CN105315668A - Highly thermally conductive inorganic-polymer complex composition applied to lighting LED that contains expanded graphite and manufacturing method thereof - Google Patents
Highly thermally conductive inorganic-polymer complex composition applied to lighting LED that contains expanded graphite and manufacturing method thereof Download PDFInfo
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- CN105315668A CN105315668A CN201510080987.7A CN201510080987A CN105315668A CN 105315668 A CN105315668 A CN 105315668A CN 201510080987 A CN201510080987 A CN 201510080987A CN 105315668 A CN105315668 A CN 105315668A
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- expanded graphite
- thermal conductivity
- inorganics
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 79
- 239000010439 graphite Substances 0.000 title claims abstract description 74
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 74
- 239000000203 mixture Substances 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title abstract description 8
- 229920000592 inorganic polymer Polymers 0.000 title 1
- 229920000642 polymer Polymers 0.000 claims abstract description 29
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 14
- 239000000057 synthetic resin Substances 0.000 claims abstract description 14
- 125000000524 functional group Chemical group 0.000 claims abstract description 12
- 238000002156 mixing Methods 0.000 claims abstract description 11
- 239000002131 composite material Substances 0.000 claims description 34
- 239000012764 mineral filler Substances 0.000 claims description 34
- 238000005286 illumination Methods 0.000 claims description 29
- 238000002360 preparation method Methods 0.000 claims description 20
- 230000004048 modification Effects 0.000 claims description 19
- 238000012986 modification Methods 0.000 claims description 19
- 238000010298 pulverizing process Methods 0.000 claims description 19
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 9
- -1 polybutylene terephthalate Polymers 0.000 claims description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 239000006185 dispersion Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 230000008676 import Effects 0.000 claims description 5
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- 125000004185 ester group Chemical group 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 3
- 150000001408 amides Chemical class 0.000 claims description 3
- 229920006038 crystalline resin Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 7
- 230000005855 radiation Effects 0.000 abstract description 4
- 239000003575 carbonaceous material Substances 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 abstract description 2
- 229910010272 inorganic material Inorganic materials 0.000 abstract 1
- 239000011147 inorganic material Substances 0.000 abstract 1
- 238000002407 reforming Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 239000007769 metal material Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000001954 sterilising effect Effects 0.000 description 2
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- 230000003245 working effect Effects 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to a high thermal conductivity inorganic material-polymer complex composition containing expanded graphite to be applied to a lighting LED, and a manufacturing method thereof. Specifically, the composition is manufactured by grinding the expanded graphite and an inorganic material into a nanosize, reforming the same in order to let a functional group be applied on the surface of the same, and dispersing and mixing the same with a thermal conductivity synthetic resin. To manufacture a carbon material and secure a functionality for the same due to the high thermal conductivity inorganic material-polymer complex composition containing the expanded graphite, the composition can be variously applied as an electric and electronic component-related heat sink material, and can improve a lifespan and energy efficiency of the lighting LED due to a heat radiation efficiency improvement.
Description
Technical field
The present invention relates to high thermal conductivity inorganics-polymer composite compositions containing expanded graphite being applicable to illumination light-emitting diode and preparation method thereof, relate to after expanded graphite and inorganics be ground into nanosized particularly, carry out modification, after making functional group importing surface, disperse and be mixed in thermal conductivity synthetic resins thus high thermal conductivity inorganics-polymer composite compositions containing expanded graphite being applicable to illumination light-emitting diode of preparation and preparation method thereof.
Background technology
In recent years, in order to realize lightweight, miniaturization, lightening (Slim), high speed and Highgrade integration gradually, thus, while the thermal value of unit volume increases, there are problems in electronics due to thermal load.
The existing aluminum being used for LED for illumination interface, because weight is comparatively large, has and is difficult to adapt to the problem as light-weighted products of sensing such as light-emitting diode (LED) illuminating lamps.In order to substitute the aluminium radiator that there are the problems referred to above, the plastic heat radiation body that existing weight is relatively light is developed and has part to come into operation, but existing plastic heat radiation body is owing to being the Markite prepared by inserting the high special conducting filler of price to plastics, compared to aluminium radiator, there is the shortcoming that cost increases by 10 ~ 20.
Photodiode is made up of the joint of p-type and n-type semiconductor, and upon application of a voltage, by the combination in electronics and hole, by a kind of optoelectronic component that the energy of the band gap (bandgap) being equivalent to semi-conductor discharges with the form of light.Photodiode, for comprising information, the display of electronic installation of signal equipment, image light source, along with the exploitation of cyan photodiode after the nineties in 20th century, achieves full-color display (display).Photodiode is widely used in general illumination lamp, decorating building lamp, atmosphere lamp, car light, traffic lights, indoor and outdoor electronic display screen, guiding lamp, warning lamp, various security personnel fill standby power source, sterilization or sterilization light source etc.
This photodiode, as semiconductor element, easily produces a large amount of heats in operational process, when overheated, under there will be low lightness, many side effects such as shortening in work-ing life.
In order to realize the efficiently radiates heat of photodiode, use the scatterer comprising the radiator element with various structure.This scatterer major part is prepared by metal materials such as aluminium, is installed on after LED light lamp.But the proportion of metal material is comparatively large, is realizing there is limitation in product lightweight, and due to cost high, there is the problem that manufacturing cost increases.Further, the processibility of metal material is relatively poor, in order to be processed into specified shape, needs to devote considerable time and expense.
For these problems, present the more alternative lightweight of existing use material of exploitation, the trend of high heat sink material in recent years.
No. 10-1228858th, Korean granted patent relates to the straight pipe type LED illumination lamp with graphite paper radiator structure, disclose the straight pipe type LED illumination lamp as follows with graphite paper radiator structure, namely, radiator structure is formed by the scatterer substituting existing metal material with graphite paper, both ensure that heat-sinking capability, significantly alleviate again weight and reduce manufacturing cost, papery material can also make processibility maximize, and by substituting the shell of existing metal material with polycarbonate material, alleviate the weight of product and reduce cost, guiding is formed in the inside of polycarbonate shell, make the printed circuit board (PCB) being provided with photodiode stitch can carry out dismounting in sliding manner, assembling procedure is simplified, and then can manufacturing process be simplified, can also maintenance cost saving.
No. 10-1120637th, Korean granted patent discloses by plating metal to Plastic Resin by constant thickness, thermal conductivity is improved, and then the illumination that can form light weight illumination plastic heat radiation body utilizing plated metal of (such as: LED lighting is used) radiator and preparation method thereof.
No. 10-1071903rd, Korean granted patent discloses the preparation method of following photodiode fluorescent-lamp-use lightweight bending radiator, namely, shaping a pair upper case, to have support portion, upper end and support portion, lower end, utilize folding forming device or rotary bending press, after preparing bending radiator, carry out fastening when above-mentioned shell and bending radiator being formed be connected, form multiple non-contact area space, thus, significantly improve lightweight and the safety of structure of photodiode luminescent lamp.
Prior art document
Patent documentation
No. 10-1228858th, Korean granted patent
No. 10-1120637th, Korean granted patent
No. 10-1071903rd, Korean granted patent
Summary of the invention
The present invention relates to high thermal conductivity inorganics-polymer composite compositions containing expanded graphite being applicable to illumination light-emitting diode and preparation method thereof, relate to after expanded graphite and inorganics be ground into nanosized particularly, carry out modification, after making functional group importing surface, disperse and be mixed in thermal conductivity synthetic resins thus high thermal conductivity inorganics-polymer composite compositions containing expanded graphite being applicable to illumination light-emitting diode be prepared and preparation method thereof.
As the example of the present invention in order to realize object as above, the present invention relates to the high thermal conductivity inorganics-polymer composite compositions containing expanded graphite being applicable to illumination light-emitting diode, it is characterized in that, by make to be ground into the expanded graphite of nanosized and mineral filler dispersing and mixing to prepare in thermal conductivity synthetic resins described in be applicable to the high thermal conductivity inorganics-polymer composite compositions containing expanded graphite of illumination light-emitting diode.
And, high thermal conductivity inorganics-the polymer composite compositions containing expanded graphite being applicable to illumination light-emitting diode of the present invention, it is characterized in that, in described mineral filler, be mixed with at least one be selected from gold and silver, copper, aluminium, silver-plated copper, silver-plated nickel, silver coated aluminum, aluminum oxide, ferric oxide, magnesium oxide, boron nitride, silicon nitride and titanium nitride.
And, the invention is characterized in, described thermal conductivity synthetic resins is the one in polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), polycarbonate (PC), polymeric amide (PA), polypropylene (PP), polyethylene (PE), urethane (PU), liquid crystalline resin (LCP), epoxy resin (Epoxy) and silicone resin (Silicone).
Further, the invention is characterized in, described expanded graphite and mineral filler account for 1 ~ 30 weight percent of composite composition entirety.
When expanded graphite and mineral filler account for composite composition entirety less than 1% time, compared to whole content, due to expanded graphite and mineral filler proportion too small, make to have and cause the effect of high thermal conductivity lowly to be worried, and when the content of expanded graphite and mineral filler exceedes 30% of composite composition entirety, the preparation cost of composite composition increases, thus a production development decline difficult problem.
Further, the invention is characterized in, comprising: nano-pulverization step, to expanded graphite and mineral filler simultaneously or carry out once above pulverizing independently and be ground into nanosized; Surface modification step, to the modifying surface of the expanded graphite and mineral filler that are ground into nanosized, thus imports stable functional group; And dispersing and mixing step, disperseed by the expanded graphite and mineral filler making the nanosized of surface modification and be mixed in thermal conductivity synthetic resins, preparing inorganics-polymer composite compositions.
Further, the invention is characterized in, in described nano-pulverization step, utilize ultrasonic grinder to pulverize expanded graphite and mineral filler.
By utilizing ultrasonic grinder to pulverize expanded graphite and mineral filler, micropartical can be made to homogenize, and then solvent can be scattered in equably.
Further, the invention is characterized in, expanded graphite is ground into the described nano-pulverization step of nanosized, comprises: wet type nano-pulverization step, under moisture state, pulverize expanded graphite by ultrasonic grinder; Moisture removal step, removes moisture from containing being ground into the expanded graphite of nanosized of moisture; And powder dispersion step, for the expanded graphite powder of the nanosized of removal moisture, by powder dispersion operation, carry out decentralized equably.
Granularity when being nanosized by expanded graphite pulverizing can be the size of 0.1 ~ 1.0 μm.Expanded graphite is pulverized as nanosized is to utilize all kinds of SOLVENTS to make it disperse equably, and then realizes dispersion stabilization.
Further, the invention is characterized in, the functional group imported in described surface modification step is at least one in carboxyl (-COOH), hydroxyl (-OH) and ester group (-C=O).
Because the functional groups such as carboxyl (-COOH), hydroxyl (-OH), ester group (-C=O) can make the particle of expanded graphite and mineral filler form micronize further, and show structural stability.
Further, the invention is characterized in, the surface modification of described expanded graphite and mineral filler carries out processing treatment by the mixing acid (Acid) of nitric acid or sulfuric acid etc.
In order to give full play to the performance of carbon materials, by surface modification, make the functionalization of composite carbon element material more smooth and easy, to guarantee polymolecularity.
Tool of the present invention has the following advantages:
Owing to adopting the high thermal conductivity inorganics-polymer composite compositions containing expanded graphite of the present invention, for guaranteeing carbon materials preparation and related functionality thereof, multiple being suitable for can be carried out with electric, electronic unit relative radiator material.
Further, in economy, the present invention has the effect of import substitutes, also can reduce manufacturing cost.
Further, in environmental improvement, the present invention can improve radiating efficiency, makes the work-ing life not only can improving LED for illumination, can also improve the Energy efficiency as reduced carbonic acid gas.
Accompanying drawing explanation
Fig. 1 represents by making the pulverizing of an example of the present invention be that the expanded graphite of nanosized and mineral filler disperse and be mixed in thermal conductivity synthetic resins, thus preparation is applicable to the outline precedence diagram of the preparation process of the high thermal conductivity inorganics-polymer composite compositions containing expanded graphite of illumination light-emitting diode.
Embodiment
Below, in order to those skilled in the art can be allowed easily to implement the present invention, enumerate example of the present invention and be described in detail.Example of the present invention provides to more intactly the present invention is described to those skilled in the art.Therefore, example of the present invention can be deformed into multiple different shape, and scope of the present invention is not limited to the example of following explanation.
Fig. 1 represents by making the pulverizing of an example of the present invention be that the expanded graphite of nanosized and mineral filler disperse and be mixed in thermal conductivity synthetic resins, thus preparation is applicable to the outline precedence diagram of the preparation process of the high thermal conductivity inorganics-polymer composite compositions containing expanded graphite of illumination light-emitting diode.
First, the step pulverizing expanded graphite and mineral filler can be performed, (S1).
Expanded graphite and mineral filler perform once above wet type nano-pulverization step of being undertaken pulverizing by ultrasonic grinder.Further, perform from the expanded graphite pulverized, remove moisture moisture removal step, for the expanded graphite powder of nanosized removing moisture, by powder dispersion operation, carry out powder dispersion step decentralized equably.
In the case, at least one be selected from gold and silver, copper, aluminium, silver-plated copper, silver-plated nickel, silver coated aluminum, aluminum oxide, ferric oxide, magnesium oxide, boron nitride, silicon nitride and titanium nitride can be mixed with in mineral filler used.
Then, can actuating surface modification procedure, to the modifying surface of the expanded graphite and mineral filler that are ground into nanosized, thus import stable functional group (S2).
In the case, the surface modification of expanded graphite and mineral filler can carry out processing treatment by the mixing acid of nitric acid or sulfuric acid etc. (Acid).
The functional group imported by surface modification can be at least one in carboxyl (-COOH), hydroxyl (-OH) and ester group (-C=O).
Then, dispersing and mixing step can be performed, disperseed by the expanded graphite and mineral filler making the nanosized of surface modification and be mixed in thermal conductivity synthetic resins, thus prepare inorganics-polymer composite compositions (S3).
In the case, thermal conductivity synthetic resins used can use the one in polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), polycarbonate (PC), polymeric amide (PA), polypropylene (PP), polyethylene (PE), urethane (PU), liquid crystalline resin (LCP), epoxy resin (Epoxy) and silicone resin (Silicone).
Embodiment
1. nano-pulverization step
Can perform and the above process pulverized is carried out once to expanded graphite and the mineral filler being mixed with copper and aluminium simultaneously.
In order to be ground into nanosized, ultrasonic grinder is utilized to pulverize.
When pulverizing expanded graphite for nanosized, after being pulverized by ultrasonic grinder under moisture state, remove moisture.
For the expanded graphite powder of the nanosized of removal moisture, by powder dispersion operation, make it decentralized equably, and then be prepared into powder.
2. surface modification step
Can perform pulverizing is the expanded graphite of nanosized and the modifying surface of mineral filler, thus imports the process of stable functional group.
The functional group imported in surface modification step can be carboxyl (-COOH).Further, the surface modification of expanded graphite and the mineral filler that is mixed with copper and aluminium can by the mixing acid of nitric acid and sulfuric acid to carry out processing treatment.
3. dispersing and mixing step
Can perform by making the expanded graphite of the nanosized of surface modification disperse with the mineral filler being mixed with copper and aluminium and be mixed in the process of thermal conductivity synthetic resins.
10g expanded graphite is made to be scattered in urethane resin with the 10g mineral filler being mixed with copper and aluminium, thus preparation 100g composite composition.
4. the physical property test of the inorganics-polymer composite compositions containing expanded graphite
As the physical property test to the expanded graphite and inorganics-polymer composite compositions that are applicable to illumination light-emitting diode, measure thermal conductivity, shock strength, thermotolerance.
The measuring method of thermal conductivity is carried out according to ASTME1461, and the measuring method of shock strength and thermotolerance is carried out according to ASTMD256, ASTMD1525 respectively.
The physical property test result being applicable to the inorganics-polymer composite compositions containing expanded graphite of illumination light-emitting diode is as shown in table 1.
Table 1
| Performance index | Unit | Test-results | Test method |
| Thermal conductivity | W/mK | 7 | ASTM E1461 |
| Shock strength | Kg.cm/cm | 10 | ASTM D256 |
| Thermotolerance | ℃ | 150 | ASTM D1525 |
Above-mentioned table 1 is for being applicable to the physical property test result of the inorganics-polymer composite compositions containing expanded graphite of illumination light-emitting diode.
Above, by exemplifying embodiment to invention has been detailed description, but the present invention is not limited to above-mentioned aspect, and can be deformed into various form, for those skilled in the art, it is apparent for can implementing various distortion in technological thought of the present invention.And, in the scope not departing from the technology of the present invention thought described in claims, general technical staff of the technical field of the invention can implement the displacement of various form, distortion and change, and this displacement, distortion and change and should belong to scope of the present invention.
Claims (9)
1. be applicable to illumination light-emitting diode containing high thermal conductivity inorganics-polymer composite compositions of expanded graphite, wherein, it is prepared by making to be ground into the expanded graphite of nanosized and mineral filler dispersing and mixing in thermal conductivity synthetic resins.
2. the high thermal conductivity inorganics-polymer composite compositions containing expanded graphite being applicable to illumination light-emitting diode according to claim 1, wherein, at least one be selected from gold and silver, copper, aluminium, silver-plated copper, silver-plated nickel, silver coated aluminum, aluminum oxide, ferric oxide, magnesium oxide, boron nitride, silicon nitride and titanium nitride is mixed with in described mineral filler.
3. the high thermal conductivity inorganics-polymer composite compositions containing expanded graphite being applicable to illumination light-emitting diode according to claim 1, wherein, described thermal conductivity synthetic resins is the one in polyphenylene sulfide, polybutylene terephthalate, polycarbonate, polymeric amide, polypropylene, polyethylene, urethane, liquid crystalline resin (LCP), epoxy resin and silicone resin.
4. the high thermal conductivity inorganics-polymer composite compositions containing expanded graphite being applicable to illumination light-emitting diode according to any one in claims 1 to 3, wherein, described expanded graphite and mineral filler account for 1 ~ 30 weight percent of composite composition entirety.
5. be applicable to a preparation method for the high thermal conductivity inorganics-polymer composite compositions containing expanded graphite of illumination light-emitting diode, wherein, comprise:
Nano-pulverization step, to expanded graphite and mineral filler simultaneously or carry out once above pulverizing independently and be ground into nanosized;
Surface modification step, to the modifying surface of the expanded graphite and mineral filler that are ground into nanosized, thus imports stable functional group; And
Dispersing and mixing step, is disperseed by the expanded graphite and mineral filler making the nanosized of surface modification and is mixed in thermal conductivity synthetic resins, preparing inorganics-polymer composite compositions.
6. the preparation method being applicable to the high thermal conductivity inorganics-polymer composite compositions containing expanded graphite of illumination light-emitting diode according to claim 5, wherein, in described nano-pulverization step, utilize ultrasonic grinder to pulverize expanded graphite and mineral filler.
7. the preparation method being applicable to the high thermal conductivity inorganics-polymer composite compositions containing expanded graphite of illumination light-emitting diode according to claim 5, wherein, expanded graphite is ground into the described nano-pulverization step of nanosized, comprise: wet type nano-pulverization step, under moisture state, pulverize expanded graphite by ultrasonic grinder; Moisture removal step, removes moisture from containing being ground into the expanded graphite of nanosized of moisture; And powder dispersion step, for the expanded graphite powder of the nanosized of removal moisture, by powder dispersion operation, carry out decentralized equably.
8. the preparation method being applicable to the high thermal conductivity inorganics-polymer composite compositions containing expanded graphite of illumination light-emitting diode according to claim 5, wherein, the functional group imported in described surface modification step is at least one in carboxyl, hydroxyl and ester group.
9. the preparation method being applicable to the high thermal conductivity inorganics-polymer composite compositions containing expanded graphite of illumination light-emitting diode according to claim 5, wherein, the surface modification of described expanded graphite and mineral filler is to carry out processing treatment by the mixing acid of nitric acid or sulfuric acid.
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020140063573A KR101606450B1 (en) | 2014-05-27 | 2014-05-27 | Manufacturing method of Highly thermally conductive inorganic-polymer complex composition for applying lighting lamp LED that contains expanded graphite |
| KR10-2014-0063573 | 2014-05-27 |
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| CN105315668A true CN105315668A (en) | 2016-02-10 |
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| CN111040324A (en) * | 2019-12-31 | 2020-04-21 | 深圳第三代半导体研究院 | Composite heat dissipation material for semiconductor and preparation method thereof |
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| WO2017150748A1 (en) * | 2016-03-02 | 2017-09-08 | 주식회사 대신테크젠 | Composite composition having high thermal conductivity for use in automotive light housing and preparation method therefor |
| WO2018216836A1 (en) * | 2017-05-26 | 2018-11-29 | 주식회사 하이씨엔티 | Thermally conductive insulation composition and heat sink made therefrom |
| CN108395699A (en) * | 2018-04-01 | 2018-08-14 | 江西科恒照明电器有限公司 | A kind of LED encapsulation material and preparation process |
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| KR20150136292A (en) | 2015-12-07 |
| KR101606450B1 (en) | 2016-03-25 |
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