CN105309054A - Soldering device and method, and manufactured substrate and electronic component - Google Patents

Soldering device and method, and manufactured substrate and electronic component Download PDF

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Publication number
CN105309054A
CN105309054A CN201480016320.4A CN201480016320A CN105309054A CN 105309054 A CN105309054 A CN 105309054A CN 201480016320 A CN201480016320 A CN 201480016320A CN 105309054 A CN105309054 A CN 105309054A
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CN
China
Prior art keywords
handling part
fusion welding
electrode
treatment process
parts
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Granted
Application number
CN201480016320.4A
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Chinese (zh)
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CN105309054B (en
Inventor
谷黑克守
渡边源藏
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TANIGUROGUMI CORP
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TANIGUROGUMI CORP
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0445—Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force

Abstract

Space-saving soldering is performed allowing high-reliability soldering at a low cost and a high yield, using a soldering apparatus (100) having: a first process part (110) for setting a component (10) having an electrode (2); a second process part (120) divided by an opening-closing means (119), the second process part (120) sending the component (10) on to a third process part (130); the third process part (130) divided by an opening-closing means (129), the third process part (130) causing the component (10) to contact an organic fatty-acid-containing solution (131) and move horizontally; a fourth process part (140) having a means (33) for moving the component (10) to an empty section (143) and causing molten solder (5) to adhere to the electrode (2), and a means (34) for removing excess molten solder (5); a fifth process part (150) for horizontally moving the component (10) moved downward by the fourth process part; a sixth process part (160) divided by an opening-closing means (159), the sixth process part (160) sending the component (10) on to a seventh process part (170); and the seventh process part (170) divided by an opening-closing means (169), the seventh process part (170) taking out the component (10).

Description

Welder and method and manufactured substrate and electronic unit
Technical field
The present invention relates to welder and method and manufactured substrate and electronic unit.More specifically, relate to and can carry out the high and welder of the welding that reliability is high of rate of finished products and method and manufactured substrate and electronic unit with low cost.
Background technology
In recent years, the wiring density of the substrates such as printed base plate, wafer and flexible substrate (following, sometimes referred to as " installation base plate ") and packing density improve all the more.Installation base plate has the electrode for welding electronic unit mostly.Be provided with the solders such as solder projection for welding electronic unit or soldering paste (following, to be all called " connection solder ") on this electrode, electronic unit is connected solder and welds and be installed on installation base plate with this.
Connection solder requires fine and shape and size etc. consistent, and is only located at the part of needs.As the formation method meeting the connection solder required like this, propose in patent documentation 1 and a kind ofly use half tone and easily form densification and the method etc. of the effigurate paste bump of tool, described half tone possesses the opening for forming paste bump with slurry, this half tone is made up of the first metal layer of rigidity, the bond layer of resinae and the second metal level, and relative to the opening of the first metal layer, the bore of the opening of bond layer and the second metal level reduces.
But, connector, (Quad Flat formula encapsulates QFP, QuadFlatPackage), SOP (little lead-out wire encapsulation, SmallOutlinePackage), the electronic units such as BGA (ball grid array, BallGridArray), LGA (grid array, LandGridArray) exist uneven sometimes in the size of the splicing ears such as lead terminal.In order to the electronic unit of the size inequality by splicing ear does not weld with having failure welding, need the impact reducing the size inequality of electronic unit by thickening " the connection solder " be located on installation base plate.When the small-sized electronic unit mixing such as CSP (wafer-level package, ChipSizePackage) are present in the electronic unit for being arranged on installation base plate, such small-sized electronic part is minimum and fine by the size connecting solder.
As the formation method of general connection solder, there will be a known and a kind ofly will be provided with installation base plate direct impregnation (dipping) method in fusion welding of the electrode (such as copper electrode, identical below) be made up of copper etc.When solder contacts with copper electrode, tin chemical combination contained in copper and solder and generate CuSn intermetallic compound.This CuSn intermetallic compound generates originally as the basis of solder bonds.But this phenomenon is formed, therefore sometimes referred to as " erosion of electrode " with the form with the tin etch copper electrode in solder.Such erosion of electrode makes the volume reducing of the copper electrode of connection electronic unit and reliability is reduced, and may damage the reliability of installation base plate.Therefore, need to shorten the dip time of installation base plate in fusion welding to suppress erosion of electrode, therefore, be studied for forming the prewelding bed of material, the then method (dipping method) be immersed in by installation base plate in fusion welding on the copper electrode of installation base plate.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 10-286936 publication
Patent documentation 2: Japan Patent No. 5079170 publication
Patent documentation 3: Japan Patent No. 5079169 publication
Summary of the invention
The problem that invention will solve
In the formation method of above-mentioned connection solder, the formation method of the connection solder of half tone is used to there is the difficult point of productivity difference, in the part of being flooded in the part and in the end carrying out of carrying out flooding (immersion) at first by the formation method of the connection solder of dipping method, the difference of erosion of electrode becomes large, in each several part of identical substrate, the reliability of electrode produces large difference.Therefore, there is the problem still insurmountable problem of erosion of electrode.
In order to solve such problem, present applicant has proposed above-mentioned patent documentation 2,3.The technology of patent documentation 2 carries out following process continuously: containing the impregnation process in the solution of organic aliphatic acid, the attachment process of fusion welding carried out in spatial portion pull-up from spatial portion decline while the remaining fusion welding carried out removing process and containing the impregnation process again the solution of organic aliphatic acid; The technology of patent documentation 3 carries out following process continuously: first containing organic aliphatic acid molten in impregnation process, fusion welding in spatial portion inject process, move horizontally in this spatial portion and the removing process of remaining fusion welding carried out and the impregnation process in the second solution containing organic aliphatic acid.According to these technology, significantly can suppress the erosion of electrode that impregnation process is in the past such, and substrate or the electronic unit of the erosion of electrode that can not cause in various installation procedures afterwards can be manufactured.Its result, can using low cost manufacture as the reliability of the electrode of electrical connection section high and the substrate that rate of finished products is good or electronic unit.
Although the technology of the patent documentation 2,3 that the applicant proposes can realize desired object, but substrate or electronic unit (hereinafter referred to as " parts ") are installed in the conveying devices such as conveyer belt continuously, therefore, overall constant airspeed, with regard to the respective processing time, need the treated length adjusting each handling part.In addition, the input port that the conveying devices such as conveyer belt are come in and gone out and outlet can not be completely airtight, and the oily taste of the solution sometimes containing organic aliphatic acid leaks to outside.
The present invention is in order to the problem that solves in the past and improve the technology of patent documentation 2,3 and carry out, and its object is to provide a kind of can carry out rate of finished products high and the new welder of the save space type of the welding that reliability is also high and welding method with low cost.In addition, another object of the present invention is to provide a kind of parts (substrate and electronic unit) manufactured by such welder or welding method.
Solve the method for problem
(1) welder of the present invention for solving above-mentioned problem has:
First handling part, it installs the parts with electrode to be welded;
Second handling part, it utilizes the first switching mechanism be located between this second handling part and described first handling part both to be separated hermetically, and sends to ensuing 3rd handling part by the described parts sent into from described first handling part;
3rd handling part, it utilizes the second switching mechanism be located between the 3rd handling part and described second handling part both to be separated hermetically, the described parts sent into from described second handling part are contacted with the solution containing organic aliphatic acid, and this component level is moved;
4th handling part, it has fusion welding attachment mechanism and fusion welding removing mechanism, described fusion welding attachment mechanism make the described parts moved horizontally in described 3rd handling part move to above spatial portion and make fusion welding be attached on described electrode, described fusion welding removing mechanism is for removing remaining fusion welding in the fusion welding adhered to described in described spatial portion;
5th handling part, it makes the described component level moving to below in described 4th handling part move;
6th handling part, it utilizes the 3rd switching mechanism be located between the 6th handling part and described 5th handling part both to be separated hermetically, and sends to ensuing 7th handling part by the described parts sent into from described 5th handling part; And
7th handling part, it utilizes the 4th switching mechanism be located between the 7th handling part and described 6th handling part both to be separated hermetically, and takes out the described parts sent into from described 6th handling part.
According to the present invention, parts by each handling part, therefore, can be set in arbitrarily the processing time respective in each handling part, can design each handling part with the size corresponding to this processing time successively.Its result, can the miniaturization of implement device, becomes low cost and the high welder of efficiency.In addition, due to switching mechanism can be utilized to be separated the 3rd processing section of carrying out processing with the solution containing organic aliphatic acid hermetically, therefore, can prevent the oily taste of the solution containing organic aliphatic acid from leaking to outside.In addition, owing to having the 3rd handling part and the 4th handling part, therefore, on the electrode surface cleaned by the solution containing organic aliphatic acid, erosion of electrode preventing layer can be formed with the uniform thickness not producing hole and defect as far as possible.Its result, can not produce hole and defect as far as possible being located on the solder in this erosion of electrode preventing layer yet.
In welder of the present invention, preferred control does not make described first switching mechanism and described second switching mechanism open simultaneously, and controls not make described 3rd switching mechanism and described 4th switching mechanism open simultaneously.
According to the present invention, can further prevent the oily taste of the solution containing organic aliphatic acid from leaking to outside.
In welder of the present invention, preferred described parts are installed in box, and possess make box at least movement between described second handling part and described 3rd handling part box conveying device and make the box conveying device of box at least movement between described 5th handling part and described 6th handling part.
According to the present invention, the box being provided with parts can be made to move interval time with the production set arbitrarily, therefore, can the miniaturization of implement device, thus become low cost and the high welder of efficiency.
In welder of the present invention, described fusion welding attachment mechanism and described fusion welding removing mechanism preferably make described parts move to carry out.
According to the present invention, can effectively carry out the attachment of fusion welding or the removing of residue solder with the short time.
In welder of the present invention, (a1) preferably the described solution containing organic aliphatic acid is the solution containing palmitic acid, (b1) fusion welding crossed by the described solution-treated containing organic aliphatic acid of preferred described fusion welding, (c1) removing of preferred described remaining fusion welding utilizes the described solution containing organic aliphatic acid to carry out, (d1) preferably described 6th handling part has the liquid remover structure making the solution containing organic aliphatic acid be attached on described parts take off liquid, (e1) preferred described spatial portion is pressurizeed by the steam of the described solution containing organic aliphatic acid, (f1) temperature of preferred described spatial portion is identical with the temperature of the described solution containing organic aliphatic acid, and temperature in this spatial portion is identical with the temperature of the fusion welding at this spatial portion internal spraying or higher than this temperature.
(2) welding method of the present invention for solving above-mentioned problem has following operation:
First treatment process, installs the parts with electrode to be welded;
Second treatment process, utilizes the first switching mechanism be located between this second treatment process and described first treatment process both to be separated hermetically, and sends to ensuing 3rd treatment process by the described parts sent into from described first treatment process;
3rd treatment process, the second switching mechanism be located between the 3rd treatment process and described second treatment process is utilized both to be separated hermetically, the described parts sent into from described second treatment process are contacted with the solution containing organic aliphatic acid, and this component level is moved;
4th treatment process, there is fusion welding attachment mechanism and fusion welding removing mechanism, by described fusion welding attachment mechanism make the described parts moved horizontally in described 3rd treatment process move to above spatial portion and make fusion welding be attached on described electrode, remove remaining fusion welding in the fusion welding adhered to described in described spatial portion by described fusion welding removing mechanism;
5th treatment process, makes the described component level moving to below in described 4th treatment process move;
6th treatment process, utilizes the 3rd switching mechanism be located between the 6th treatment process and described 5th treatment process both to be separated hermetically, and sends to ensuing 7th treatment process by the described parts sent into from described 5th treatment process;
7th treatment process, utilizes the 4th switching mechanism be located between the 7th treatment process and described 6th treatment process both to be separated hermetically, and takes out the described parts sent into from described 6th treatment process.
In welding method of the present invention, (a2) preferably the described solution containing organic aliphatic acid is the solution containing palmitic acid, (b2) fusion welding crossed by the described solution-treated containing organic aliphatic acid of preferred described fusion welding, (c2) preferably the liquid of the described remaining fusion welding of removing is the described solution containing organic aliphatic acid, (d2) preferably described 6th treatment process has the liquid remover structure making the solution containing organic aliphatic acid being attached to described parts surface carry out de-liquid, (e2) preferred described spatial portion is pressurizeed by the steam of the described solution containing organic aliphatic acid, (f2) temperature of preferred described spatial portion is identical with the temperature of the described solution containing organic aliphatic acid, and temperature in this spatial portion is identical with the temperature of the fusion welding at this spatial portion internal spraying or higher than this temperature.
(3) be the substrate manufactured by the welder of the invention described above or welding method for solving the substrate of the present invention of above-mentioned problem, it is characterized in that, this substrate has electrode, and from the surface of described electrode, be disposed with erosion of electrode preventing layer, solder layer and organic fatty acid coated.
(4) be the electronic unit manufactured by the welder of the invention described above or welding method for solving the electronic unit of the present invention of above-mentioned problem, it is characterized in that, this electronic unit has electrode, and from the surface of described electrode, be disposed with erosion of electrode preventing layer, solder layer and organic fatty acid coated.
The effect of invention
According to welder of the present invention and welding method, the respective processing time of each handling part can be set in arbitrarily, therefore, each handling part can be designed with the size corresponding to its processing time.Its result, can seek the space saving of device and realize miniaturization, thus becomes low cost and high efficiency welder.In addition, can prevent the oily taste of the solution containing organic aliphatic acid from leaking to outside.In addition, erosion of electrode preventing layer can be formed on the electrode surface cleaned by the solution containing organic aliphatic acid, therefore can prevent the erosion of electrode, and the generation or the defect that the solder in this erosion of electrode preventing layer produce hole can be located at as much as possible.According to such apparatus and method, can using low cost manufacture as the reliability of the electrode of electrical connection section high and the substrate that rate of finished products is high, electronic unit.
According to substrate of the present invention and electronic unit; erosion of electrode preventing layer, solder layer and organic fatty is disposed with acid coated the surface of the electrode had from substrate and electronic unit; therefore; even if apply heat in reflow soldering afterwards or firing furnace etc., erosion of electrode preventing layer guard electrode also can be utilized not weather.Its result, the reliability of the electrical connection section (electrode section) in the installation procedure of the electronic unit carried out through various operation can not reduce, even fine electrode, also can manufacture on high finished product rate ground, therefore, the substrate that reliability can be provided high with low cost and electronic unit.
Accompanying drawing explanation
Fig. 1 is the schematic perspective views of the example that welder of the present invention is shown.
Schematic configuration diagram when Fig. 2 is the welder shown in vertical view 1.
Fig. 3 be front see shown in Fig. 1 welder time schematic configuration diagram.
Fig. 4 is the schematic configuration diagram of the 4th handling part when observing shown in Fig. 1 welder from left surface.
Fig. 5 is the schematic configuration diagram of another example of the 4th handling part when observing shown in Fig. 1 welder from left surface.
Fig. 6 is the schematic sectional view of an example of the substrate illustrated as parts.
Fig. 7 is the schematic sectional view of an example of substrate (processing unit) after process is shown.
Fig. 8 is the schematic sectional view of the form that the parts that have passed through after each handling part or each operation are shown.
Fig. 9 illustrates spray fusion welding and make fusion welding be attached to the schematic sectional view of the operation on electrode.
Figure 10 illustrates the solution the schematic sectional view removing the operation of remaining fusion welding that spray and contain organic aliphatic acid.
Figure 11 is formed in the example of the intermetallic compounds layer on electrode, and Figure 11 (A) is the schematic sectional view of the electrode section formed in comparative example, and Figure 11 (B) is the schematic sectional view of the electrode section formed in embodiment.
Figure 12 illustrates that being kept fixture keeps and carry out the schematic diagram of an example of processed continuously electronic unit.
Figure 13 is stereogram and the cutaway view of the example that manufactured electronic unit is shown.
Figure 14 is the stereogram of another example that manufactured electronic unit is shown.
Figure 15 is the diagrammatic top view of another example that welder of the present invention is shown.
Figure 16 is the schematic front view of the welder shown in Fig. 1.
Symbol description
1 base material
2 electrodes
3 coatings
4 erosion of electrode preventing layers
5 solder layers
The liquid stream of 5 ' fusion welding
5a fusion welding
6 coatings
7CuSn compound layer
10 parts (substrate or electronic unit)
11 parts processed (substrate or electronic unit)
33 attachment mechanisms (nozzle of fusion welding)
34 attachment mechanisms (nozzle of the solution containing organic aliphatic acid)
40 electronic units
41 elements
The maintenance fixture of 42 electronic units
51,52 semiconductor chips
100 welders
101 handling parts
102 circulating device portions
103 send into door
104 send door
105 observation windows
110 first handling parts
111 clamping devices
112 clamping parts
113 lifting shafts
114 elevating motors
115 boxes
116 boxes
119 first switching mechanisms
120 second handling parts
121 heaters
122 box conveying devices
123 conveying circuits
124 conveying motor
125 conveying rollers
129 second switching mechanisms
130 the 3rd handling parts
131 containing the solution of organic aliphatic acid
140 the 4th handling parts
141 fusion welding pipe arrangements
142 containing the solution pipe arrangement of organic aliphatic acid
143 spatial portions
148 drainage pipes
150 the 5th handling parts
152 box conveying devices
153 conveying circuits
154 conveying motor
155 conveying rollers
159 the 3rd switching mechanisms
160 the 6th handling parts
169 the 4th switching mechanisms
170 the 7th handling parts
181 clamping devices
182 clamping parts
183 lifting shafts
191 clamping devices
192 clamping parts
193 lifting shafts
194 elevating motors
201 pumps
202 branch units
203,204 pipe arrangements
301 pumps
302 branch units
303 tanks
304 branch units
305 junction surfaces
306,307 branches
The moving direction of A1, A2, A3, A4, A5, A6, A7, A8, A9 parts
The Return-ing direction of B box
400 welders
401 first treatment troughs (inlet slot)
402 second treatment troughs (K cryogenic treatment liquid bath)
403 the 3rd treatment troughs (high-temperature processing tank)
404 the 4th treatment troughs (soldering groove)
405 the 5th treatment troughs (solution removing treatment trough)
406 the 6th treatment troughs (link slot)
407 the 7th treatment troughs (outlet slot)
411 entrance storehouses
412 feeding devices
413 arms
421 outlet storehouses
422 dischargers
423 arms
431 process tanks
432 arm rotating shafts
433 covers
434 turning arms
435 suspension arms
436 mechanical arms
437 hold parts
438 slide units
441 solder cycles tanks
442 filters
443 gear pumps
500,510,520,530,540 treatment substrates
501 sliding supports
Embodiment
Below, with reference to accompanying drawing, welder of the present invention and welding method and manufactured substrate and electronic unit are described.It should be noted that, in this application, can by " the present invention " also referred to as " execution mode of the application ".In addition, can by " handling part " in welder also referred to as " treatment process " in welding method.In addition, " erosion of electrode preventing layer " has the electrode that prevents from forming electrode is corroded the effect of (such as when copper electrode, copper atom diffusion and the form of stripping) layer by solder.
[welder and method]
As shown in FIG. 1 to 3, welder 100 of the present invention and method are made up of the first handling part (the first treatment process) the 110 ~ seven handling part (the 7th treatment process) 170.
Specifically, device 100 and method have: the first handling part 110, install the parts 10 with electrode 2 to be welded; Second handling part 120, utilizes the first switching mechanism 119 be located between this second handling part 120 and first handling part 110 both to be separated hermetically, and is sent by the parts 10 sent into from the first handling part 110 to ensuing 3rd handling part 130; 3rd handling part 130, utilize the second switching mechanism 129 be located between the 3rd handling part 130 and this second handling part 120 both to be separated hermetically, and make the parts 10 sent into from the second handling part 120 contact with the solution 131 containing organic aliphatic acid and these parts 10 are moved horizontally; 4th handling part 140, it has fusion welding attachment mechanism 33 and fusion welding removing mechanism 34, the spatial portion 143 that the parts 10 utilizing the 3rd handling part 130 to move horizontally are moved to top by described fusion welding attachment mechanism 33 makes fusion welding 5 be attached on electrode 2, and described fusion welding removing mechanism 34 removes remaining fusion welding 5 in the fusion welding 5 of attachment in spatial portion 143; 5th handling part 150, makes to move to the parts 11 after the process of below in the 4th handling part 140 and moves horizontally; 6th handling part 160, utilizes the 3rd switching mechanism 159 be located between the 6th handling part 160 and the 5th handling part 150 both to be separated hermetically, and is sent by the parts 11 sent into from the 5th handling part 150 to ensuing 7th handling part 170; And the 7th handling part 170, utilize the 4th switching mechanism 169 be located between the 7th handling part 170 and the 6th handling part 160 both to be separated hermetically, and take out the parts 11 sent into from the 6th handling part 160.
By such welder 100 and method, can manufacture and can not cause the such erosion of electrode of impregnation process in the past and substrate, the electronic unit of erosion of electrode after can not causing in various installation procedure.Its result, can using low cost manufacture as the reliability of the electrode of electrical connection section high and the substrate that rate of finished products is high, electronic unit.In addition, the respective processing time of each handling part can be set in arbitrarily, therefore, each handling part can be designed with the size corresponding to this processing time.Its result, can seek the space saving of device and realize miniaturization, becomes low cost and the high welder of efficiency.In addition, can prevent the oily taste of the solution containing organic aliphatic acid from leaking to outside.
Welder 100 also can be the device of outward appearance shown in Fig. 1.For the example of Fig. 1, have: the handling part 101 being configured with the first handling part the 110 ~ seven handling part 170 and the circulating device portion 102 possessed for the device making fusion welding 5a and the solution 131 containing organic aliphatic acid circulate.What be provided with the feeding door 103 of feeding member 10 and submitting component 10 in the front face side of handling part 101 sends door 104, and has the observation window 105 arranged as required.
Below, each structure of device 100 and operation are described in detail.
(the first handling part/the first treatment process)
First handling part 110 is the handling parts installing the parts 10 with electrode 2 to be welded.
As long as parts 10 electrode 2 is located at the parts on base material 1 in any way, be just not particularly limited.As parts 10, such as, can enumerate: the electronic units such as the substrates such as printed base plate, wafer, flexible substrate (being all called " installation base plate ") and connector, QFP (QuadFlatPackage), SOP (SmallOutlinePackage), BGA (BallGridArray), LGA (LandGridArray), semiconductor chip, chip-resistance, chip capacitor, wire jumper wiring material.Also comprise new substrate and the electronic unit of known substrate beyond parts listed herein and electronic unit and Future Development.As the concrete example of parts 10, the substrate 10 shown in Fig. 6, the electronic unit 40 shown in Figure 12 and Figure 13 (A) and the electronic unit shown in Figure 14 51,52 such various parts can be listed.Such parts 10 have electrode 2 in one or two sides.
Electrode 2 is located on parts 10 with various form.The kind of electrode 2 is also not particularly limited, but using the conductive electrode comprising the metal ingredient be etched with the tin chemical combination contained by fusion welding 5a as object.As the metal ingredient be etched with tin chemical combination, Cu, Ag, Au, Pd, Rh, Zn, Sn, Ni, Co, Bi etc. can be enumerated.Electrode 2 is made up of one or more being selected from such metal ingredient.In addition, solder wettability and to corrode on surface be consistent with the back side, " solder wettability " is one or more and the easy chemical combination of tin contained by fusion welding 5a of such metal ingredient and forms tin compound and the phenomenon of moistening expansion, and " erosion " is one or more and tin chemical combination contained by fusion welding 5a of metal ingredient and forms tin compound thus make the phenomenon that electrode 2 diminishes.Erosion of electrode preventing layer 4 described later prevents such erosion and prevents the layer that the reliability of electrode 2 reduces.
As concrete electrode 2, can enumerate: copper electrode, copper alloy electrode, silver electrode, alloy silver electrode, gold electrode, gold alloy electrodes, palladium electrode, palladium alloy electrodes, aluminium electrode, aluminum alloy anode etc.In these alloying components containing above-mentioned one or more metal ingredients be selected from Cu, Ag, Au, Pd, Rh, Zn, Sn, Ni, Co, Bi etc., like this form tin compound containing composition and the tin chemical combination contained by fusion welding 5a, thus cause the phenomenon that electrode 2 diminishes.
Such as, when electrode 2 be copper electrode or copper alloy electrode, easily formed CuSn compound layer 7 (such as with reference to Figure 11 (A)) by the tin in its copper component and fusion welding.Its result, the copper component forming electrode 2 reduces (erosion of electrode), and electrode 2 diminishes.Equally, as the constituent of the electrodes 2 such as silver electrode, alloy silver electrode, gold electrode, gold alloy electrodes, palladium electrode, palladium alloy electrodes, aluminium electrode, aluminum alloy anode, when containing one or more in Cu, Ag, Au, Pd, Rh, Zn, Sn, Ni, Co, Bi, easily form MSn compound by its one or more compositions (M) and the tin (Sn) in fusion welding.Its result, the composition M forming electrode 2 reduces and causes electrode 2 to diminish.
Form and the size of electrode 2 are not particularly limited, but when electrode is the electrode pattern be located on substrate, such as, can enumerates pattern width or pattern diameter and be more than 5 μm or more than 10 μm and the electrode of the narrow pattern of the width of less than 500 μm or fine circular pattern.In addition, when electrode is the electrode be located on electronic unit, according to the kind of this electronic unit, more than hundreds of μm can be enumerated, count the electrode of the large-size of below mm degree.
In addition, the thickness of electrode 2 is also not particularly limited, and as an example, such as, can enumerate the degree of more than 5 μm, less than 30 μm.The size and the outer shape that are provided with the base material 1 of electrode 2 are also not particularly limited, can to various substrate application the present invention.The manufacture method of parts of the present invention is on the surface of such electrode 2, form the method that can suppress the erosion of electrode preventing layer 4 of the stripping of electrode composition.
Such parts 10 are fed through in device 100 from the feeding door 103 of Fig. 1.The parts 10 be admitted to are arranged in order as shown, for example, in fig. 2 like that, and utilize clamping device (clamping and the device of holding member) 111 to be delivered to the second handling part 120 successively.When the two sides of parts 10 has electrode 2, deliver to the second handling part 120 one by one, but only when the one side of parts 10 has electrode 2, also can every two deliver to the second handling part 120.This clamping device 111 is not particularly limited, and can enumerate to have clamping part 112 and the mode that lifting shaft 113 carries out moving up and down under the effect of elevating motor 114 carries out the device that controls.
In addition, when parts 10 are printed base plate etc., the printed base plate of this rectangle can directly be installed, but when parts 10 for such as shown in Figure 12 electronic unit 40, be preferably mounted on the maintenance fixture 42 that is consistent with the shape of this electronic unit 40.
(the second handling part/the second treatment process)
Second handling part 120 utilizes the first switching mechanism 119 be located between this second handling part 120 and first handling part 110 both can be separated hermetically and the parts 10 sent into from the first handling part 110 be sent the handling part to ensuing 3rd handling part 130.
In second handling part 120, before parts 10 are admitted to from the first handling part 110, the baffle plate (not shown, identical below) of the first switching mechanism 119 is closed, and when parts 10 are about to be admitted to, baffle plate is opened.After baffle plate is opened, parts 10 are transported to below from the first handling part 110, and parts 10 are installed in box 115.After being installed in box 115, close the baffle plate of the first switching mechanism 119, then open the baffle plate of the second switching mechanism 129, the box 115 (being referred to as parts mounting block 115) being provided with parts 10 is sent to the 3rd handling part 130.
Preferably parts mounting block 115 is sent to the 3rd handling part 130, close the baffle plate of the second switching mechanism 129, utilize air or non-active gas etc. to purify and replace spraying and the stink of the solution 131 containing organic aliphatic acid in the second handling part 120 of entering from the 3rd handling part 130.Thus, can prevent the spraying of the solution 131 containing organic aliphatic acid used in the 3rd handling part 130 or stink from flowing to the first handling part 110 from the second handling part 120 and leaking to outside.It should be noted that, purify and the gas displaced by deodorization device, adsorbent equipment process.
The conveying of box 115 is not particularly limited, and such as box conveying device 122 as shown in Figure 2 can be utilized to carry out.This box conveying device 122 is made up of conveying circuit 123, conveying motor 124 and conveying roller 125.By this box conveying device 122, box 115 can be made at least repeatedly to come and go between the second handling part 120 and the 3rd handling part 130.
The shape of the second handling part 120 is not particularly limited, as long as 1 or 2 parts 10 can be installed on the size in 1 box 115.In the example in figure 2, be elongated Structure composing when the second handling part 130 is to overlook, be particularly conducive to and save space.
Preferably arrange at the second handling part 120 and be used for pre-heated heater 121.By utilizing this heater 121 to heat to parts 10 in advance, can the solution 131 containing organic aliphatic acid of suppression component 10 and the 3rd handling part 130 temperature that contains the solution 131 of organic aliphatic acid when contacting decline.
(the 3rd handling part/the 3rd treatment process)
3rd handling part 130 utilizes the second switching mechanism 129 be located between the 3rd handling part 130 with the second handling part 120 both can be separated hermetically, make the parts 10 sent into from the second handling part 120 contact with the solution 131 containing organic aliphatic acid and make the handling part that these parts 10 move horizontally.
Parts mounting block 115 declines and is admitted to the 3rd handling part 130, and parts 10 contact with the solution 131 containing organic aliphatic acid in the 3rd handling part 130.Usually as shown in Figure 3 with in the 3rd handling part 130, fill up a certain amount of solution 131 immersive contact containing organic aliphatic acid, but the shower of the solution 131 containing organic aliphatic acid of also can spraying.It should be noted that, after parts mounting block 115 being sent into the 3rd handling part 130, close the baffle plate of the second switching mechanism 129.
Size and the shape of the 3rd handling part 130 are not particularly limited, and preferably can make the sufficient size and shape that parts 10 contact with the solution 131 containing organic aliphatic acid, and be formed not hinder the size and shape of the conveying of parts mounting block 115.In the example of Fig. 2, the 3rd handling part 130, by being elongated Structure composing when overlooking, being particularly conducive to and saving space.
The parts mounting block 115 contacted with the solution 131 containing organic aliphatic acid is moved horizontally to and described laterly adheres to process and remain the removing process of solder and the position of pull-up for carrying out fusion welding.Then, the spatial portion of the top of formation the 4th handling part 140 is risen to.
For the temperature of the solution 131 containing organic aliphatic acid in the 3rd handling part 130, the temperature of the spatial portion 143 of formation the 4th handling part 140 is made to be identical with the fluid temperature of fusion welding 5a or substantially identical temperature owing to utilizing from the steam wherein evaporated, therefore, decide according to the fluid temperature of fusion welding 5a.Such as when the fluid temperature of fusion welding 5a is about 250 DEG C, the temperature of the solution 131 preferably containing organic aliphatic acid is also temperature that is identical or equal extent, when the fluid temperature of the fusion welding 5a of low temperature type is about 150 DEG C, the temperature of the solution 131 preferably containing organic aliphatic acid is also temperature that is identical or equal extent.By being set as such temperature, the steam temperature evaporated can be set to temperature that is identical with the fluid temperature of fusion welding 5a or equal extent from the solution 131 containing organic aliphatic acid.As the control method of the temperature of the solution 131 containing organic aliphatic acid, can reel heater or cooler or in groove, insert heater or cooling water pipe or make the circulation in temperature control device (not shown) of the solution 131 containing organic aliphatic acid in groove carry out temperature control around the 3rd handling part 130.
The solution 131 containing organic aliphatic acid in 3rd handling part 130 is preferably containing carbon number more than 12 and the solution of the organic aliphatic acid of less than 20.Although also can use the organic aliphatic acid of carbon number less than 11, such organic aliphatic acid has water absorption, therefore not too preferred.In addition, the organic aliphatic acid of carbon number more than 21 exists that fusing point is high, impregnability is poor, be difficult to the difficult points such as process.Representatively organic aliphatic acid, is preferably the palmitic acid of carbon number 16.As organic aliphatic acid, particularly preferably only use the palmitic acid of carbon number 16, also can contain carbon number more than 12 as required and the stearic acid of other organic aliphatic acid of less than 20, such as carbon number 18.
Solution 131 containing organic aliphatic acid preferably uses containing more than 5 quality % and the solution that is made up of Lipase absobed oil of the palmitic acid of below 25 quality % and remainder.By using such solution 131 containing organic aliphatic acid, the solution 131 that should contain organic aliphatic acid optionally can introduce the impurity such as oxide, flux ingredients of the electrode surface being present in parts 10, makes electrode surface purifying.Be particularly preferably the solution 131 containing organic aliphatic acid of the palmitic acid of the carbon number 16 containing about 10 quality % (such as, more than 5 quality % and below 15 quality %).It should be noted that, not containing the additive such as the slaine such as nickel salt, cobalt salt or antioxidant in the solution 131 containing organic aliphatic acid.
When the concentration of organic aliphatic acid is lower than 5 quality %, the effect that the impurity such as oxide, flux ingredients that optionally introducing is present in electrode 2 surface carries out refining is slightly low, and then the management sometimes under low concentration becomes complicated.On the other hand, if the concentration of organic aliphatic acid is more than 25 quality %, then the viscosity of solution 131 existed containing organic aliphatic acid uprises, high-temperature area generation more than 300 DEG C is fuming and the problem such as problem of stench.Therefore, the content of organic aliphatic acid is preferably more than 5 quality % and below 25 quality %, particularly when only using the palmitic acid of carbon number 16, be preferably the content of about 10 quality % (such as, more than 5 quality % and below 15 quality %).
In the 3rd handling part 130, parts 10 contact with the above-mentioned solution 131 containing organic aliphatic acid, its result, and the oxide, impurity etc. on what parts 10 had be present in electrode 2 surface are removed and purifying.And the surface of electrode 2 forms the coating 3 (with reference to Fig. 8 (B)) of the organic aliphatic acid of the solution 131 formed containing organic aliphatic acid.This coating 3 can clean the surface of electrode 2, and then suppresses the oxidation on electrode 2 surface and prevent the generation of oxide film thereon.
(the 4th handling part/the 4th treatment process)
4th handling part 140 is the handling parts with fusion welding attachment mechanism 33 and fusion welding removing mechanism 34, described fusion welding attachment mechanism 33 make the parts 10 moved horizontally in the 3rd handling part 130 move to above spatial portion 143 and make fusion welding 5a be attached on electrode 2, described fusion welding removing mechanism 34 for remove in spatial portion 143 attachment fusion welding 5a in remaining fusion welding 5a.It should be noted that, symbol 141 is the pipe arrangement of fusion welding 5a, usually to be provided with nozzle 33 at equal intervals on this pipe arrangement 141.In addition, symbol 142 is the pipe arrangement of the solution 131 containing organic aliphatic acid, usually to be provided with nozzle 34 at equal intervals on this pipe arrangement 142.
In 4th handling part 140, as shown in Figure 3, by clamping part 182 hold assembly 10 from parts mounting block 115 of clamping device 181, the rising after being undertaken by the lifting of lifting shaft 183, decline, move horizontally.It should be noted that, in the example in figure 3, from parts mounting block 115, only hold assembly 10 moves, but also can move with the form of parts mounting block 115 and apply attachment mechanism 33 and removing mechanism 34.
First, fusion welding attachment mechanism 33 is described.
Fusion welding attachment mechanism 33 make the parts 10 moved horizontally in the 3rd handling part 130 move to above spatial portion 143 and fusion welding 5a is attached on electrode 2.As shown in Fig. 3 ~ Fig. 5, parts 10 are pulled up the spatial portion 143 to top after being processed by the solution 131 containing organic aliphatic acid of the 3rd handling part 130.Spatial portion 143 is spatial portions that have passed through pressurization of the vapor atmosphere of identical or substantially identical with the solution 131 containing the organic aliphatic acid solution 131 containing organic aliphatic acid, and this spatial portion in the horizontal direction compartment of terrain is configured with the removing mechanism 34 for the attachment mechanism 33 of the liquid stream 5 ' of the fusion welding 5a that sprays to the electrode 2 being located at parts 10 and spray to residue fusion welding 5a described later solution 131 containing organic aliphatic acid and removing residue fusion welding 5a.
Spatial portion:
Preferable space portion 143 is full of by the steam etc. of the solution 131 containing organic aliphatic acid and becomes pressurized state.The pressure of spatial portion 143 is not particularly limited, but is preferably about 0.1Pa.Particularly by being formed the pressurized state of above-mentioned scope by the steam of the solution 131 containing organic aliphatic acid, the electrode 2 of parts 10 can not be oxidized or be easily polluted by the external foreign matters.This spatial portion 143 is formed as follows: first import nitrogen, then heats to the solution 131 containing organic aliphatic acid, and utilizes its steam to be full of spatial portion 143.It should be noted that, symbol 148 is pressure for adjusting in spatial portion or the drainage pipe carrying out gas displacement.
The ambient temperature of spatial portion 143 is preferably identical with the temperature of the fusion welding 5a of welding or close to the temperature of this temperature.Although can be also identical temperature, be preferably set to the temperature slightly higher than fusion welding 5a.Such as, be preferably set to more than 2 DEG C and less than 10 DEG C higher than the fluid temperature of fusion welding 5a, be more preferably set to more than 2 DEG C and the ambient temperature of less than 5 DEG C higher than the fluid temperature of fusion welding 5a.By being set in this temperature range, the liquid stream 5 ' of the fusion welding 5a be injected into after electrode 2 surface can be made to spread all over the surface of this electrode 2 and flow, fusion welding 5a particularly can be made to extend to each corner of the electrode of micro-pitch or the electrode surface of small size.When ambient temperature is lower than the fluid temperature of fusion welding 5a, sometimes the viscosity of fusion welding 5a reduces and the mobility of fusion welding 5a is reduced, on the other hand, if be set to ambient temperature more than 10 DEG C higher than the fluid temperature of fusion welding 5a, then there is temperature too high and parts 10 are caused to the worry of fire damage.
Have the 3rd handling part 130 in the below of spatial portion 143, the steam containing the solution 131 of organic aliphatic acid evaporated from the 3rd handling part 130 is full of spatial portion 143.Its amount is not particularly limited, and makes the pressure of spatial portion 143 be the amount of the degree of the steam of about 0.1MPa as long as can produce.
For the temperature of the solution 131 containing organic aliphatic acid of the below of spatial portion 143, the temperature of spatial portion 143 is made to be identical with the fluid temperature of fusion welding 5a or substantially identical temperature owing to utilizing from the steam of wherein 1 evaporation, therefore, decide according to the fluid temperature of fusion welding 5a.Such as when the fluid temperature of fusion welding 5a be the situation of 250 DEG C or be 150 DEG C of degree as solder, the temperature of solution 131 preferably containing organic aliphatic acid is also temperature that is identical or equal extent.By being set to such temperature, the steam temperature evaporated by the solution 131 containing organic aliphatic acid can be made to be temperature that is identical with the fluid temperature of fusion welding 5a or equal extent.As the control method of the temperature of the solution 131 containing organic aliphatic acid, can reel heater or cooler or in groove, insert heater or cooling water pipe or the solution 131 containing organic aliphatic acid in groove is carried out temperature control in temperature control device (not shown) circulation around the 3rd handling part 130.
Attachment process;
In the spatial portion 143 of formation the 4th handling part 140, the electrode 2 to parts 10 carries out the attachment process (also referred to as inject process) of fusion welding 5a.That is, as shown in Fig. 3 ~ Fig. 5, from the spatial portion 143 pull-up parts 10 upward of the solution 131 containing organic aliphatic acid, while spray the liquid stream 5 ' of fusion welding 5a to these parts 10, fusion welding 5a is attached on electrode 2.The attachment mechanism 33 of the liquid stream 5 ' of attachment processing and utilizing spraying fusion welding 5a carries out, and such as shown in Figures 4 and 5, preferably uses nozzle 33.This nozzle 33 preferred disposition in the side, face being provided with electrode 2, but is configured at the side, two sides of parts 10 usually.
First, the fusion welding 5a sprayed from nozzle 33 is described.As fusion welding 5a, make solder heating and melting and make its liquidation to the solder that can carry out the degree of spraying with the form of liquid stream 5 '.Its heating-up temperature can select arbitrarily according to solder composition, usually sets good temperature from more than 150 DEG C in the scope of less than 300 DEG C degree.In the present invention, use at least containing the tin as principal component and the nickel as accessory ingredient, and optional containing one or more the melting lead-free solder be selected from silver, copper, zinc, bismuth, antimony and germanium as accessory ingredient further.
Preferred solder consists of Sn-Ni-Ag-Cu-Ge alloy, specifically, use more than nickel 0.01 quality % and below 0.5 quality %, silver-colored more than 2 quality % and below 4 quality %, more than copper 0.1 quality % and below 1 quality %, more than germanium 0.001 quality % and the solder alloy that below 0.02 quality %, surplus are tin forms the CuNiSn intermetallic compound 4 (with reference to Figure 11 (B)) that stably can prevent erosion of electrode, therefore preferably.More than nickel 0.01 quality % is consisted of and below 0.07 quality %, silver-colored more than 0.1 quality % and below 4 quality %, more than copper 0.1 quality % and below 1 quality %, more than germanium 0.001 quality % and below 0.01 quality %, surplus are the solder alloy of tin for the formation of such CuNiSn intermetallic compound 4 particularly preferred.When utilizing such Sn-Ni-Ag-Cu-Ge alloy to weld, preferably make more than 240 DEG C and the fusion welding 5a of less than 260 DEG C temperature uses.
In addition, the solder containing bismuth can make the further low temperature of the heating-up temperature of fusion welding 5a, is grouped into by adjusting this one-tenth, can low temperature near such as 150 DEG C.Such low temperature can also reduce the steam temperature in spatial portion 143, is therefore more preferably.As described above, the solder composition containing bismuth also preferably contains more than 0.01 quality % and the nickel of below 0.5 quality %, more preferably contains more than 0.01 quality % and the nickel of below 0.07 quality %.Thus, the fusion welding 5a that easily can form the low form of CuSn intermetallic compounds layer 4 can be made.
In addition, other zinc or antimony can also be coordinated as required.In any case, solder composition all preferably at least contains more than 0.01 quality % and the nickel of below 0.5 quality %, more preferably contains more than 0.01 quality % and the nickel of below 0.07 quality %.
The fusion welding 5a of above-mentioned composition is lead-free lead-free solder, and the nickel of above-mentioned content must be contained, therefore, as shown in Figure 11 (B), nickel contained in fusion welding 5a and the copper chemical combination of electrode 2, further with the tin chemical combination of fusion welding 5a, thus can easily form CuNiSn intermetallic compounds layer 4 on the surface of electrode 2.The CuNiSn intermetallic compounds layer 4 formed plays a role as the erosion of electrode preventing layer of electrode 2, and performance prevents the defect of electrode 2 or the effect of disappearance.Therefore, the solder layer 5 with CuNiSn intermetallic compounds layer 4, to put into the situation substrate being formed with this solder layer 5 being immersed in the dipping process in solder bath afterwards such, easily can tolerate the process that electrode 2 be can be described as to harshness.Therefore, even if the solder dipping operation of application low cost, the solder layer 5 that rate of finished products is high, reliability is high can also be formed.In addition, can obtain low cost and high reliability can carrying out the installation base plate of the installation of the electronic unit utilizing this solder layer 5 with high finished product rate.
The thickness of nickel content on CuNiSn intermetallic compounds layer 4 contained by known fusion welding 5a has impact.Specifically, be more than 0.01 quality % at nickel content and in the scope of below 0.5 quality % (being preferably below 0.07 quality %), more than 1 μm can be generated and the basic uniform CuNiSn intermetallic compounds layer 4 of the thickness of less than 3 μm.Thickness is that the CuNiSn intermetallic compounds layer 4 within the scope of this can prevent from the copper in electrode 2 to be added in fusion welding 5a or in solder layer 5 being etched.
When nickel content is 0.01 quality %, the thickness of CuNiSn intermetallic compounds layer 4 is about more than 1 μm and less than 1.5 μm, when nickel content is such as 0.07 quality %, the thickness of CuNiSn intermetallic compounds layer 4 is about 2 μm, when nickel content is 0.5 quality %, the thickness of CuNiSn intermetallic compounds layer 4 is about 3 μm.
When nickel content is lower than 0.01 quality %, the thickness of CuNiSn intermetallic compounds layer 4 is lower than 1 μm, and producing this CuNiSn intermetallic compounds layer 4 can not the position of coated electrode 2 completely, the easy erosion causing copper from this position sometimes.When nickel content is more than 0.5 quality %, harder CuNiSn intermetallic compounds layer 4 exceedes thickness 3 μm and becomes thicker, sometimes on this CuNiSn intermetallic compounds layer 4, produces be full of cracks.Its result, easily causes the erosion of copper from this be full of cracks part.It should be noted that, preferred nickel content is more than 0.01 quality % and below 0.07 quality %, the fusion welding 5a with the nickel content of this scope and nickel content more than 0.07 quality % and be below 0.5 quality % situation compared with, the be full of cracks of CuNiSn intermetallic compounds layer 4 can not be caused, level and smooth conforming layer can be formed.
Refinement treatment;
Solder as fusion welding 5a preferably carries out refinement treatment.Specifically, containing more than 5 quality % and the solution of the organic aliphatic acid of the carbon number 12 ~ 20 of below 25 quality % is heated to more than 180 DEG C and less than 350 DEG C, the solution after this heating will be contacted with fusion welding 5a and is also uniformly mixed tempestuously.Thus, the fusion welding 5a before the refinement treatment that oxidized copper and flux ingredients etc. can be made to pollute is purifying, thus the fusion welding 5a of can be removed cupric oxide and flux ingredients etc.Then, mixed liquor containing the fusion welding 5a eliminating cupric oxide and flux ingredients etc. is imported in the solution storage tank (not shown) containing organic aliphatic acid, utilize pump by this contain in the solution storage tank of organic aliphatic acid utilize difference in specific gravity isolated purifying after fusion welding 5a bottom that to contain the solution storage tank of organic aliphatic acid from this be back to Pb-free coating liquid tank.By carrying out such refinement treatment, can suppress to be used as the copper concentration in the fusion welding 5a of liquid stream and the rising of impurity concentration time dependent, and can not the impurity such as cupric oxide and scaling powder residue be brought into lead-free solder liquid storage tank.Its result, can suppress the time dependent composition change of the fusion welding 5a in Pb-free coating liquid tank, therefore, can form solder layer 5 that is stable and the use fusion welding 5a that joint reliability is high continuously.In addition, the installation base plate possessing such solder layer 5 can be manufactured continuously.
Fusion welding 5a after refining does not contain the impurity such as the cupric oxide level scaling powder residue of the joint quality affecting solder layer 5.In addition, the viscosity of this fusion welding 5a also declines than the viscosity of untreated fusion welding.Its result, the electrode 2 of fine pattern forms solder layer 5, can form solder layer 5 with spreading all over, and the joint quality of the solder layer 5 between each batch and electronic unit can be made even, contribute to quality stability by the time on this electrode 2.
Identical with the organic aliphatic acid contained by the above-mentioned solution 131 containing organic aliphatic acid for the organic aliphatic acid contained by the refining solution containing organic aliphatic acid, therefore, at this, the description thereof will be omitted.It should be noted that, temperature for the refining solution containing organic aliphatic acid determines according to the fusing point of fusion welding 5a to be refined, solution containing organic aliphatic acid and the fusion welding 5a high-temperature area at least more than the fusing point of fusion welding 5a (as an example, being 240 DEG C ~ 260 DEG C) stirs contact tempestuously.In addition, from the problem of being fuming and energy-conservation viewpoint, the ceiling temperature of the solution containing organic aliphatic acid is about 350 DEG C, preferably treats the scope of temperature ~ 300 DEG C of more than the fusing point of the fusion welding 5a of refinement treatment.Such as, more than nickel 0.01 quality % and below 0.07 quality %, silver-colored more than 0.1 quality % and below 4 quality %, more than copper 0.1 quality % and below 1 quality %, more than germanium 0.001 quality % and below 0.01 quality %, surplus are that the solder alloy of tin is more than 240 DEG C and the temperature of less than 260 DEG C is used as fusion welding 5a, therefore, the temperature of the solution containing organic aliphatic acid is also preferably identical with it more than 240 DEG C and less than 260 DEG C.In addition, when using solder, the solution 131 containing organic aliphatic acid also can be set to low temperature according to its temperature.
As shown in Fig. 3 ~ Fig. 5, like this by containing the fusion welding 5a after the solution refining of organic aliphatic acid by parts 10 from the process of the pull-up upward of the solution 131 containing organic aliphatic acid, spray in the mode of liquid stream 5 ' from attachment mechanism 33 to parts 10.Expulsion pressure from the fusion welding 5a of attachment mechanism 33 is not particularly limited, can according to the setting arbitrarily such as the kind of fusion welding 5a, temperature, viscosity.Usually with the pressure injection of about 0.3MPa ~ 0.8MPa.As mentioned above, ambient temperature is preferably the temperature (preferably slightly high temperature) identical or close with it with the fluid temperature of fusion welding 5a.Like this, as shown in Fig. 8 (C) and Fig. 5, the fusion welding 5a being attached to protuberance on electrode 2 is set.In addition, the settings arbitrarily such as the kind of fusion welding 5a can be considered from the flow velocity of the liquid stream 5 ' of the fusion welding 5a of attachment mechanism 33 spraying with the spraying processing time.In addition, the condition such as the shape of attachment mechanism 33 and spray angle also can consider application or the settings arbitrarily such as the kind of fusion welding 5a.
Then, the removing mechanism 34 of remaining fusion welding is described.The removing mechanism 34 of residue solder is the mechanism removing remaining fusion welding 5 in the fusion welding 5 that adhered to by above-mentioned attachment mechanism 33.
Pile up after having the parts 10 of fusion welding 5a to be pulled up in spatial portion 143 as shown in Figure 4, move in the horizontal direction in spatial portion 143, then on remaining fusion welding 5a, spraying contains the solution 131 of organic aliphatic acid and removes.This removal step parts 10 is declined in the solution 131 containing organic aliphatic acid while to spray solution 131 containing organic aliphatic acid and the operation of carrying out from the removing mechanism 34 in the spatial portion 143 being configured at its midway.By this removal step, as shown in Fig. 8 (C) and Figure 10, the fusion welding 5a swelled on the electrodes 2 can be removed, and only remain inexpungible fusion welding 5a.Inexpungible fusion welding 5a refers to, is being formed at the fusion welding 5a of attachment on the CuNiSn intermetallic compounds layer 4 on electrode 2, and the fusion welding 5a of this attachment forms solder layer 5.
In addition, can preferably make with the following method: as shown in Figure 5, while by pull-up in the spatial portion 143 of parts 10 formation the 4th handling part 140 upward, while the nozzle 33 installed from the side, two sides towards substrate 10 sprays the liquid stream 5 ' of fusion welding 5a, and then while parts 10 are reduced and again to pull-up in spatial portion 143, removes the remaining fusion welding 5a on parts 10.
The solution identical or substantially identical with the solution 131 containing organic aliphatic acid contained by the 3rd handling part 130 for what remove fusion welding 5a containing the solution of organic aliphatic acid.Spatial portion 143 is the vapor atmosphere of the solution 131 containing organic aliphatic acid, therefore can use the solution identical with the solution 131 containing organic aliphatic acid of the solution 131 formed containing organic aliphatic acid.It should be noted that, also partly can be mixed into the non-active gas such as nitrogen.On the other hand, from the viewpoint of the oxidation of solder layer 5 and the intermiscibility to the solution containing organic aliphatic acid, be not mixed into the air and water etc. containing aerobic.Expulsion pressure from the solution 131 containing organic aliphatic acid of removing mechanism 34 is not particularly limited, can according to the setting arbitrarily such as the kind of fusion welding 5a, temperature, viscosity.Usually with the pressure injection of about 0.2MPa ~ 0.4MPa.
Temperature as the solution 131 containing organic aliphatic acid of atomizing of liquids is preferably identical or substantially identical with the temperature of fusion welding 5a (such as about 250 DEG C, in solder situation be about 150 DEG C etc.).So, while blowing and flying remaining fusion welding 5a, the coating 6 (with reference to Fig. 8 (D) and Figure 13 (B)) of organic aliphatic acid can be formed on the surface of the fusion welding 5a exposed.
The recycling of fusion welding:
Although not shown, the bottom of the 3rd handling part 130 below spatial portion 143, sinks to having the fusion welding 5a that sprayed by attachment mechanism 33 in the effect of difference in specific gravity and is removed the fusion welding 5a that mechanism 34 wipes off.Also can arrange for reclaiming and recycling the circulating device (not shown) of fusion welding 5a of sinking.The fusion welding 5a be stored in bottom the 3rd handling part 130 also can be delivered to the attachment mechanism 33 of spraying fusion welding 5a by this circulating device.
It should be noted that, the solution 131 containing organic aliphatic acid is separated due to difference in specific gravity with fusion welding 5a, the fusion welding 5a sunk down into bottom the 3rd handling part 130 can be taken out, and be separated with the solution 131 containing organic aliphatic acid.The fusion welding 5a that such separation obtains and recycling after filtration treatment etc. can being implemented as required containing the solution 131 of organic aliphatic acid.
(the 5th handling part/the 5th treatment process)
5th handling part 150 be by the process moving to below in the 4th handling part 140 after parts 11 carry out the handling part that moves horizontally.
The parts 11 moved to after the process of below from the 4th handling part 140 are again contacted with the solution 131 containing organic aliphatic acid by impregnating the 5th handling part 150.Such as shown in Figure 3, although the 5th handling part 150 is positioned at the groove identical from the 3rd handling part 130 of save space type and but the region of total solution 131 containing organic aliphatic acid of identical different as handling part, and be in the prolongation of above-mentioned 3rd handling part 130.
The temperature of the solution 131 containing organic aliphatic acid of the 5th handling part 150 is identical with the temperature in each portion in the 3rd handling part 130 as above.In addition, should solution 131 containing organic aliphatic acid and all described above containing composition etc., therefore, omit their explanation at this.
Parts 11 after decline are installed in box 116, and this parts mounting block 116 is moved horizontally to immediately below the 6th handling part 160.The conveying of box 116 is not particularly limited, can be same with the conveying of above-mentioned box 115, utilizes such as box conveying device 152 as shown in Figure 2 to carry out.This box conveying device 152 is made up of conveying circuit 153, conveying motor 154 and conveying roller 155.Utilize this box conveying device 152, box 116 can be made at least repeatedly to come and go between the 5th handling part 150 and the 6th handling part 160.
(the 6th handling part/the 6th treatment process)
6th handling part 160 utilizes the 3rd switching mechanism 159 be located between the 6th handling part 160 and the 5th handling part 150 both to be separated hermetically, and the parts 11 sent into from the 5th handling part 150 are sent the handling part to ensuing 7th handling part 170.
In the 6th handling part 160, before the 5th handling part 150 feeding member mounting box 116, the flapper closure of the 3rd switching mechanism 159, when by feeding member mounting box 116, baffle plate is opened.After baffle plate is opened, from the 5th handling part 150 transfer unit mounting box 116 upward.Close the baffle plate of the 3rd switching mechanism 159 after feeding member mounting box 116 immediately, then open the baffle plate of the 4th switching mechanism 169, only parts 11 are sent to the 7th handling part 170 from parts mounting block 116.
Preferably parts 11 are sent to the 7th handling part 170, close the baffle plate of the 4th switching mechanism 169, and the spraying of the solution 131 containing organic aliphatic acid in the 6th handling part 160 utilizing the purifying and replacing such as air or non-active gas to enter from the 5th handling part 150 and stink.Thus, can prevent the spraying of the solution 131 containing organic aliphatic acid used in the 5th handling part 150 and stink from flowing to the 7th handling part 170 from the 6th handling part 160 and leaking to outside.It should be noted that, to purify and the gas displaced is processed by deodorization device and adsorbent equipment.
Folder from the parts 11 of parts mounting block 116 goes out and can carry out with clamping device 191 as shown in Figure 3.Clamping device 191 is not particularly limited, but can enumerate and have clamping part 192 and lifting shaft 193 carries out the device that controls in the mode that the effect of elevating motor 194 is carried out moving up and down.
In 6th handling part 160, also air knife (not shown) can be set as required.The solution 131 containing organic aliphatic acid that the surface of the parts 11 from the 5th handling part 150 pull-up is adhered to by air knife takes off liquid, therefore preferably uses.By so de-liquid, the solution 131 containing organic aliphatic acid of residue attachment can be removed.This de-liquid preferably uses air nozzle etc.The expulsion pressure of air nozzle now etc. is not particularly limited, and can set arbitrarily according to the size of parts 11 or shape.The parts 11 after processing can be obtained thus.
(the 7th handling part/the 7th treatment process)
7th handling part 170 utilizes the 4th switching mechanism 169 be located between the 7th handling part and the 6th handling part 160 both to be separated hermetically, and by handling part that the parts 11 sent into from the 6th handling part 160 take out.The parts 11 sending into the 7th handling part 170 are such as arranged in order as shown in Figure 2, and send to device 100 from the door 104 of sending of Fig. 1.
(other)
A1, A2, A3, A4, A5, A6, A7, A8, A9 shown in Fig. 3 ~ Fig. 5 represents the moving direction of parts or parts mounting block, and B represents the Return-ing direction of box.In addition, forming the circulating device portion 102 of welder 100 is for the device making fusion welding 5a, solution 131 containing organic aliphatic acid circulates, for pump 201, branch unit 202, pipe arrangement 203,204, pump 301, branch unit 302, tank 303, branch unit 304, junction surface 305, branch 306,307.They can design arbitrarily, also can be set to the structure beyond mode shown in Fig. 2.
In addition, as shown in FIG. 1 to 3, welder 100 is provided with and covers overall enclosed hood, and defines closed structure between reason portion 110 ~ 170 throughout together with above-mentioned opening and closing device.Thus, can prevent the solution 131 containing organic aliphatic acid being easy to evaporate from becoming steam and diffusing to outside, and can prevent in the polluter access to plant from outside.
When obtained parts 11 are the substrates such as printed base plate, be provided with erosion of electrode preventing layer 4, minimal solder layer 5 and organic fatty acid coated 6 successively on electrode 2 surface of this substrate.Its result, even if this substrate impregnated in this installation procedure in various fusion weld hopper, or drop in reflow soldering after having printed cream solder, or when in input firing furnace, all can not cause the erosion of electrode of electrode 2, and do not damage solder wettability, then process in installation procedure.
When obtained parts 11 are electronic unit, be also provided with erosion of electrode preventing layer 4, minimal solder layer 5 and organic fatty acid coated 6 successively on electrode 2 surface of this electronic unit.Its result, even if be immersed in various fusion weld hopper in the installation procedure of this electronic unit, or when mounting cream solder after printing dropping into afterwards reflow soldering or drop in firing furnace, all can not cause the erosion of electrode of the electrode 2 of electronic unit, and do not damage solder wettability, then process in installation procedure.
As mentioned above, in welder 100 of the present invention and method, parts 10 pass through each handling part 110 ~ 170 of save space structure successively, therefore, the respective processing time of each handling part can be set in arbitrarily, and each handling part can be designed with the size corresponding to this processing time.Its result, becomes the space saving that can seek device and realizes miniaturization, low cost and the high welder of efficiency.In addition, the 3rd handling part 130 processed by the solution 131 containing organic aliphatic acid can be utilized and can realize compact, space-efficient switching mechanism 119,129,159,169 and can separate hermetically, therefore, can the miniaturization of implement device entirety, and can prevent the oily taste of the solution 131 containing organic aliphatic acid from leaking to outside.In addition, owing to having the 3rd handling part 130 and the 4th handling part 140, therefore erosion of electrode preventing layer 4 can be formed at the electrode surface purifying by the solution 131 containing organic aliphatic acid with the uniform thickness not producing hole or defect as far as possible.Its result, can also not produce hole or defect as far as possible being located on the solder 5 in this erosion of electrode preventing layer 4.According to such apparatus and method, can, substrate that rate of finished products high high as the reliability of the electrode of electrical connection section using low cost manufacture or electronic unit.
In addition, after contacting with the solution 131 containing organic aliphatic acid, while contain spatial portion 143 pull-up of the vapor atmosphere of the solution 131 of organic aliphatic acid to this, the liquid stream 5 ' of fusion welding 5a while spray to the electrode 2 being located at parts 10, fusion welding 5a is made to be attached on electrode 2, and further while decline or pull-up again from this spatial portion 143, while remove remaining fusion welding 5a to the solution 131 of remaining fusion welding 5a spraying containing organic aliphatic acid, therefore, evenly erosion of electrode preventing layer 4 can not be formed defectively at purifying electrode surface, and, again contact with the solution 131 containing organic aliphatic acid under the state of the remaining fusion welding 5a of removing and be provided with organic fatty acid coated 6.Its result, even if impregnated in installation procedure afterwards in various fusion weld hopper, or drops in reflow soldering after printing paste solder, or when in input firing furnace, also can not cause the erosion of electrode of electrode 2, and not damage solder wettability, then process in installation procedure.
[manufactured substrate and electronic unit]
As shown in Fig. 7 and Fig. 8 (D), substrate 10 of the present invention is the substrates manufactured by welder 100 or the welding method of the invention described above, and the electrode 2 that this substrate 10 has is provided with erosion of electrode preventing layer 4, solder layer 5 and organic fatty acid coated 6 successively from its surface.As substrate 10, the various substrates such as printed base plate, wafer and flexible substrate can be enumerated.Particularly wafer, because electrode width, spacing are narrow, therefore advantageous applications device and method of the present invention, can arrange solder layer 5 accurately on the micro-electrode of thin space.In addition, when arranging printed base plate or the flexible substrate of larger electronic unit, the surface of this solder layer 5 being kept purifying state, or can process in operation afterwards, therefore, can as the substrate with reliability.
In addition, as shown in FIG. 13 and 14, electronic unit of the present invention is the electronic unit 40,51,52 manufactured by welder 100 or the welding method of the invention described above, and the electrode 2 that this electronic unit 40,51,52 has is provided with erosion of electrode preventing layer 4, solder layer 5 and organic fatty acid coated 6 successively from its surface.As electronic unit, semiconductor chip, semiconductor module, IC chip, IC module, dielectric chip, dielectric module, resistance chip, resistive module etc. can be enumerated.
According to such substrate and electronic unit, even if heating in reflow soldering afterwards or firing furnace etc., erosion of electrode preventing layer 4 guard electrode 2 also can be utilized not by erosion of electrode.Its result, the reliability of the electrical connection section (electrode section) in the installation procedure of the electronic unit carried out through various operation can not reduce, and can manufacture on high finished product rate ground, therefore, the substrate that reliability can be provided high with low cost and electronic unit.
[another execution mode of welder]
The welder 400 of another embodiment of the present invention is as shown in Figure 15 and Figure 16, have: the first treatment trough (inlet slot) 401 installing the parts (being called treatment substrate) 500 with electrode to be welded, the treatment substrate sent into from this first treatment trough 401 is sent the second treatment trough (K cryogenic treatment liquid bath) 402 to ensuing 3rd treatment trough 403, make the 3rd treatment trough (high-temperature processing tank) 403 that the treatment substrate sent into from this second treatment trough 402 contacts with the solution containing organic aliphatic acid, 4th treatment trough 404 of the fusion welding removing mechanism (fusion welding removing groove) of remaining fusion welding in the fusion welding attachment mechanism (soldering groove) electrode in the 3rd treatment trough 403 with the treatment substrate of process adhering to fusion welding and the fusion welding removing above-mentioned attachment, utilize the 5th treatment trough (solution removing treatment trough) 405 that gas or liquid process the treatment substrate after process in the 4th treatment trough 404, the treatment substrate sent into from the 5th treatment trough 405 is sent the 6th treatment trough (link slot) 406 to ensuing 7th treatment trough 407, and take out the 7th treatment trough (outlet slot) 407 of the treatment substrate 600 sent into from the 6th treatment trough 406.
Below, be described in detail.
Welder 400 shown in Figure 15 and Figure 16 is made up of the first treatment trough 401, second treatment trough 402, the 3rd treatment trough 403, the 4th treatment trough 404, the 5th treatment trough 405, the 6th treatment trough 406 and the 7th treatment trough.Second these 5 treatment troughs for the treatment of trough the 402 ~ six treatment trough 406 are configured in process tank 431.Configuration is as follows: centered by arm rotating shaft 432, and with (such as 72 ° of intervals) at equal intervals and radially mode is from inside to outside configured with elongated each treatment trough laterally.In addition, this interval may not be at equal intervals.
First treatment trough 401 and the 7th treatment trough 407 are configured at outside process tank 431, but as shown in figure 16, the first treatment trough 401 is connected in bottom with the second treatment trough 402, and the 7th treatment trough 407 is connected in bottom with the 6th treatment trough 406.Arbitrary treatment trough 401,402,406,407 all guarantee treatment substrate 500,600 by the longitudinal space of degree, treatment substrate 500,600 slides mobile in this space.
The entrance storehouse 411 of storage treatment substrate 500 is configured with on the side of the first treatment trough 401.Treatment substrate 500 is accommodated in this entrance storehouse 411.On the other hand, the outlet storehouse 421 receiving the substrate 600 processed is configured with on the side of the 7th treatment trough 407.The substrate 600 processed is contained in this outlet storehouse 421.
Above-mentioned each treatment trough is configured at and covers in overall cover, and entrance storehouse 411 and outlet storehouse 421 configure as follows: treatment substrate is passed in and out from the outside of cover 433, and makes its part extend out to the outside of cover 433.
Treatment substrate 500 is one of the parts of the electrode being provided with soldering.The kind of this substrate is not particularly limited, and is the substrate of sheet.Treated side can be one side, also can be two sides.
First treatment trough 401 is put into from entrance storehouse 411.Its input utilizes mechanical arm 436 to carry out, and utilizes the hold assembly 437 being located at mechanical arm 436 front end to clamp treatment substrate 500 to carry out.Organic fatty acid solution has been put in this first treatment trough 401.First treatment trough 401 is connected with the second treatment trough 402, therefore, in the second treatment trough 402, has also put into organic fatty acid solution.The temperature of organic fatty acid solution is not particularly limited, but preferably not too high, as long as about 50 DEG C ~ about 80 DEG C.By the temperature of organic fatty acid solution is set to lower temperature, the stink of organic fatty acid solution and the generation of cigarette can be suppressed.It should be noted that, the first treatment trough 401 define arm rise after the structure of closing cap immediately, treatment trough 407 forms the structure of closing cap immediately after arm rising too.
The treatment substrate 500 entering into the first treatment trough 401 utilizes sliding component 438 to move to the second treatment trough 402 from the first treatment trough 401.This travel mechanism is not particularly limited, and such as shown in figure 16, the travelling carriage 501 come and gone in the first treatment trough 401 and the second treatment trough 402 can be utilized to carry out.This travelling carriage 501 can be moved by sliding component 438, and the driving for this movement can transmit driving to carry out to sliding component 438 by hold assembly 437.Such as, rotate by clamping components 437, and utilize the effect that sliding component 438 performance makes travelling carriage 501 round.It should be noted that, this moves and movement between the 6th treatment trough 406 and the 7th treatment trough 407 can be carried out according to identical principle.In addition, symbol 412 is feeding device, and symbol 413 is the arm extended from this feeding device, and symbol 422 is discharger, and symbol 423 is the arm extended from this feeding device.
The treatment substrate moving to the second treatment trough 402 is located at the front end clamping of the suspension arm 435 of turning arm 434 front end, and pull-up upward.The treatment substrate of pull-up as shown in figure 15, utilizes turning arm 434 to rotate and declines to the position of the 3rd treatment trough 403, and enters in the 3rd treatment trough 403 under the state that the arm 435 that is draped clamps.
3rd treatment trough 403 has put into the groove through the organic fatty acid solution of heating, and treatment substrate is processed by this organic fatty acid solution.As described above, therefore, at this, the description thereof will be omitted and effect for the temperature of organic fatty acid solution.
Treatment substrate after treatment utilizes suspension arm 435 to be pulled up, and as shown in figure 15, utilizes turning arm 434 to rotate and decline to the position of the 4th treatment trough 404, and enters in the 4th treatment trough 404 under the state that the arm 435 that is draped clamps.
4th treatment trough 404 carries out adhering to the process of fusion welding and the groove except the process of remaining fusion welding in the fusion welding of attachment removal.Flood under the state that the attachment of fusion welding can be full of fusion welding in groove 404, fusion welding also can be made to carry out spray injection towards real estate.In addition, the removing of remaining fusion welding is: remove by making the gas such as nitrogen or air or organic fatty acid solution the remaining solder be attached on treatment substrate face towards real estate spray injection.
Also solder cycles tank 441, filter 442 and gear pump 443 can be set in the 4th treatment trough 404.Solder cycles tank 441 when flood, spray when all preferably carry out solder cycles.Filter 442, for separating of the impurity be mixed in solder or organic fatty acid solution, preferably can use cyclone filter.
Treatment substrate is after treatment draped arm 435 pull-up, and as shown in figure 15, utilizes turning arm 434 to rotate and decline to the position of the 5th treatment trough 405, and enters in the 5th treatment trough 405 under the state that the arm 435 that is draped clamps.
5th treatment trough 405 is the grooves for utilizing gas or liquid to process the substrate after above-mentioned process.Specifically, the clean organic fatty acid solution being attached to substrate surface.As such mechanism, air-atomizing injection, non-active gas spray injection etc. can be enumerated.In addition, also can be full of arbitrary cleaning solution, and utilize this cleaning solution to process.
Treatment substrate is after treatment draped arm 435 pull-up, and as shown in figure 15, utilizes turning arm 434 to rotate and decline to the position of the 6th treatment trough 406, and enters in the 6th treatment trough 406 under the state that the arm 435 that is draped clamps.
The solvent for the atmosphere in process tank and external atmosphere being cut off is added in the 6th treatment trough 406.As solvent, can be above-mentioned organic fatty acid solution, also can be other organic solutions such as alcohol.In addition, the organic fatty acid solution being full of the first treatment trough 401 and the second treatment trough 402 adds the solvent for the atmosphere in process tank and bottom atmosphere being cut off too.Technology essential factor very important in welder of the present invention by such solution by cutting off with the atmosphere outside process tank in process tank.By carrying out such partition, having and the high temperature atmosphere in process tank and organic fatty acid solution atmosphere can not be made to diffuse to outside larger advantage.
As mentioned above, the welder 400 according to Figure 15 and Figure 16 and employ the welding method of this device, can be set to the short time by the processing time in each treatment trough, and arm can be utilized to rotate process successively.Its result, can implement device significantly space saving and miniaturization, becomes low cost and the high welder of efficiency.In addition, owing to can effectively cut off, therefore can prevent the oily taste of the solution containing organic aliphatic acid from leaking to outside.In addition, erosion of electrode preventing layer is formed due to purifying electrode surface can have been carried out at the solution of utilization containing organic aliphatic acid, therefore can prevent the erosion of electrode, and can the generation or the defect that the solder in this erosion of electrode preventing layer do not produce as far as possible hole be located at.According to such apparatus and method, can, substrate that rate of finished products high high as the reliability of the electrode of electrical connection section using low cost manufacture or electronic unit.
Embodiment
Below, embodiment is enumerated and comparative example further illustrates the present invention.
[embodiment 1]
As an example, prepare to be formed with width on base material 1 and be such as 200 μm and thickness is such as the substrate 10 of the thin copper film pattern of 10 μm.This substrate 10 only the width becoming the mounting portion of electronic unit in thin copper film pattern is such as 200 μm and the electrode 2 that length is such as 50 μm exposes multiple, and other thin copper film pattern is covered by insulating barrier.
As the solution 131 containing organic aliphatic acid put in the 3rd handling part 130, prepare the solution 131 containing organic aliphatic acid of the palmitic acid containing 10 quality % in the Lipase absobed oil not containing the slaine such as nickel salt and cobalt salt or antioxidant etc.The temperature of the solution 131 containing organic aliphatic acid in the 3rd handling part 130 is controlled to be 250 DEG C.For used fusion welding 5a, prepare following fusion welding 5a: the 5 yuan of system lead-free solders using Ni:0.05 quality %, Ge:0.005 quality %, Ag:3 quality %, Cu:0.5 quality %, remainder to be made up of Sn are also heated to 250 DEG C, have made fusion welding 5a thus.
After spatial portion 143 has imported nitrogen, by the temperature to 250 DEG C of the solution 131 containing organic aliphatic acid, and the steam of the solution 131 containing organic aliphatic acid is utilized to be full of upper space.Substrate 10 is put in the welder 100 prepared like this.
Substrate 10 is installed on the first handling part 110.Substrate 10 is clamped by clamping device 111 and delivers to the second handling part 120 in the first handling part 110, and is installed in box 115.Then, close the baffle plate of the first switching mechanism 119, the substrate 10 be installed in box 115 is sent to the 3rd handling part 130.After substrate 10 being delivered to the 3rd handling part 130, close the baffle plate of the second switching mechanism 129.Substrate 10 impregnated in the solution 131 containing organic aliphatic acid in the 3rd handling part 130, is provided with acid coated 3 (such as with reference to Fig. 8 (B)) of organic fatty on the electrodes 2.This organic fatty acid coated 3 is the layers as the solution 131 utilized containing organic aliphatic acid, purifying result being carried out on copper surface and adhere to.After making substrate 10 move horizontally in the 3rd handling part 130, as shown in Fig. 7 and Fig. 9, the 4th handling part 140 pull-up upward, while the nozzle 33 installed from the side, two sides towards substrate 10 jetted the liquid stream 5 ' of the fusion welding 5a of such as 250 DEG C.Such as shown in Fig. 8 (C), the electrode 2 of fusion welding 5a of having sprayed becomes fusion welding 5a and adheres to the state of piling up.
Then, as shown in Fig. 7 and Fig. 4, in the spatial portion 143 of the 4th handling part 140, substrate 10 horizontal direction is moved, then decline downwards, while the remaining fusion welding 5a on removing substrate 10.The two sides that this removing mechanism is used in substrate 10 all tilts such as 30 ° and the nozzle 34 installed carries out.The solution 131 containing organic aliphatic acid of such as 250 DEG C is sprayed from nozzle 34.Its result, obtains the substrate 11 of form shown in Fig. 8 (D).It should be noted that, this substrate 11 is provided with erosion of electrode preventing layer 4, solder layer 5, organic fatty acid coated 6 on the electrodes 2 successively.Then, substrate 11 is moved in the horizontal direction in the 5th handling part 150, then open the baffle plate of the 3rd switching mechanism 159, the 6th handling part 160 pull-up upward.Pull-up is on one side while carried out de-liquid by spraying from the air of air nozzle 39.Closing baffle plate after pull-up to the 6th handling part 160.Then open the baffle plate of the 4th switching mechanism 169 and move to the 7th handling part 170.Like this, substrate 11 is obtained.
[embodiment 2]
In embodiment 1, except carrying out, except the process of the 4th handling part 140, operating similarly to Example 1 as illustrated in fig. 5, the substrate 11 of embodiment 2 is obtained.Specifically, by substrate 10 the 4th handling part 140 pull-up upward, while the nozzle 33 installed from the side, two sides towards substrate 10 jetted the liquid stream 5 ' of the fusion welding 5a of such as 250 DEG C.Then, as shown in Figure 5, substrate 10 to be declined and again to spatial portion 143 pull-up, while the remaining fusion welding 5a on removing substrate 10.
[comparative example 1]
Except employing Ag:3 quality %, Cu:0.5 quality % in embodiment 1,3 yuan of system lead-free solders that remainder is made up of Sn as except solder material, operate similarly to Example 1, obtain the substrate of comparative example 1.The electrode 2 of substrate defines CuSn intermetallic compounds layer 7, but there is not CuNiSn intermetallic compounds layer (with reference to Figure 11 (A)).

Claims (7)

1. a welder, it has:
First handling part, it installs the parts with electrode to be welded;
Second handling part, it utilizes the first switching mechanism be located between this second handling part and described first handling part both to be separated hermetically, and sends to ensuing 3rd handling part by the described parts sent into from described first handling part;
3rd handling part, it utilizes the second switching mechanism be located between the 3rd handling part and described second handling part airtightly both to be separated, the described parts sent into from described second handling part are contacted with the solution containing organic aliphatic acid, and this component level is moved;
4th handling part, it has fusion welding attachment mechanism and fusion welding removing mechanism, described fusion welding attachment mechanism make the described parts moved horizontally in described 3rd handling part move to above spatial portion and make fusion welding be attached on described electrode, described fusion welding removing mechanism is for removing remaining fusion welding in the fusion welding adhered to described in described spatial portion;
5th handling part, it makes the described component level moving to below in described 4th handling part move;
6th handling part, it utilizes the 3rd switching mechanism be located between the 6th handling part and described 5th handling part both to be separated hermetically, and sends to ensuing 7th handling part by the described parts sent into from described 5th handling part; And
7th handling part, it utilizes the 4th switching mechanism be located between the 7th handling part and described 6th handling part both to be separated hermetically, and takes out the described parts sent into from described 6th handling part.
2. welder according to claim 1, wherein,
Control not make described first switching mechanism and described second switching mechanism open simultaneously, and control not make described 3rd switching mechanism and described 4th switching mechanism open simultaneously.
3. welder according to claim 1 and 2, wherein,
Described parts are installed in box, and described welder possesses the box conveying device of at least movement between described second handling part and described 3rd handling part and the box conveying device of at least movement between described 5th handling part and described 6th handling part.
4. the welder according to any one of claims 1 to 3, wherein,
Described fusion welding attachment mechanism and described fusion welding removing mechanism make described parts move while carry out.
5. a welding method, it has following operation:
First treatment process, installs the parts with electrode to be welded;
Second treatment process, utilizes the first switching mechanism be located between this second treatment process and described first treatment process both to be separated hermetically, and sends to ensuing 3rd treatment process by the described parts sent into from described first treatment process;
3rd treatment process, the second switching mechanism be located between the 3rd treatment process and described second treatment process is utilized both to be separated hermetically, the described parts sent into from described second treatment process are contacted with the solution containing organic aliphatic acid, and this component level is moved;
4th treatment process, there is fusion welding attachment mechanism and fusion welding removing mechanism, by described fusion welding attachment mechanism make the described parts moved horizontally in described 3rd treatment process move to above spatial portion and make fusion welding be attached on described electrode, remove remaining fusion welding in the fusion welding adhered to described in described spatial portion by described fusion welding removing mechanism;
5th treatment process, makes the described component level moving to below in described 4th treatment process move;
6th treatment process, utilizes the 3rd switching mechanism be located between the 6th treatment process and described 5th treatment process both to be separated hermetically, and sends to ensuing 7th treatment process by the described parts sent into from described 5th treatment process;
7th treatment process, utilizes the 4th switching mechanism be located between the 7th treatment process and described 6th treatment process both to be separated hermetically, and takes out the described parts sent into from described 6th treatment process.
6. a substrate, it is the substrate manufactured by the welder according to any one of Claims 1 to 4 or welding method according to claim 5,
This substrate has electrode, and from the surface of described electrode, be disposed with erosion of electrode preventing layer, solder layer and organic fatty acid coated.
7. an electronic unit, it is the electronic unit manufactured by the welder according to any one of Claims 1 to 4 or welding method according to claim 5,
This electronic unit has electrode, and from the surface of described electrode, be disposed with erosion of electrode preventing layer, solder layer and organic fatty acid coated.
CN201480016320.4A 2013-03-21 2014-03-20 Welder and method and manufactured substrate and electronic unit Active CN105309054B (en)

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US9686871B2 (en) 2017-06-20
JPWO2014148634A1 (en) 2017-02-16

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