CN110098172A - A kind of thick film hybrid pin connection structure and connection method - Google Patents
A kind of thick film hybrid pin connection structure and connection method Download PDFInfo
- Publication number
- CN110098172A CN110098172A CN201810088689.6A CN201810088689A CN110098172A CN 110098172 A CN110098172 A CN 110098172A CN 201810088689 A CN201810088689 A CN 201810088689A CN 110098172 A CN110098172 A CN 110098172A
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- China
- Prior art keywords
- face
- pin
- fitting end
- circuit portion
- integrated circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
- H01L27/013—Thick-film circuits
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses a kind of thick film hybrid pin connection structure and connection methods.The thick film hybrid pin connection structure includes substrate, integrated circuit portion, interconnecting piece and pin；The substrate is connect with integrated circuit portion；Substrate is provided with connecting hole, and connecting hole through substrate, connecting hole perforation direction is perpendicular to integrated circuit portion；The pin passes through the connecting hole；The interconnecting piece includes the first fitting end face and the second fitting end face, and the first fitting end face is perpendicular to the second fitting end face；The first fitting end face is electrically connected with the fitting of integrated circuit portion, and second fitting end face is electrically connected with the pin and is；Guarantee that pin is electrically connected with integrated circuit portion, it is connect simultaneously because pin is vertical with integrated circuit portion, enhance the fixed stability of pin, it is safe and reliable, reduce pin outer diameter and connecting hole internal diameter required precision, it reduces thick film hybrid pin connection structure and produces precision, improving production efficiency.
Description
Technical field
The present invention relates to a kind of thick film hybrid pin connection structure and connection methods.
Background technique
The metal shell of thick film integrated circuit plate includes inside/outside pin, substrate installing zone and insulator (glass or ceramic material
Material) etc..In the ceramic substrate that substrate installing zone is installed according to circuit design requirements, need at the corresponding substrate of pin inside the shell
It makes through-hole (bore dia is generally 0.5mm bigger than pin in shell), packs into interior pin set to make the ceramic substrate after figure
It is attached to inside enclosure cavity.Currently, the interconnection for pin in metal shell and ceramic substrate, usually using electric iron manual welding
It connects.There are two types of electric iron manual welding modes, one is directly interior pin and substrate bond pad welding is interconnected using scolding tin, in addition
One is interconnected respectively with interior pin, substrate bond pad welding using fly line.But the two ways requires manual welding, production effect
Rate is lower, and quality conformance is poor；Simultaneously because interior pin is relatively thick (usually 1.0mm and its more than), interior pin and substrate are welded
Thermal stress is larger after disk manual welding, during subsequent test, by high/low temperature circulation, mechanical shock or constant acceleration etc.
Proof stress effect, interior pin or fly line and the substrate bond pad coefficient of expansion are inconsistent, and interior pin or fly line are reciprocal to substrate bond pad
It upholds, pull, can there is the hidden danger of pad cracking.
Summary of the invention
In order to solve the above technical problems, the present invention proposes a kind of thick film hybrid pin connection structure and connection method.
The technical solution of the present invention is as follows: the thick film hybrid pin connection structure includes substrate, integrated circuit portion, connects
Socket part and pin；The substrate is connect with integrated circuit portion；Substrate is provided with connecting hole, connecting hole through substrate, the connection
Hole penetrates through direction perpendicular to integrated circuit portion；The pin passes through the connecting hole；The interconnecting piece includes the first fitting end face
With the second fitting end face, the first fitting end face is perpendicular to the second fitting end face；The first fitting end face and integrated circuit
Portion's fitting electrical connection, second fitting end face are electrically connected with the pin and is.
Further, the integrated circuit portion includes bonding pad；First fitting end face covers the bonding pad.
Further, the interconnecting piece includes Copper substrate and welding layer；The welding layer wraps up the Copper substrate.
Further, the welding layer is nickel plating/tin coating.
Further, the interconnecting piece is semi-circular structure.
Further, the substrate is made of aluminium oxide/aluminium nitride.
A kind of thick film hybrid pin connection method:
S1: coating soldering paste for the first fitting end face of interconnecting piece, and soldering paste is coated in the second fitting end face of interconnecting piece；
S2: interconnecting piece is placed in integrated circuit portion, is bonded the first fitting end face with integrated circuit portion, and described second
Fitting end face is bonded with pin；
S3: the integrated circuit portion for being placed with interconnecting piece and pin is placed on hot plate；
S4: heating hot plate, and soldering paste is heated to realize that the first fitting end face is connect with integrated circuit portion, while the second patch
End face is closed to connect with pin.
Further, the pin is perpendicular to integrated circuit portion；The first fitting end face is perpendicular to the second fitting end face.
Further, the interconnecting piece thermal expansion coefficient is identical as pin.
Further, first fitting end face is connect with integrated circuit portion by reflow welding/Reflow Soldering, second patch
End face is closed to connect with pin by reflow welding/Reflow Soldering.
The beneficial effects of the present invention are: guarantee that pin is electrically connected with integrated circuit portion, simultaneously because pin and integrated electricity
Road portion vertically connects, the fixed stability of enhancing pin, safe and reliable, reduces pin outer diameter and connecting hole internal diameter essence
Degree requires, and reduces thick film hybrid pin connection structure and produces precision, improving production efficiency.
Detailed description of the invention
Fig. 1 is thick film hybrid pin connection structure schematic diagram；
Fig. 2 is substrate and interconnecting piece attachment structure schematic diagram；
Fig. 3 is interconnecting piece structural schematic diagram；
Fig. 4 is a kind of thick film hybrid pin connection method schematic diagram.
Specific embodiment
For convenient for those skilled in the art understand that technical solution of the present invention, technical solution of the present invention is combined have below
Body embodiment is described in further detail.
As shown in Figure 1, Figure 2 and Figure 3, the thick film hybrid pin connection structure 100 includes substrate 20, integrated circuit
Portion 30, interconnecting piece 40 and pin 50；Integrated circuit portion 30 is fixed on substrate 20, and substrate 20 is that insulating materials is used to support collection simultaneously
At circuit portion 30；Need to realize that integrated circuit portion 30 is electrically connected with pin 50 and fixes relatively connection；Interconnecting piece 40 is conduction material
Material, the thermal expansion coefficient and pin 50 of interconnecting piece 40 are consistent, to prevent interconnecting piece 40 from causing connection unstable because of temperature distortion
It is fixed；
The substrate 20 is connect with integrated circuit portion 30, is increased the support strength in integrated circuit portion 30 and is reduced extraneous electricity
Interference of the magnetic to integrated circuit portion 30；Substrate 20 is provided with connecting hole 21, and 21 through substrate 20 of connecting hole guarantees that pin 50 passes through
Connecting hole 21 is capable of forming outer pin and interior pin；The connecting hole 21 penetrates through direction perpendicular to integrated circuit portion 30, guarantees to draw
Foot 50 does not cover integrated circuit portion 30, to reduce the interference after pin 50 is powered to disconnected area, integrated circuit portion 30；It is described
Pin 50 passes through the connecting hole 21；The interconnecting piece 40 includes the first fitting end face 401 and second is bonded end face 402, described
First fitting end face 401 is perpendicular to the second fitting end face 402；First fitting end face 401 is bonded electricity with integrated circuit portion 30
Connection, second fitting end face 402 are electrically connected with pin 50, guarantee that pin 50 is electrically connected with integrated circuit portion 30, while by
It connect in pin 50 is vertical with integrated circuit portion 30, the fixed stability of enhancing pin 50 is safe and reliable, reduces pin 50
The 21 internal diameter required precision of outer diameter and connecting hole reduces thick film hybrid pin connection structure 100 and produces precision, promotes life
Produce efficiency；The integrated circuit portion 30 includes bonding pad 31；First fitting end face 401 covers the bonding pad 31, guarantees
The pin 50 is electrically connected by preset bonding pad 31 with integrated circuit portion 30, and the thick film hybrid pin connection is enhanced
The consistency and stability of 100 product of structure；The interconnecting piece 40 includes Copper substrate 41 and welding layer 42, and pin 50 is copper
At to guarantee that interconnecting piece 40 is consistent with 50 thermal expansion coefficient of pin；The welding layer 42 wraps up the Copper substrate 41, the weldering
Connecing layer 42 is nickel plating/tin coating, and welding layer 42 prevents Copper substrate 41 from aoxidizing, while there is the welding layer 42 buffering welding to answer
Power protects the effect of pad.
As shown in Figure 1, Figure 2 and Figure 3, the interconnecting piece 40 is semi-circular structure, and cyclic annular reduction is made relative to interconnecting piece 40
31 area occupied of bonding pad；The substrate 20 is made of aluminium oxide/aluminium nitride, low in cost, meets thick film hybrid pin
100 insulating requirements of connection structure and intensity requirement；It is directly connected to relative to integrated circuit portion 30 and pin 50, using halfround bar slice knot
Structure reduces the expansive force between integrated circuit portion 30 and pin 50；Simultaneously in thick film hybrid pin connection structure 100 in life
In production, reduces the scolding tin tensile elongation of 30 pad of integrated circuit portion and pin 50, prevent scolding tin from being influenced thick film by stress drawing crack
100 product quality of hybrid circuit pin connection structure.
It is as shown in Figure 1, Figure 2, Figure 3 and Figure 4: a kind of thick film hybrid pin connection method 200；
S1: soldering paste is coated into the first fitting end face 401 of interconnecting piece 40, the second fitting end face 402 of interconnecting piece 40 is applied
Upper soldering paste；
S2: interconnecting piece 40 is placed in integrated circuit portion 30, pastes the first fitting end face 401 with integrated circuit portion 30
It closes, second fitting end face 402 is bonded with pin 50；
S3: the integrated circuit portion 30 for being placed with interconnecting piece 40 and pin 50 is placed on hot plate；
S4: heating hot plate, and soldering paste is heated to realize that the first fitting end face 401 is connect with integrated circuit portion 30, simultaneously
Second fitting end face 402 is connect with pin 50；
Reduction pin 50 is electrically connected with the satisfaction of integrated circuit portion 30 and relatively-stationary production requirement, reduces thick film mixing electricity
The production cost of pass feet connecting structure 100.
As shown in Figure 1, Figure 2, Figure 3 and Figure 4；The pin 50 is perpendicular to integrated circuit portion 30；First fitting end face
401 perpendicular to the second fitting end face 402；Meet pin 50 and fix and be electrically connected along the direction perpendicular to integrated circuit portion 30, ties
Structure is simple, easy to connect reliable.
As shown in Figure 1, Figure 2, Figure 3 and Figure 4；40 thermal expansion coefficient of interconnecting piece is identical as pin 50；Pin 50 is copper,
The interconnecting piece 40 also uses copper.
As shown in Figure 1, Figure 2, Figure 3 and Figure 4；It is described first fitting end face 401 and integrated circuit portion 30 by reflow welding/return
Fluid welding connection, second fitting end face 402 are connect with pin 50 by reflow welding/Reflow Soldering；Connection structure is reliable and stable, raw
It produces at low cost.
The above are preferred embodiments of the present invention, is not intended to limit the scope of the invention.It should approve, this field skill
Art personnel made non-creative change and modification after understanding technical solution of the present invention, should also belong to protection of the invention
Range.
Claims (10)
1. a kind of thick film hybrid pin connection structure, it is characterised in that: the thick film hybrid pin connection structure packet
Include substrate, integrated circuit portion, interconnecting piece and pin；
The substrate is connect with integrated circuit portion；Substrate is provided with connecting hole, connecting hole through substrate, the connecting hole perforation side
To perpendicular to integrated circuit portion；
The pin passes through the connecting hole；
The interconnecting piece includes the first fitting end face and the second fitting end face, and the first fitting end face is perpendicular to the second fitting end
Face；The first fitting end face is electrically connected with the fitting of integrated circuit portion, and second fitting end face is electrically connected with the pin and is.
2. thick film hybrid pin connection structure according to claim 1, it is characterised in that: the integrated circuit portion packet
Include bonding pad；
First fitting end face covers the bonding pad.
3. thick film hybrid pin connection structure according to claim 1, it is characterised in that: the interconnecting piece includes copper
Matrix and welding layer；The welding layer wraps up the Copper substrate.
4. thick film hybrid pin connection structure according to claim 3, it is characterised in that: the welding layer is plating
Nickel/tin coating.
5. thick film hybrid pin connection structure according to claim 1, it is characterised in that: the interconnecting piece is semicircle
Structure.
6. thick film hybrid pin connection structure according to claim 1, it is characterised in that:
The substrate is made of aluminium oxide/aluminium nitride.
7. a kind of thick film hybrid pin connection method, it is characterised in that:
S1: coating soldering paste for the first fitting end face of interconnecting piece, and soldering paste is coated in the second fitting end face of interconnecting piece；
S2: interconnecting piece is placed in integrated circuit portion, is bonded the first fitting end face with integrated circuit portion, second fitting
End face is bonded with pin；
S3: the integrated circuit portion for being placed with interconnecting piece and pin is placed on hot plate；
S4: heating hot plate, and soldering paste is heated to realize that the first fitting end face is connect with integrated circuit portion, while the second fitting end
Face is connect with pin.
8. thick film hybrid pin connection method according to claim 7, it is characterised in that: the pin is perpendicular to collection
At circuit portion；The first fitting end face is perpendicular to the second fitting end face.
9. thick film hybrid pin connection method according to claim 7, it is characterised in that: the interconnecting piece thermal expansion
Coefficient is identical as pin.
10. thick film hybrid pin connection method according to claim 7, it is characterised in that: first fitting end
Face is connect with integrated circuit portion by reflow welding/Reflow Soldering, and the second fitting end face and pin are connected by reflow welding/Reflow Soldering
It connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810088689.6A CN110098172A (en) | 2018-01-30 | 2018-01-30 | A kind of thick film hybrid pin connection structure and connection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810088689.6A CN110098172A (en) | 2018-01-30 | 2018-01-30 | A kind of thick film hybrid pin connection structure and connection method |
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| Publication Number | Publication Date |
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| CN110098172A true CN110098172A (en) | 2019-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810088689.6A Pending CN110098172A (en) | 2018-01-30 | 2018-01-30 | A kind of thick film hybrid pin connection structure and connection method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01278051A (en) * | 1988-04-30 | 1989-11-08 | Mitsubishi Mining & Cement Co Ltd | Package structure |
| JPH0738255A (en) * | 1993-07-22 | 1995-02-07 | Nippondenso Co Ltd | Connection method of thick film substrate with terminal |
| JP2006294828A (en) * | 2005-04-11 | 2006-10-26 | Nec Corp | Electronic component and its mounting structure |
| CN105261571A (en) * | 2015-09-21 | 2016-01-20 | 北京新雷能科技股份有限公司 | Hybrid integrated circuit (HIC) package pin and substrate connection device and manufacturing method thereof |
| CN208570596U (en) * | 2018-01-30 | 2019-03-01 | 深圳市振华微电子有限公司 | A kind of thick film hybrid pin connection structure |
-
2018
- 2018-01-30 CN CN201810088689.6A patent/CN110098172A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01278051A (en) * | 1988-04-30 | 1989-11-08 | Mitsubishi Mining & Cement Co Ltd | Package structure |
| JPH0738255A (en) * | 1993-07-22 | 1995-02-07 | Nippondenso Co Ltd | Connection method of thick film substrate with terminal |
| JP2006294828A (en) * | 2005-04-11 | 2006-10-26 | Nec Corp | Electronic component and its mounting structure |
| CN105261571A (en) * | 2015-09-21 | 2016-01-20 | 北京新雷能科技股份有限公司 | Hybrid integrated circuit (HIC) package pin and substrate connection device and manufacturing method thereof |
| CN208570596U (en) * | 2018-01-30 | 2019-03-01 | 深圳市振华微电子有限公司 | A kind of thick film hybrid pin connection structure |
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