CN107748409A - Based on AWG wavelength-division multiplex Snigle and preparation method - Google Patents
Based on AWG wavelength-division multiplex Snigle and preparation method Download PDFInfo
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- CN107748409A CN107748409A CN201711012812.8A CN201711012812A CN107748409A CN 107748409 A CN107748409 A CN 107748409A CN 201711012812 A CN201711012812 A CN 201711012812A CN 107748409 A CN107748409 A CN 107748409A
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- 238000002360 preparation method Methods 0.000 title claims description 15
- 230000003287 optical effect Effects 0.000 claims abstract description 32
- 238000000227 grinding Methods 0.000 claims abstract description 24
- 238000003491 array Methods 0.000 claims abstract description 21
- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- 239000000835 fiber Substances 0.000 claims description 26
- 238000012360 testing method Methods 0.000 claims description 20
- 230000008878 coupling Effects 0.000 claims description 15
- 238000010168 coupling process Methods 0.000 claims description 15
- 238000005859 coupling reaction Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 230000003321 amplification Effects 0.000 claims description 11
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 10
- 230000002457 bidirectional effect Effects 0.000 claims description 9
- 239000000047 product Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000013307 optical fiber Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 239000011229 interlayer Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000007517 polishing process Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- 239000006059 cover glass Substances 0.000 claims description 3
- 238000011156 evaluation Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 239000011265 semifinished product Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- 238000001514 detection method Methods 0.000 claims 1
- 230000006641 stabilisation Effects 0.000 abstract description 2
- 238000011105 stabilization Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 4
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000001808 coupling effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 230000011514 reflex Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000007540 photo-reduction reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
- G02B6/12019—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by the optical interconnection to or from the AWG devices, e.g. integration or coupling with lasers or photodiodes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
- G02B6/12019—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by the optical interconnection to or from the AWG devices, e.g. integration or coupling with lasers or photodiodes
- G02B6/12021—Comprising cascaded AWG devices; AWG multipass configuration; Plural AWG devices integrated on a single chip
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
- G02B6/12026—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29301—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means based on a phased array of light guides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29379—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means characterised by the function or use of the complete device
- G02B6/2938—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means characterised by the function or use of the complete device for multiplexing or demultiplexing, i.e. combining or separating wavelengths, e.g. 1xN, NxM
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The invention discloses one kind to be based on AWG wavelength-division multiplex Snigles, and it includes encapsulating housing and the light engine being arranged in the encapsulating housing, and the light engine includes light unit and electric unit, and the light unit includes：AWG chips, laser DFB arrays, detector PIN arrays, the capillary with lock pin, the AWG chips are rectangle AWG chip of light waveguide, one end of the AWG chips is 44.5 46 ° of grinding interfaces, the other end of the AWG chips is 8 ° of interfaces, 8 ° of interfaces of the AWG chips are connected with the capillary with lock pin, one end that capillary is connected with AWG chips is 8 ° of grinding angles, and lock pin docks Snigle with outside wire jumper.The optical transceiver module transmission rate that the present invention prepares is 100Gbps~112Gbps, and transmission range is more than 10km, and power consumption is less than 1.5W, dependable performance, transmission stabilization.
Description
Technical field
It is double more particularly, to a kind of single fiber based on AWG wavelength-division multiplex techniques the present invention relates to the manufacturing field of optical device
To optical transceiver module, preparation method, method of testing.
Background technology
At present, in present information network, turned into by spreading rate communication network transmission capacity to increase fiber optic communication
Main flow, optical transceiver module are the Photon-Electron electrons equipment of core, and it is widely applied to wide area network (WAN), Metropolitan Area Network (MAN) (MAN), office
In the various fields such as domain net (LAN), and as the development of technology is, it is necessary to which optical transceiver module increasingly in multiclass meets to believe
The demand of network is ceased, and with desired raising, the complexity of optical transceiver module also more and more higher.
Diversity of the user to optical module demand：The characteristic such as low cost, high-speed, miniaturization, low-power consumption, remote, so
And meet that the optical module machining accuracy of these characteristics and quantity have serious contravention, although by groping for many years, this species
The optical transceiver module large-scale processing problem of type is always the bottleneck of big data, cloud computing and BAT class system production capacities.Therefore,
In optical device manufacturing field, it is necessary to a kind of processing method improve optical module machining accuracy and efficiency method, come solve need
The problem of amount of asking and precision contradiction.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of single-fiber bidirectional optical based on AWG wavelength-division multiplex techniques to receive and dispatch mould
Block and preparation method thereof so that the optical transceiver module transmission rate prepared is 100Gbps~112Gbps, and transmission range is big
In 10km, power consumption is less than 1.5W, dependable performance, transmission stabilization.
In order to solve the above-mentioned technical problem, the invention provides one kind based on AWG wavelength-division multiplex single-fiber bidirectional optical transmitting-receiving mould
Block, it includes encapsulating housing and the light engine being arranged in the encapsulating housing, and the light engine includes light unit and electric unit,
The light unit includes：AWG chips, laser DFB arrays, detector PIN arrays, the capillary with lock pin, the AWG cores
Piece is rectangle AWG chip of light waveguide, and interface, the other end of the AWG chips are ground in one end of the AWG chips for 44.5-46 °
For 8 ° of interfaces, 8 ° of interfaces of the AWG chips are connected with the capillary with lock pin, and the capillary connects with the AWG chips
The one end connect is 8 ° of grinding angles, and lock pin docks the Snigle with outside wire jumper；
When the light unit carries out light transmitting, the laser of the laser DFB array emitters passes through 44.5-46 ° of AWG core
Piece interface reflexes to the AWG chip internals, is light wave by the AWG chips filter-coupler, and the capillary passes through its 8 °
Grinding angle increases the coupling area with the AWG chips, makes the couples optical energy that launching fiber exports into reception optical fiber；
The electric unit includes drive system, amplification system, Control management system, and the drive system includes driving chip
With the drive circuit configured with it, the amplification system includes amplifier and control device, and the Control management system includes number
Word diagnosing chip, memory, warning device；
The driving chip performs the instruction of the memory, and the amplifier is used to amplify the letter for putting on its input
Number, amplifier output signal is produced, the control device senses the amplifier output signal, exports and believes according to the amplifier
Number level put on the electric current of the amplifier in control.
In the preferred embodiment of the present invention, further comprise, one end of the AWG chips is 45 ° of grinding interfaces.
In the preferred embodiment of the present invention, further comprise, the laser DFB arrays include at least four and hung down
Straight Cavity surface laser, the wavelength interval between the planar laser with vertical cavity is equal, and the planar laser with vertical cavity passes through solder joint
It is connected with metal electrode.
In the preferred embodiment of the present invention, further comprise, the detector PIN arrays include at least four light
Sub- detector, the photon detector are connected by solder joint with metal electrode.
In the preferred embodiment of the present invention, further comprise, one kind is received based on AWG wavelength-division multiplex single-fiber bidirectional optical
The preparation method for sending out module, comprises the following steps：
S10AWG chip input adjustment：The three-dimensional adjustable shelf being connected with input CCD image intensifers is adjusted, makes display
Upper clear display single fiber end face and AWG chip inputs end face, then adjust input 6 DOF adjusting bracket so that single fiber end face with
AWG chip input end faces reach the position that both sides are parallel and side is parallel so that the waveguide of single fiber input inputs with AWG chips
Hold waveguide alignment；
The output end adjustment of S20AWG chips：The three-dimensional adjustable shelf being connected with output end CCD image intensifers is adjusted, makes display
Clear display light engine end face and AWG chip outputs end face, then adjust output end 6 DOF adjusting bracket so that light engine on device
End face reaches the position that both sides are parallel and side is parallel with AWG chip outputs face so that the waveguide of AWG chip outputs and list
The waveguide alignment of crystal silicon fiber array；
S30 balance adjustments：Input CCD image intensifers are moved on light engine, in DFB chips, PIN chips and AWG cores
At piece input end face, and the reading for combining light power meter is adjusted；By output end CCD image intensifers move to single fiber end face with
At AWG chip outputs face, it is adjusted with reference to the reading of light power meter, until the optical signal reading from lock pin output is both less than
Defined standard value；
S40 is less than defined standard value when the optical signal reading of lock pin output, and point UV glue is solidified simultaneously；
S50 is tested：Snigle semi-finished product for being finished to coupling carry out the survey of optical fiber transmission data
Examination；
S60 is encapsulated：Product after test passes is packaged.
In the preferred embodiment of the present invention, further comprise, in addition to AWG chip manufacture steps, including it is following
Several steps：
S101 is by the both ends cover glass cover plate of AWG chips；
The AWG chips with glass cover-plate in S101 are solidified and ground by S102, obtain AWG cores to be coupled
Piece.
In the preferred embodiment of the present invention, further comprise, in cure stage in S102, AWG chips are passed through
Binding agent is fixed on interlayer substrate, and interlayer substrate flatness is 2-15 μm, and angularity is 20-50 μm, after solidification, is carried out
AWG chips are ground, and AWG chips one end are ground into 44.5-46 °, the other end is ground into 8 °.
In the preferred embodiment of the present invention, further comprise, the bonding between the AWG chips and the substrate
Glue thickness is less than 1 μm.
In the preferred embodiment of the present invention, further comprise, S102 process of lapping is divided into rough grinding pass and throwing
Photoreduction process, rough grinding pass is using there is the grounds travel of lattice form, and the powder granularity of grounds travel is 10nm-2000nm, split Mohs
Hardness is 7-9；For the powder granularity for the polishing powder that polishing process uses for 5nm-200nm, split Mohs' hardness is 5-9.
In the preferred embodiment of the present invention, further comprise, in addition to the single fiber bi-directional that coupling finishes is received and dispatched
Module carries out data transmission debugging step, including the following steps：
The optical transceiver module that coupling finishes is placed on specimen holder by S201；
S202 code error testers and the evaluation board being connected with code error tester are ready to, and mongline bidirectional light then is received and dispatched into mould
The input of block and shunt connects, and the first output end of shunt is connected with tunable light source, the second output end of shunt and
Spectrometer connects, test.
1st, AWG chips of the invention carry out the temperature control of AWG chips using the working method of dual drive Hot Spare, can
It is greatly enhanced the reliability of temperature control circuit；Most preferably 45 ° of one end of AWG chips, the other end are 8 °, its bandwidth of operation wavelength model
1271nm-1650nm can be reached by enclosing, and the test wave band of insertion loss covers the spectrum curve of this wavelength band, and wavelength-division is uniform,
The dependent loss such as stable performance, polarization is low.
2nd, producing device of the invention and preparation method by existing PLC optical branchings to optical coupling board based on, increase
AWG chip loading platforms, realize simple to operate, the high coupling effect of accuracy, largely improve to based on AWG
The production efficiency and product quality of the Snigle of wavelength-division multiplex technique.
3rd, the present invention is debugged, and debugging apparatus includes specimen holder, adjustable light sources, spectrometer equipment, photoswitch, required
Test equipment quantity it is few, do not limited by surrounding environment, test site, cost is low, easily carry out, using this accelerated test
Method, the testing time (only need the conventionally test time 1/10th) is not only shortened, improves testing efficiency, and can survey
The incipient fault of whole wave band is tried, to carrying for the Snigle quality and reliabilities of AWG wavelength-division multiplex techniques
Height, great effect is served, shorten the cycle of launch products.
Brief description of the drawings
Fig. 1 is the theory structure schematic diagram of the present invention；
Fig. 2 is the theory structure schematic diagram of light unit in the present invention；
Fig. 3 is the theory structure schematic diagram of electric unit in the present invention；
Fig. 4 is the explosive view of module of the present invention；
Fig. 5 is the fundamental diagram of overall light engine；
Fig. 6 is the interiors of products structure of the present invention；
Fig. 7 is the fundamental diagram of adjustment method of the present invention；
Fig. 8 is the flow chart of preparation method of the present invention.
Label declaration in figure：1-PCB circuit boards, 10- drive amplification systems, 3- amplification systems, 34-PD detector arrays,
32-TIA chips, 31-LA chips, 6- drive systems, 5-LD laser arrays, 4- laser drivers, 2- radiating insulating laminar substrates,
81-AWG chips, 81-AWG inner waveguides, the 45° angle after 9- grindings, 101- light engines, cover on 102-, 103- lower covers, 104-
Handle, 105- sheaths.
Embodiment
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, so that those skilled in the art can be with
More fully understand the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
Embodiment 1
The present embodiment is that one kind is based on AWG wavelength-division multiplex Snigles, and it includes encapsulating housing and setting
Light engine in above-mentioned encapsulating housing, its external structure is as shown in figure 4, encapsulating housing mainly has upper lid 102, with upper lid 102
The lower cover 103 of cooperation, the sheath 105 that upper lid 102 and lower cover 103 are blocked, the handle 104 coordinated with sheath 105, light engine
After 101 couplings finish, it is encapsulated in above-mentioned encapsulating housing.
As Figure 1-5, above-mentioned light engine includes light unit and electric unit, and above-mentioned light unit includes：AWG chips, laser
Device DFB arrays, detector PIN arrays, the capillary with lock pin, above-mentioned laser DFB arrays include at least four vertical cavities
Planar laser, the wavelength interval between above-mentioned planar laser with vertical cavity is equal, and above-mentioned planar laser with vertical cavity passes through solder joint and gold
Belong to electrode connection.Above-mentioned detector PIN arrays include at least four photon detectors, and above-mentioned photon detector passes through solder joint and gold
Belong to electrode connection.
In the present embodiment, above-mentioned AWG chips are rectangle AWG chip of light waveguide, and one end of above-mentioned AWG chips is 44.5-
46 ° of grinding interfaces, the other end of above-mentioned AWG chips is 8 ° of interfaces, 8 ° of interfaces of above-mentioned AWG chips and the capillary with lock pin
Pipe is connected, and one end that above-mentioned capillary is connected with above-mentioned AWG chips is 8 ° of grinding angles, and above-mentioned single-fiber bidirectional optical is received and dispatched mould by lock pin
Block docks with outside wire jumper.One end of AWG chips is optimal when being 45 ° of grinding interfaces, and traditional AWG chip manufacture modes are to cut
Cut, in the present embodiment by the way of grinding because the size of AWG chips is smaller, during cutting success rate can not control, accurate journey
Degree can not be ensured, success rate can be improved by the way of grinding.
When above-mentioned light unit carries out light transmitting, the laser of the equal laser DFB array emitters in wavelength interval passes through 44.5-
46 ° of AWG chip interfaces reflex to above-mentioned AWG chip internals, by the light that above-mentioned AWG chips filter-coupler is certain bandwidth length
Ripple, AWG chips are connected by index matching glue with the capillary with lock pin, and above-mentioned capillary is increased by its 8 ° of grinding angles
With the coupling area of above-mentioned AWG chips, while return loss is increased, the effect of lock pin is that two end faces of optical fiber are accurate
Docking is got up, and the luminous energy that launching fiber exports is coupled to greatest extent in reception optical fiber.
As shown in figure 3, above-mentioned electric unit includes drive system, amplification system, Control management system, above-mentioned drive system bag
Driving chip and the drive circuit configured with it are included, above-mentioned amplification system includes amplifier and control device, above-mentioned control management
System includes numerical diagnostic chip, memory, warning device；
Above-mentioned driving chip performs the instruction of above-mentioned memory, and the current loss of driving chip is not more than 75mA, Neng Gougai
The hot property of kind module；Above-mentioned amplifier is used to amplify the signal for putting on its input, produces amplifier output signal, above-mentioned
Control device senses above-mentioned amplifier output signal, when output signal has of a relatively high level, responds the Automatic level control and applies
The electric current of amplifier in is added on, a linear working state is in hold amplifier.
AWG chips in the present embodiment carry out the temperature control of AWG chips, energy using the working method of dual drive Hot Spare
Enough it is greatly enhanced the reliability of temperature control circuit；Most preferably 45 ° of one end of AWG chips, the other end are 8 °, its bandwidth of operation wavelength
Scope can reach 1271nm-1650nm, and the test wave band of insertion loss covers the spectrum curve of this wavelength band, and wavelength-division is equal
It is even, stable performance, polarization etc. dependent loss it is low.
Embodiment 2
As shown in figure 8, a kind of making based on AWG wavelength-division multiplex Snigles is disclosed in the present embodiment
Method, comprise the following steps：
1st, AWG chip manufactures, including the following steps：
1.1 by the both ends cover glass cover plate of AWG chips；
The AWG chips with glass cover-plate in upper step are solidified and ground by 1.2, obtain AWG cores to be coupled
Piece.
In cure stage, AWG chips are fixed on interlayer substrate by binding agent, interlayer substrate flatness is 2-15 μ
M, angularity are 20-50 μm, and the adhesive glue thickness between above-mentioned AWG chips and aforesaid substrate is less than 1 μm；After solidification, carry out
AWG chips are ground, and AWG chips one end are ground into 44.5-46 °, the other end is ground into 8 °.
Process of lapping is divided into rough grinding pass and polishing process, and rough grinding pass is using the grounds travel for having lattice form, grounds travel
Powder granularity be 10nm-2000nm, split Mohs' hardness is 7-9；The powder granularity for the polishing powder that polishing process uses for
5nm-200nm, split Mohs' hardness are 5-9.
2nd, module preparation process：
2.1AWG chip input adjustment：The three-dimensional adjustable shelf being connected with input CCD image intensifers is adjusted, makes display
Upper clear display single fiber end face and AWG chip inputs end face, then adjust input 6 DOF adjusting bracket so that single fiber end face with
AWG chip input end faces reach the position that both sides are parallel and side is parallel so that the waveguide of single fiber input inputs with AWG chips
Hold waveguide alignment.
The output end adjustment of 2.2AWG chips：The three-dimensional adjustable shelf being connected with output end CCD image intensifers is adjusted, makes display
Clear display light engine end face and AWG chip outputs end face, then adjust output end 6 DOF adjusting bracket so that light engine on device
End face reaches the position that both sides are parallel and side is parallel with AWG chip outputs face so that the waveguide of AWG chip outputs and list
The waveguide alignment of crystal silicon fiber array.
2.3 balance adjustment：Input CCD image intensifers are moved on light engine, in DFB chips, PIN chips and AWG cores
At piece input end face, and the reading for combining light power meter is adjusted；By output end CCD image intensifers move to single fiber end face with
At AWG chip outputs face, it is adjusted with reference to the reading of light power meter, until the optical signal reading from lock pin output is both less than
Defined standard value.
2.4 are less than defined standard value when the optical signal reading of lock pin output, and point UV glue is solidified simultaneously.
2.5 test：Snigle semi-finished product for being finished to coupling carry out the survey of optical fiber transmission data
Examination；
2.6 encapsulation：Product after test passes is packaged.
The module product obtained by above-mentioned steps is as shown in fig. 6, wherein, PCB 1 is above-mentioned control management system
System；Drive amplification system 10 and amplification system 3, are amplified to the electric signal changed by PD detector arrays 34, PD detectors
The light reflected from total reflection lens 33 is converted to electric signal, TIA chips 32 (preamplifier) and LA chips by array 34
The pin of 31 (limited range enlargements) is connected by wirebonding with PCB 1；
Drive system 6 includes LD laser arrays 5 and LD laser arrays 5, and LDD laser drivers 4 are to LD laser battle arrays
Row 5 are driven, and make LD laser arrays 5 luminous, LDD laser drivers 4 are entered with PCB 1 by wirebonding
Row connection.
Radiating insulating laminar substrate 2 causes PCB 1 and drive amplification system 10 to heat spreader caused by device
It is dielectrically separated from；There are some AWG inner waveguides 81 inside AWG chips 8, AWG inner waveguides 81 cause light wave in the waveguide
It is multiplexed or is demultiplexed, AWG chips 8 is ground into 45° angle 9.
Above-mentioned producing device and preparation method by existing PLC optical branchings to optical coupling board based on, add AWG
Chip loading platform, realizes simple to operate, the high coupling effect of accuracy, largely improves to based on AWG wavelength-divisions
The production efficiency and product quality of the Snigle of multiplexing technology.
3rd, the single-fiber bidirectional transceiving module finished to coupling carries out data transmission debugging, as shown in fig. 7, comprises following several
Step：
3.1 are placed into the optical transceiver module that coupling finishes on specimen holder；
3.2 code error testers and the evaluation board being connected with code error tester are ready to, and mongline bidirectional light then is received and dispatched into mould
The input of block and shunt connects, and the first output end of shunt is connected with tunable light source, the second output end of shunt and
Spectrometer connects, test.
Debugging apparatus includes specimen holder, adjustable light sources, spectrometer equipment, photoswitch, and required test equipment quantity is few,
Do not limited by surrounding environment, test site, cost is low, easily carries out, using the method for this accelerated test, not only shortens survey
The time (only need the conventionally test time 1/10th) is tried, improves testing efficiency, and the latent of whole wave band can be tested
In failure, the raising to the Snigle quality and reliability of AWG wavelength-division multiplex techniques, great work is served
With shortening cycles of launch products.
Embodiment described above is only to absolutely prove preferred embodiment that is of the invention and being lifted, protection model of the invention
Enclose not limited to this.The equivalent substitute or conversion that those skilled in the art are made on the basis of the present invention, in the present invention
Protection domain within.Protection scope of the present invention is defined by claims.
Claims (10)
1. one kind is based on AWG wavelength-division multiplex Snigles, it includes encapsulating housing and is arranged on the encapsulating shell
Light engine in body, the light engine include light unit and electric unit, it is characterised in that the light unit includes：AWG chips,
Laser DFB arrays, detector PIN arrays, the capillary with lock pin, the AWG chips are rectangle AWG chip of light waveguide,
One end of the AWG chips is 44.5-46 ° of grinding interface, and the other end of the AWG chips is 8 ° of interfaces, the AWG chips
8 ° of interfaces are connected with the capillary of lock pin, and one end that the capillary is connected with the AWG chips is 8 ° of grinding angles, lock pin
The Snigle is docked with outside wire jumper；
When the light unit carries out light transmitting, the laser of the laser DFB array emitters passes through 44.5-46 ° of AWG chip interface
The AWG chip internals are reflexed to, are light wave by the AWG chips filter-coupler, the capillary passes through its 8 ° of grinding angles
Increase and the coupling area of the AWG chips, make the couples optical energy that launching fiber exports into reception optical fiber；
The electric unit include drive system, amplification system, Control management system, the drive system include driving chip and with
Its drive circuit configured, the amplification system include amplifier and control device, and the Control management system is examined including numeral
Disconnected chip, memory, warning device；
The driving chip performs the instruction of the memory, and the amplifier is used to amplify the signal for putting on its input,
Amplifier output signal is produced, the control device senses the amplifier output signal, according to the amplifier output signal
Level put on the electric current of the amplifier in control.
2. it is based on AWG wavelength-division multiplex Snigles as claimed in claim 1, it is characterised in that the AWG cores
One end of piece is 45 ° of grinding interfaces.
3. it is based on AWG wavelength-division multiplex Snigles as claimed in claim 1, it is characterised in that the laser
Device DFB arrays include at least four planar laser with vertical cavity, and the wavelength interval between the planar laser with vertical cavity is equal, described
Planar laser with vertical cavity is connected by solder joint with metal electrode.
4. it is based on AWG wavelength-division multiplex Snigles as claimed in claim 1, it is characterised in that the detection
Device PIN arrays include at least four photon detectors, and the photon detector is connected by solder joint with metal electrode.
5. a kind of preparation method based on AWG wavelength-division multiplex Snigles, it is characterised in that including following step
Suddenly：
The AWG chip input adjustment of S 10：The three-dimensional adjustable shelf being connected with input CCD image intensifers is adjusted, is made on display
Clear display single fiber end face and AWG chip inputs end face, then adjust input 6 DOF adjusting bracket so that single fiber end face with
AWG chip input end faces reach the position that both sides are parallel and side is parallel so that the waveguide of single fiber input inputs with AWG chips
Hold waveguide alignment；
The output end adjustment of the AWG chips of S 20：The three-dimensional adjustable shelf being connected with output end CCD image intensifers is adjusted, makes display
Upper clear display light engine end face and AWG chip outputs end face, then adjust output end 6 DOF adjusting bracket so that light engine end
Face reaches the position that both sides are parallel and side is parallel with AWG chip outputs face so that the waveguide of AWG chip outputs and monocrystalline
The waveguide alignment of silicon optical fiber array；
S30 balance adjustments：Input CCD image intensifers are moved on light engine, it is defeated in DFB chips, PIN chips and AWG chips
Enter end, and the reading for combining light power meter is adjusted；Output end CCD image intensifers are moved into single fiber end face and AWG cores
At piece output end face, it is adjusted with reference to the reading of light power meter, until both less than being provided from the optical signal reading of lock pin output
Standard value；
S 40 is less than defined standard value when the optical signal reading of lock pin output, and point UV glue is solidified simultaneously；
S 50 is tested：Snigle semi-finished product for being finished to coupling carry out the test of optical fiber transmission data；
S 60 is encapsulated：Product after test passes is packaged.
6. the preparation method as claimed in claim 5 based on AWG wavelength-division multiplex Snigles, its feature exist
In, in addition to AWG chip manufacture steps, including the following steps：
S 101 is by the both ends cover glass cover plate of AWG chips；
The AWG chips with glass cover-plate in S 101 are solidified and ground by S 102, obtain AWG chips to be coupled.
7. the preparation method as claimed in claim 6 based on AWG wavelength-division multiplex Snigles, its feature exist
In in cure stage in S 102, AWG chips being fixed on interlayer substrate by binding agent, interlayer substrate flatness is 2-15
μm, angularity is 20-50 μm, after solidification, carries out AWG chip grindings, and AWG chips one end is ground into 44.5-46 °, another
End is ground into 8 °.
8. the preparation method as claimed in claim 7 based on AWG wavelength-division multiplex Snigles, its feature exist
In the adhesive glue thickness between the AWG chips and the substrate is less than 1 μm.
9. the preparation method as claimed in claim 6 based on AWG wavelength-division multiplex Snigles, its feature exist
In S 102 process of lapping is divided into rough grinding pass and polishing process, and rough grinding pass is using the grounds travel for having lattice form, grinding
The powder granularity of powder is 10nm-2000nm, and split Mohs' hardness is 7-9；The powder granularity for the polishing powder that polishing process uses for
5nm-200nm, split Mohs' hardness are 5-9.
10. the preparation method as claimed in claim 5 based on AWG wavelength-division multiplex Snigles, its feature exist
In, in addition to carry out data transmission debugging step, including the following steps to coupling the single-fiber bidirectional transceiving module finished：
The optical transceiver module that coupling finishes is placed on specimen holder by S 201；
The code error testers of S 202 and the evaluation board being connected with code error tester are ready to, then by mongline bidirectional optical transceiver module
It is connected with the input of shunt, the first output end of shunt is connected with tunable light source, the second output end and light of shunt
Spectrometer connects, test.
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Effective date of registration: 20220808 Address after: No. 168 Jiaotong North Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Applicant after: Suzhou Zhuoyu Photon Technology Co.,Ltd. Address before: 215000 Heng Road, Wujiang District, Suzhou City, Jiangsu Province, No. 88 Applicant before: JIANGSU HENGTONG OPTICAL NETWORK TECHNOLOGY Co.,Ltd. Applicant before: HENGTONG OPTIC-ELECTRIC Co.,Ltd. |