CN105261571A - Hybrid integrated circuit (HIC) package pin and substrate connection device and manufacturing method thereof - Google Patents
Hybrid integrated circuit (HIC) package pin and substrate connection device and manufacturing method thereof Download PDFInfo
- Publication number
- CN105261571A CN105261571A CN201510605087.XA CN201510605087A CN105261571A CN 105261571 A CN105261571 A CN 105261571A CN 201510605087 A CN201510605087 A CN 201510605087A CN 105261571 A CN105261571 A CN 105261571A
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- China
- Prior art keywords
- shell
- needle guard
- guard ring
- substrate
- pin
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- 239000000758 substrate Substances 0.000 title claims abstract description 97
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000003466 welding Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 21
- 230000008569 process Effects 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 34
- 229910052802 copper Inorganic materials 0.000 claims description 34
- 239000010949 copper Substances 0.000 claims description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 5
- 238000006056 electrooxidation reaction Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 19
- 229910000679 solder Inorganic materials 0.000 abstract description 17
- 230000007774 longterm Effects 0.000 abstract description 7
- 238000002955 isolation Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 19
- 238000005476 soldering Methods 0.000 description 11
- 238000002360 preparation method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
Abstract
The invention discloses a hybrid integrated circuit (HIC) package pin and substrate connection device, which comprises a package pin, a substrate, and a package pin lantern ring positioned between the package pin and a substrate front-side pad of the substrate. The package pin lantern ring comprises a semi-circular ring part and a clamping part arranged at the two ends of the semi-circular ring part and used for being in clamped connection with the package pin. The semi-circular ring part is positioned above the substrate and the radial inner side of the semi-circular ring part is close to the package pin. The width of the semi-circular ring part is larger than the average distance between one side edge of the substrate front-side pad that is close to the package pin and the nearest outer peripheral part of the package pin. According to the technical scheme of the invention, by means of the package pin lantern ring, the condition that the scolding tin might flow into holes in the substrate to cause the short-circuit failure of a circuit or the disqualified isolation strength during the manually welding process of the package pin with the substrate can be effectively avoided. Meanwhile, by means of the additionally arranged package pin lantern ring, no scolding tin bridging structure is formed between the package pin and the substrate, and the welding angle of a solder joint around the package pin is enabled to be larger. Moreover, the quality of the solder joint and the long-term operation reliability of the solder joint are better.
Description
Technical field
The present invention relates to hybrid integrated circuit encapsulation field, particularly relate to a kind of hybrid integrated circuit shell pin and base plate connecting device and preparation method thereof.
Background technology
In hybrid integrated circuit, shell comprises tube shell 11, shell pin 12, glass insulator 13 and cover plate 14.As shown in Figure 1, shell pin 12 passes perpendicularly through glass insulator 13 center, is isolated between shell pin 12 and tube shell 11 by glass insulator 13.
The inside of tube shell 11 is provided with substrate 15, and the front of substrate 15 is provided with substrate front side pad 18, and the back side is provided with substrate back pad, substrate back pad by the first adhesive linkage or the first weld layer 17 bonding or be welded in the upper base surface of tube shell 11.
Substrate 15 is bonding or after being welded and fixed, shell pin 12 passes perpendicularly through substrate aperture 16.There is wiring layer in the front of substrate 15, it is assembled with each class component, completes the circuit forming after connecting and have particular characteristic.Substrate front side pad 18 is connected with shell pin 12 by scolding tin 19, and circuit input, output are drawn out to shell outside by shell pin 12.
Be welded to connect by manual welding between substrate front side pad 18 and shell pin 12, its solder joint pattern partial schematic diagram as shown in Figure 2.Because the size of shell pin 12, substrate aperture 16 exists mismachining tolerance, therefore, the diameter of shell pin 12 is less than the diameter of substrate aperture 16, typically, and shell pin 12 about 0.5mm less of substrate aperture 16 diameter.Simultaneously because substrate 15 is bonding or may produce deviation when being welded and fixed, thus, substrate 15 is bonding or be welded in after on tube shell 11, can leave certain pause between shell pin 12 and substrate aperture 16.Due to the existence of interval, during manual welding, the scolding tin 19 of melting may flow into substrate aperture 16 along interval.Even trickle time serious to the below of substrate 15, with tube shell 11 adhesion, cause short circuit.
Therefore, in prior art, hybrid integrated circuit shell pin 12, when welding, need control soldering tin amount and weld time etc. welding, and special check point is set, during to avoid manual welding scolding tin flow into substrate aperture 16 cause short circuit to lose efficacy or isolation strength defective.
In addition, due to Edge Distance substrate aperture 16 edge (being typically 0.3mm) at regular intervals of substrate front side pad 18, there is again certain interval (being typically 0 ~ 0.5mm) between substrate aperture 16 edge and shell pin 12, cause distant (being typically 0.3mm ~ 0.8mm) of substrate front side pad 18 edge and shell pin 12.Therefore, the connection between substrate front side pad 18 and shell pin 12 is actually and realizes with scolding tin local bridging, and the average span of bridging part scolding tin is typically 0.55mm.
, especially when solder joint 19 is less around the soldering angle of shell pin 12, the problem ftractureed after solder joint long-term work, may be there is in the poor reliability of above-mentioned scolding tin bridged linkage.The quality and the reliable long-term working that control to ensure solder joint to soldering tin amount and soldering angle is needed in actual production.
Therefore, how improving the soldering reliability of shell pin and substrate in hybrid integrated circuit, is the current technical issues that need to address of those skilled in the art.
Summary of the invention
The object of this invention is to provide a kind of hybrid integrated circuit shell pin and base plate connecting device and preparation method thereof, problem when effectively avoiding shell pin to weld, the problem includes: scolding tin may flow into the problem of substrate aperture, increase the soldering angle of solder joint around shell pin, avoid scolding tin bridged linkage, improve quality and the long-term reliability of shell pin and substrate welding.
For solving the problems of the technologies described above, the invention provides following technical scheme:
A kind of hybrid integrated circuit shell pin and base plate connecting device, comprise shell pin and substrate, also comprise the shell needle guard ring between described shell pin and the substrate front side pad of described substrate, described shell needle guard ring comprises semicircular ring part and is positioned at described semicircular ring part two ends for the Access Division with the clamping of described shell pin;
Described semicircular ring part is positioned at described surface, and the radially inner side of described semicircular ring part is near described shell pin;
The width of described semicircular ring part is greater than the edge of described substrate front side pad near described shell pin side and the average distance of the nearest peripheral part of described shell pin.
Preferably, described Access Division is specially protrusion circular arc portion, and described protrusion circular arc portion is positioned at the two ends of described semicircular ring part, and the arc angle of described protrusion circular arc portion be 20 ° ~ 25 °, circular arc width is 0.25mm ~ 0.3mm.
Preferably, the thickness of described shell needle guard ring is 0.1mm ~ 0.2mm.
Preferably, described semicircular ring part and described shell pin are rotatably connected, the internal diameter 0.01mm ~ 0.02mm larger than the diameter of described shell pin of described semicircular ring part.
Preferably, the width of described semicircular ring part than described substrate front side pad near the edge of described shell pin side and the large 0.2mm ~ 0.3mm of the average distance of the nearest peripheral part of described shell pin.
The present invention also provides the manufacture method of a kind of hybrid integrated circuit shell pin and base plate connecting device, comprises the following steps:
Step a: make shell needle guard ring;
Step b: the hybrid integrated circuit that pending shell pin welds with substrate is provided;
Step c: shell needle guard ring is fixed on shell pin to be welded, after fixing, shell needle guard ring is between shell pin to be welded and substrate front side pad;
Steps d: the manual welding carrying out shell pin and substrate, for connecting shell pin, shell needle guard ring and substrate front side pad.
Preferably, described step a comprises the following steps:
Step a1: layout design is carried out to shell needle guard ring copper mesh plate;
Step a2: the etch processs such as employing chemistry or electrochemical corrosion produce the shell needle guard ring copper mesh plate with described shell needle guard ring figure;
Step a3: at described shell needle guard ring copper mesh plate electroplating surface solderable layer;
Step a4: clamp described shell needle guard ring with clamping devices such as tweezers and fold, being separated described shell needle guard ring and dowel, obtaining described shell needle guard ring finished product.
Preferably, before carrying out etch process in described step a2, also comprise:
Step a2 ': arrange mask layer to the positive and negative of described shell needle guard ring copper mesh plate, the front of wherein said shell needle guard ring copper mesh plate is positioned at partially etching area on described dowel without the need to arranging described mask layer.
Preferably, described step a3 is specially: on the surface of described shell needle guard ring copper mesh plate, first thickness setting is the nickel dam of 1.3 μm ~ 8.9 μm, is then the layer gold of 1.3 μm ~ 5.7 μm at the surperficial thickness setting of described nickel dam.
Hybrid integrated circuit shell pin provided by the present invention and base plate connecting device, comprise shell pin and substrate, also comprise the shell needle guard ring between shell pin and the substrate front side pad of substrate, shell needle guard ring comprises semicircular ring part and is positioned at semicircular ring part two ends for the Access Division with the clamping of shell pin.This hybrid integrated circuit shell pin and base plate connecting device add shell needle guard ring compared to prior art, and be set to be greater than substrate front side pad near the average distance between the edge and the nearest periphery of shell pin of shell pin side by the width of the semicircular ring part by shell needle guard ring, when effectively can avoid manual welding, scolding tin may flow into the short circuit that substrate aperture causes and lost efficacy or the underproof problem of isolation strength.Simultaneously, compared to the manual welding in prior art between shell pin and substrate front side pad, the present invention, by increasing shell needle guard ring, makes solder joint non-soldering tin bridged linkage, solder joint is larger around the soldering angle of shell pin, and quality and the reliable long-term working of solder joint are higher.Meanwhile, the present invention make shell needle guard ring precision high, evenness good, preparation technology is simple, with low cost, can be mass, simple to operate, in hybrid integrated circuit packaging technology field, there is more wide use value and application prospect.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of hybrid integrated circuit in prior art;
Fig. 2 is the partial schematic diagram of shell pin solder joint pattern in prior art;
Fig. 3 is the structural representation of shell needle guard ring provided by the present invention;
Fig. 4 is the manufacture method flow chart of shell pin provided by the present invention and base plate connecting device;
Fig. 5 is preparation technology's flow chart of shell needle guard ring provided by the present invention;
Fig. 6 is the domain schematic diagram of shell needle guard ring copper mesh plate provided by the present invention;
Fig. 7 is the close-up schematic view of the needle guard of shell shown in Fig. 6 ring copper mesh version;
The structural representation of collar fixing tool of Fig. 8 for providing in the present invention;
The shell needle guard ring scheme of installation of Fig. 9 for providing in the present invention;
The structural representation that Figure 10 is the shell pin that provides in the present invention and base plate connecting device;
Reference numeral is as follows: tube shell-11, shell pin-12, glass insulator-13, cover plate-14, substrate-15, substrate aperture-16, the first weld layer-17, substrate front side pad-18, scolding tin-19, shell needle guard ring-30, semicircular ring part-31, protrusion circular arc portion-32, outside framework-51, branch-52, dowel-53, partially etching area-54, collar fixing tool-80, lower floor's semicircular ring part-81, upper strata semicircular ring part-82, second weld layer-83, square aperture-84.
Embodiment
Core of the present invention is to provide a kind of hybrid integrated circuit shell pin and base plate connecting device and preparation method thereof, when shell pin can be avoided to weld by increasing shell needle guard ring, problem, the problem includes: scolding tin may flow into the problem of substrate aperture, increase the soldering angle of solder joint around shell pin, avoid scolding tin bridged linkage, significant quality and the long-term reliability improving shell pin and substrate welding.
In order to make those skilled in the art person understand the present invention program better, below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Please refer to Figure 10, the structural representation that Figure 10 is the hybrid integrated circuit shell pin that provides in the present invention and base plate connecting device.
In this embodiment, hybrid integrated circuit shell pin and base plate connecting device comprise shell pin 12 and substrate 15, also comprise the shell needle guard ring 30 between shell pin 12 and the substrate front side pad 18 of substrate 15, shell needle guard ring 30 flows into the substrate aperture 16 of substrate 15 for stoping motlten metal in welding process.
Shell needle guard ring 30 comprises semicircular ring part 31 and is positioned at semicircular ring part 31 two ends for the Access Division with shell pin 12 clamping, as shown in Figure 3.
Concrete, the two ends that circular arc portion 32 is positioned at semicircular ring part 31 for protruding circular arc portion 32, can be protruded in Access Division, and certainly, Access Division is not limited to structure given in the present embodiment, can realize the structure with shell pin 12 clamping.
Semicircular ring part 31 is positioned at above substrate 15, and the radially inner side of semicircular ring part 31 is near shell pin 12.Here it should be noted that, the radially inner side of semicircular ring part 31 refers to semicircular ring part 31 diametrically near the side in the center of circle.Concrete, semicircular ring part 31 is placed on the top of substrate aperture 16 and neighbouring substrate 15, the width of semicircular ring part 31 is greater than the edge of substrate front side pad 18 near shell pin 12 side and the average distance of the nearest peripheral part of shell pin 12, namely the size of shell needle guard ring 30 is enough to fill substrate aperture 16, and can contact with substrate front side pad 18, when welding shell pin 12 with substrate 15, shell needle guard ring 30 effectively can stop that motlten metal flows into substrate aperture 16.
Preferably, can be rotationally connected between semicircular ring part 31 and shell pin 12, especially by by the interior diameter of semicircular ring part 31, the diameter be set to slightly larger than shell pin 12 realizes.Certainly, the size of shell needle guard ring 30 should be determined according to the size of shell pin 12, substrate aperture 16, substrate front side pad 18 etc. in hybrid integrated circuit and position.Design rule is: the interior diameter 0.01mm ~ 0.02mm larger than the diameter of shell pin 12 of semicircular ring part 31, the width 0.2mm ~ 0.3mm larger than the average distance of the Edge Distance shell pin 12 of substrate front side pad 18 of semicircular ring part 31; The arc angle protruding circular arc portion 32 is 20 ° ~ 25 °, and circular arc width is 0.25mm ~ 0.3mm.
Such as, in the present embodiment, shell pin 12 diameter of hybrid integrated circuit is 1mm, and substrate aperture 16 diameter is 1.5mm, and the distance at substrate front side pad 18 edge and substrate aperture 16 edge is 0.3mm.Then according to going up rule according to this, the interior diameter of the semicircular ring part 31 of shell needle guard ring 30 can be preferably designed for 1.01mm ~ 1.02mm, and width design is 0.75mm ~ 0.85mm; The circular arc radian protruding circular arc portion 32 is designed to 20 ° ~ 25 °, and circular arc width design is 0.25mm ~ 0.3mm.
In addition, for the thickness of shell needle guard ring 30, if the thickness of shell needle guard ring 30 is too thick, be then out of shape difficulty, easily damage shell pin 12, if the thickness of shell needle guard ring 30 is too thin, easily fixing and deforming in welding process, impact uses.Therefore, in order to ensure the practicality of shell needle guard ring 30, the thickness of shell needle guard ring 30 is generally 0.1mm ~ 0.2mm.
As shown in Figure 4, present invention also offers the manufacture method of a kind of hybrid integrated circuit shell pin and base plate connecting device, comprise the following steps:
Step a: make shell needle guard ring 30;
Step b: the hybrid integrated circuit that pending shell pin 12 welds with substrate 15 is provided;
Step c: shell needle guard ring 30 is fixed on shell pin 12 to be welded, after fixing, shell needle guard ring 30 is between shell pin 12 to be welded and substrate front side pad 18;
Steps d: the manual welding carrying out shell pin 12 and substrate 15, for connecting shell pin 12, shell needle guard ring 30 and substrate front side pad 18.
In step c, when shell needle guard ring 30 is fixed on shell pin 12, first protrude circular arc portion 32 towards shell pin 12 by two of shell needle guard ring 30, be placed on the position between the upper surface shell pin 12 of substrate 15 and substrate front side pad 18, suitable thrust is applied away from the side of shell pin 12 at shell needle guard ring 30, make the protrusion circular arc portion 32 at shell needle guard ring 30 two ends that slight deformation occur, last whole shell needle guard ring 30 is held on shell pin 12, completes the fixing operation of shell needle guard ring 30 and shell pin 12.
Here it should be noted that, because the thickness of shell needle guard ring 30 is thin, be generally 0.1mm ~ 0.2mm, and the width protruding circular arc portion 32 is narrow, is generally 0.25mm ~ 0.3mm, therefore, when fixing shell needle guard ring 30, the required thrust applied is very little, and fixing operation is convenient, and the process that shell needle guard ring 30 is fixed can not cause damage to shell pin 12.
Simultaneously, because the interior diameter of shell needle guard ring 30 is compared to the bigger 0.01mm ~ 0.02mm of the overall diameter of shell pin 12, therefore, the shell needle guard ring 30 after fixing can not be shifted when not being subject to External Force Acting, but uses tweezers still can carry out rotation adjustment to shell needle guard ring 30 easily.
By above-mentioned setting, make product in mobile and follow-up welding operation, shell needle guard ring 30 all can not be moved and be out of shape, simultaneously, in the inappropriate situation of shell needle guard ring 30 fixed angle, tweezers can also be used to rotate shell needle guard ring 30, regulate fixed angle.
In addition, as shown in Figure 5, step a: make shell needle guard ring 30, specifically comprise the following steps:
Step a1: layout design is carried out to shell needle guard ring copper mesh plate;
As shown in Figure 6, shell needle guard ring copper mesh plate domain comprises outside framework 51, branch 52, dowel 53 and shell needle guard ring 30.Wherein be provided with partially etching area 54 with the dowel 53 of shell needle guard ring 30 contact position, the setting of partially etching area 54 is conveniently taken off from shell needle guard ring copper mesh plate by shell needle guard ring 30.
On shell needle guard ring copper mesh plate domain, the quantity of shell needle guard ring 30 can increase and decrease according to user demand, is not limited to the quantity shown in Fig. 6.In addition, the conveniently follow-up lock out operation to shell needle guard ring 30, require dowel 53 when meet shell needle guard ring 30 supported and connection function its width as far as possible narrow, preferably, the width of dowel 53 is 0.15mm ~ 0.2mm, and on dowel 53, the width of partially etching area 54 is 0.2mm ~ 0.3mm.
For the width of outside framework 51, branch 52 without particular/special requirement, can play support and connection function to whole copper mesh version, maintenance half tone is indeformable, preferably, outside framework 51 width is greater than 2mm, and branch 52 width is greater than 0.5mm.
Step a2: take copper plate as raw material, the etch processs such as employing chemistry or electrochemical corrosion produce the shell needle guard ring copper mesh plate with shell needle guard ring 30 figure;
Shell needle guard ring copper mesh plate close-up schematic view after completing as shown in Figure 7.For ensureing in use procedure, when being fixed on shell pin 12 by shell needle guard ring 30, the protrusion circular arc portion 32 at shell needle guard ring 30 two ends can produce certain deformation, to carry out the fixing operation of shell needle guard ring 30 easily, preferably, shell needle guard ring copper mesh plate thickness is 0.1mm ~ 0.2mm.
In addition, in step a2, etching required precision controls within 0.01mm.Before carrying out etch process, on copper plate, positive and negative graph area all needs to protect with mask layer, during etching, etches away the region without mask layer protection, forms shell needle guard ring copper mesh plate.
Certainly, in order to form partially etching area 54 on dowel 53, before carrying out etch process in step a2, also comprise, step a2 ': arrange mask layer to the positive and negative of copper plate, wherein the front of copper plate is positioned at partially etching area 54 on dowel 53 without the need to arranging mask layer.Namely the backside mask district of copper plate comprises all shell needle guard ring copper mesh plate graphics fields, and mask regions, front comprises all shell needle guard ring copper mesh plate graphics fields except partially etching area 54.Setting like this, after shell needle guard ring copper mesh plate etches, the dowel 53 contacted with shell needle guard ring 30 can form partially etching area 54, and the groove depth of partially etching area 54 etching bath is 1/2 ~ 2/3 of shell needle guard ring copper mesh plate thickness.
Step a3: at shell needle guard ring copper mesh plate electroplating surface solderable layer;
Solderable layer comprises nickel dam and layer gold, and the thickness of nickel dam is 1.3 μm ~ 8.9 μm, comprises endpoint value, and the thickness of layer gold is 1.3 μm ~ 5.7 μm, comprises endpoint value.When electroplating weld layer, should first electroless nickel layer, then in the electroplating surface layer gold of nickel dam, make nickel dam between layer gold and shell needle guard ring copper mesh plate mother metal.
Step a4: clamp shell needle guard ring 30 with clamping devices such as tweezers and fold, is separated shell needle guard ring 30 and dowel 53, obtains shell needle guard ring 30 finished product.
Because the size of shell needle guard ring 30 is less, the instrument (as tweezers etc.) used when promoting shell needle guard ring 30, end is all comparatively sharp-pointed, if exert a force excessive or misoperation when fixing shell needle guard ring 30, easily scratches shell needle guard ring 30 and substrate front side pad 18.Therefore, for improving the fixing operability of shell needle guard ring 30, present invention also offers a kind of collar fixing tool 80.
As shown in Figure 8, the structural representation of collar fixing tool of Fig. 8 for providing in the present invention.
Collar fixing tool 80 is double-layer structure, comprises upper strata semicircular ring part 82 and lower floor's semicircular ring part 81, the square aperture 84 of force when it at the middle and upper levels semicircular ring part 82 has to facilitate gripping and fixing shell needle guard ring 30.Between upper strata semicircular ring part 82 and lower floor's semicircular ring part 81 by the second adhesive linkage or the second weld layer 83 bonding or weld together.
Lower floor's semicircular ring part 81 and upper strata semicircular ring part 82 all can adopt the method identical with shell needle guard ring 30 preparation method provided in the present embodiment to prepare.Wherein, the thickness of upper strata semicircular ring part 82 and lower floor's semicircular ring part 81 is 0.2mm ~ 0.3mm, and the interior diameter of lower floor's semicircular ring part 81 equals the overall diameter of the semicircular ring part 31 of shell needle guard ring 30, and circular arc width is recommended as 0.3mm ~ 0.5mm; The overall diameter of upper strata semicircular ring part 82 equals the overall diameter of lower floor's semicircular ring part 81, the interior diameter 0.1mm ~ 0.4mm less of semicircular ring part 31 overall diameter of shell needle guard ring 30 of upper strata semicircular ring part 82; The length of side of square aperture 84 is 0.3mm ~ 0.5mm.
As shown in Figure 9, the shell needle guard ring scheme of installation of Fig. 9 for providing in the present invention.
When fixing shell needle guard ring 30, two of shell needle guard ring 30 are protruded circular arc portion 32 end towards shell pin 12 to be welded, be placed on the position between shell pin 12 and substrate front side pad 18, the opening of collar fixing tool 80 aims at shell needle guard ring 30, the tip of the instruments such as tweezers is inserted in the square aperture 84 on collar fixing tool 80, promote shell needle guard ring fixing tool 80, make the protrusion circular arc portion 32 at shell needle guard ring 30 two ends that slight deformation occur, shell needle guard ring 30 is held on shell pin 12, complete the fixing operation of shell needle guard ring 30 and shell pin 12.
After completing the fixing operation of shell needle guard ring 30 and shell pin 12, carry out the manual welding of shell pin 12 and substrate 15, solder joint schematic diagram as shown in Figure 10.
After adding shell needle guard ring 30, when manual welding, the scolding tin 19 of melting can not flow into substrate aperture 16, and when avoiding manual welding, scolding tin 19 may flow into the short circuit that substrate aperture 16 causes and lost efficacy or the underproof problem of isolation strength.
Meanwhile, the manual welding solder joint non-soldering tin bridged linkage between the shell pin 12 of band shell needle guard ring 30 and substrate front side pad 18, solder joint 19 is larger around the soldering angle of shell pin 12, and quality and the reliable long-term working of solder joint are higher.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.
Above hybrid integrated circuit shell pin provided by the present invention and base plate connecting device and preparation method thereof are described in detail.Apply specific case herein to set forth principle of the present invention and execution mode, the explanation of above embodiment just understands method of the present invention and core concept thereof for helping.It should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also carry out some improvement and modification to the present invention, these improve and modify and also fall in the protection range of the claims in the present invention.
Claims (9)
1. a hybrid integrated circuit shell pin and base plate connecting device, comprise shell pin (12) and substrate (15), it is characterized in that, also comprise the shell needle guard ring (30) between the substrate front side pad (18) being positioned at described shell pin (12) and described substrate (15), described shell needle guard ring (30) comprises semicircular ring part (31) and is positioned at described semicircular ring part (31) two ends for the Access Division with the clamping of described shell pin (12);
Described semicircular ring part (31) is positioned at described substrate (15) top, and the radially inner side of described semicircular ring part (31) is near described shell pin (12);
The width of described semicircular ring part (31) is greater than the edge of described substrate front side pad (18) near described shell pin (12) side and the average distance of the nearest peripheral part of described shell pin (12).
2. hybrid integrated circuit shell pin according to claim 1 and base plate connecting device, it is characterized in that, described Access Division is specially protrudes circular arc portion (32), described protrusion circular arc portion (32) is positioned at the two ends of described semicircular ring part (31), and the arc angle of described protrusion circular arc portion (32) be 20 ° ~ 25 °, circular arc width is 0.25mm ~ 0.3mm.
3. hybrid integrated circuit shell pin according to claim 2 and base plate connecting device, is characterized in that, the thickness of described shell needle guard ring (30) is 0.1mm ~ 0.2mm.
4. the hybrid integrated circuit shell pin according to claims 1 to 3 any one and base plate connecting device, it is characterized in that, described semicircular ring part (31) and described shell pin (12) are rotatably connected, the internal diameter 0.01mm ~ 0.02mm larger than the diameter of described shell pin (12) of described semicircular ring part (31).
5. hybrid integrated circuit shell pin according to claim 4 and base plate connecting device, it is characterized in that, the large 0.2mm ~ 0.3mm of average distance of the edge of width shell pin (12) side close more described than described substrate front side pad (18) of described semicircular ring part (31) and the nearest peripheral part of described shell pin (12).
6. a manufacture method for hybrid integrated circuit shell pin and base plate connecting device, is characterized in that, comprises the following steps:
Step a: make shell needle guard ring (30);
Step b: the hybrid integrated circuit that pending shell pin (12) is welded with substrate (15) is provided;
Step c: shell needle guard ring (30) is fixed on shell pin (12) to be welded, after fixing, shell needle guard ring (30) is positioned between shell pin (12) to be welded and substrate front side pad (18);
Steps d: the manual welding carrying out shell pin (12) and substrate (15), for connecting shell pin (12), shell needle guard ring (30) and substrate front side pad (18).
7. manufacture method according to claim 6, is characterized in that, described step a comprises the following steps:
Step a1: layout design is carried out to shell needle guard ring copper mesh plate;
Step a2: the etch processs such as employing chemistry or electrochemical corrosion produce the shell needle guard ring copper mesh plate with described shell needle guard ring (30) figure;
Step a3: at described shell needle guard ring copper mesh plate electroplating surface solderable layer;
Step a4: clamp described shell needle guard ring (30) with clamping devices such as tweezers and fold, being separated described shell needle guard ring (30) and dowel (53), obtaining described shell needle guard ring (30) finished product.
8. manufacture method according to claim 7, is characterized in that, before carrying out etch process, also comprises in described step a2:
Step a2 ': arrange mask layer to the positive and negative of described shell needle guard ring copper mesh plate, the front of wherein said shell needle guard ring copper mesh plate is positioned at partially etching area (54) on described dowel (53) without the need to arranging described mask layer.
9. the manufacture method according to claim 7 or 8, it is characterized in that, described step a3 is specially: on the surface of described shell needle guard ring copper mesh plate, first thickness setting is the nickel dam of 1.3 μm ~ 8.9 μm, is then the layer gold of 1.3 μm ~ 5.7 μm at the surperficial thickness setting of described nickel dam.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510605087.XA CN105261571B (en) | 2015-09-21 | 2015-09-21 | A kind of hydrid integrated circuit shell pin and base plate connecting device and preparation method thereof |
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| CN201510605087.XA CN105261571B (en) | 2015-09-21 | 2015-09-21 | A kind of hydrid integrated circuit shell pin and base plate connecting device and preparation method thereof |
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| CN105261571A true CN105261571A (en) | 2016-01-20 |
| CN105261571B CN105261571B (en) | 2018-04-20 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110098172A (en) * | 2018-01-30 | 2019-08-06 | 深圳市振华微电子有限公司 | A kind of thick film hybrid pin connection structure and connection method |
| US11974479B2 (en) * | 2019-12-20 | 2024-04-30 | Innolux Corporation | Electrical connection structure and electronic device comprising the same |
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| US20080079505A1 (en) * | 2006-09-28 | 2008-04-03 | Nihon Dempa Kogyo Co., Ltd. | Surface mounting piezoelectric oscillator |
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| US11974479B2 (en) * | 2019-12-20 | 2024-04-30 | Innolux Corporation | Electrical connection structure and electronic device comprising the same |
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| Publication number | Publication date |
|---|---|
| CN105261571B (en) | 2018-04-20 |
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