CN105300298A - Diamond tool bit parameter measurement device and diamond saw blade welding machine - Google Patents
Diamond tool bit parameter measurement device and diamond saw blade welding machine Download PDFInfo
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- CN105300298A CN105300298A CN201510746701.4A CN201510746701A CN105300298A CN 105300298 A CN105300298 A CN 105300298A CN 201510746701 A CN201510746701 A CN 201510746701A CN 105300298 A CN105300298 A CN 105300298A
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Abstract
The invention provides a diamond tool bit parameter measurement device and a diamond saw blade welding machine, belonging to the machine tool technology field. The invention solves the problem that the prior art has the problem of lack of measurement accuracy. A thickness measurement assembly in the diamond tool bit parameter measurement device and the thickness measurement assembly in the diamond saw blade welding machine comprise two oppositely-arranged laser distance detection sensors; the two laser distance measurement sensors are connected to a control circuit; and a workpiece to be detected can go through between the two laser distance detection sensors. The invention can dramatically improve the measurement accuracy by adopting two laser distance detection sensors. The installation plate and the rack are not connected through a floating connection structure, which simplifies the structure, guarantees the measurement accuracy and improves the measurement accuracy.
Description
Technical field
The invention belongs to machine tool technology field, particularly relate to a kind of diamond segment parameter measuring apparatus.
The invention belongs to machine tool technology field, particularly relate to a kind of diamond saw chip bonding machine.
Background technology
Diamond segment is the operative body of diamond cutting tool.Diamond cutting tool is as diamond disc saw blade, diamond gang saw, diamond disk and diamond core drill bit.As the cutter head that Fig. 1 is diamond saw blade, in order to improve the quality of diamond saw blade, need carry out measurement classification to cutter head, of a sort cutter head is welded on same saw bit matrix; Measure the thickness of saw bit matrix when welding, the center reference face of guaranty money's diamond tool bit flushes with the center reference face of saw blade body.People once proposed diamond segment thickness gauge (Authorization Notice No. CN203216446U) and diamond segment parameter auto-testing device (application publication number CN104729449A) for this reason, utilized this measurement mechanism to achieve automatically to measure diamond segment thickness and according to measurement data automatic classification.People also proposed diamond saw blade measurer for thickness and have the bonding machine (application publication number CN103322959A) of above-mentioned measurement mechanism.Find that measuring accuracy cannot meet the requirement of portions of client, especially measures the matrix in small-sized diamond saw blade and cutter head in actual use.
Summary of the invention
The present invention proposes a kind of diamond segment parameter measuring apparatus, the technical problem to be solved in the present invention how at least to improve diamond segment thickness measure precision.
The present invention proposes a kind of diamond saw chip bonding machine, the technical problem to be solved in the present invention how at least to improve diamond saw blade substrate thickness measure precision.
The technical matters that will solve of the present invention realizes by following technical proposal: this diamond segment parameter measuring apparatus comprises working plate, pneumatic gripping, thickness measure assembly and first control circuit, working plate is provided with the conveying belt assembly of energy horizontal feed diamond segment, pneumatic gripping is fixedly connected with lift cylinder, and the cylinder body of lift cylinder and the first numerical control by pneumatic gripping can be made to move horizontally between the working plate feeder assembly that leads is connected; Thickness measure assembly comprises two laser range sensors be oppositely arranged, and laser range sensor is fixed on working plate, and two laser range sensors are all electrically connected with first control circuit; Numerical control guiding feeder assembly can also make pneumatic gripping pass through between two laser range sensors.
Can ensure that the light beam of laser range sensor impinges upon on the side of diamond segment by the direction arranging pneumatic gripping clamping diamond segment, namely measure the thickness of diamond segment.Two laser range sensors can record spacing between diamond segment corresponding side surface respectively, and first control circuit just can go out the actual (real) thickness of diamond segment according to the measurement numerical operation of two laser range sensors.
This diamond segment parameter measuring apparatus is compared with prior art adopted to efficiently avoid because pneumatic gripping clamping diamond segment does not just affect the problem of measuring accuracy; In other words, employing two laser range sensors are measured simultaneously and are combined the computing strategy be applicable to and just can improve measuring accuracy significantly.
This diamond segment parameter measuring apparatus adopts numerical control guiding feeder assembly to drive pneumatic gripping to move, and has pneumatic gripping displacement controllability strong, and then can realize multimetering diamond segment, ensure measuring accuracy reliability and realize more disaggregated classification.
This diamond saw blade bonding machine comprises frame, second control circuit and thickness measure assembly, and frame is provided with cutter head clamping device for clamping diamond segment and for locating diamond saw blade substrate and having the fixture of substrate; Described thickness measure assembly comprises two laser range sensors be oppositely arranged and one piece of sensor installing plate, two laser range sensors all electrically connect with second control circuit, laser range sensor is fixed on sensor installing plate, on the substrate that sensor installing plate is arranged on fixture or be arranged in frame; The outer edge being positioned at the diamond saw blade substrate on fixture can embed between two laser range sensors.
The light beam of laser range sensor impinges upon on the side of diamond saw blade substrate, namely measures the thickness of diamond saw blade substrate.Two laser range sensors can record spacing between diamond saw blade substrate corresponding side surface respectively, and second control circuit just can go out the actual (real) thickness of diamond segment according to the measurement numerical operation of two laser range sensors.
Compared with prior art, the sensor installing plate in this diamond saw blade bonding machine with between frame without the need to being connected by floating connecting structure, thus have and can simplify structure, can measuring accuracy be ensured again, even can improve the advantage of measuring accuracy.
Accompanying drawing explanation
Fig. 1 is the perspective view of diamond saw blade.
Fig. 2 is the perspective view of this diamond segment parameter measuring apparatus.
Fig. 3 is the perspective view of elevation carrection part in this diamond segment parameter measuring apparatus.
Fig. 4 is the main TV structure schematic diagram of elevation carrection part in this diamond segment parameter measuring apparatus.
Fig. 5 is the main TV structure schematic diagram of this diamond saw blade bonding machine.
Fig. 6 is the sectional perspective structural representation of this diamond saw blade bonding machine.
Fig. 7 is the main TV structure schematic diagram of the another kind of scheme of this diamond saw blade bonding machine.
Fig. 8 is the sectional perspective structural representation of the another kind of scheme of this diamond saw blade bonding machine.
In figure, 1, working plate; 2, pneumatic gripping; 3, conveying belt assembly; 3a, conveying belt; 3b, motor; 3c, deflector chute; 3d, guide plate; 3e, block; 4, lift cylinder; 5, the first numerical control guiding feeder assembly; 6, the first support; 7, laser range sensor; 8, the second support; 9, the 3rd support; 10, upper clamping thimble; 11, lower clamping thimble; 12, travel(l)ing rest; 13, cylinder is measured; 14, elevation carrection sensor; 15, substrate is measured; 16, upper correction thimble; 17, lower correction thimble; 18, cylinder is corrected; 19, frame; 20, cutter head clamping device; 21, fixture; 21a, substrate; 22, the second numerical control guiding feeder assembly; 23, sensor installing plate; 23a, escape groove; 24, the 4th numerical control guiding feeder assembly; 25, height control assembly; 25a, fixed head; 25b, portable plate; 26, rotating shaft; 27, diamond segment; 28, diamond saw blade substrate.
Embodiment
Be below specific embodiments of the invention and by reference to the accompanying drawings, technical scheme of the present invention is further described, but the present invention be not limited to these embodiments.
Embodiment one
As shown in Figures 2 to 4, this diamond segment parameter measuring apparatus comprises working plate 1, pneumatic gripping 2, thickness measure assembly and first control circuit.
Part based on working plate 1, working plate 1 is horizontally disposed with.
Working plate 1 is provided with the conveying belt 3a assembly 3 of energy horizontal feed diamond segment 27, conveying belt 3a assembly 3 comprises horizontally disposed conveying belt 3a, two rotor wheels are provided with in conveying belt 3a, be rotationally connected between rotor wheel and working plate 1, working plate 1 is fixed with a motor 3b, motor 3b and one of them rotor wheel are in transmission connection.The top of conveying belt 3a is provided with the guide plate 3d forming deflector chute 3c and the block 3e stoping diamond segment 27 movement; Block 3e and guide plate 3d is all fixed on working plate 1.Whether block 3e is provided with and has diamond segment 27 to be resisted against first sensor on block 3e for detecting, first sensor is electrically connected with first control circuit.
Pneumatic gripping 2 is fixedly connected with lift cylinder 4, the cylinder body of lift cylinder 4 is connected by the first numerical control feeder assembly 5 that leads with between working plate 1.Specifically, the first numerical control guiding feeder assembly 5 comprises numerical-control motor, screw mandrel screw and line slideway; Numerical-control motor is electrically connected with first control circuit; The slippery fellow of line slideway is all fixedly connected with the cylinder body of lift cylinder 4 with screw; Working plate 1 is fixed with the first support 6, the guide rod of line slideway is fixedly connected with the first support 6, and screw mandrel and the first support 6 are rotationally connected; The rotating shaft 26 of numerical-control motor is connected with screw rod transmission, and the housing of numerical-control motor is fixed on the first support 6.First numerical control guiding feeder assembly 5 cathetus guide rail guide direction and conveying belt 3a throughput direction be arranged in parallel; Line slideway is horizontally disposed with, and thus pneumatic gripping 2 can move horizontally and move with vertical lifting.
Ensure that pneumatic gripping 2 motion track and deflector chute 3c coincide by controlling spacing between pneumatic gripping 2 and the first support 6, in other words, diamond segment 27 only needs to move on one face, and then makes this diamond segment parameter measuring apparatus structure simpler.
Thickness measure assembly comprises two laser range sensors be oppositely arranged, 7, two laser range sensors 7 and is all electrically connected with first control circuit.Each laser range sensor 7 is all connected by adjustable for height second support 8 with between working plate 1.Ensure that the light beam of two laser range sensors 7 overlaps by the height adjusting the second support 8, in other words ensure that two laser range sensors 7 measure the same position of diamond segment 27, improve measuring accuracy.When changing measurement diamond segment 27 model, also highly ensure that measuring height and diamond segment 27 adapt by adjusting the second support 8.
Two laser range sensors 7 are positioned at the both sides of clamp, and namely the guide direction of beam level injection feeder assembly 5 and light beam and the first numerical control are led of laser range sensor 7 is perpendicular; Thus the first numerical control guiding feeder assembly 5 can make pneumatic gripping 2 pass through between two laser range sensors 7.
Working plate 1 is also provided with cutter head thickness measure assembly, cutter head thickness measure assembly is positioned on pneumatic gripping 2 moving rail trace.Cutter head thickness measure assembly comprises the 3rd support 9 and two clamping thimbles; 3rd support 9 is fixed on working plate 1, and two clamping thimble opposed vertical are arranged; Two clamping thimbles are clamping thimble 10 and lower clamping thimble 11, upper clamping thimble 10 is fixed on the 3rd support 9, lower clamping thimble 11 is fixed on travel(l)ing rest 12, by the measurement cylinder 13 of travel(l)ing rest 12 vertical lifting can be made to be connected between travel(l)ing rest 12 with the 3rd support 9.The cylinder body of measurement cylinder 13 is fixed with on elevation carrection sensor the 14, three support 9 and is fixed with measurement substrate 15; Elevation carrection sensor 14 is electrically connected with first control circuit.
The both sides of upper clamping thimble 10 are equipped with a upper correction thimble 16, and upper correction thimble 16 is fixed on the 3rd support 9.Correct thimble 17 under the both sides of lower clamping thimble 11 are equipped with one, lower correction thimble 17 is connected by correcting cylinder 18 with between travel(l)ing rest 12.Adopt the posture of this correct-by-construction diamond segment 27, having diamond segment 27, to adjust rear posture consistance high, and coincidence measurement requirement, thus can ensure the stability of measuring accuracy.
By setting forth the effect and the advantage that utilize this diamond segment parameter measuring apparatus measurement diamond saw blade to further illustrate this diamond segment parameter measuring apparatus:
Diamond segment 27 is by vibrating disk infeed conveyor belt 3a, and the concaved circular cambered surface of diamond segment 27 upwards.Under the guide effect of guide plate 3d and under the drive of conveying belt 3a, diamond segment 27 is resisted against on the end face of block 3e; This state triggers first sensor, and then first control circuit controls the measurement of parts execution accordingly action.
It is perpendicular that Figure of description provides the lead guide direction of feeder assembly 5 of the tong arm moving direction of pneumatic gripping 2 and the first numerical control.
First, the piston rod controlling lift cylinder 4 stretches out, and pneumatic gripping 2 clamps, and realizes pneumatic gripping 2 and clamps the diamond segment 27 be resisted against on block 3e.Pneumatic gripping 2 is clipped in the middle part of diamond segment 27 two sides, has clamping more firmly advantage.
Then, keep pneumatic gripping 2 clamping to be in clamp position, the piston rod retraction, the numerical-control motor that control lift cylinder 4 successively rotate, and make diamond segment 27 move to diamond segment 27 and stop the light beam that laser range sensor 7 penetrates.Laser range sensor 7 measures spacing between diamond segment 27 side, and first control circuit calculates the actual (real) thickness of diamond segment 27.Its computing strategy carries out measuring and measured value being set as reference value as adopted cylinder clamp to clamp standard diamond cutter head 27, then the difference calculating actual measured value and reference value just can calculate the actual (real) thickness of diamond segment 27.In the process, the thickness at diamond segment 27 both ends is measured respectively, for improving classification degree.
Then, continue to control numerical-control motor and rotate, make diamond segment 27 move between two clamping thimbles; The piston rod of control survey cylinder 13 and the piston rod of correction cylinder 18 stretch out, the state realizing correcting diamond segment 27 improves measuring accuracy and adopts elevation carrection sensor 14 to measure and measure spacing between substrate 15, and first control circuit calculates the true altitude of diamond segment 27.
Finally, control numerical-control motor reverse rotation and pneumatic gripping 2 open successively, realize automatic blanking.
Embodiment two
As shown in Figure 5 and Figure 6, this diamond saw blade bonding machine comprises frame 19, second control circuit, cutter head clamping device 20, fixture 21 and thickness measure assembly.
Part based on frame 19, frame 19 is vertically arranged.
Fixture 21 is for locating diamond saw blade substrate 28, fixture 21 comprises substrate 21a, the substrate 21a of fixture 21 is connected by the second numerical control feeder assembly 22 that leads with between frame 19, second numerical control guiding feeder assembly 22 and the first numerical control feeder assembly 5 structure that lead is identical, in this no longer burdensome description.Second numerical control guiding feeder assembly 22 cathetus guide rail is vertically arranged, and thus fixture 21 can vertical lifting.In 3rd numerical control guiding feeder assembly, numerical-control motor is electrically connected with second control circuit.
Cutter head clamping device 20 is for clamping diamond segment 27, cutter head clamping device 20 comprises contiguous block and pneumatic chuck, be connected by the 3rd numerical control guiding feeder assembly between pneumatic chuck with contiguous block, 3rd numerical control guiding feeder assembly and the first numerical control feeder assembly 5 structure that lead is identical, in this no longer burdensome description.3rd numerical control guiding feeder assembly cathetus guide rail is horizontally disposed with, and thus pneumatic chuck can move horizontally, and pneumatic chuck moves horizontally with the diamond saw blade substrate 28 plate face be positioned on fixture 21 perpendicular; Thus flushed with the center reference face of saw blade body by the center reference face of adjustment pneumatic chuck position guaranty money's diamond tool bit 27.In 3rd numerical control guiding feeder assembly, numerical-control motor is electrically connected with second control circuit.
Thickness measure assembly comprises two laser range sensors be oppositely arranged 7 and a sensor installing plate 23, and laser range sensor 7 is fixed on sensor installing plate 23.Two laser range sensors 7 all electrically connect with second control circuit.Sensor installing plate 23 has the escape groove 23a be embedded for diamond saw blade substrate 28.
Be connected by the 4th numerical control feeder assembly 24 that leads between sensor installing plate 23 and the substrate 21a of fixture 21, the 4th numerical control guiding feeder assembly 24 cathetus guide rail is horizontally disposed with and perpendicular with the 3rd numerical control feeder assembly cathetus guide rail that leads; Thus laser range sensor 7 is driven to move horizontally by the height of lift dog 21 with manipulation the 4th numerical control guiding feeder assembly 24, the outer edge of the diamond saw blade substrate 28 be positioned on fixture 21 can be made to embed between two laser range sensors 7, two laser range sensors 7 measure spacing between diamond saw blade substrate 28 plate face, and second control circuit calculates the actual (real) thickness of diamond saw blade substrate 28.Its computing strategy can be identical with measurement diamond segment 27 thickness computing strategy, in this no longer burden description.
Sensor installing plate 23 is positioned at the top of laser range sensor 7; this structure can protect laser range sensor 7 effectively; avoid welding the impurity dropped and scald laser range sensor 7, and then effectively ensure the serviceable life of laser range sensor 7 and ensure measuring accuracy.
Embodiment three
The present embodiment with the structure of embodiment one and principle substantially identical, basic something in common no longer burden describes, different place is only described, different place is the structure that sensor installing plate 23 is mounted: as shown in Figure 7 and Figure 8, be connected between sensor installing plate 23 with frame 19 by height control assembly 25.Height control assembly 25 comprises fixed head 25a and portable plate 25b, and fixed head 25a is fixedly connected with frame 19.Sensor installing plate 23 is fixed with a rotating shaft 26, rotating shaft 26 penetrates portable plate 25b and portable plate 25b is rotationally connected, and portable plate 25b is provided with set nut, namely screws set nut energy limiting sensor installing plate 23 and rotates.
By the height of lift dog 21 with rotate portable plate 25b rotational and make the outer edge of the diamond saw blade substrate 28 be positioned on fixture 21 embed between two laser range sensors 7, two laser range sensors 7 measure spacing between diamond saw blade substrate 28 plate face, and second control circuit calculates the actual (real) thickness of diamond saw blade substrate 28.Be rotated further portable plate 25b after measurement to rotate, avoid portable plate 25b rotation and laser range sensor 7 to affect normal weld, in other words, this action also can protect laser range sensor 7 effectively.Handle the height of height control assembly 25 and then adjustment laser range sensor 7 according to the size adaptability of reality diamond saw blade substrate 28 to be measured, ensure that the outer edge of the diamond saw blade substrate 28 be positioned on fixture 21 embeds between two laser range sensors 7.
Claims (10)
1. a diamond segment parameter measuring apparatus, comprises working plate (1), pneumatic gripping (2), thickness measure assembly and first control circuit; Working plate (1) is provided with conveying belt (3a) assembly (3) of energy horizontal feed diamond segment (27); It is characterized in that, described pneumatic gripping (2) is fixedly connected with lift cylinder (4), the cylinder body of lift cylinder (4) and the first numerical control by pneumatic gripping (2) can be made to move horizontally between working plate (1) feeder assembly (5) that leads is connected; Thickness measure assembly comprises two laser range sensors be oppositely arranged (7), laser range sensor (7) is fixed on working plate (1), and two laser range sensors (7) are all electrically connected with first control circuit; Numerical control guiding feeder assembly can also make pneumatic gripping (2) pass through between two laser range sensors (7).
2. diamond segment parameter measuring apparatus according to claim 1, is characterized in that, described first numerical control guiding feeder assembly (5) comprises line slideway; First numerical control guiding feeder assembly (5) cathetus guide rail guide direction and conveying belt (3a) throughput direction be arranged in parallel.
3. diamond segment parameter measuring apparatus according to claim 1, it is characterized in that, described thickness measure assembly comprises two laser range sensors be oppositely arranged (7), and two laser range sensors (7) are all electrically connected with first control circuit.
4. diamond segment parameter measuring apparatus according to claim 3, is characterized in that, each described laser range sensor (7) is all connected by adjustable for height second support (8) with between working plate (1).
5. diamond segment parameter measuring apparatus according to claim 3, it is characterized in that, two described laser range sensors (7) lay respectively at the both sides of clamp, beam level that laser range sensor (7) penetrates is arranged, and the lead guide direction of feeder assembly (5) of light beam and the first numerical control is perpendicular.
6. diamond segment parameter measuring apparatus as claimed in any of claims 1 to 5, it is characterized in that, described working plate (1) is also provided with cutter head thickness measure assembly, cutter head thickness measure assembly is positioned on pneumatic gripping (2) moving rail trace.
7. diamond segment parameter measuring apparatus according to claim 6, is characterized in that, described cutter head thickness measure assembly comprises the 3rd support (9) and two clamping thimbles; 3rd support (9) is fixed on working plate (1), and two clamping thimble opposed vertical are arranged; Two clamping thimbles are clamping thimble (10) and lower clamping thimble (11), upper clamping thimble (10) is fixed on the 3rd support (9), lower clamping thimble (11) is fixed on travel(l)ing rest (12), by the measurement cylinder (13) of travel(l)ing rest (12) vertical lifting can be made to be connected between travel(l)ing rest (12) with the 3rd support (9); The both sides of upper clamping thimble (10) are equipped with on one and correct thimble (16), and upper correction thimble (16) is fixed on the 3rd support (9); Correct thimble (17) under the both sides of lower clamping thimble (11) are equipped with one, lower correction thimble (17) is connected by correcting cylinder (18) with between travel(l)ing rest (12).
8. a diamond saw chip bonding machine, comprise frame (19), second control circuit and thickness measure assembly, frame (19) is provided with cutter head clamping device (20) for clamping diamond segment (27) and for locating diamond saw blade substrate (28) and having the fixture (21) of substrate (21a); It is characterized in that, described thickness measure assembly comprises two laser range sensors be oppositely arranged (7) and one piece of sensor installing plate (23), two laser range sensors (7) all electrically connect with second control circuit, laser range sensor (7) is fixed on sensor installing plate (23), and the substrate (21a) that sensor installing plate (23) is arranged on fixture (21) is gone up or is arranged in frame (19); The outer edge being positioned at the diamond saw blade substrate (28) on fixture (21) can embed between two laser range sensors (7).
9. diamond saw chip bonding machine according to claim 8, is characterized in that, described sensor installing plate (23) is positioned at the top of laser range sensor (7); Be connected by the 4th numerical control feeder assembly (24) that leads between sensor installing plate (23) and the substrate (21a) of fixture (21).
10. diamond saw chip bonding machine according to claim 8, is characterized in that, described sensor installing plate (23) is connected by height control assembly (25) with between frame (19); Height control assembly (25) comprises fixed head (25a) and portable plate (25b), and fixed head (25a) is fixedly connected with frame (19); Sensor installing plate (23) is fixed with a rotating shaft (26), rotating shaft (26) penetrates portable plate (25b) and is rotationally connected with portable plate (25b).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510746701.4A CN105300298B (en) | 2015-11-06 | 2015-11-06 | Diamond segment parameter measuring apparatus |
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| CN201510746701.4A CN105300298B (en) | 2015-11-06 | 2015-11-06 | Diamond segment parameter measuring apparatus |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108838540A (en) * | 2018-09-14 | 2018-11-20 | 项大清 | Saw blade laser soldering device |
| CN109048101A (en) * | 2018-08-07 | 2018-12-21 | 项大清 | Gang saw welder |
| CN109048167A (en) * | 2018-09-14 | 2018-12-21 | 项大清 | Cutting tool bonding machine |
| CN109834358A (en) * | 2019-04-04 | 2019-06-04 | 台州市圣西亚金刚石设备有限公司 | Automatic brazing device and utilize automatic brazing device butt-welding fitting carry out method for welding |
| CN114311054A (en) * | 2021-12-23 | 2022-04-12 | 太仓北新建材有限公司 | High-efficient banding area cut-off system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109048167A (en) * | 2018-09-14 | 2018-12-21 | 项大清 | Cutting tool bonding machine |
| CN108838540B (en) * | 2018-09-14 | 2020-07-14 | 项大清 | Circular saw blade laser welding device |
| CN109834358A (en) * | 2019-04-04 | 2019-06-04 | 台州市圣西亚金刚石设备有限公司 | Automatic brazing device and utilize automatic brazing device butt-welding fitting carry out method for welding |
| CN114311054A (en) * | 2021-12-23 | 2022-04-12 | 太仓北新建材有限公司 | High-efficient banding area cut-off system |
| CN114311054B (en) * | 2021-12-23 | 2023-12-01 | 北新建材(苏州)有限公司 | High-efficient banding area cuts off system |
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| CN105300298B (en) | 2017-09-29 |
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