CN105261571B - A kind of hydrid integrated circuit shell pin and base plate connecting device and preparation method thereof - Google Patents
A kind of hydrid integrated circuit shell pin and base plate connecting device and preparation method thereof Download PDFInfo
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- CN105261571B CN105261571B CN201510605087.XA CN201510605087A CN105261571B CN 105261571 B CN105261571 B CN 105261571B CN 201510605087 A CN201510605087 A CN 201510605087A CN 105261571 B CN105261571 B CN 105261571B
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Abstract
The invention discloses a kind of hydrid integrated circuit shell pin and base plate connecting device, including shell pin and substrate, the shell needle guard ring between shell pin and the substrate front side pad of substrate is further included, shell needle guard ring includes semicircle loop section and is used for the Access Division with the clamping of shell pin positioned at semicircle loop section both ends；Semicircle loop section is located at surface, and the radially inner side of semicircle loop section is close to shell pin；The width of semicircle loop section is more than substrate front side pad close to the edge of shell pin side and the average distance of the nearest peripheral part of shell pin.Shell needle guard ring provided by the present invention, can effectively avoid manual welding shell pin and scolding tin during substrate from flowing into short circuit failure or the underproof problem of isolation strength caused by substrate aperture.Meanwhile by increasing shell needle guard ring, making the solder joint non-soldering tin bridged linkage between shell pin and substrate, solder joint surrounds the soldering angle bigger of shell pin, the quality and reliable long-term working higher of solder joint.
Description
Technical field
The present invention relates to hydrid integrated circuit encapsulation field, more particularly to a kind of hydrid integrated circuit shell pin and substrate
Attachment device and preparation method thereof.
Background technology
In hydrid integrated circuit, shell includes tube shell 11, shell pin 12, glass insulator 13 and cover board 14.Such as Fig. 1
Shown, shell pin 12 passes perpendicularly through 13 center of glass insulator, passes through glass insulator 13 between shell pin 12 and tube shell 11
Isolated.
Tube shell 11 is internally provided with substrate 15, and the front of substrate 15 is equipped with substrate front side pad 18, and the back side is equipped with substrate
Backside pads, substrate back pad are bonded or are welded on the bottom of tube shell 11 by the first adhesive linkage or the first weld layer 17
Surface.
After substrate 15 is bonded or is welded and fixed, shell pin 12 passes perpendicularly through substrate aperture 16.There is wiring layer in the front of substrate 15,
Each class component is assembled with thereon, and the circuit with particular characteristic is formed after completing connection.Substrate front side pad 18 passes through scolding tin 19
It is attached, circuit is inputted, output terminal is drawn out to outside shell by shell pin 12 with shell pin 12.
It is welded to connect between substrate front side pad 18 and shell pin 12 by manual welding, its solder joint pattern locally shows
It is intended to as shown in Figure 2.Due to shell pin 12, substrate aperture 16 size there are mismachining tolerance, the diameter of shell pin 12 is less than
The diameter of substrate aperture 16, typically, shell pin 12 is smaller 0.5mm than 16 diameter of substrate aperture or so.Simultaneously because substrate 15 is being bonded
Or there may be deviation when being welded and fixed, thus, after substrate 15 is bonded or is welded on tube shell 11, shell pin 12 and substrate aperture
Certain pause can be left between 16.Due to the presence of interval, during manual welding, the scolding tin 19 of melting may flow into base along interval
Plate hole 16.Even trickling to the lower section of substrate 15, with 11 adhesion of tube shell, causes short circuit when serious.
Therefore, in the prior art, hydrid integrated circuit shell pin 12, need to be to welding soldering tin amount and weld interval in welding
Etc. being controlled, and special check point is set, flowing into substrate aperture 16 to avoid scolding tin during manual welding causes short circuit to lose
Effect or isolation strength are unqualified.
Further, since 16 edge of Edge Distance substrate aperture of substrate front side pad 18 is (being typically 0.3mm) at regular intervals,
There is certain interval (being typically 0~0.5mm) again between 16 edge of substrate aperture and shell pin 12, cause 18 side of substrate front side pad
Distant (being typically 0.3mm~0.8mm) of edge and shell pin 12.Therefore, between substrate front side pad 18 and shell pin 12
Connection be actually with scolding tin part bridging come what is realized, the average span of bridging part scolding tin is typically 0.55mm.
The poor reliability of above-mentioned scolding tin bridged linkage, especially when solder joint 19 is smaller around the soldering angle of shell pin 12
When, it is possible that the problem of cracking after solder joint long-term work.Need to control soldering tin amount and soldering angle in actual production
Make to ensure the quality and reliable long-term working of solder joint.
Therefore, the soldering reliability of shell pin and substrate in hydrid integrated circuit how is improved, is those skilled in the art
The technical issues that need to address at present.
The content of the invention
The object of the present invention is to provide a kind of hydrid integrated circuit shell pin and base plate connecting device and preparation method thereof, have
Effect avoids the problem that existing scolding tin may flow into substrate aperture during the welding of shell pin, and increase solder joint surrounds the welding angle of shell pin
Degree, avoids scolding tin bridged linkage, improves the quality and long-term reliability of shell pin and substrate welding.
In order to solve the above technical problems, the present invention provides following technical solution：
A kind of hydrid integrated circuit shell pin and base plate connecting device, including shell pin and substrate, further include positioned at described
Shell needle guard ring between shell pin and the substrate front side pad of the substrate, the shell needle guard ring include semicircle loop section and
It is used for the Access Division with shell pin clamping positioned at the semicircle loop section both ends；
The semicircle loop section is located at the surface, and the radially inner side of the semicircle loop section is close to the shell
Pin；
The width of the semicircle loop section is more than the substrate front side pad close to the edge of the shell pin side and institute
State the average distance of the nearest peripheral part of shell pin.
Preferably, the Access Division is specially to protrude circular arc portion, and the protrusion circular arc portion is located at the semicircle ring portion
The both ends divided, and the arc angle of the protrusion circular arc portion is 20 °~25 °, circular arc width is 0.25mm~0.3mm.
Preferably, the thickness of the shell needle guard ring is 0.1mm~0.2mm.
Preferably, the semicircle loop section is rotatably connected with the shell pin, and the internal diameter of the semicircle loop section compares institute
State the big 0.01mm~0.02mm of diameter of shell pin.
Preferably, the width of the semicircle loop section than the substrate front side pad close to the edge of the shell pin side
With the big 0.2mm~0.3mm of average distance of the nearest peripheral part of shell pin.
The present invention also provides the production method of a kind of hydrid integrated circuit shell pin and base plate connecting device, including following step
Suddenly：
Step a：Make shell needle guard ring；
Step b：Pending shell pin and the hydrid integrated circuit of substrate welding are provided；
Step c：Shell needle guard ring is fixed on shell pin to be welded, after fixed, shell needle guard ring is positioned to be welded
Shell pin and substrate front side pad between；
Step d：The manual welding of shell pin and substrate is carried out, for connecting shell pin, shell needle guard ring and substrate front side
Pad.
Preferably, the step a comprises the following steps：
Step a1：Layout design is carried out to shell needle guard ring copper mesh plate；
Step a2：Pipe with the shell needle guard ring figure is produced using etch process such as chemistry or electrochemical corrosion
Shell needle guard ring copper mesh plate；
Step a3：Solderable layer is electroplated in the shell needle guard ring copper mesh plate surface；
Step a4：Clamp the shell needle guard ring with clamping devices such as tweezers and fold, separate the shell needle guard ring and
Dowel, obtains the shell needle guard ring finished product.
Preferably, it is etched before technique, further includes in the step a2：
Step a2 '：Mask layer is set to the positive and negative of the shell needle guard ring copper mesh plate, wherein the shell needle guard ring
The partially etching area that the front of copper mesh plate is located on the dowel need not set the mask layer.
Preferably, the step a3 is specially：It is 1.3 μm that thickness is first set on the surface of the shell needle guard ring copper mesh plate
~8.9 μm of nickel layer, then sets the layer gold that thickness is 1.3 μm~5.7 μm on the surface of the nickel layer.
Hydrid integrated circuit shell pin and base plate connecting device provided by the present invention, including shell pin and substrate, are also wrapped
The shell needle guard ring between shell pin and the substrate front side pad of substrate is included, shell needle guard ring includes semicircle loop section and position
It is used for the Access Division with the clamping of shell pin in semicircle loop section both ends.The hydrid integrated circuit shell pin and base plate connecting device phase
Than adding shell needle guard ring in the prior art, and by the way that the width of the semicircle loop section of shell needle guard ring is set greater than
Average distance of the substrate front side pad between the edge of shell pin side and the nearest periphery of shell pin, can effectively avoid
Scolding tin may flow into short circuit failure or the underproof problem of isolation strength caused by substrate aperture during manual welding.Meanwhile phase
Than being made in the manual welding between shell pin and substrate front side pad in the prior art, the present invention by increasing shell needle guard ring
Solder joint non-soldering tin bridged linkage is obtained, solder joint surrounds the soldering angle bigger of shell pin, the quality and reliable long-term working of solder joint
Higher.Meanwhile the shell needle guard ring precision that makes of the present invention is high, flatness is good, preparation process is simple, it is of low cost, can batch
Produce, is easy to operate, there is broader use value and application prospect in hydrid integrated circuit packaging technology field.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structure diagram of hydrid integrated circuit in the prior art；
Fig. 2 is the partial schematic diagram of shell pin solder joint pattern in the prior art；
Fig. 3 is the structure diagram of shell needle guard ring provided by the present invention；
Fig. 4 is the production method flow chart of shell pin provided by the present invention and base plate connecting device；
Fig. 5 is the preparation technology flow chart of shell needle guard ring provided by the present invention；
Fig. 6 is the domain schematic diagram of shell needle guard ring copper mesh plate provided by the present invention；
Fig. 7 is the close-up schematic view of the copper mesh version of shell needle guard ring shown in Fig. 6；
Fig. 8 is the structure diagram of the lantern ring fixing tool provided in the present invention；
Fig. 9 is the shell needle guard ring scheme of installation provided in the present invention；
Figure 10 is the structure diagram of the shell pin and base plate connecting device provided in the present invention；
Reference numeral is as follows：Tube shell -11, shell pin -12, glass insulator -13, cover board -14, substrate -15, substrate
Hole -16, the first weld layer -17, substrate front side pad -18, scolding tin -19, shell needle guard ring -30, semicircle loop section -31, protrusion
Circular arc portion -32, outer framework -51, branch -52, dowel -53, partially etching area -54, lantern ring fixing tool -80, lower floor's semicircle
Loop section -81, upper strata semicircle loop section -82, the second weld layer -83, square aperture -84.
Embodiment
The core of the present invention is to provide a kind of hydrid integrated circuit shell pin and base plate connecting device and preparation method thereof, leads to
The problem of crossing increase shell needle guard ring existing scolding tin may flow into substrate aperture when can be welded to avoid shell pin, increase solder joint encloses
Around the soldering angle of shell pin, scolding tin bridged linkage is avoided, the quality and for a long time may be used that significant raising shell pin and substrate weld
By property.
In order to make those skilled in the art more fully understand the present invention program, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.
0, Figure 10 is please referred to Fig.1 as the hydrid integrated circuit shell pin and the knot of base plate connecting device provided in the present invention
Structure schematic diagram.
In this embodiment, hydrid integrated circuit shell pin includes shell pin 12 and substrate 15 with base plate connecting device,
The shell needle guard ring 30 between shell pin 12 and the substrate front side pad 18 of substrate 15 is further included, shell needle guard ring 30 is used for
Prevent the substrate aperture 16 of molten metal inflow substrate 15 in welding process.
Shell needle guard ring 30 includes semicircle loop section 31 and is used to be clamped with shell pin 12 positioned at 31 both ends of semicircle loop section
Access Division, as shown in Figure 3.
Specifically, Access Division can be protrusion circular arc portion 32, protrusion circular arc portion 32 is located at the two of semicircle loop section 31
End, certainly, Access Division is not limited to the structure gone out given in the present embodiment, can realize that the structure being clamped with shell pin 12 is equal
Can.
Semicircle loop section 31 is located at the top of substrate 15, and the radially inner side of semicircle loop section 31 is close to shell pin 12.Here need
It is noted that the radially inner side of semicircle loop section 31 refers to semicircle loop section 31 diametrically close to the side in the center of circle.Tool
Body, semicircle loop section 31 is placed on substrate aperture 16 and nearby the top of substrate 15, the width of semicircle loop section 31 are more than substrate
Front pad 18 is close to the edge of 12 side of shell pin and the average distance of 12 nearest peripheral part of shell pin, i.e. shell needle guard ring 30
Size be enough to fill substrate aperture 16, and can be contacted with substrate front side pad 18, when welding shell pin 12 with substrate 15,
Shell needle guard ring 30 can effectively stop that molten metal flows into substrate aperture 16.
Preferably, can be rotatablely connected between semicircle loop section 31 and shell pin 12, especially by by semicircle loop section 31
Interior diameter be arranged to realize slightly larger than the diameter of shell pin 12.Certainly, the size of shell needle guard ring 30 should be according to mixing
The size of shell pin 12, substrate aperture 16, substrate front side pad 18 etc. and position are determined in integrated circuit.Design rule is：
The interior diameter of semicircle loop section 31 is bigger 0.01mm~0.02mm than the diameter of shell pin 12, and the width of semicircle loop section 31 compares substrate
Big 0.2mm~the 0.3mm of average distance of the Edge Distance shell pin 12 of front pad 18；Protrude the arc angle of circular arc portion 32
For 20 °~25 °, circular arc width is 0.25mm~0.3mm.
For example, in the present embodiment, 12 a diameter of 1mm of shell pin of hydrid integrated circuit, substrate aperture 16 is a diameter of
1.5mm, 18 edge of substrate front side pad and the distance at 16 edge of substrate aperture are 0.3mm.Then according to upper rule according to this, shell needle guard
The interior diameter of the semicircle loop section 31 of ring 30 can be preferably designed for 1.01mm~1.02mm, width design for 0.75mm~
0.85mm；The circular arc radian of protrusion circular arc portion 32 is designed as 20 °~25 °, and circular arc width design is 0.25mm~0.3mm.
In addition, for the thickness of shell needle guard ring 30, if the thickness of shell needle guard ring 30 is too thick, deformation is tired
Difficulty, is easily damaged shell pin 12, if the thickness of shell needle guard ring 30 is too thin, easily becomes in fixation and welding process
Shape, influences to use.Therefore, in order to ensure the practicality of shell needle guard ring 30, the thickness of shell needle guard ring 30 be generally 0.1mm~
0.2mm。
A kind of as shown in figure 4, making side present invention also offers hydrid integrated circuit shell pin and base plate connecting device
Method, comprises the following steps：
Step a：Make shell needle guard ring 30；
Step b：The hydrid integrated circuit that pending shell pin 12 is welded with substrate 15 is provided；
Step c：Shell needle guard ring 30 is fixed on shell pin 12 to be welded, after fixed, shell needle guard ring 30 is located at
Between shell pin 12 and substrate front side pad 18 to be welded；
Step d：The manual welding of shell pin 12 and substrate 15 is carried out, for connecting shell pin 12,30 and of shell needle guard ring
Substrate front side pad 18.
In step c, when shell needle guard ring 30 is fixed on shell pin 12, first by two protrusions of shell needle guard ring 30
Circular arc portion 32 is towards shell pin 12, the position being placed between the upper surface shell pin 12 of substrate 15 and substrate front side pad 18
On, apply appropriate thrust in side of the shell needle guard ring 30 away from shell pin 12, justify the protrusion at 30 both ends of shell needle guard ring
Slight deformation occurs for arc portion point 32, and last whole shell needle guard ring 30 completes shell needle guard ring 30 by clamping to shell pin 12
With the fixed operation of shell pin 12.
Explanation is needed exist for, since the thickness of shell needle guard ring 30 is thin, generally 0.1mm~0.2mm, and protruding
The width of circular arc portion 32 is narrow, generally 0.25mm~0.3mm, and therefore, in fixed shell needle guard ring 30, required application pushes away
Power is very small, and fixed operation is convenient, and the process that shell needle guard ring 30 is fixed will not cause to damage to shell pin 12.
Simultaneously as the interior diameter of shell needle guard ring 30 compared to shell pin 12 the bigger 0.01mm of overall diameter~
0.02mm, therefore, the shell needle guard ring 30 after fixing will not be shifted over when being not affected by external force effect, but still may be used using tweezers
Rotation adjusting easily is carried out to shell needle guard ring 30.
Pass through above-mentioned setting so that in mobile and follow-up welding operation, shell needle guard ring 30 will not occur product
Mobile and deformation, at the same time, moreover it is possible in the case of shell needle guard 30 fixed angles of ring are inappropriate, using tweezers to shell needle guard ring
30 are rotated, and adjust fixed angle.
In addition, as shown in figure 5, step a：Shell needle guard ring 30 is made, specifically includes following steps：
Step a1：Layout design is carried out to shell needle guard ring copper mesh plate；
As shown in fig. 6, shell needle guard ring copper mesh plate domain includes outer framework 51, branch 52, dowel 53 and shell needle guard
Ring 30.Wherein be equipped with partially etching area 54 with the dowel 53 of 30 contact position of shell needle guard ring, the setting of partially etching area 54 be for
Convenience removes shell needle guard ring 30 from shell needle guard ring copper mesh plate.
The quantity of shell needle guard ring 30 can be increased and decreased according to use demand on shell needle guard ring copper mesh plate domain, not office
It is limited to the quantity shown in Fig. 6.In addition, for convenience subsequently to the lock out operation of shell needle guard ring 30, it is desirable to which dowel 53 exists
Satisfaction shell needle guard ring 30 is supported and connection function in the case of its width it is as far as possible narrow, it is preferred that the width of dowel 53 is
0.15mm~0.2mm, the width of partially etching area 54 is 0.2mm~0.3mm on dowel 53.
For outer framework 51, branch 52 width without particular/special requirement, whole copper mesh version can be played support and connection function,
Keep halftone indeformable, it is preferred that 51 width of outer framework is more than 2mm, and 52 width of branch is more than 0.5mm.
Step a2：Using copper plate as raw material, produced using etch process such as chemistry or electrochemical corrosion with shell pin
The shell needle guard ring copper mesh plate of 30 figure of the lantern ring；
Shell needle guard ring copper mesh plate close-up schematic view after completing is as shown in Figure 7.During ensureing use,
When shell needle guard ring 30 is fixed on shell pin 12, the protrusion circular arc portion 32 at 30 both ends of shell needle guard ring can produce necessarily
Deformation, easily to carry out the fixed operation of shell needle guard ring 30, it is preferred that shell needle guard ring copper mesh plate thickness is 0.1mm
~0.2mm.
In addition, in step a2, etching required precision control is within 0.01mm.Before technique is etched, red copper
Positive and negative graph area is both needed to be protected with mask layer on plate, during etching, etches away the region of no mask layer protection, forms pipe
Shell needle guard ring copper mesh plate.
Certainly, it is etched before technique, further includes in order to form partially etching area 54 on dowel 53, in step a2,
Step a2 '：Mask layer is set to the positive and negative of copper plate, the wherein front of copper plate is located at the partially etching area on dowel 53
54 need not set mask layer.I.e. the backside mask area of copper plate includes all shell needle guard ring copper mesh plate graphics fields, and positive
Mask regions include all shell needle guard ring copper mesh plate graphics fields in addition to partially etching area 54.So set, shell needle guard ring copper
After web plate etches, partially etching area 54 can be formed on the dowel 53 contacted with shell needle guard ring 30, partially etching area 54 loses
The groove depth of cutting is the 1/2~2/3 of shell needle guard ring copper mesh plate thickness.
Step a3：Solderable layer is electroplated in shell needle guard ring copper mesh plate surface；
Solderable layer includes nickel layer and layer gold, and the thickness of nickel layer is 1.3 μm~8.9 μm, including endpoint value, the thickness of layer gold
For 1.3 μm~5.7 μm, including endpoint value.When electroplating weld layer, first electroless nickel layer is answered, then in the electroplating gold on surface of nickel layer
Layer so that nickel layer is located between layer gold and shell needle guard ring copper mesh plate mother metal.
Step a4：Shell needle guard ring 30 is clamped with clamping devices such as tweezers and is folded, separation shell needle guard ring 30 and connection
Muscle 53, obtains 30 finished product of shell needle guard ring.
Since the size of shell needle guard ring 30 is smaller, used instrument (such as tweezers) when promoting shell needle guard ring 30,
End is relatively sharp, if exerting a force excessive or misoperation in fixed shell needle guard ring 30, easily scratches 30 He of shell needle guard ring
Substrate front side pad 18.Therefore, to improve the operability that shell needle guard ring 30 is fixed, present invention also offers a kind of lantern ring to consolidate
Determine frock 80.
As shown in figure 8, Fig. 8 is the structure diagram of the lantern ring fixing tool provided in the present invention.
Lantern ring fixing tool 80 is double-layer structure, including upper strata semicircle loop section 82 and lower floor's semicircle loop section 81, wherein
The square aperture 84 of force when having a convenient gripping and fixed shell needle guard ring 30 on upper strata semicircle loop section 82.Upper strata semicircle
It is bonded or welds together by the second adhesive linkage or the second weld layer 83 between loop section 82 and lower floor's semicircle loop section 81.
Lower floor's semicircle loop section 81 and upper strata semicircle loop section 82 can use and the shell pin provided in the present embodiment
The identical method of 30 preparation method of the lantern ring is prepared.Wherein, the thickness of upper strata semicircle loop section 82 and lower floor's semicircle loop section 81
Degree is 0.2mm~0.3mm, and the interior diameter of lower floor's semicircle loop section 81 is equal to the outer of the semicircle loop section 31 of shell needle guard ring 30
Diameter, circular arc width are recommended as 0.3mm~0.5mm；The overall diameter of upper strata semicircle loop section 82 is equal to lower floor's semicircle loop section 81
Overall diameter, the interior diameter of upper strata semicircle loop section 82 is smaller 0.1mm than 31 overall diameter of semicircle loop section of shell needle guard ring 30~
0.4mm；The length of side of square aperture 84 is 0.3mm~0.5mm.
As shown in figure 9, Fig. 9 is the shell needle guard ring scheme of installation provided in the present invention.
In fixed shell needle guard ring 30, by two protrusion 32 ends of circular arc portion of shell needle guard ring 30 towards to be welded
Shell pin 12, is placed on the position between shell pin 12 and substrate front side pad 18, the opening alignment of lantern ring fixing tool 80
Shell needle guard ring 30, by the square aperture 84 on the tip insertion lantern ring fixing tool 80 of the instruments such as tweezers, promotes shell pin
Lantern ring fixing tool 80, makes the protrusion circular arc portion 32 at 30 both ends of shell needle guard ring that slight deformation occur, by shell needle guard ring 30
Clamping completes the fixed operation of shell needle guard ring 30 and shell pin 12 on shell pin 12.
Shell needle guard ring 30 is completed with after the fixed operation of shell pin 12, carrying out the manual welding of shell pin 12 and substrate 15
Connect, solder joint schematic diagram is as shown in Figure 10.
After adding shell needle guard ring 30, in manual welding, the scolding tin 19 of melting may not flow into substrate aperture 16, avoid
Scolding tin 19 may flow into short circuit failure or the underproof problem of isolation strength caused by substrate aperture 16 during manual welding.
Meanwhile the manual welding solder joint non-soldering tin between the shell pin 12 and substrate front side pad 18 with shell needle guard ring 30
Bridged linkage, solder joint 19 surround the soldering angle bigger of shell pin 12, the quality and reliable long-term working higher of solder joint.
Each embodiment is described by the way of progressive in this specification, what each embodiment stressed be and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.
Hydrid integrated circuit shell pin provided by the present invention and base plate connecting device and preparation method thereof are carried out above
It is discussed in detail.Specific case used herein is set forth the principle of the present invention and embodiment, above example
Explanation be only intended to help understand the present invention method and its core concept.It should be pointed out that for the common of the art
For technical staff, without departing from the principle of the present invention, some improvement and modification can also be carried out to the present invention, these
Improve and modification is also fallen into the protection domain of the claims in the present invention.
Claims (9)
1. a kind of hydrid integrated circuit shell pin and base plate connecting device, including shell pin (12) and substrate (15), its feature exist
In further including the shell needle guard ring between the shell pin (12) and the substrate front side pad (18) of the substrate (15)
(30), the shell needle guard ring (30) includes semicircle loop section (31) and is used for and institute positioned at semicircle loop section (31) both ends
State the Access Division of shell pin (12) clamping；
The semicircle loop section (31) is located above the substrate (15), and the radially inner side of the semicircle loop section (31) is close to institute
State shell pin (12)；
The width of the semicircle loop section (31) is more than the substrate front side pad (18) close to shell pin (12) side
The average distance at edge and the nearest peripheral part of the shell pin (12).
2. hydrid integrated circuit shell pin according to claim 1 and base plate connecting device, it is characterised in that the clamping
Portion is specially to protrude circular arc portion (32), and the protrusion circular arc portion (32) is located at the both ends of the semicircle loop section (31), and
And the arc angle of the protrusion circular arc portion (32) is 20 °~25 °, circular arc width is 0.25mm~0.3mm.
3. hydrid integrated circuit shell pin according to claim 2 and base plate connecting device, it is characterised in that the shell
The thickness of needle guard ring (30) is 0.1mm~0.2mm.
4. hydrid integrated circuit shell pin and base plate connecting device according to claims 1 to 3 any one, its feature exist
In the semicircle loop section (31) is rotatably connected with the shell pin (12), and the internal diameter of the semicircle loop section (31) compares institute
State the big 0.01mm~0.02mm of diameter of shell pin (12).
5. hydrid integrated circuit shell pin according to claim 4 and base plate connecting device, it is characterised in that the semicircle
The width of loop section (31) is than the substrate front side pad (18) close to the edge of shell pin (12) side and the shell
Big 0.2mm~the 0.3mm of average distance of the nearest peripheral part of pin (12).
6. the production method of a kind of hydrid integrated circuit shell pin and base plate connecting device, it is characterised in that comprise the following steps：
Step a：Make shell needle guard ring (30)；
Step b：Pending shell pin (12) and the hydrid integrated circuit of substrate (15) welding are provided；
Step c：Shell needle guard ring (30) is fixed on shell pin (12) to be welded, after fixed, shell needle guard ring (30) position
Between shell pin (12) and substrate front side pad (18) to be welded；
Step d：The manual welding of shell pin (12) and substrate (15) is carried out, for connecting shell pin (12), shell needle guard ring
(30) and substrate front side pad (18).
7. production method according to claim 6, it is characterised in that the step a comprises the following steps：
Step a1：Layout design is carried out to shell needle guard ring copper mesh plate；
Step a2：Pipe with shell needle guard ring (30) figure is produced using the etch process of chemistry or electrochemical corrosion
Shell needle guard ring copper mesh plate；
Step a3：Solderable layer is electroplated in the shell needle guard ring copper mesh plate surface；
Step a4：The shell needle guard ring (30) is clamped with tweezers clamping device and is folded, and separates the shell needle guard ring (30)
With dowel (53), shell needle guard ring (30) finished product is obtained.
8. production method according to claim 7, it is characterised in that be etched in the step a2 before technique, also
Including：
Step a2 '：Mask layer is set to the positive and negative of the shell needle guard ring copper mesh plate, wherein the shell needle guard ring copper mesh
The partially etching area (54) that the front of plate is located on the dowel (53) need not set the mask layer.
9. the production method according to claim 7 or 8, it is characterised in that the step a3 is specially：In the shell pin
The surface of lantern ring copper mesh plate first sets the nickel layer that thickness is 1.3 μm~8.9 μm, and then on the surface of the nickel layer, setting thickness is
1.3 μm~5.7 μm of layer gold.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510605087.XA CN105261571B (en) | 2015-09-21 | 2015-09-21 | A kind of hydrid integrated circuit shell pin and base plate connecting device and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510605087.XA CN105261571B (en) | 2015-09-21 | 2015-09-21 | A kind of hydrid integrated circuit shell pin and base plate connecting device and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN105261571A CN105261571A (en) | 2016-01-20 |
| CN105261571B true CN105261571B (en) | 2018-04-20 |
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| CN110098172A (en) * | 2018-01-30 | 2019-08-06 | 深圳市振华微电子有限公司 | A kind of thick film hybrid pin connection structure and connection method |
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| CN201898122U (en) * | 2010-12-06 | 2011-07-13 | 西安卫光科技有限公司 | Large-power transistor seat with solid packaging steel ring |
| CN202488880U (en) * | 2012-03-09 | 2012-10-10 | 常州海弘电子有限公司 | PCB (printed circuit board) capable of preventing hole from being plugged in tin soldering |
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| JP4995527B2 (en) * | 2006-09-28 | 2012-08-08 | 日本電波工業株式会社 | Piezoelectric oscillator for surface mounting |
| JP2012174857A (en) * | 2011-02-21 | 2012-09-10 | Casio Comput Co Ltd | Mounting structure of electronic component and mounting method |
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| CN1425269A (en) * | 1999-12-20 | 2003-06-18 | 辛奎奥公司 | Flanged terminal pins for DC/DC converters |
| CN201898122U (en) * | 2010-12-06 | 2011-07-13 | 西安卫光科技有限公司 | Large-power transistor seat with solid packaging steel ring |
| CN202488880U (en) * | 2012-03-09 | 2012-10-10 | 常州海弘电子有限公司 | PCB (printed circuit board) capable of preventing hole from being plugged in tin soldering |
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| CN105261571A (en) | 2016-01-20 |
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Inventor after: Xu Yanjun Inventor before: Xu Yanjun Inventor before: Dou Nana |