual layers;
Step 5, determines the pad locations of ripe porcelain piece, and pad is carried out to nickel plating, soldering and gold-plated rear acquisition ceramic matrix.
3. LCCC pottery adapter as claimed in claim 1, is characterized in that, described pad also needs through nickel plating and gold-plated processing after adopting the printing of tungsten metallization slurry to form.
4. LCCC pottery adapter as claimed in claim 1, is characterized in that, described pin also needs through nickel plating, gold-plated and edging processing after adopting silver-copper brazing alloy to be welded and fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410318938.8A CN104080273A (en) | 2014-07-04 | 2014-07-04 | LCCC ceramic transfer base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410318938.8A CN104080273A (en) | 2014-07-04 | 2014-07-04 | LCCC ceramic transfer base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104080273A true CN104080273A (en) | 2014-10-01 |
Family
ID=51601255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410318938.8A Pending CN104080273A (en) | 2014-07-04 | 2014-07-04 | LCCC ceramic transfer base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104080273A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105338734A (en) * | 2015-11-03 | 2016-02-17 | 畅博电子(上海）有限公司 | Ceramic substrate circuit board and manufacturing method thereof |
| CN106216791A (en) * | 2016-08-08 | 2016-12-14 | 北方电子研究院安徽有限公司 | Space welding and assembling method bottom the one of LCCC device |
| CN107148161A (en) * | 2017-05-27 | 2017-09-08 | 中国运载火箭技术研究院 | Electronic component prong sizes converter and preparation method thereof |
| CN112122732A (en) * | 2020-09-23 | 2020-12-25 | 西安微电子技术研究所 | Adapter plate and method for welding LCCC device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989005570A1 (en) * | 1987-12-08 | 1989-06-15 | Rogers Corporation | Mounting substrate for leadless ceramic chip carrier |
| US20030032362A1 (en) * | 2000-01-28 | 2003-02-13 | Schueller Randolph D. | Package structure for mounting a field emitting device in an electron gun |
| CN103681593A (en) * | 2013-12-02 | 2014-03-26 | 江苏省宜兴电子器件总厂 | Leadless ceramic chip carrier packaging structure and process for manufacturing same |
-
2014
- 2014-07-04 CN CN201410318938.8A patent/CN104080273A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989005570A1 (en) * | 1987-12-08 | 1989-06-15 | Rogers Corporation | Mounting substrate for leadless ceramic chip carrier |
| US20030032362A1 (en) * | 2000-01-28 | 2003-02-13 | Schueller Randolph D. | Package structure for mounting a field emitting device in an electron gun |
| CN103681593A (en) * | 2013-12-02 | 2014-03-26 | 江苏省宜兴电子器件总厂 | Leadless ceramic chip carrier packaging structure and process for manufacturing same |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105338734A (en) * | 2015-11-03 | 2016-02-17 | 畅博电子(上海）有限公司 | Ceramic substrate circuit board and manufacturing method thereof |
| CN106216791A (en) * | 2016-08-08 | 2016-12-14 | 北方电子研究院安徽有限公司 | Space welding and assembling method bottom the one of LCCC device |
| CN107148161A (en) * | 2017-05-27 | 2017-09-08 | 中国运载火箭技术研究院 | Electronic component prong sizes converter and preparation method thereof |
| CN112122732A (en) * | 2020-09-23 | 2020-12-25 | 西安微电子技术研究所 | Adapter plate and method for welding LCCC device |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141001 |
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| RJ01 | Rejection of invention patent application after publication |