CN105227155A - Filter - Google Patents
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- CN105227155A CN105227155A CN201510670339.7A CN201510670339A CN105227155A CN 105227155 A CN105227155 A CN 105227155A CN 201510670339 A CN201510670339 A CN 201510670339A CN 105227155 A CN105227155 A CN 105227155A
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- filter according
- electric capacity
- inner wire
- filter
- packaging protection
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Abstract
The present invention relates to a kind of filter; the pin comprising packaging protection body, be located at the inner wire in described packaging protection body and be electrically connected with described inner wire; described inner wire comprises electric capacity, and described electric capacity adopts pcb board modular construction, and it is external that described pin extends out to described packaging protection.Reliability of the present invention is high.
Description
Technical field
The present invention relates to electronic component, particularly relate to a kind of filter.
Background technology
The filter circuit that filter is made up of electric capacity and inductance or magnetic bead.Filter can interference signal effectively on filter out power line, stops the interference signal of the particular frequency range on power line to be transmitted, thus solves electromagnetic compatibility problem.The encapsulating structure of filter has a certain impact to its characteristic tool.
But traditional filter often causes capacitance short-circuit to lose efficacy because of mechanical stress and thermal stress in encapsulation process, and reliability is low.
Summary of the invention
Based on this, be necessary the filter providing a kind of reliability high.
A kind of filter; the pin comprising packaging protection body, be located at the inner wire in described packaging protection body and be electrically connected with described inner wire; described inner wire comprises electric capacity, and described electric capacity adopts pcb board modular construction, and it is external that described pin extends out to described packaging protection.
Above-mentioned filter, described electric capacity have employed pcb board modular construction, by utilizing pcb board modular construction power to protect described electric capacity, improving the ability to bear of described electric capacity to mechanical stress and thermal stress, preventing capacitance short-circuit to lose efficacy, improving the reliability of filter.
Wherein in an embodiment, described inner wire also comprises magnetic bead or inductance, and described pcb board modular construction is fixed on the centre of described magnetic bead or inductance, and is bonded into one by packaging plastic with described magnetic bead or inductance.Achieve the integral structure of filter, prevent mechanical stress to the damage of described electric capacity.
Wherein in an embodiment, the coated whole described inner wire of described packaging protection body.Both protect inner wire, and prevent again inner wire to loosen.
Wherein in an embodiment, described packaging plastic is G500 glue.G500 glue has electrical insulating property, moisture-proof, resistance to sudden heating, thermal endurance, low-corrosiveness.
Wherein in an embodiment, described electric capacity is chip ceramic capacitor.
Wherein in an embodiment, described electric capacity adopts the mode of Reflow Soldering to weld.Avoid manual welding to cause damage to chip ceramic capacitor, thus improve the reliability of filter.
Wherein in an embodiment, described packaging protection body is thermosetting epoxy resin.
Wherein in an embodiment, the number of described pin is three.
Wherein in an embodiment, described three pins extend out from the same side of described packaging protection body.Be convenient to welding.
Wherein in an embodiment, described three pins are respectively as signal input part, signal output part and earth terminal.
Accompanying drawing explanation
Fig. 1 is the internal structure schematic diagram of an embodiment median filter;
Fig. 2 is the contour structures front elevation of median filter embodiment illustrated in fig. 1;
Fig. 3 is the contour structures side view of median filter embodiment illustrated in fig. 1.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Please refer to Fig. 1, is the internal structure schematic diagram of an embodiment median filter.In addition, ask composition graphs 2 and Fig. 3 simultaneously, be respectively contour structures front elevation and the side view of median filter embodiment illustrated in fig. 1.
Three pins (132,134,136) that this filter comprises packaging protection body 110, is located at the inner wire 120 in packaging protection body 110 and is electrically connected with inner wire 120.
In the present embodiment, packaging protection body 110 is thermosetting epoxy resin, and in cuboid after packaging protection body 110 is shaping, and four of this cuboid face end drift angles are fillet, specifically as shown in 2 and Fig. 3.
Be appreciated that in other embodiments, the profile of packaging protection body 110 can become cylindric, square tube type etc.Packaging protection body 110 also can be other materials.
Inner wire 120 comprises electric capacity 122 and magnetic bead 124.Electric capacity 122 adopts pcb board modular construction, is welded on pcb board 126 by electric capacity 122, and electric capacity 122 is welded by the mode of Reflow Soldering.By reflow soldering process, electric capacity is welded, manual welding can be avoided to cause damage to electric capacity, thus improve the reliability of product.
Further, described pcb board modular construction is fixed on the centre of magnetic bead 124, and with magnetic bead 124 by encapsulating gluing 128 integrators to realize the integral structure of filter.Like this, under the prerequisite meeting filter electrical property, utilize pcb board modular construction to try hard to keep and protect electric capacity 122; avoid electric capacity 122 to cause damage because being subject to mechanical stress and thermal stress, thus improve filter anti-vibration, impact resistance; prevent electric capacity 122 short-circuit failure, improve the reliability of filter.
In one embodiment, electric capacity is chip ceramic capacitor.
In one embodiment, magnetic bead 124 can be replaced with the inductance comprising coil and magnetic core.Like this, described pcb board modular construction is then fixed in the middle of the magnetic core of described inductance, and electric capacity 122 and described magnetic core are bonded into one by packaging plastic 128.
In one embodiment, packaging plastic 128 is G500 glue.
G500 glue is applied in electronic apparatus, has electrical insulating property, moisture-proof, resistance to sudden heating, thermal endurance, low-corrosiveness.
Three pins (132,134,136) extend out to outside packaging protection body 100.In one embodiment, three pins (132,134,136) extend out from the same side of packaging protection body 110.Be appreciated that in other embodiments, three pins (132,134,136) can also be distributed in the not coplanar of packaging protection body.
Particularly, three pins (132,134,136) are respectively as signal input part, earth terminal and signal output part.
In addition, the coated whole inner wire 120 of packaging protection body 110, and the blank space between electric capacity 122 and magnetic bead 124 is also filled with packaging protection body 110.
Above-mentioned filter, described electric capacity have employed pcb board modular construction, by utilizing pcb board modular construction power to protect described electric capacity, improving the ability to bear of described electric capacity to mechanical stress and thermal stress, preventing capacitance short-circuit to lose efficacy, improving the reliability of filter.
Above-mentioned filter meets the test requirements document of GJB1518-92 and GJB360B, the requirement of filter anti-vibration, impact resistance can be realized, can reach military requirements, this filter may be used on all needs in the product of power-supply filter, thus effectively expands its scope of application.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a filter; the pin that it is characterized in that, comprise packaging protection body, be located at the inner wire in described packaging protection body and be electrically connected with described inner wire, described inner wire comprises electric capacity; described electric capacity adopts pcb board modular construction, and it is external that described pin extends out to described packaging protection.
2. filter according to claim 1, is characterized in that, described inner wire also comprises magnetic bead or inductance, and described pcb board modular construction is fixed on the centre of described magnetic bead or inductance, and is bonded into one by packaging plastic with described magnetic bead or inductance.
3. filter according to claim 1, is characterized in that, the coated whole described inner wire of described packaging protection body.
4. filter according to claim 2, is characterized in that, described packaging plastic is G500 glue.
5. filter according to claim 1, is characterized in that, described electric capacity is chip ceramic capacitor.
6. filter according to claim 1, is characterized in that, described electric capacity adopts the mode of Reflow Soldering to weld.
7. filter according to claim 1, is characterized in that, described packaging protection body is thermosetting epoxy resin.
8. filter according to claim 1, is characterized in that, the number of described pin is three.
9. filter according to claim 8, is characterized in that, described three pins extend out from the same side of described packaging protection body.
10. filter according to claim 8, is characterized in that, described three pins are respectively as signal input part, signal output part and earth terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510670339.7A CN105227155A (en) | 2015-10-15 | 2015-10-15 | Filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510670339.7A CN105227155A (en) | 2015-10-15 | 2015-10-15 | Filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105227155A true CN105227155A (en) | 2016-01-06 |
Family
ID=54995902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510670339.7A Pending CN105227155A (en) | 2015-10-15 | 2015-10-15 | Filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105227155A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093992A (en) * | 2017-05-23 | 2017-08-25 | 深圳振华富电子有限公司 | Wave filter |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4021760A (en) * | 1976-01-19 | 1977-05-03 | The United States Of America As Represented By The Secretary Of The Army | EMP circuit board filter using MOV devices |
| US4622526A (en) * | 1984-09-14 | 1986-11-11 | Corcom, Inc. | Power line interference filter mounted on a PC board |
| US5034710A (en) * | 1987-07-22 | 1991-07-23 | Murata Manufacturing Co., Ltd. | LC filter device having magnetic resin encapsulating material |
| CN201541237U (en) * | 2009-08-12 | 2010-08-04 | 王晓峰 | Integrated common-mode noise filter |
| CN204206719U (en) * | 2014-10-22 | 2015-03-11 | 深圳振华富电子有限公司 | Electromagnetic interference filter |
| CN205051662U (en) * | 2015-10-15 | 2016-02-24 | 深圳振华富电子有限公司 | Filter |
-
2015
- 2015-10-15 CN CN201510670339.7A patent/CN105227155A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4021760A (en) * | 1976-01-19 | 1977-05-03 | The United States Of America As Represented By The Secretary Of The Army | EMP circuit board filter using MOV devices |
| US4622526A (en) * | 1984-09-14 | 1986-11-11 | Corcom, Inc. | Power line interference filter mounted on a PC board |
| US5034710A (en) * | 1987-07-22 | 1991-07-23 | Murata Manufacturing Co., Ltd. | LC filter device having magnetic resin encapsulating material |
| CN201541237U (en) * | 2009-08-12 | 2010-08-04 | 王晓峰 | Integrated common-mode noise filter |
| CN204206719U (en) * | 2014-10-22 | 2015-03-11 | 深圳振华富电子有限公司 | Electromagnetic interference filter |
| CN205051662U (en) * | 2015-10-15 | 2016-02-24 | 深圳振华富电子有限公司 | Filter |
Non-Patent Citations (1)
| Title |
|---|
| 沙占友 等: "《开关电源外围元器件选择与检测》", 31 January 2014, 中国电力出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093992A (en) * | 2017-05-23 | 2017-08-25 | 深圳振华富电子有限公司 | Wave filter |
| CN107093992B (en) * | 2017-05-23 | 2023-08-29 | 深圳振华富电子有限公司 | filter |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160106 |