CN105334580B - A kind of wavelength division multiplexed light receiving unit - Google Patents
A kind of wavelength division multiplexed light receiving unit Download PDFInfo
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- CN105334580B CN105334580B CN201510833786.XA CN201510833786A CN105334580B CN 105334580 B CN105334580 B CN 105334580B CN 201510833786 A CN201510833786 A CN 201510833786A CN 105334580 B CN105334580 B CN 105334580B
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- wavelength
- waveguide
- division multiplex
- chip
- optical waveguide
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29301—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means based on a phased array of light guides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
- H04B10/66—Non-coherent receivers, e.g. using direct detection
- H04B10/67—Optical arrangements in the receiver
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The invention discloses a kind of wavelength division multiplexed light receiving units, wavelength-division multiplex chip (1) is integrated containing planar optical waveguide, photo detector chip array (2), optical fiber component (3), the coupling port (31) of the optical fiber component (3) is Nian Jie with integrated wavelength-division multiplex chip (1) the input terminal coupling of planar optical waveguide, the photo detector chip array (2) is located at the lower section that planar optical waveguide integrates wavelength-division multiplex chip output face (12), the photosurface (21 of the photo detector chip array, 22, 23, 24 ...) output waveguide (121 of wavelength-division multiplex chip (1) is integrated with planar optical waveguide, 122, 123, 124 ...) corresponding alignment；The planar optical waveguide integrates wavelength-division multiplex chip output face (12) and waveguide surface (13) constitute 40~50 ° of angles, export output end face (12) can the light that be parallel to waveguide surface (13) reflection from waveguide surface and couples with the photosurface of photo detector chip array.Wavelength-division multiplex chip is integrated present invention employs planar optical waveguide and completes the demultiplexing of optical signal, and makees reflective surface using the output end face that planar optical waveguide integrates wavelength-division multiplex chip, has further used optical fiber component as light input channel.Present invention greatly simplifies light channel structures, enhance stability of layout, reduce coupling package difficulty, so that wavelength division multiplexed light receiving unit is integrated, it is cost effective.
Description
Technical field
The present invention relates to a kind of light-receiving components, in particular to wavelength division multiplexed light receiving unit, belong to optical communication field.
Background technique
Data center and high-performance calculation are increasingly harsh using proposing to optical assembly transmission rate and package dimension
It is required that.It addresses that need, IEEE organizes tailor IEEE802.ba specification, which specifies 40G and 100G ether
Net transmission standard.Using CWDM/Lan-WDM wavelength-division multiplex technique, 40G/100G transmission rate is realized, and meet special package ruler
Very little optical assembly is the huge challenge that current optical communication field faces.
Existing CWDM/Lan-WDM wavelength division multiplexed light receiving unit light channel structure is mostly: after light enters input port, by
One collimated focuses, and into filter set, wavelength (de) multiplexing is realized in multiple roundtrip filtering in filter set, then again
By the second lens group, focus on optical detector.This space optics structure that wavelength-division demultiplexing is realized using optical filter, light
Road is extremely complex, first has to single filter unit is accurately combined into certain sequence a multi-channel filter group, so
Realize the optical path coupling between light input port, at least two lens groups, multi-channel filter group and detector, coupling again afterwards
Encapsulation difficulty is very big.This is minimized with optical device, integrated developing direction runs in the opposite direction.
Planar optical waveguide integrates wavelength-division multiplex chip, and multiplexing and the demultiplexing of wavelength can be realized in chip-scale, uses it
Space optics optical filter is replaced, many and diverse space optics assembly is avoided, packaging efficiency can be greatly improved, it is reliable to increase optical path
Property and stability.The output end face that another aspect planar optical waveguide integrates wavelength-division multiplex chip can be easily processed into various
Specific shape, this also considerably increases the flexibility of the light path design between output waveguide and optical detector.
Furthermore channel of the optical fiber component as optical signal disengaging optical device is widely used in various optical passive component encapsulation.So
And in active optical component encapsulation field, especially light-receiving component internal use optical fiber component as light input channel there has been no
Using.If replacing the components such as input port, the lens in existing wavelength division multiplexed light receiving unit with optical fiber component, as light into
Enter the channel of wavelength division multiplexed light receiving unit, to reduction optical device cost, coupling can be improved to avoid complicated Lens Coupling technique
It is very helpful to close efficiency.
In conclusion existing wavelength division multiplexed light receiving unit realizes wavelength (de) multiplexing with space optics optical filter；It uses up defeated
The components such as inbound port, lens produce and its complicated light channel structure as light input channel, greatly choose to packaging technology generation
War.And existing planar optical waveguide integrates the advantage of wavelength-division multiplex chip and optical fiber component not in wavelength division multiplexed light receiving unit
In embody.
Summary of the invention
In order to overcome the shortage of prior art, planar optical waveguide is made full use of to integrate the excellent of wavelength-division multiplex chip and optical fiber component
Gesture, the present invention propose a kind of new wavelength division multiplexed light receiving unit.
The technical scheme is that
A kind of wavelength division multiplexed light receiving unit integrates wavelength-division multiplex chip, photo detector chip battle array comprising planar optical waveguide
The coupling port of column, optical fiber component, the optical fiber component is Nian Jie with the integrated wavelength-division multiplex chip input terminal coupling of planar optical waveguide,
The photo detector chip array is located at the lower section that planar optical waveguide integrates wavelength-division multiplex chip output face, the optical detector
The photosurface of chip array is accordingly aligned with the output waveguide that planar optical waveguide integrates wavelength-division multiplex chip；The planar optical waveguide
Integrated wavelength-division multiplex chip output face, which constitutes angle with waveguide surface, enables output end face to reflect into the light for being incident in waveguide surface
Enter the photosurface coupling of photo detector chip array.
Further, it is 40 ° that the planar optical waveguide, which integrates wavelength-division multiplex chip output face and waveguide surface composition angle,
~50 °.
Preferably, the planar optical waveguide integrate wavelength-division multiplex chip output face and waveguide surface constitute that angle is set as can
It is totally reflected incident light in output end face.
Preferably, the planar optical waveguide integrates wavelength-division multiplex chip output face and is set as with waveguide surface composition angle
40°
Further, the planar optical waveguide integrates wavelength-division multiplex chip output face, and being coated with makes the plane light wave
Lead reflectance coating of the reflectivity greater than 80% that integrated wavelength-division multiplex chip output faces light energy in output waveguide.
Further, the optical fiber component is made of light input port, optical fiber, coupling port, light input port and coupling
It closes port and is respectively arranged in the optical fiber both ends.
Still further, the light input port is LC type optical interface.
Still further, the coupling port is the capillary glass tube of end face polishing.
Still further, the planar optical waveguide integrates the output waveguide and the photo detector chip of wavelength-division multiplex chip
Array photosurface port number having the same and channel spacing.
Still further, the waveguide surface that the planar optical waveguide integrates wavelength-division multiplex chip is bonded with cover glass, glass
Coverslip thickness is slightly larger than the thickness of photo detector chip array, and cover glass, photo detector chip array are adhesively fixed on cushion block
On or the planar optical waveguide integrate wavelength-division multiplex chip waveguide face without cover glass, the waveguide surface and optical detector core
Chip arrays are directly bonded on fixed cushion block.
The relatively existing wavelength division multiplexed light receiving unit advantage of the present invention is: the present invention by existing light-receiving component point
Vertical space optics structure is substituted for integrated, modular optical texture, and planar optical waveguide is made full use of to integrate wavelength-division multiplex
Chip output face cold processing technique is further simplified light channel structure, and the encapsulation for greatly reducing wavelength division multiplexed light receiving unit is difficult
Degree improves packaging efficiency, while also increasing the Stability and dependability of light-receiving component.
Detailed description of the invention
Fig. 1 is schematic structural diagram of the device of the invention；
Fig. 2 is optical fiber component schematic diagram of the present invention；
Fig. 3 is that the optical signal in waveguide of the present invention is reflected into optical detector photosurface coupling schematic diagram by output end face
Fig. 4 is one schematic diagram of embodiment of the present invention；
Fig. 5 is two schematic diagram of embodiment of the present invention；
Wherein:
1, planar optical waveguide integrates wavelength-division multiplex chip；
11, planar optical waveguide integrates wavelength-division multiplex chip input end face；
12, planar optical waveguide integrates wavelength-division multiplex chip output face；
13, planar optical waveguide integrates wavelength-division multiplex chip waveguide face；
121,122,123,124, planar optical waveguide integrates the output waveguide of wavelength-division multiplex chip；
14, cover glass；
2, photo detector chip array；
21,22,23, the 24, photosurface in each channel of photo detector chip；
3, optical fiber component；
31, the coupling port of optical fiber component is formed；
32, the optical fiber of optical fiber component is formed；
33, the input port of optical fiber component is formed；
4, encapsulating housing；
41, encapsulating housing optical interface；
5, cushion block；
6, reflectance coating；
Specific embodiment
Below by specific embodiment and in conjunction with attached drawing, the present invention will be further described.
Such as Fig. 1, shown in 2,3, the present invention includes that planar optical waveguide integrates wavelength-division multiplex chip 1, photo detector chip array
2, optical fiber component 3.Optical fiber component is made of coupling port 31, optical fiber 32 and light input port 33.32 one end of optical fiber is fixed
In capillary glass tube, end face is polished, and is formed the coupling port 31 of optical fiber component and is integrated wavelength-division with planar optical waveguide and answers
Bonding is coupled with the input end face 11 of chip.The other end of single-core fiber 32 is equipped with light input port 33, the light input port
For LC optical interface.The photo detector chip array 2 is in the planar optical waveguide and integrates wavelength-division multiplex chip output face 12
Underface, and be aligned with the reflected light path of output waveguide.The planar optical waveguide integrates wavelength-division multiplex chip output face 12
The reflecting surface of polishing, and with the waveguide surface 13 at 40~50 ° of angles, one contains λ 1, the multi-wavelength light of λ 2, λ 3, λ 4 ...
Signal inputs from light input port 33, passes sequentially through optical fiber 32, couples end face 31, is coupled into planar optical waveguide and integrates wave
Divide multiplexing chip 1.It is integrated in planar optical waveguide and realizes demultiplexing in wavelength-division multiplex chip 1, be divided into four tunnel individual wavelengths light λ 1, λ
2, λ 3, λ 4 ... then reflects on output end face 12, enters the photosensitive of the corresponding channel of photo detector chip array
On face 21,22,23,24 ....
Heretofore described planar optical waveguide integrates wavelength-division multiplex chip output face 12 and sets with the composition angle of waveguide surface 13
It is set to while incident light can be made to be totally reflected in output end face 12.
Embodiment one:
It is disposed as shown in figure 4, planar optical waveguide integrates wavelength-division multiplex chip 1, photodetector array chip 2, optical fiber component 3
In encapsulating housing 4.Wherein planar optical waveguide integrate wavelength-division multiplex chip input end face 11 be and optical fiber component coupling port
The same burnishing surface, and bond together with the coupling port of optical fiber component 31.It is defeated that planar optical waveguide integrates wavelength-division multiplex chip
End face 12 is uncoated burnishing surface out, and the face and waveguide surface 13 form 40 ° of angles, and the light in output waveguide is in output end face 12
It is upper to be totally reflected into optical detector.Photo detector chip array 2 is located at planar optical waveguide and integrates the output of wavelength-division multiplex chip
There is optical interface 41 on the reflected light path of the lower section of end face 12, on encapsulating housing, encapsulating housing is interior, and there are also cushion blocks 5.Light input port
33 are fixed at the optical interface 41 of encapsulating housing 4.
The waveguide surface 13 that planar optical waveguide integrates wavelength-division multiplex chip is bonded with cover glass 14, and cover glass 14 and light are visited
Device chip array 2 is surveyed to be adhesively fixed on cushion block 5 simultaneously.The thickness of cover glass 14 is slightly larger than the thickness of photo detector chip array
Degree, main purpose are that control planar optical waveguide integrates wavelength-division multiplex chip output waveguide and photodetector array chip photosurface
Between Longitudinal data distance, and ensure planar optical waveguide integrate wavelength-division multiplex chip 1 will not collide photo detector chip battle array
Column 2.
Embodiment two:
It is disposed as shown in figure 5, planar optical waveguide integrates wavelength-division multiplex chip 1, photodetector array chip 2, optical fiber component 3
In encapsulating housing 4.Wherein planar optical waveguide integrate wavelength-division multiplex chip input end face 11 be and optical fiber component coupling port
The same burnishing surface, and bond together with the coupling port of optical fiber component 31.It is defeated that planar optical waveguide integrates wavelength-division multiplex chip
End face 12 is polished out, and forms 50 ° of angles with waveguide surface 13, and the planar optical waveguide integrates wavelength-division multiplex chip output face
Reflectance coating is also coated on 12, reflectivity of the light in output waveguide in the face is greater than 80%.Photo detector chip array 2 is located at flat
Face optical waveguide integrates on the reflected light path of the lower section in wavelength-division multiplex chip output face 12, there is optical interface 41 on encapsulating housing, seals
Fill the interior also cushion block 5 of shell.Light input port 33 is fixed at the optical interface 41 of encapsulating housing 4.
Planar optical waveguide integrates the waveguide surface 13 of wavelength-division multiplex chip and photo detector chip array 2 is adhesively fixed simultaneously
On cushion block 5.Wherein the location of photo detector chip array 2 is slightly below the wave that planar optical waveguide integrates wavelength-division multiplex chip
Guide face 13.
This embodiment and the difference of embodiment one are that output end face 12 and waveguide surface 13 are arranged in embodiment one
For 40 ° of total reflection angle, and output end face 12 and 13 angle of waveguide surface are 50 ° in this embodiment, and by planar light
Waveguide, which integrates plating reflectance coating 6 on wavelength-division multiplex chip output face 12 and realizes, is higher than 80% reflection to the light energy in output waveguide
Rate.
This embodiment and embodiment one another difference is that, planar optical waveguide integrates wavelength-division in this embodiment
There is no cover glass on multiplexing chip waveguide surface 13, but is directly anchored on cushion block 5.
The present invention and existing light-receiving component the difference is that: existing light-receiving component realizes wavelength using filter set
Demultiplexing, and the present invention integrates wavelength-division multiplex chip using planar optical waveguide and realizes wavelength (de) multiplexing；Existing light-receiving component
Optical signal is by being coupled on photo detector chip photosurface after lens shaping, and optical signal of the invention is by planar light
Waveguide integrates wavelength-division multiplex chip output face and is directly reflected on optical detector photosurface；Existing light-receiving component uses saturating
Mirror will be coupled into wavelength-division multiplex chip after the light shaping of light input port, and light of the present invention passes through optical fiber component for optical signal
It is directly coupled into wavelength-division multiplex chip.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to of the invention
Protection scope.
Claims (9)
1. a kind of wavelength division multiplexed light receiving unit, it is characterised in that: integrate wavelength-division multiplex chip (1), light including planar optical waveguide
Detector chip array (2), optical fiber component (3), the coupling port (31) and planar optical waveguide of the optical fiber component (3) integrate wave
Divide multiplexing chip (1) input terminal coupling bonding, the photo detector chip array (2) is located at planar optical waveguide and integrates wavelength-division multiplex
The lower section in chip output face (12), the photosurface (21,22,23,24 ...) and planar light of the photo detector chip array
The output waveguide (121,122,123,124 ...) that waveguide integrates wavelength-division multiplex chip (1) is accordingly aligned；The planar optical waveguide
Integrated wavelength-division multiplex chip output face (12) and waveguide surface (13) composition angle, which are 40 °~50 °, incite somebody to action output end face (12) can
The light for being incident in waveguide surface (13) is reflected into the photosurface coupling of photo detector chip array.
2. a kind of wavelength division multiplexed light receiving unit according to claim 1, it is characterised in that: the planar optical waveguide is integrated
Wavelength-division multiplex chip output face (12) and waveguide surface (13) constitute angle and are configured such that incident light is sent out in output end face (12)
Raw total reflection.
3. a kind of wavelength division multiplexed light receiving unit according to claim 2, it is characterised in that: the planar optical waveguide is integrated
Wavelength-division multiplex chip output face (12) and waveguide surface (13) constitute angle and are set as 40 °.
4. a kind of wavelength division multiplexed light receiving unit according to claim 1, it is characterised in that: the planar optical waveguide is integrated
Wavelength-division multiplex chip output face (12) be coated with make the planar optical waveguide integrate wavelength-division multiplex chip output face (12) for
The reflectivity of light energy is greater than 80% reflectance coating in output waveguide.
5. a kind of wavelength division multiplexed light receiving unit according to claim 1, it is characterised in that: the optical fiber component (3) by
Light input port (33), optical fiber (32), coupling port (31) composition, light input port (33) are installed respectively with coupling port (31)
In the optical fiber (32) both ends.
6. a kind of wavelength division multiplexed light receiving unit according to claim 5, it is characterised in that: the light input port (33)
For LC type optical interface.
7. a kind of wavelength division multiplexed light receiving unit according to claim 5, it is characterised in that: the coupling port (31) is
The capillary glass tube of end face polishing.
8. a kind of wavelength division multiplexed light receiving unit according to claim 1, it is characterised in that: the planar optical waveguide is integrated
The output waveguide (121,122,123,124 ...) of wavelength-division multiplex chip and the photo detector chip array photosurface (21,
22,23,24 ...) port number and channel spacing having the same.
9. a kind of wavelength division multiplexed light receiving unit according to claim 1 or 4, it is characterised in that: the planar optical waveguide
The waveguide surface of integrated wavelength-division multiplex chip is bonded with cover glass (14), and cover glass (14) thickness is slightly larger than photo detector chip
The thickness of array (2), cover glass (14), photo detector chip array (2) are adhesively fixed on cushion block (5) or described flat
Face optical waveguide integrates wavelength-division multiplex chip waveguide face (13) without cover glass, the waveguide surface (13) and photo detector chip array
(2) it is directly bonded on fixed cushion block (5).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510833786.XA CN105334580B (en) | 2015-11-26 | 2015-11-26 | A kind of wavelength division multiplexed light receiving unit |
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| CN201510833786.XA CN105334580B (en) | 2015-11-26 | 2015-11-26 | A kind of wavelength division multiplexed light receiving unit |
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| CN105334580A CN105334580A (en) | 2016-02-17 |
| CN105334580B true CN105334580B (en) | 2019-01-25 |
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| CN105866904A (en) * | 2016-05-23 | 2016-08-17 | 宁波环球广电科技有限公司 | Multichannel parallel optical receiving device |
| CN106371169A (en) * | 2016-10-19 | 2017-02-01 | 河南仕佳光子科技股份有限公司 | Multi-mode waveguide 90-degree turning array chip |
| CN106371170A (en) * | 2016-10-26 | 2017-02-01 | 中国科学院半导体研究所 | Array waveguide type light path conversion interconnection chip |
| CN106646783A (en) * | 2017-02-14 | 2017-05-10 | 上海新微科技服务有限公司 | Silicon-based WDM optical transceiver module |
| CN106814423A (en) * | 2017-03-31 | 2017-06-09 | 武汉博昇光电股份有限公司 | A kind of multichannel light receiving element and receiver module |
| CN108931837A (en) * | 2017-05-25 | 2018-12-04 | 中兴通讯股份有限公司 | The integrating device of photoelectric detector PD chip and chip of light waveguide |
| CN107748409A (en) * | 2017-10-26 | 2018-03-02 | 江苏亨通光网科技有限公司 | Based on AWG wavelength-division multiplex Snigle and preparation method |
| CN107991743A (en) * | 2018-01-11 | 2018-05-04 | 绍兴柯芯光电技术有限公司 | A kind of optical transceiver module of integrated PLC planar waveguide-types device |
| CN108919434A (en) * | 2018-07-27 | 2018-11-30 | 武汉光迅科技股份有限公司 | A kind of light receiving element |
| CN110488415A (en) * | 2019-09-04 | 2019-11-22 | 苏州伽蓝致远电子科技股份有限公司 | A kind of light splitting slab guide for optical power monitoring |
| CN112698452A (en) * | 2019-10-22 | 2021-04-23 | 上海信及光子集成技术有限公司 | Optical waveguide chip probe and reflective vertical optical coupling structure based on same |
| CN111367027A (en) * | 2020-03-10 | 2020-07-03 | 武汉华工正源光子技术有限公司 | Optical fiber FA structure and high return loss light receiving device |
| CN111404609B (en) | 2020-03-31 | 2021-05-11 | 武汉光迅科技股份有限公司 | Multi-channel light receiving module |
| CN111367018B (en) * | 2020-04-24 | 2022-01-25 | 苏州伽蓝致远电子科技股份有限公司 | Coupling packaging structure of chip assembly of demultiplexer |
| CN111638577B (en) * | 2020-06-29 | 2021-05-18 | 中国科学院半导体研究所 | Surface-mounted integrated optical module |
| CN112946837A (en) * | 2021-02-04 | 2021-06-11 | 光彩芯辰(浙江)科技有限公司 | Light receiving assembly |
| CN113281841B (en) * | 2021-04-16 | 2022-05-27 | 武汉联特科技股份有限公司 | Silicon optical multichannel parallel optical component and coupling method thereof |
| CN113900179A (en) * | 2021-10-19 | 2022-01-07 | 河南仕佳光子科技股份有限公司 | Array waveguide grating demultiplexer chip of cladding integrated micro-lens and preparation method thereof |
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| KR20140079540A (en) * | 2012-12-14 | 2014-06-27 | 한국전자통신연구원 | Optical receiver module using wavelength division multiplexing type |
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