CN107093992A - Wave filter - Google Patents
Wave filter Download PDFInfo
- Publication number
- CN107093992A CN107093992A CN201710369974.0A CN201710369974A CN107093992A CN 107093992 A CN107093992 A CN 107093992A CN 201710369974 A CN201710369974 A CN 201710369974A CN 107093992 A CN107093992 A CN 107093992A
- Authority
- CN
- China
- Prior art keywords
- pcb
- electric capacity
- shell
- wave filter
- capacitance components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0057—Constructional details comprising magnetic material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/40—Arrangements for reducing harmonics
Landscapes
- Filters And Equalizers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention relates to a kind of wave filter.A kind of wave filter includes the shell with inner chamber, located at the lead-out terminal of shell first end；PCB electric capacity, PCB electric capacity is made up of the first pcb board of double-sided copper-clad；PCB electric capacity is set in inner chamber close to shell first end, and is electrically connected with lead-out terminal；Input terminal located at shell second end relative with first end；PCB capacitance components between PCB electric capacity in shell inner cavity and the end of shell second；PCB capacitance components include the second pcb board and several electric capacity being uniformly laid in around the second pcb board center line on the second pcb board；PCB capacitance components are electrically connected with PCB electric capacity and input terminal respectively；Inductor between PCB capacitance components in shell inner cavity and the second end of shell；Inductor is electrically connected with PCB capacitance components and lead-out terminal respectively.The electric capacity of PCB electric capacity and PCB capacitance components is arranged at pcb board, it is to avoid the problem of forced vibration sends a telegraph appearance cracking, improves the antivibration kinetic force of wave filter, strengthens the reliability of wave filter.
Description
Technical field
The present invention relates to electromagnetic interference technical field, more particularly to a kind of wave filter.
Background technology
EMI FILTER, also known as " electromagnetic interface filter " are a kind of for suppression electromagnetic interference, particularly power circuit
Or in control signal lines noise electronics equipment.EMI FILTER is generally by the group of networks of passive electronic components
Into, including electric capacity and inductance composition lc circuit.Wherein, current electric capacity uses ceramic disks feedthrough capacitor, and the electric capacity mostly
The enclosure of EMI FILTER can be directly welded at, in this way, because disk feedthrough capacitor area is big, thinner thickness, easily
Appearance cracking is sent a telegraph during because of EMI FILTER forced vibration.
The content of the invention
Based on this, it is necessary to provide a kind of anti-vibration, the wave filter of the enhancing reliability of anti-impact force.
A kind of wave filter, including shell；The shell has inner chamber；Also include：Lead-out terminal, the lead-out terminal is located at
In the first end of the shell；PCB electric capacity, the PCB electric capacity is made up of the first pcb board of double-sided copper-clad；The PCB electric capacity in
The interior intracavitary is set close to the first end of the shell, and is electrically connected with the lead-out terminal；Input terminal, the input
Terminal is on second end relative with the first end of the shell；PCB capacitance components, the PCB capacitance components are located at
Between PCB electric capacity described in the shell inner cavity and the second end of the shell；The PCB capacitance components include the second pcb board
And uniformly it is laid in several electric capacity on second pcb board around the center line of second pcb board；The PCB electric capacity
Component is electrically connected with the PCB electric capacity and the input terminal respectively.；Inductor, the inductor is located at the shell
Between PCB capacitance components described in inner chamber and the second end of the shell；The inductor respectively with the PCB capacitance components and
The lead-out terminal is electrically connected with.
In one of the embodiments, in addition to magnetic bead；The magnetic bead includes the first magnetic bead and the second magnetic bead；Described first
Magnetic bead is connected between the lead-out terminal and the PCB electric capacity, and electrical with the lead-out terminal and the PCB electric capacity respectively
Connection；Second magnetic bead is connected between the PCB electric capacity and the PCB capacitance components, and respectively with the PCB electric capacity and
The PCB capacitance components are electrically connected with.
In one of the embodiments, the magnetic bead is column type magnetic bead.
In one of the embodiments, first pcb board is multi-layer PCB board.
In one of the embodiments, in addition to back-up ring；The back-up ring is located at the shell inner cavity；The back-up ring is used for solid
The device of the fixed shell inner cavity.
In one of the embodiments, in addition to back-up ring anti-drop structure；The back-up ring anti-drop structure is used for anti-backstop
Circle comes off.
In one of the embodiments, the input terminal is provided with external screw thread, the second end of the shell and is provided with and institute
State the internal thread of external screw thread cooperation.
In one of the embodiments, in addition to embedding is in the fluid sealant of the shell inner cavity.
In one of the embodiments, through hole is provided with the PCB electric capacity and the PCB capacitance components, it is described close
Sealing is distributed in the inner chamber through the through hole.
In one of the embodiments, the wave filter described in any of the above-described embodiment is tubulose wave filter.
In above-mentioned wave filter, PCB electric capacity and PCB capacitance components, electric capacity is arranged on pcb board, relative to traditional
Electric capacity is directly welded at the mode of enclosure, can avoid sending a telegraph during because of EMI FILTER forced vibration and hold asking for cracking
Topic.This improves the antivibration kinetic force of wave filter, strengthen the reliability of wave filter.
Brief description of the drawings
Fig. 1 be an embodiment in wave filter internal structure schematic diagram；
Fig. 2 be an embodiment in wave filter front projection schematic diagram；
Fig. 3 is the front projection schematic diagram of the A terminals (B terminals) of wave filter shown in Fig. 2；
Fig. 4 be an embodiment in PCB electric capacity front appearance structure chart；
Fig. 5 is the reverse side appearance assumption diagram of PCB electric capacity shown in Fig. 4；
Fig. 6 is that the profile before electric capacity is placed on the pcb board of PCB capacitance components in an embodiment；
Fig. 7 is that the profile after electric capacity is placed on the pcb board of the PCB capacitance components shown in Fig. 6；
Fig. 8 be an embodiment in PCB capacitance components appearance assumption diagram.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
A kind of wave filter, for suppression electromagnetic interference in electronic circuit.As shown in figure 1, the wave filter 10 includes shell
100th, A terminals 600, B terminals 700, PCB electric capacity 200, PCB capacitance components 300, inductor 400 and magnetic bead 500.Shell 100
With an inner chamber 101.A terminals 600 are in the first end of shell 100.B terminals 700 are located at shell 100 relative to first end
The second end on.A terminals 600 as wave filter 10 lead-out terminal.B terminals 700 as wave filter 10 input terminal.A ends
The structure of 600 and B of son terminals 700 is referring to shown in Fig. 2 and Fig. 3.In the present embodiment, wave filter 10 is tubulose wave filter.
PCB electric capacity 200 is electrically connected with the first end of inner chamber 101 with A terminals 600.PCB electric capacity 200 is by two-sided
The first pcb board for covering copper is constituted.First pcb board is multi-layer PCB board.In the present embodiment, the first pcb board uses doubling plate.PCB
The positive and negative structure of electric capacity 200 is as shown in Figure 4 and Figure 5.
Inductor 400 is located on the second end relative to first end in inner chamber 101, and is electrically connected with B terminals 700.
In the present embodiment, wave filter 10 is also coated on the high tempreture tape 401 outside inductor 400.
PCB capacitance components 300 are located between PCB electric capacity 200 and inductor 400.PCB capacitance components 300 include the 2nd PCB
Plate and center line around the second pcb board are uniformly laid in several electric capacity on the second pcb board.PCB capacitance components 300 are distinguished
It is electrically connected with PCB electric capacity 200 and inductor 400.In the present embodiment, the electric capacity on the second pcb board is sheet capacitor.Piece
Formula electric capacity has that capacity is big, small volume, easy chip type.Electric capacity on second pcb board is four.Four electric capacity surround second
The center line of pcb board is uniformly laid on the second pcb board.The internal structure of PCB capacitance components 300 is as shown in Figure 6 and Figure 7.Fig. 6
The cut-away view before electric capacity is not placed for PCB capacitance components 300.C1, C2, C3 and C4 represent to be used to place electric capacity in figure
Position.Fig. 7 is the cut-away view after the placement electric capacity of PCB capacitance components 300.The capacity cell back of the body of PCB capacitance components 300
Face is as shown in Figure 8.
Magnetic bead 500 is in the first end of inner chamber 101.Magnetic bead 500 includes the first magnetic bead 501 and the second magnetic bead 503.First
Magnetic bead 501 is connected between A terminals 600 and PCB electric capacity 200.First magnetic bead 501 respectively with defeated A terminals 600 and PCB electric capacity 200
It is electrically connected with.Second magnetic bead 503 is connected between PCB electric capacity 200 and PCB capacitance components 300.Second magnetic bead 503 respectively with PCB
Electric capacity 200 and PCB capacitance components 300 are electrically connected with.Magnetic bead 500 is used to suppress signal wire, high-frequency noise and point on power line
Peak is disturbed, and with the ability for absorbing electrostatic pulse.Magnetic bead 500 has very high resistivity and magnetic conductivity, and it is equivalent to resistance
Connected with inductance, but resistance value and inductance value all change with frequency.Magnetic bead 500 has more preferable High frequency filter special than common inductance
Property, it is presented resistive in high frequency, therefore higher impedance can be kept in comparatively wide frequency range, so as to improve frequency modulation filtering
Effect.In the present embodiment, magnetic bead 500 is column type magnetic bead.
The first end of A terminals 600 is connected through the first magnetic bead 501 and with PCB electric capacity 200.Relative to the of A terminals 600
Second end of one end exposes to the outside of the first end of shell 100.In the present embodiment, the structure of A terminals 600 also has and prevented
Its own rotation on shell 100, or prevent the function that is drawn out.The first end of B terminals 700 is interted into shell 100
Second end is simultaneously connected with inductor 400.The second end relative to the first ends of B terminals 700 exposes to the second end of shell 100
It is outside.In the present embodiment, the structure of B terminals 700, which also has, prevents its own rotation on shell 100, or prevent by
The function of pull-out.Specifically, B terminals 700 are flat-shaped terminal.Flat-shaped terminal can prevent the rotation of terminal.
The first end of B terminals 700 is provided with to be provided with external screw thread, the second end of shell 100 and matched with the external screw thread of B terminals 700
Internal thread 703.Internal thread 703 is threadedly coupled with the first end formation for being used to be connected with inductor 400 in B terminals 700, with solid
Determine B terminals 700.In other embodiments, A terminals 600 can be also provided with external screw thread (not shown), the first end of shell 100
The internal thread (not shown) matched with the external screw thread of A terminals 600 can be provided with.The external screw thread of A terminals and the first end of shell 100
Female thread into threaded connection, to improve the positioning stationarity of A terminals 600.
In above-mentioned wave filter 10, PCB electric capacity 200 and PCB capacitance components 300, electric capacity is arranged at the upper of pcb board, phase
The mode of enclosure is directly welded at for traditional electric capacity, can avoid sending a telegraph during because of wave filter forced vibration and hold asking for cracking
Topic.This improves the antivibration kinetic force of wave filter, strengthen the reliability of wave filter.Meanwhile, using PCB electric capacity 200 and PCB
Capacitance component 300 replaces ceramic feedthrough capacitor, wave filter is reached from the insertion loss index of 10KHz -1GHz frequency ranges
Use the level of ceramic feedthrough capacitor.
In the present embodiment, wave filter 10 also includes back-up ring 800 and back-up ring anti-drop structure 801.Back-up ring is by shell 100
First end closure, to fix the device of inner chamber 101.Back-up ring anti-drop structure 801 comes off for anti-Sealing shield ring 800.
In the present embodiment, wave filter 10 also includes embedding in the fluid sealant 900 of the inner chamber 101 of shell 100.Specifically,
Using multiple vacuum encapsulation technology to electrical filter embedding fluid sealant 900, to ensure the sealing of wave filter 10 and ensure filtering
Without steam bubble inside device 10.Meanwhile, also make wave filter 10 at low pressure being capable of normal work.Fluid sealant 900 includes A/B glue
901 and G500 glue 903.The position that the first end of the embedding B terminals 700 of G500 glue 903 is contacted with internal thread, back-up ring anti-drop structure
801 are formed by the embedding of G500 glue 903.In the embedding inner chamber 101 of A/B glue 901 except the embedding of G500 glue 903 part other portions
Point.It is provided with through hole (not shown) on PCB electric capacity 200 and PCB capacitance components 300, fluid sealant 900 is through through hole to realize pair
The embedding of PCB electric capacity 200 and PCB capacitance components 300.In the present embodiment, using A/B glue 901 respectively to the He of PCB electric capacity 200
PCB capacitance components 300 carry out integral embedding, during so that proper wave filter is by extraneous stress, PCB electric capacity 200 and PCB capacitance groups
Part 300 is not contacted with shell 100, and extraneous stress is born by pcb board first, therefore reaches the purpose of protection electric capacity.
Above-mentioned wave filter, formation PCB electric capacity on pcb board is integrated in using pcb board Design PCB electric capacity 200, and by electric capacity
Component 300, PCB electric capacity 200 and PCB capacitance components 300 have through hole, are easy to implement the integral embedding of A/B glue 901.PCB electric capacity
200 and PCB capacitance components 300 load shell and realize after overall embedding that sheet capacitor is wrapped up by A/B glue 901 completely, not with pipe
Shell is contacted.The stress of the generations such as Wen Chong, random vibration, dither, low-frequency vibration, impact is born by pcb board first, so as to reach
To the purpose of protection electric capacity.This improves the antivibration kinetic force of wave filter 10, strengthen the reliability of wave filter 10.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of wave filter, including shell；The shell has inner chamber；Characterized in that, also including：
Lead-out terminal, the lead-out terminal is in the first end of the shell；
PCB electric capacity, the PCB electric capacity is made up of the first pcb board of double-sided copper-clad；The PCB electric capacity is close in the interior intracavitary
The first end of the shell is set, and is electrically connected with the lead-out terminal；
Input terminal, the input terminal is on second end relative with the first end of the shell；
PCB capacitance components, the PCB capacitance components are located at the second of PCB electric capacity described in the shell inner cavity and the shell
Between end；The PCB capacitance components are uniformly laid in described including the second pcb board and the center line around second pcb board
Several electric capacity on second pcb board；The PCB capacitance components are electrical with the PCB electric capacity and the input terminal respectively
Connection；
Inductor, the inductor is located at described in the shell inner cavity between PCB capacitance components and the second end of the shell；
The inductor is electrically connected with the PCB capacitance components and the lead-out terminal respectively.
2. wave filter according to claim 1, it is characterised in that also including magnetic bead；The magnetic bead include the first magnetic bead and
Second magnetic bead；First magnetic bead is connected between the lead-out terminal and the PCB electric capacity, and respectively with the lead-out terminal
It is electrically connected with the PCB electric capacity；Second magnetic bead is connected between the PCB electric capacity and the PCB capacitance components, and point
It is not electrically connected with the PCB electric capacity and the PCB capacitance components.
3. wave filter according to claim 2, it is characterised in that the magnetic bead is column type magnetic bead.
4. wave filter according to claim 1, it is characterised in that first pcb board is multi-layer PCB board.
5. wave filter according to claim 1, it is characterised in that also including back-up ring；The back-up ring is in the shell
Chamber；The back-up ring is used for the device for fixing the shell inner cavity.
6. wave filter according to claim 5, it is characterised in that also including back-up ring anti-drop structure；The back-up ring anticreep
Fall structure to come off for anti-Sealing shield ring.
7. wave filter according to claim 1, it is characterised in that the input terminal is provided with external screw thread, the shell
The internal thread coordinated with the external screw thread is provided with second end.
8. wave filter according to claim 1, it is characterised in that also including embedding in the fluid sealant of the shell inner cavity.
9. wave filter according to claim 8, it is characterised in that be all provided with the PCB electric capacity and the PCB capacitance components
Through hole is equipped with, the fluid sealant is distributed in the inner chamber through the through hole.
10. the wave filter according to claim any one of 1-9, the wave filter is tubulose wave filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710369974.0A CN107093992B (en) | 2017-05-23 | 2017-05-23 | filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710369974.0A CN107093992B (en) | 2017-05-23 | 2017-05-23 | filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107093992A true CN107093992A (en) | 2017-08-25 |
| CN107093992B CN107093992B (en) | 2023-08-29 |
Family
ID=59639740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710369974.0A Active CN107093992B (en) | 2017-05-23 | 2017-05-23 | filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107093992B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109935947A (en) * | 2019-03-14 | 2019-06-25 | 深圳振华富电子有限公司 | Tubulose filter |
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| US5801597A (en) * | 1997-02-05 | 1998-09-01 | Lucent Technologies Inc. | Printed-circuit board-mountable ferrite EMI filter |
| US20030206081A1 (en) * | 1998-02-24 | 2003-11-06 | Wems, Inc. | Electromagnetic interference filter |
| US20040233015A1 (en) * | 2003-05-20 | 2004-11-25 | Ming-Chih Tsai | Electromagnetic interference filter |
| US20080176751A1 (en) * | 2007-01-18 | 2008-07-24 | Tcaciuc Alexander M | Systems, methods, and apparatus for electrical filters |
| CN101510650A (en) * | 2009-03-20 | 2009-08-19 | 贵州航天电器股份有限公司 | Socket capable of resisting electromagnetic interference and electromagnetic impulse |
| CN201629721U (en) * | 2010-03-12 | 2010-11-10 | 王晓峰 | Integrated XY capacitive noise filter |
| CN103780216A (en) * | 2014-01-24 | 2014-05-07 | 南京航空航天大学 | Whole-plane EMI filter integrated structure composed of round-plane PCB coupling inductors |
| CN104022749A (en) * | 2013-02-28 | 2014-09-03 | 深圳振华富电子有限公司 | Laminated type EMI filter |
| CN105227155A (en) * | 2015-10-15 | 2016-01-06 | 深圳振华富电子有限公司 | Filter |
| CN105592674A (en) * | 2014-10-21 | 2016-05-18 | 深圳振华富电子有限公司 | Electromagnetic interference filter |
| CN105592675A (en) * | 2014-10-22 | 2016-05-18 | 深圳振华富电子有限公司 | Electromagnetic interference filter |
| CN105990628A (en) * | 2015-02-09 | 2016-10-05 | 深圳振华富电子有限公司 | Tubular filter |
| CN207070023U (en) * | 2017-05-23 | 2018-03-02 | 深圳振华富电子有限公司 | Wave filter |
-
2017
- 2017-05-23 CN CN201710369974.0A patent/CN107093992B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5801597A (en) * | 1997-02-05 | 1998-09-01 | Lucent Technologies Inc. | Printed-circuit board-mountable ferrite EMI filter |
| US20030206081A1 (en) * | 1998-02-24 | 2003-11-06 | Wems, Inc. | Electromagnetic interference filter |
| US20040233015A1 (en) * | 2003-05-20 | 2004-11-25 | Ming-Chih Tsai | Electromagnetic interference filter |
| US20080176751A1 (en) * | 2007-01-18 | 2008-07-24 | Tcaciuc Alexander M | Systems, methods, and apparatus for electrical filters |
| CN101510650A (en) * | 2009-03-20 | 2009-08-19 | 贵州航天电器股份有限公司 | Socket capable of resisting electromagnetic interference and electromagnetic impulse |
| CN201629721U (en) * | 2010-03-12 | 2010-11-10 | 王晓峰 | Integrated XY capacitive noise filter |
| CN104022749A (en) * | 2013-02-28 | 2014-09-03 | 深圳振华富电子有限公司 | Laminated type EMI filter |
| CN103780216A (en) * | 2014-01-24 | 2014-05-07 | 南京航空航天大学 | Whole-plane EMI filter integrated structure composed of round-plane PCB coupling inductors |
| CN105592674A (en) * | 2014-10-21 | 2016-05-18 | 深圳振华富电子有限公司 | Electromagnetic interference filter |
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| CN207070023U (en) * | 2017-05-23 | 2018-03-02 | 深圳振华富电子有限公司 | Wave filter |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109935947A (en) * | 2019-03-14 | 2019-06-25 | 深圳振华富电子有限公司 | Tubulose filter |
| WO2020034640A1 (en) * | 2019-03-14 | 2020-02-20 | 深圳振华富电子有限公司 | Tubular filter |
| CN109935947B (en) * | 2019-03-14 | 2023-11-10 | 深圳振华富电子有限公司 | Tubular filter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107093992B (en) | 2023-08-29 |
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