CN105290622A - Self-adaption cutting laser cutter and method for laser cutting by adopting same - Google Patents
Self-adaption cutting laser cutter and method for laser cutting by adopting same Download PDFInfo
- Publication number
- CN105290622A CN105290622A CN201510854315.7A CN201510854315A CN105290622A CN 105290622 A CN105290622 A CN 105290622A CN 201510854315 A CN201510854315 A CN 201510854315A CN 105290622 A CN105290622 A CN 105290622A
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- China
- Prior art keywords
- laser
- galvanometer
- cutting
- laser cutting
- computer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
Abstract
The invention discloses a self-adaption cutting laser cutter. The self-adaption cutting laser cutter comprises an ultraviolet laser, wherein the ultraviolet laser is connected with a beam expander; the beam expander is connected with a galvanometer capable of cutting workpieces on a working platform; the galvanometer is connected with a field lens; a CCD alignment observation system is arranged beside the galvanometer, and is connected with a computer; the ultraviolet laser and the computer are connected through a laser control card; the galvanometer is connected with the laser control card; and the working platform is connected with the computer through a motion control card. The laser cutter is simple in structure, high in automation procedures, low in cost and convenient and quick in processing.
Description
[technical field]
The present invention relates to a kind of can self adaptation cutting laser cutting machine, more particularly relate to a kind of laser cutting machine cutting flexible pvc, below 0.3mm thicknesses of metal thin slice.
[background field]
Laser cutting machine is a kind of laser launched from laser instrument, through light path system, is focused into the laser beam of high power density.Laser beam irradiation, to surface of the work, makes workpiece reach fusing point or boiling point, and fusing or gasified metal blow away by the gases at high pressure coaxial with light beam simultaneously.Along with the movement of light beam and workpiece relative position, finally make material form joint-cutting, thus reach the object of cutting.Laser cutting instead of traditional mechanical blades with sightless light beam, has precision high, and cutting fast, be not limited to cutting pattern restriction, Automatic Typesetting saves material, and otch is level and smooth, the features such as processing cost is low, will improve or be replaced in traditional metal cutting processes equipment gradually.Mechanical part and the workpiece of laser probe are contactless, can not cause scuffing at work to surface of the work; Laser cutting speed is fast, and smooth cut is smooth, generally without the need to following process; Cutting heat affected area is little, and sheet deformation is little, joint-cutting narrow (0.1mm ~ 0.3mm); Otch does not have mechanical stress, without shear burr; Machining accuracy is high, reproducible, not attacking material surface; Numerical control programming, can process arbitrary plane, and whole plate cutting that can be very large to breadth, without the need to mold, economy saves time.
There is following defect in the laser cutting of the flexible pvc of existing cutting, below 0.3mm thicknesses of metal thin slice: cutting width is larger, particularly concerning numerous complicated, the flexible circuit of tool randomness, this width is too large, this type of wide otch can cause: reduce packing density, or the circuit reduced on every block plate is installed.And adding man-hour, the stress be applied to above rapidoprint of generation causes and seriously burns and be out of shape, and the consequence that stress produces is that effective kerf width extends to 120 μm, causes otch uneven and quality is bad.And cutting yield rate is low, inefficiency, long processing time.
[summary of the invention]
The object of the invention is to overcome the deficiencies in the prior art part, provide a kind of structure simple, automated procedures are high, cost is low, fast easy to process, and process time is short, reduce artificial, the flexible pvc reduced costs, below 0.3mm thicknesses of metal thin-disc laser cutting machine.
It is high that another object of the present invention is also to provide a kind of cutting yield rate, and operating efficiency is high, and process time is short, and automated procedures are high, reduces artificial, the method for the flexible pvc reduced costs, below 0.3mm thicknesses of metal thin-disc laser cutting.
The object of the present invention is achieved like this:
A kind of can self adaptation cutting laser cutting machine, it is characterized in that it comprises ultraviolet laser 1, described ultraviolet laser 1 is connected with beam expanding lens 2, described beam expanding lens 2 is connected with the galvanometer 3 that can cut the workpiece on workbench 100, galvanometer 3 is connected with field lens 4, the side of described galvanometer 3 is also provided with CCD para-position observing system 5, described CCD para-position observing system 5 is connected with computer 6, described ultraviolet laser 1 is also connected by a laser controlling card 7 with between workbench 100, galvanometer 3 is connected with laser controlling card 7, described control card 6 is connected with computer 5, workbench 100 is connected with computer 5 by motion control card 8.
As above can self adaptation cutting a laser cutting machine, it is characterized in that the camera of described CCD para-position observing system be paraxonic arrange.
As above can self adaptation cutting a laser cutting machine, it is characterized in that the visual identity precision 30 μm of described CCD para-position observing system, scope 20mm*30mm, optical maser wavelength 355nm, processing live width < 25 μm.
As above a kind of can self adaptation cutting laser cutting machine, it is characterized in that the spot diameter of the maximum incidence of described galvanometer is 10mm, scanning angle is 0.25rad-0.40rad, nonlinearity 3.5mrad, conventional tracking error time 0.16ms, repetitive positioning accuracy <20urad, gain drift <50ppm/k, null offset <15urad/k, 8 hours work drift <0.3mrad, signature velocity 2m/s, locating speed 10m/s, lens reflecting wavelength 355nm.
As above can self adaptation cutting a laser cutting machine, it is characterized in that described workbench is XY motion platform, workpiece is flexible pvc, below 0.3mm thicknesses of metal thin slice.
To utilize described in claim 1 a kind of the laser cutting machine of self adaptation cutting can carry out the method for laser cutting, and its step has:
1., ultraviolet laser sends the hot spot of diameter 0.7mm;
2., laser enters beam expanding lens, and beam expanding lens collimates launching spot,
3. the laser, after above-mentioned steps collimation, enters galvanometer, by two driven by motor, two speculum high speed swingings in galvanometer, controls the exit direction of the incident light velocity;
4. the laser, after above-mentioned steps is mapped on the workpiece of workbench through field lens;
5., CCD para-position observing system collection signal is transferred to computer and processes, and draws the accurate location of workpiece;
6., in above-mentioned processing method, conputer controlled ultraviolet laser, galvanometer and workbench.
The method of a kind of laser cutting as above, is characterized in that the visual identity precision 30 μm of described CCD para-position observing system, scope 20mm*30mm, optical maser wavelength 355nm, processing live width < 25 μm.
The method of a kind of laser cutting as above, it is characterized in that the spot diameter of the maximum incidence of described galvanometer (3) is 10mm, scanning angle is 0.25rad-0.40rad, nonlinearity 3.5mrad, conventional tracking error time 0.16ms, repetitive positioning accuracy <20urad, gain drift <50ppm/k, null offset <15urad/k, 8 hours work drift <0.3mrad, signature velocity 2m/s, locating speed 10m/s, lens reflecting wavelength 355nm.
The method of a kind of laser cutting as above, is characterized in that described workbench is XY motion platform, and workpiece is flexible pvc, below 0.3mm thicknesses of metal thin slice.
Laser cutting machine structure of the present invention is simple, and automated procedures are high, and cost is low, fast easy to process.
Adopt the cutting method of laser cutting machine of the present invention, cutting yield rate is high, and operating efficiency is high, long processing time, automated procedures are high, reduce artificial, reduce cost, particularly for the cutting more laser cutting machine of flexible pvc, below 0.3mm thicknesses of metal thin slice.
[accompanying drawing explanation]
Fig. 1 is structure chart of the present invention.
[detailed description of the invention]
A kind of can self adaptation cutting laser cutting machine, it comprises ultraviolet laser 1, described ultraviolet laser 1 is connected with beam expanding lens 2, described beam expanding lens 2 is connected with the galvanometer 3 that can cut the workpiece on workbench 100, field lens 4 is connected with below galvanometer, the side of described galvanometer 3 is also provided with CCD para-position observing system 5, described CCD para-position observing system 5 is connected with computer 6, described ultraviolet laser 1 is also connected by a laser controlling card 7 with between computer 6, galvanometer 3 is connected with laser controlling card 7, workbench 100 is connected with computer 6 by motion control card 8.That is computer 6 can control ultraviolet laser 1, galvanometer 3 and workbench 100; Wherein CCD para-position observing system 5 by the information feed back observed to computer; Wherein computer 6 controls the transmitting of ultraviolet laser 1, and computer 6 also controls the work of galvanometer 3, and wherein computer 6 also controls the movement of workbench 100, ensures that workpiece can be accurate to immediately below galvanometer 3, is then formed the cutting work of auxiliary track by galvanometer 3.
The camera of CCD para-position observing system of the present invention is that paraxonic is arranged.
Ultraviolet laser of the present invention, its visual identity precision 30 μm, scope 20mm*30mm, optical maser wavelength 355nm, processing live width < 25 μm.
The spot diameter of the maximum incidence of galvanometer of the present invention is 10mm, scanning angle is 0.25rad-0.40rad, nonlinearity 3.5mrad, conventional tracking error time 0.16ms, repetitive positioning accuracy <20urad, gain drift <50ppm/k, null offset <15urad/k, 8 hours work drifts <0.3mrad, signature velocity 2m/s, locating speed 10m/s, lens reflecting wavelength 355nm.
Workbench of the present invention is XY motion platform, and workpiece is flexible pvc or below 0.3mm thicknesses of metal thin slice.Computer of the present invention connects motion control card, and controlled motion control card connects the servo-drive of motion platform, the drive motors of last connecting platform.Computer end software provides signal to control card, after control card process Signal transmissions to driving, finally by the motion of drived control motor.
Claims (9)
1. one kind can self adaptation cutting laser cutting machine, it is characterized in that it comprises ultraviolet laser (1), described ultraviolet laser (1) is connected with beam expanding lens (2), described beam expanding lens (2) is connected with the galvanometer (3) that can cut the workpiece on workbench (100), galvanometer (3) is connected with field lens (4), the side of described galvanometer (3) is also provided with CCD para-position observing system (5), described CCD para-position observing system (5) is connected with computer (6), described ultraviolet laser (1) is also connected by a laser controlling card (7) with between computer (6), galvanometer (3) is connected with laser controlling card (7), workbench (100) is connected with computer (6) by motion control card (8).
2. according to claim 1 a kind of can self adaptation cutting laser cutting machine, it is characterized in that the camera of described CCD para-position observing system be paraxonic arrange.
3. according to claim 1 a kind of can self adaptation cutting laser cutting machine, it is characterized in that the visual identity precision 30 μm of described CCD para-position observing system, scope 20mm*30mm, optical maser wavelength 355nm, processing live width < 25 μm.
4. according to claim 1 a kind of can self adaptation cutting laser cutting machine, it is characterized in that the spot diameter of the maximum incidence of described galvanometer is 10mm, scanning angle is 0.25rad-0.40rad, nonlinearity 3.5mrad, conventional tracking error time 0.16ms, repetitive positioning accuracy <20urad, gain drift <50ppm/k, null offset <15urad/k, 8 hours work drift <0.3mrad, signature velocity 2m/s, locating speed 10m/s, lens reflecting wavelength 355nm.
5. according to claim 1 a kind of can self adaptation cutting laser cutting machine, it is characterized in that described workbench is XY motion platform, workpiece is flexible pvc, below 0.3mm thicknesses of metal thin slice.
6. to utilize described in claim 1 a kind of the laser cutting machine of self adaptation cutting can carry out the method for laser cutting, and its step has:
1., ultraviolet laser (1) sends the hot spot of diameter 0.7mm;
2., laser enters beam expanding lens (2), and beam expanding lens collimates launching spot,
3. the laser, after above-mentioned steps collimation, enters galvanometer (3), by two driven by motor, two speculum high speed swingings in galvanometer, controls the exit direction of the incident light velocity;
4. the laser, after above-mentioned steps is mapped on the workpiece of workbench (100) through field lens (4);
5., CCD para-position observing system (5) collection signal is transferred to computer and processes, and draws the accurate location of workpiece;
6., in above-mentioned processing method, computer (6) controls ultraviolet laser (1), galvanometer (3) and workbench (100).
7. the method for a kind of laser cutting according to claim 6, is characterized in that the visual identity precision 30 μm of described CCD para-position observing system, scope 20mm*30mm, optical maser wavelength 355nm, processing live width < 25 μm.
8. the method for a kind of laser cutting according to claim 6, it is characterized in that the spot diameter of the maximum incidence of described galvanometer (3) is 10mm, scanning angle is 0.25rad-0.40rad, nonlinearity 3.5mrad, conventional tracking error time 0.16ms, repetitive positioning accuracy <20urad, gain drift <50ppm/k, null offset <15urad/k, 8 hours work drift <0.3mrad, signature velocity 2m/s, locating speed 10m/s, lens reflecting wavelength 355nm.
9. the method for a kind of laser cutting according to claim 6, is characterized in that described workbench is XY motion platform, and workpiece is flexible pvc, below 0.3mm thicknesses of metal thin slice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510854315.7A CN105290622A (en) | 2015-11-28 | 2015-11-28 | Self-adaption cutting laser cutter and method for laser cutting by adopting same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510854315.7A CN105290622A (en) | 2015-11-28 | 2015-11-28 | Self-adaption cutting laser cutter and method for laser cutting by adopting same |
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| CN105290622A true CN105290622A (en) | 2016-02-03 |
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| CN201510854315.7A Pending CN105290622A (en) | 2015-11-28 | 2015-11-28 | Self-adaption cutting laser cutter and method for laser cutting by adopting same |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107414318A (en) * | 2017-09-06 | 2017-12-01 | 青岛科捷机器人有限公司 | A kind of fixed Scan orientation device and method for laser cutting head positioning |
| CN109570779A (en) * | 2018-12-29 | 2019-04-05 | 大族激光科技产业集团股份有限公司 | A kind of laser processing and laser-processing system |
| CN110125559A (en) * | 2019-06-13 | 2019-08-16 | 苏州镭扬激光科技有限公司 | A kind of laser cutting device suitable for being cut to sheet metal with film |
| CN110936027A (en) * | 2018-09-21 | 2020-03-31 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting device |
| CN111770812A (en) * | 2017-12-28 | 2020-10-13 | 艾利丹尼森零售信息服务公司 | Self-adaptive laser cutting control equipment and method based on optical inspection |
| CN112975162A (en) * | 2021-04-21 | 2021-06-18 | 武汉华工激光工程有限责任公司 | Ground glass cutting device and method based on adaptive optics |
| CN114420446A (en) * | 2022-03-29 | 2022-04-29 | 绵阳聚贤自动化设备有限公司 | Winding pin manufacturing process of network filter |
| CN114420445A (en) * | 2022-03-29 | 2022-04-29 | 绵阳聚贤自动化设备有限公司 | Pin winding pre-cutting system of network filter and pin winding system thereof |
| CN114420443A (en) * | 2022-03-29 | 2022-04-29 | 绵阳聚贤自动化设备有限公司 | Pre-cutting process of network filter |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040188396A1 (en) * | 2002-11-06 | 2004-09-30 | Somit Talwar | Laser scanning apparatus and methods for thermal processing |
| US20050056626A1 (en) * | 2003-09-12 | 2005-03-17 | Orbotech Ltd | Multiple beam micro-machining system and method |
| CN1640607A (en) * | 2004-01-02 | 2005-07-20 | 上海工程技术大学 | Thin-plate laser cutting-welding machine workpiece positioning photoelectric measuring and controlling device |
| CN101318264A (en) * | 2008-07-07 | 2008-12-10 | 苏州德龙激光有限公司 | Design method for ultraviolet laser machining apparatus for cutting wafer |
| CN101882578A (en) * | 2009-05-08 | 2010-11-10 | 东莞市中镓半导体科技有限公司 | Integral solid laser lift-off and cutting equipment |
| CN205200816U (en) * | 2015-11-28 | 2016-05-04 | 中山汉通激光设备有限公司 | But laser cutting machine of self -adaptation cutting |
-
2015
- 2015-11-28 CN CN201510854315.7A patent/CN105290622A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040188396A1 (en) * | 2002-11-06 | 2004-09-30 | Somit Talwar | Laser scanning apparatus and methods for thermal processing |
| US20050056626A1 (en) * | 2003-09-12 | 2005-03-17 | Orbotech Ltd | Multiple beam micro-machining system and method |
| CN1640607A (en) * | 2004-01-02 | 2005-07-20 | 上海工程技术大学 | Thin-plate laser cutting-welding machine workpiece positioning photoelectric measuring and controlling device |
| CN101318264A (en) * | 2008-07-07 | 2008-12-10 | 苏州德龙激光有限公司 | Design method for ultraviolet laser machining apparatus for cutting wafer |
| CN101882578A (en) * | 2009-05-08 | 2010-11-10 | 东莞市中镓半导体科技有限公司 | Integral solid laser lift-off and cutting equipment |
| CN205200816U (en) * | 2015-11-28 | 2016-05-04 | 中山汉通激光设备有限公司 | But laser cutting machine of self -adaptation cutting |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107414318A (en) * | 2017-09-06 | 2017-12-01 | 青岛科捷机器人有限公司 | A kind of fixed Scan orientation device and method for laser cutting head positioning |
| CN111770812A (en) * | 2017-12-28 | 2020-10-13 | 艾利丹尼森零售信息服务公司 | Self-adaptive laser cutting control equipment and method based on optical inspection |
| US11504811B2 (en) | 2017-12-28 | 2022-11-22 | Avery Dennison Retail Information Services Llc | Apparatus and method of adaptive laser cutting control based on optical inspection |
| CN110936027B (en) * | 2018-09-21 | 2022-05-03 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting device |
| CN110936027A (en) * | 2018-09-21 | 2020-03-31 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting device |
| CN109570779A (en) * | 2018-12-29 | 2019-04-05 | 大族激光科技产业集团股份有限公司 | A kind of laser processing and laser-processing system |
| CN110125559A (en) * | 2019-06-13 | 2019-08-16 | 苏州镭扬激光科技有限公司 | A kind of laser cutting device suitable for being cut to sheet metal with film |
| CN110125559B (en) * | 2019-06-13 | 2024-02-23 | 苏州镭扬激光科技有限公司 | Laser cutting device suitable for to foil area membrane cutting |
| CN112975162A (en) * | 2021-04-21 | 2021-06-18 | 武汉华工激光工程有限责任公司 | Ground glass cutting device and method based on adaptive optics |
| CN114420446A (en) * | 2022-03-29 | 2022-04-29 | 绵阳聚贤自动化设备有限公司 | Winding pin manufacturing process of network filter |
| CN114420445A (en) * | 2022-03-29 | 2022-04-29 | 绵阳聚贤自动化设备有限公司 | Pin winding pre-cutting system of network filter and pin winding system thereof |
| CN114420443A (en) * | 2022-03-29 | 2022-04-29 | 绵阳聚贤自动化设备有限公司 | Pre-cutting process of network filter |
| CN114420443B (en) * | 2022-03-29 | 2022-08-12 | 绵阳聚贤自动化设备有限公司 | Pre-cutting method of network filter |
| CN114420445B (en) * | 2022-03-29 | 2022-08-16 | 绵阳聚贤自动化设备有限公司 | Pin winding pre-cutting system of network filter and pin winding system thereof |
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Application publication date: 20160203 |