CN105300298B - Diamond segment parameter measuring apparatus - Google Patents
Diamond segment parameter measuring apparatus Download PDFInfo
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- CN105300298B CN105300298B CN201510746701.4A CN201510746701A CN105300298B CN 105300298 B CN105300298 B CN 105300298B CN 201510746701 A CN201510746701 A CN 201510746701A CN 105300298 B CN105300298 B CN 105300298B
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Abstract
The invention provides a kind of diamond segment parameter measuring apparatus and diamond saw chip bonding machine, belong to machine tool technology field.It, which is solved, has the problem of measurement accuracy is not enough in existing parameter measuring apparatus and diamond saw chip bonding machine.Thickness measure component and thickness measure component in this diamond saw blade bonding machine include two laser range sensors being oppositely arranged in this diamond segment parameter measuring apparatus, and two laser range sensors are electrically connected with control circuit；Workpiece for measurement can pass through between two laser range sensors.Being measured simultaneously using two laser range sensors and combining suitable computing strategy just can significantly increase measurement accuracy.Without being connected by floating connecting structure between sensor installing plate and frame in this diamond saw blade bonding machine, thus with structure can be simplified, measurement accuracy is can guarantee that again, or even can improve the advantage of measurement accuracy.
Description
Technical field
The invention belongs to machine tool technology field, more particularly to a kind of diamond segment parameter measuring apparatus.
The invention belongs to machine tool technology field, more particularly to a kind of diamond saw chip bonding machine.
Background technology
Diamond segment is the operative body of diamond cutting tool.Diamond cutting tool such as diamond disc saw blade,
Diamond gang saw, diamond disk and diamond core drill bit.If Fig. 1 is the cutter head of diamond saw blade, in order to improve diamond saw
The quality of piece, need to measure classification to cutter head, and of a sort cutter head is welded on same saw bit matrix；Measured in welding
The thickness of saw bit matrix, it is ensured that the center reference face of diamond segment is flushed with the center reference face of saw blade body.For this people
It is proposed that diamond segment thickness gauge (Authorization Notice No. CN203216446U) and diamond segment parameter auto-testing
Device (application publication number CN104729449A), automatic measurement diamond segment thickness and basis are realized using the measurement apparatus
Measurement data is classified automatically.People also proposed diamond saw blade measurer for thickness and the bonding machine with above-mentioned measurement apparatus
(application publication number CN103322959A).Find that measurement accuracy can not meet the requirement of portions of client in actual use,
Especially measure the matrix and cutter head in small-sized diamond saw blade.
The content of the invention
The present invention proposes a kind of diamond segment parameter measuring apparatus, and how extremely the technical problem to be solved in the present invention is
Diamond segment thickness measure precision is improved less.
The present invention proposes a kind of diamond saw chip bonding machine, and the technical problem to be solved in the present invention is how at least to improve
Diamond saw blade substrate thickness measure precision.
The technical problem to be solved of the present invention can be realized by following technical proposal：The parameter measurement of this diamond segment
Device includes working plate, pneumatic gripping, thickness measure component and first control circuit, and working plate is provided with energy horizontal feed
Lift cylinder, the cylinder body and working plate of lift cylinder are fixedly connected with the conveyer belt assembly of diamond segment, pneumatic gripping
Between be connected by the way that the first numerical control that pneumatic gripping moves horizontally can be made to be oriented to feeder assembly；Thickness measure component includes two
The laser range sensor being oppositely arranged, laser range sensor is fixed on working plate, and two laser range sensors are equal
Electrically connected with first control circuit；Numerical control, which is oriented to feeder assembly, can also be such that pneumatic gripping leads between two laser range sensors
Cross.
It can guarantee that the light beam of laser range sensor impinges upon gold by the direction for setting pneumatic gripping to clamp diamond segment
On the side of diamond tool bit, that is, measure the thickness of diamond segment.Two laser range sensors can be measured and diamond respectively
Spacing between cutter head corresponding side surface, first control circuit just can calculate gold according to the measured value of two laser range sensors
The actual (real) thickness of diamond tool bit.
It is efficiently avoid compared with prior art using this diamond segment parameter measuring apparatus because of pneumatic gripping clamping
The problem of diamond segment does not just influence measurement accuracy；In other words, measure and tie simultaneously using two laser range sensors
The computing strategy properly closed just can significantly increase measurement accuracy.
This diamond segment parameter measuring apparatus is oriented to feeder assembly driving pneumatic gripping movement using numerical control, with pneumatic
Clamp displacement controllability is strong, and then can realize multimetering diamond segment, it is ensured that measurement accuracy reliability and realization
More disaggregated classification.
This diamond saw blade bonding machine includes frame, second control circuit and thickness measure component, and frame, which is provided with, to be used for
Clamp diamond segment cutter head clamping device and for position diamond saw blade substrate and with substrate fixture；The thickness
Measurement assembly includes two laser range sensors and one piece of sensor installing plate being oppositely arranged, two laser range sensors
Electrically connected with second control circuit, laser range sensor is fixed on sensor installing plate, sensor installing plate is arranged on
On the substrate of fixture or it is arranged in frame；The outer edge for the diamond saw blade substrate being positioned on fixture can be embedded in two laser
Between distance measuring sensor.
The light beam of laser range sensor is impinged upon on the side of diamond saw blade substrate, that is, measures diamond saw blade substrate
Thickness.Two laser range sensors can measure the spacing between diamond saw blade substrate corresponding side surface, the second control electricity respectively
Road just can calculate the actual (real) thickness of diamond segment according to the measured value of two laser range sensors.
Compared with prior art, without by floating between the sensor installing plate and frame in this diamond saw blade bonding machine
Dynamic attachment structure is connected, thus with that can simplify structure, measurement accuracy is can guarantee that again, or even can improve the excellent of measurement accuracy
Point.
Brief description of the drawings
Fig. 1 is the dimensional structure diagram of diamond saw blade.
Fig. 2 is the dimensional structure diagram of this diamond segment parameter measuring apparatus.
Fig. 3 is the dimensional structure diagram of elevation carrection part in this diamond segment parameter measuring apparatus.
Fig. 4 is elevation carrection part main structure diagram in this diamond segment parameter measuring apparatus.
Fig. 5 is the main structure diagram of this diamond saw blade bonding machine.
Fig. 6 is the sectional perspective structural representation of this diamond saw blade bonding machine.
Fig. 7 is the main structure diagram of another scheme of this diamond saw blade bonding machine.
Fig. 8 is the sectional perspective structural representation of another scheme of this diamond saw blade bonding machine.
In figure, 1, working plate；2nd, pneumatic gripping；3rd, conveyer belt assembly；3a, conveyer belt；3b, motor；3c, deflector chute；
3d, guide plate；3e, block；4th, lift cylinder；5th, the first numerical control is oriented to feeder assembly；6th, first support；7th, laser ranging is sensed
Device；8th, second support；9th, the 3rd support；10th, upper clamping thimble；11st, lower clamping thimble；12nd, travel(l)ing rest；13rd, cylinder is measured；
14th, elevation carrection sensor；15th, substrate is measured；16th, upper correction thimble；17th, lower correction thimble；18th, cylinder is corrected；19th, machine
Frame；20th, cutter head clamping device；21st, fixture；21a, substrate；22nd, the second numerical control is oriented to feeder assembly；23rd, sensor installing plate；
23a, escape groove；24th, the 4th numerical control is oriented to feeder assembly；25th, height adjustment component；25a, fixed plate；25b, portable plate；26、
Rotating shaft；27th, diamond segment；28th, diamond saw blade substrate.
Embodiment
The following is specific embodiment of the invention and with reference to accompanying drawing, technical scheme is further described,
But the present invention is not limited to these embodiments.
Embodiment one
As shown in Figures 2 to 4, this diamond segment parameter measuring apparatus includes working plate 1, pneumatic gripping 2, thickness survey
Measure component and first control circuit.
Part based on working plate 1, working plate 1 is horizontally disposed with.
Conveyer belt assembly 3 of the working plate 1 provided with energy horizontal feed diamond segment 27, conveyer belt assembly 3 includes water
Provided with two rotating wheels in the flat conveyer belt 3a set, conveyer belt 3a, connection, work are rotated between rotating wheel and working plate 1
A motor 3b is fixed with platen 1, motor 3b is connected with one of rotating wheel.Conveyer belt 3a top is provided with and formed
The deflector chute 3c guide plate 3d and block 3e for preventing diamond segment 27 from moving；Block 3e and guide plate 3d are each attached to work
On platen 1.It is provided with block 3e for detecting whether there is the first sensor that diamond segment 27 is resisted against on block 3e,
First sensor is electrically connected with first control circuit.
Lift cylinder 4 is fixedly connected with pneumatic gripping 2, first is passed through between the cylinder body and working plate 1 of lift cylinder 4
Numerical control is oriented to feeder assembly 5 and is connected.Specifically, the first numerical control be oriented to feeder assembly 5 include numerical-control motor, screw mandrel screw and
Line slideway；Numerical-control motor is electrically connected with first control circuit；The cylinder body of the slippery fellow of line slideway and screw with lift cylinder 4
It is fixedly connected；First support 6 is fixed with working plate 1, the guide rod of line slideway is fixedly connected with first support 6, screw mandrel with
First support 6 rotates connection；The rotating shaft 26 of numerical-control motor is connected with screw rod transmission, and the housing of numerical-control motor is fixed on first support
On 6.First numerical control is oriented to the cathetus guide rail guide direction of feeder assembly 5 and be arranged in parallel with conveyer belt 3a conveying directions；Straight line is led
Rail is horizontally disposed with, thus pneumatic gripping 2 can be moved horizontally and vertical lifting is moved.
By controlling spacing between pneumatic gripping 2 and first support 6 to ensure the motion track of pneumatic gripping 2 and deflector chute 3c phases
Overlap, in other words, diamond segment 27 only needs to move on one face, and then makes this diamond segment parameter measuring apparatus structure
It is simpler.
Thickness measure component includes two laser range sensors 7 for being oppositely arranged, two laser range sensors 7 with
First control circuit is electrically connected.Each pass through adjustable for height second support between laser range sensor 7 and working plate 1
8 are connected.Ensure that the light beam of two laser range sensors 7 is overlapped by adjusting the height of second support 8, in other words ensure two
Individual laser range sensor 7 measures the same position of diamond segment 27, improves measurement accuracy.Change measurement diamond segment 27
During model, also it can highly ensure that measurement height is adapted with diamond segment 27 by adjusting second support 8.
The beam level that two laser range sensors 7 are located at the both sides of clamp, i.e. laser range sensor 7 is projected and light
Beam and the guide direction that the first numerical control is oriented to feeder assembly 5 are perpendicular；Thus the first numerical control, which is oriented to feeder assembly 5, can make pneumatic clamps
Pincers 2 pass through between two laser range sensors 7.
Cutter head elevation carrection component is additionally provided with working plate 1, cutter head elevation carrection component is located at the moving rail of pneumatic gripping 2
On trace.Cutter head elevation carrection component includes the 3rd support 9 and two clamping thimbles；3rd support 9 is fixed on working plate 1
On, two clamp thimble opposed vertical and set；It is upper clamping thimble 10 and lower clamping thimble 11, upper clamping that two, which clamp thimble,
Thimble 10 is fixed on the 3rd support 9, and lower clamping thimble 11 is fixed on travel(l)ing rest 12, the support 9 of travel(l)ing rest 12 and the 3rd
Between by the way that the measurement cylinder 13 of the vertical lifting of travel(l)ing rest 12 can be made to be connected.Height is fixed with the cylinder body for measuring cylinder 13
Measurement substrate 15 is fixed with measurement sensor 14, the 3rd support 9；Elevation carrection sensor 14 is electrically connected with first control circuit
Connect.
The upper both sides for clamping thimble 10 are equipped with a upper correction thimble 16, and upper correction thimble 16 is fixed on the 3rd support 9
On.The lower both sides for clamping thimble 11 are equipped with correction thimble 17 under one, pass through between lower correction thimble 17 and travel(l)ing rest 12
Correction cylinder 18 is connected.Using the posture of the correct-by-construction diamond segment 27, posture after being adjusted with diamond segment 27
Uniformity is high, coincidence measurement requirement, thus can guarantee that the stability of measurement accuracy.
By illustrating that measuring diamond saw blade using this diamond segment parameter measuring apparatus further illustrates capital
The effect of diamond tool bit parameter measuring apparatus and advantage：
Diamond segment 27 is by vibrating disk infeed conveyor belt 3a, and the concaved circular cambered surface of diamond segment 27 is upward.It is being oriented to
Under plate 3d guide effect and under conveyer belt 3a drive, diamond segment 27 is resisted against on block 3e end face；The state is touched
First sensor is sent out, and then accordingly part performs measurement action for first control circuit control.
Figure of description provides the tong arm moving direction of pneumatic gripping 2 and the first numerical control is oriented to the guiding side of feeder assembly 5
To perpendicular.
First, the piston rod of control lift cylinder 4 stretches out, and pneumatic gripping 2 clamps, realizes that pneumatic gripping 2 is clamped and be resisted against
Diamond segment 27 on block 3e.Pneumatic gripping 2 is clipped in the middle part of the two sides of diamond segment 27, stronger with clamping
Advantage.
Then, keep the clamping of pneumatic gripping 2 to be in clamp position, piston rod retraction, the numerical control of lift cylinder 4 are controlled successively
Motor rotates, and diamond segment 27 is moved to diamond segment 27 and stops the light beam that laser range sensor 7 is projected.Laser Measuring
The spacing between the side of diamond segment 27 is measured away from sensor 7, first control circuit calculates the reality of diamond segment 27
Thickness.Its computing strategy measures as clamped standard diamond cutter head 27 using cylinder clamp and measured value is set as into base
Quasi- value, then calculate actual measured value and the difference of a reference value and just can calculate the actual (real) thickness of diamond segment 27.In this process
In, the thickness at the both ends of diamond segment 27 is measured respectively, for improving classification degree.
Then, continue to control numerical-control motor rotation, diamond segment 27 is moved between two clamping thimbles；Control is surveyed
The piston rod of the piston rod and correction cylinder 18 of measuring cylinder 13 stretches out, and realizes that the state of correction diamond segment 27 improves measurement essence
Spend and measure and measure spacing between substrate 15 using elevation carrection sensor 14, first control circuit calculates diamond segment
27 actual height.
Finally, control numerical-control motor is reversely rotated successively and pneumatic gripping 2 opens, and realizes automatic blanking.
Embodiment two
As shown in Figure 5 and Figure 6, this diamond saw blade bonding machine includes frame 19, second control circuit, cutter head clamping device
20th, fixture 21 and thickness measure component.
Part based on frame 19, frame 19 is vertically arranged.
Fixture 21 is used to position diamond saw blade substrate 28, and fixture 21 includes substrate 21a, the substrate 21a and machine of fixture 21
Feeder assembly 22 is oriented between frame 19 by the second numerical control to be connected, the second numerical control is oriented to the numerical control of feeder assembly 22 and first and is oriented to
The structure of feeder assembly 5 is identical, herein no longer burden description.Second numerical control is oriented to the cathetus guide rail of feeder assembly 22 and is vertically arranged,
Thus fixture 21 can vertical lifting.3rd numerical control is oriented to numerical-control motor in feeder assembly and electrically connected with second control circuit.
Cutter head clamping device 20 is used to clamp diamond segment 27, and cutter head clamping device 20 includes contiguous block and pneumatic clamps
Head, between pneumatic chuck and contiguous block by the 3rd numerical control be oriented to feeder assembly be connected, the 3rd numerical control be oriented to feeder assembly with
The first numerical control guiding structure of feeder assembly 5 is identical, herein no longer burden description.3rd numerical control is oriented to feeder assembly cathetus guide rail
It is horizontally disposed, thus pneumatic chuck can move horizontally, pneumatic chuck moves horizontally and is positioned at the diamond saw blade on fixture 21
The plate face of matrix 28 is perpendicular；Thus ensure center reference face and the veneer sawing machine of diamond segment 27 by adjusting pneumatic chuck position
The center reference face of body is flushed.3rd numerical control is oriented to numerical-control motor in feeder assembly and electrically connected with second control circuit.
Thickness measure component includes two laser range sensors 7 and a sensor installing plate 23 being oppositely arranged, and swashs
Ligh-ranging sensor 7 is fixed on sensor installing plate 23.Two laser range sensors 7 with second control circuit Electricity Federation
Connect.The escape groove 23a being embedded for diamond saw blade substrate 28 is provided with sensor installing plate 23.
Feeder assembly 24 is oriented between sensor installing plate 23 and the substrate 21a of fixture 21 by the 4th numerical control to be connected,
4th numerical control is oriented to the cathetus guide rail of feeder assembly 24 and is horizontally disposed with and is oriented to feeder assembly cathetus guide rail phase with the 3rd numerical control
Vertically；Feeder assembly 24 is thus oriented to by the height and the 4th numerical control of manipulation of lift dog 21 and drives laser range sensor 7
Move horizontally, the outer edge for the diamond saw blade substrate 28 being positioned on fixture 21 can be made to be embedded in two laser range sensors 7
Between, two laser range sensors 7 measure the spacing between the plate face of diamond saw blade substrate 28, and second control circuit is calculated
The actual (real) thickness of diamond saw blade substrate 28.Its computing strategy can be identical with the measurement thickness computing strategy of diamond segment 27,
No longer burden description herein.
Sensor installing plate 23 is located at the top of laser range sensor 7, and the structure effectively can protect laser ranging to pass
Sensor 7, it is to avoid the impurity that welding is dropped scalds laser range sensor 7, and then effectively ensure making for laser range sensor 7
With life-span and guarantee measurement accuracy.
Embodiment three
The structure and principle of the present embodiment be the same as Example one are essentially identical, the no longer burden description of essentially identical part, only retouch
Different place is stated, different place is the mounted structure of sensor installing plate 23：As shown in Figure 7 and Figure 8, sense
It is connected between device installing plate 23 and frame 19 by height adjustment component 25.Highly adjustment component 25 include fixed plate 25a and
Portable plate 25b, fixed plate 25a is fixedly connected with frame 19.A rotating shaft 26 is fixed with sensor installing plate 23, rotating shaft 26 is worn
Enter portable plate 25b to be connected with portable plate 25b rotations, portable plate 25b is provided with locking nut, that is, biography can be limited by screwing locking nut
Sensor installing plate 23 is rotated.
The diamond saw blade that can make to be positioned on fixture 21 is rotated by the height and rotation portable plate 25b of lift dog 21
The outer edge of matrix 28 is embedded between two laser range sensors 7, and two laser range sensors 7 are measured and diamond saw blade
Spacing between the plate face of matrix 28, second control circuit calculates the actual (real) thickness of diamond saw blade substrate 28.Continue to turn after measurement
Dynamic portable plate 25b is rotated, it is to avoid portable plate 25b is rotated and laser range sensor 7 influences normal weld, in other words, the action
Also laser range sensor 7 can effectively be protected.Grasped according to the size adaptability of actual diamond saw blade substrate 28 to be measured
Vertical height adjustment component 25 and then the height for adjusting laser range sensor 7, it is ensured that be positioned at the diamond saw blade on fixture 21
The outer edge of matrix 28 is embedded between two laser range sensors 7.
Claims (3)
1. a kind of diamond segment parameter measuring apparatus, including working plate (1), pneumatic gripping (2), thickness measure component and
One control circuit；Conveyer belt assembly (3) and cutter head height of the working plate (1) provided with energy horizontal feed diamond segment (27)
Measurement assembly；Characterized in that, being fixedly connected with lift cylinder (4), the cylinder body of lift cylinder (4) on the pneumatic gripping (2)
It is connected between working plate (1) by the way that the first numerical control that pneumatic gripping (2) is moved horizontally can be made to be oriented to feeder assembly (5)；
Cutter head elevation carrection component is located on pneumatic gripping (2) moving rail trace；Thickness measure component is located at conveyer belt assembly (3) and knife
Between grease head highness measurement assembly；Thickness measure component includes two laser range sensors (7) being oppositely arranged, two Laser Measurings
Light beam away from sensor (7) is overlapped, and the beam level of laser range sensor (7) is projected and light beam and the first numerical control are oriented to and fed
The guide direction of component (5) is perpendicular, and laser range sensor (7) is fixed on work by adjustable for height second support (8)
On platen (1), two laser range sensors (7) electrically connect with first control circuit；Two laser range sensor (7) positions
Both sides in pneumatic gripping (2)；The cutter head elevation carrection component includes the 3rd support (9) and two clamping thimbles；3rd
Frame (9) is fixed on working plate (1), and two clamp thimble and are oppositely arranged and are vertically arranged；Two clamp thimble and are clamped to be upper
Thimble (10) and lower clamping thimble (11), upper clamping thimble (10) are fixed on the 3rd support (9), and lower clamping thimble (11) is fixed
On travel(l)ing rest (12), by the way that travel(l)ing rest (12) vertical lifting can be made between travel(l)ing rest (12) and the 3rd support (9)
Measurement cylinder (13) is connected；Numerical control be oriented to feeder assembly can also make pneumatic gripping (2) from two laser range sensors (7) it
Between by and can make pneumatic gripping (2) clamp diamond segment (27) be moved to two clamp thimbles between.
2. diamond segment parameter measuring apparatus according to claim 1, it is characterised in that first numerical control be oriented into
Include line slideway to component (5)；First numerical control is oriented to feeder assembly (5) cathetus guide rail guide direction and conveyer belt (3a) is defeated
Direction is sent to be arranged in parallel.
3. diamond segment parameter measuring apparatus according to claim 1, it is characterised in that above clamp the two of thimble (10)
Side is equipped with a upper correction thimble (16), and upper correction thimble (16) is fixed on the 3rd support (9)；Lower clamping thimble (11)
Both sides, which are equipped with one, corrects thimble (17), by correcting cylinder (18) between lower correction thimble (17) and travel(l)ing rest (12)
It is connected；When measuring diamond segment thickness and height parameter using this diamond segment parameter measuring apparatus, pneumatic gripping (2)
It is clipped in the middle part of diamond segment (27) two sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510746701.4A CN105300298B (en) | 2015-11-06 | 2015-11-06 | Diamond segment parameter measuring apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510746701.4A CN105300298B (en) | 2015-11-06 | 2015-11-06 | Diamond segment parameter measuring apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105300298A CN105300298A (en) | 2016-02-03 |
| CN105300298B true CN105300298B (en) | 2017-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510746701.4A Active CN105300298B (en) | 2015-11-06 | 2015-11-06 | Diamond segment parameter measuring apparatus |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109048101B (en) * | 2018-08-07 | 2021-03-12 | 项大清 | Gang saw welding machine |
| CN108838540B (en) * | 2018-09-14 | 2020-07-14 | 项大清 | Circular saw blade laser welding device |
| CN109048167B (en) * | 2018-09-14 | 2020-06-12 | 项大清 | Cutting tool welding machine |
| CN109834358B (en) * | 2019-04-04 | 2024-08-13 | 台州市圣西亚金刚石设备有限公司 | Automatic brazing device |
| CN111545831B (en) * | 2020-06-18 | 2024-06-07 | 山东交通学院 | Welding device and welding method for saw blade and diamond tool bit |
| CN114311054B (en) * | 2021-12-23 | 2023-12-01 | 北新建材(苏州)有限公司 | High-efficient banding area cuts off system |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61114120A (en) * | 1984-11-09 | 1986-05-31 | Toshiba Mach Co Ltd | Scanning type thickness measuring device |
| JPH06238435A (en) * | 1991-12-24 | 1994-08-30 | Sanritsu Seiki Kk | Holding/transferring device of blade tip |
| DE102011107771B4 (en) * | 2011-04-15 | 2013-10-17 | Micro-Epsilon Messtechnik Gmbh & Co. Kg | Device and method for measuring the thickness of a measurement object |
| CN103148789A (en) * | 2011-12-06 | 2013-06-12 | 鸿富锦精密工业（深圳）有限公司 | Thickness measurement system |
| CN203216446U (en) * | 2013-04-15 | 2013-09-25 | 项大清 | Diamond cutter head thickness detector |
| CN103322959B (en) * | 2013-06-04 | 2016-08-17 | 项大清 | Diamond saw chip bonding machine |
| CN203881312U (en) * | 2013-11-28 | 2014-10-15 | 太仓北新建材有限公司 | Device for automatically detecting thickness of plate |
| CN204439053U (en) * | 2015-03-17 | 2015-07-01 | 项俊俊 | Diamond segment parameter auto-testing device |
| CN104729449B (en) * | 2015-03-17 | 2017-05-03 | 项俊俊 | Automatic measurement device for diamond tool bit parameters |
| CN204565369U (en) * | 2015-05-10 | 2015-08-19 | 项俊俊 | Diamond saw chip bonding machine |
| CN106180953B (en) * | 2015-05-10 | 2018-07-17 | 项俊俊 | The saw bit matrix fixing tool of diamond saw chip bonding machine |
| CN205066702U (en) * | 2015-11-06 | 2016-03-02 | 项俊俊 | Diamond segments parameter measurement device and diamond saw blade welding machine |
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2015
- 2015-11-06 CN CN201510746701.4A patent/CN105300298B/en active Active
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