CN105210457B - The circuit board folded including at least one - Google Patents
The circuit board folded including at least one Download PDFInfo
- Publication number
- CN105210457B CN105210457B CN201480024976.0A CN201480024976A CN105210457B CN 105210457 B CN105210457 B CN 105210457B CN 201480024976 A CN201480024976 A CN 201480024976A CN 105210457 B CN105210457 B CN 105210457B
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- Prior art keywords
- substrate
- circuit board
- board according
- folding
- light source
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- 239000000758 substrate Substances 0.000 claims abstract description 178
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000000465 moulding Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000003550 marker Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0058—Reflectors for light sources adapted to cooperate with light sources of shapes different from point-like or linear, e.g. circular light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/048—Optical design with facets structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/10—Construction
- F21V7/18—Construction with provision for folding or collapsing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
Abstract
A kind of method that the circuit board (10) for carrying at least one light source (16) of lighting apparatus and this circuit board of manufacture are provided.The circuit board includes substrate (1), wherein the substrate includes at least one folding (9) to form protrusion and extend to the interior section (2) of substrate from the periphery of substrate (3), so that the substrate has polygon funnel shaped.The concept folded to substrate is utilized to obtain the polygon funnel shaped of circuit board in the aspect proposed, therefore allows to carry out substrate material of the moulding without removing substrate.
Description
Technical field
The present invention relates generally to the fields of the circuit board of at least one light source for carrying lighting apparatus.
Background technique
Traditional generally includes the light source for being coupled to circuit board based on solid lighting apparatus, for supporting as desired
And the support construction of directional circuit plate and light source, for reflecting the reflector of light launched by light source and for by light source
The radiator that the heat of generation dissipates.Advantageous is that two or more component set of lighting apparatus are become single group
Part, to reduce the number of component in lighting apparatus, help to manufacture and reduce cost.JP2011040510 shows tool
There is the lighting apparatus for the circuit board for being equipped with light emitting diode (LED).Circuit board include reflecting surface and have rectangular shape,
Wherein two relatively long lateral bends of circuit board are to reflect light emitted by the LED.Further, circuit board include for conduct by
The metal for the heat that LED is generated.The defect of circuit board shown by JP2011040510 is the configuration of the bending part of circuit board
Only allow the linearity configuration (or channel form shape) of circuit board.
Summary of the invention
Will obtain a kind of circuit board, overcome or at least mitigate above-mentioned defect.Particularly, it wishes
What is hoped is at least one light source for allowing the circuit board of other shapes to be used to carry lighting apparatus.
In order to better solve one or more of these focus, provide a kind of in the independent claim
The circuit board of the feature of restriction and method for manufacturing circuit board.Preferred implementation is defined in the dependent claims
Example.
Therefore, according in a first aspect, providing a kind of for carrying the circuit board of at least one light source of lighting apparatus.Circuit
Plate includes substrate, wherein the substrate includes that at least one forms protrusion and extends to substrate from the periphery of substrate
Interior section folding, thus the substrate have polygon funnel shaped.
According to second aspect, a kind of side manufactured for carrying the circuit board of at least one light source of lighting apparatus is provided
Method.Method includes providing substrate and carrying out the substrate to fold to be formed at least one to form protrusion and from base
The periphery at bottom extends to the folding of the interior section of substrate, so that the substrate obtains polygon funnel shaped.
For various reasons, it may wish to polygon funnel shaped (or the substantially bowl of the substrate of circuit board
Shape or funnelform shape).For example, it may be possible to can wish to support with the polygon funnel shaped for light source (or multiple light sources)
Structure and/or the polygon funnel shaped reflecting surface at circuit board for reflecting the light from light source.Current
Aspect obtains the polygon funnel shaped of circuit board using the concept of foldable substrate.From the periphery of substrate until (still
Do not pass through) extension (it is also referred to as fold) of the folding of the interior section of substrate may by substrate initially substantially
The shape of plane becomes polygon funnel shaped.Current aspect allows to carry out substrate material of the moulding without removing substrate
Material.Therefore, the polygon funnel shaped of substrate can pass through the notch at the non-ablated a piece of substrate of folding and linker bottom
Edge obtains.Therefore, material loss can be reduced.
In the present specification, term " polygon funnel shaped " will be widely interpreted and may include any polygon
Funnel shaped, such as any (at least partly) parabola, funnel, cup, pyramid or conical by its shape and these shapes
Polygon morphing.Further, the interior section of substrate can be any part for the substrate being mutually separated with the periphery of substrate.It is preferred that
Ground, the interior section of substrate can be reached up to from the part of the periphery of substrate by folding, but not pass through interior section always
To the opposite segments of the periphery of substrate.
The folding can be prominent from the non-collapsible part of substrate, such as prominent from the outside of polygon funnel shaped, can
Facilitate the dissipation of heat from substrate.Dissipation of heat fin can be used for example as by folding the protrusion formed.
According to one embodiment, which includes the two of at least one fold line and the substrate positioned at the opposite side of fold line
A part.The fold line can extend to the interior section of substrate from the periphery of substrate as a result,.For example, two of substrate
Part can interconnect at fold line.Fold line can form (outside) edge (or ridge) of folding.Further, (it is located at and folds
The opposite side of line) substrate two parts between angle may be embodied within 0 ° to 90 ° of interval, preferably arrived at 0 °
Within 45 ° of interval, and preferably in 0 ° to 10 ° of interval.Angle between two parts of substrate is smaller, base
The polygon funnel shaped at bottom is deeper (or being more obvious).In one embodiment, two parts can at least partly each other
Adjacent, thus adjoiner of the angle between the two parts at least two parts may be about 0.
According to one embodiment, folding includes at least two foldings extended from the burble point of the periphery of substrate towards common ground
Superimposing thread.Therefore, folding can foldable substrate be formed and the fold line extended along at least two towards identical point.It should
What is understood is that common ground can be point in the imagination, and is therefore not necessarily the point of substrate, this for example can be in substrate
A piece of the case where (or being not present) is removed at the position of common ground.In addition, two parts of the substrate described before
The opposite side in one of fold line can be located at, and another in fold line can be by one in two parts from substrate
Adjacent unfolded part mark off come.If folding includes not more than two fold lines, in two parts of substrate
Transition between another (not by the two only by a division in fold line) and the adjacent unfolded part of substrate
It may not include any fold line.Therefore, the interface (or at limitation) between the base part adjacent with folding is being folded
Substrate can be straight (or plane).Optionally, it folds and may include further fold line (that is, from the periphery of substrate
Three fold lines altogether extended at burble point towards common ground), it can be by another in two parts from the phase of substrate
Adjacent unfolded part, which marks off, to be come.Alternatively, folding may include not more than one fold line, and fold and with folding
Fold the interface between the part of adjacent substrate can be curve rather than including fold line.
In one embodiment, the depth of folding increases on direction of the interior section from substrate towards based periphery
Add.In the present specification, the depth of folding be from the edge (or ridge) (for example, outmost fold line) of folding arrive with folding phase
The distance of the unfolded part of adjacent substrate.The depth of increased folding on the direction towards based periphery helps to obtain
Obtain the polygon funnel shaped of substrate.In addition, fold width may substrate interior section towards based periphery side
Increase upwards.In this context, the width of folding be between two parts of the substrate of the opposite side of fold line away from
From wherein folding is docked with the unfolded part of adjacent substrate.
According to one embodiment, substrate has polygonal shape, and at least one folding can be from polygonal shape
Corner extends and up to the interior section of substrate.Therefore, substrate can have the periphery (or perimeter) of polygon.
According to one embodiment, at least one folds inwardly projecting with polygon funnel shaped.Alternatively, at least one
Folding can be protruded outward for example on the outside of polygon funnel shaped.It, can in the case where providing two or more foldings
To provide both inside and/or outwardly projecting parts.
According to one embodiment, folding is arranged to the heat generated by least one light source that dissipates, and which increase light sources
Service life.Folding can be used for example as carrying out the fin of the dissipation of heat to substrate and form (at least partly) radiator of lighting apparatus.
Radiator and circuit board can integrate in identical component as a result, to reduce the number of the component of lighting apparatus, help
In manufacture.In one embodiment, substrate may include the material with the thermal conductivity for being at least 1W/ (mK), such as metal,
Enhance the dissipation of heat from light source.Substrate may include any material with relatively high thermal conductivity, such as any metal (example
Such as aluminium or copper) or heat transfer polymer.Using can be by with biggish substrate thickness with the material compared with lower thermal conductivity
To compensate.However, lesser substrate thickness contributes to form folding.
According to one embodiment, circuit board further comprises being arranged in the reflecting surface of bases thus will be by least one
The light of light source transmitting is reflected, therefore circuit board may be used as the reflector of lighting apparatus.In this way, reflector and circuit board can
To be integrated in identical component, thus the number of the component of lighting apparatus is reduced, helps to manufacture.Reflecting surface can be with
For example, diffusion, mirror surface or a combination thereof (it is, part diffusion and partial mirror).Circuit board can have application substrate
On reflecting layer to providing reflecting surface.In one embodiment, circuit board may further include arrangement to reflect
By the reflection solder resist for the light that at least one light source emits.The solder resist can provide the reflecting surface of circuit board.It can replace
Ground, or as supplement, substrate can be made of the material with light reflecting attribute, such as metal, thus (at least part of)
Reflecting surface can be provided by substrate itself.Therefore, at least partly substrate may be used as the reflector of lighting apparatus.
According to one embodiment, circuit board further comprises the perimeter at least partially surrounding the polygon funnel shaped of substrate
And the spring extended is to be funnel shaped by substrate support.Spring can be for example including at least slightly springy ring, such as
Substrate is maintained at the position of folding by becket.Therefore, spring can extend around the outside of polygon funnel shaped and will
Substrate is maintained at folding position.Spring may not necessarily extend around the entire perimeter of substrate, but preferably at least enclose
Around the major part of substrate perimeter.The present embodiment, which has, is advantageous in that substrate is stabilized in the position of funnel shaped and reduces base
Bottom becomes not folded risk during encapsulation and transport.
According to one embodiment, a kind of lighting apparatus is provided.Lighting apparatus includes any one limit as in the previous examples
Fixed circuit board and at least one be coupled to the light source of circuit board.In this way, providing the circuit with polygon funnel shaped
The lighting apparatus of plate.
According to one embodiment, lighting apparatus further comprises driver, is configured to drive at least one light source, driving
Device is coupled to circuit board.Circuit board can be to carry the driver of lighting apparatus as a result,.Further, driver and at least one
A light source can be arranged in the opposite side of circuit board.For example, at least one light source can be arranged in the reflection side of circuit board and
Driver is located at the side opposite with reflection side of circuit board.Alternatively, driver can be not coupled to circuit board (that is,
Outside circuit board).
It is noted that the present invention relates to all possible combinations for recording feature in the claims.Further, it will manage
Solution is that the various embodiments described for circuit board all can be with method group defined according to the second aspect of the invention
It closes.
When studying detailed disclosure below, attached drawing and appended claims, the aspects that is proposed into one
Purpose, the feature and advantage of step will be apparent.Those skilled in the art recognize can by different characteristic of the invention into
Row combination is to create the embodiment different from those described below embodiment.
Detailed description of the invention
Now with reference to the attached drawing for showing embodiment, these and other aspects described in more detail.
Fig. 1 shows the substrate of the circuit board according to the embodiment during the fabrication stage；
Fig. 2 shows the substrates of the circuit board according to the embodiment during another fabrication stage；
Fig. 3 shows another view of substrate illustrated in fig. 2；
Fig. 4 shows another view of substrate illustrated in fig. 2；
Fig. 5 shows the circuit board according to the embodiment including substrate；
Fig. 6 shows the circuit board according to the embodiment during the fabrication stage；
Fig. 7 shows lighting apparatus according to the embodiment；
Fig. 8 is the exploded view of lighting apparatus illustrated in fig. 7；
Fig. 9 shows the circuit board according to another embodiment；
Figure 10 shows the folding of circuit board according to the embodiment；
Figure 11 shows the folding of the circuit board according to another embodiment.
All attached drawings be it is schematical, not necessarily proportionally, and mostly just show necessary part to
The present invention is illustrated, wherein other parts may be omitted or only suggestiveness.
Specific embodiment
The circuit board according to the embodiment for being used for lighting apparatus and this circuit board of manufacture will be described referring to figs. 1 to Fig. 5
Method.
The method for manufacturing circuit board includes providing substrate 1, as described in Figure 1.Substrate 1 can be basic in the fabrication stage
Upper plane.Substrate 1 may include metal (such as aluminium or copper) or any other material with relatively high thermal conductivity, example
Such as polymer of thermal conductivity.For example, substrate 1 may include sheet metal.Substrate 1 can have any shape desired, such as with
The polygonal shape at multiple angles 4.This method further comprises fold by substrate 1 being formed from the periphery 3 of substrate 1 always
The one or more of the interior section 2 of substrate are extended to fold 9 (in the example proposed, six are folded 9), such as Fig. 1 and Fig. 2
It is illustrated.Fig. 1 shows the substrate 1 for not being folded the fold line 5,6,7 still with illustrated folding 9 and Fig. 2 shows
The substrate 1 when folding 9 and having been formed is gone out.Optionally, the middle section of substrate 1 can remove before folding (such as cuts
Except) to contribute to form the folding 9 of substrate 1.Notch can be used for the electronics connection (such as wiring) of circuit board.
Each fold 9 may include one or more fold line, such as the first fold line 5, the second fold line 6 and third folding
Superimposing thread 7 extends from the periphery 3 of substrate 1 towards common ground 8.Optionally, fold line 5,6,7 can not reach from beginning to end altogether
With point 8, but until the interior section 2 of substrate 1.The interior section 2 of substrate 1 can be periphery 3 (outside) phase with substrate 1
Any part of the substrate 1 of separation, such as it is located substantially on the part of the substrate 1 at the center of (or close) substrate 1.Further,
Common ground 8 can be the point of the imagination and may not have to be located at substrate 1.For example, common ground 8 can be located at circuit board
At center, the place that the middle section of such as substrate 1 is cut open, as illustrated in figure 1.Each fold 9 may include being arranged in
The first part 11 of the substrate 1 of the opposite side of second fold line 6 and second part 12.Further, first part 1 can be by first
Fold line 5 marked off from the unfolded part 13 of substrate 1 come and the second part 12 of substrate 1 can by third fold line 7 from
Another unfolded part 14 of substrate 1, which marks off, to be come.Folding 9 can be by 11 He of first part of substrate 1 made toward each other
The formation of second part 12.In current example, the first part 11 of substrate 1, second part 12 it is at least partly adjacent to each other (by
This is least partially overlapped), thus the angle between first part 11 and second part 12 is about 0.In another embodiment,
A part 11 and second part 12 can be formed including the angle within 0 ° to 90 ° of interval, preferably between 0 ° to 45 °
Within, and most preferably within 0 ° to 10 ° of interval.
As substrate 1 folded as described above as a result, which give polygon funnel shapeds is (or big
It is funnel shaped in cause).The funnel shaped broaden on direction of the interior section 2 from substrate 1 towards the periphery 3 of substrate 1 (for
It is tubaeform).The funnel shaped of substrate 1 can be, for example, at least partly conical.In current example, substrate 1 is rolled over
It folds to obtain polygon funnel shaped.The depth D for folding 9 can be in the interior section 2 from substrate 1 towards the periphery 3 of substrate 1
Direction on increase, facilitate the funnel shaped of deeper (or more obvious).Folding 9 can be from the unfolded part of substrate 1
13,14 is prominent, such as leaks from the outside of polygon funnel shaped (as illustrated in Fig. 2 to Fig. 4) and/or with polygon
The inside (not shown) of bucket shape shape is prominent, to form the protrusion of substrate.Alternatively, the one or more for folding 9 can be with
It is arranged as adjacent with the unfolded part 13,14 of substrate 1.
Further, one or more light sources 16 can be with coupling such as based on solid light source (such as light emitting diode, LED)
It closes (such as welding or bonding) and arrives substrate 1, the Fig. 5 for such as showing circuit board 10 is illustrated.In the feelings made of metal of substrate 1
Under condition, circuit board 10 may include the dielectric layer 15 of the electric insulation between the component carried for circuit board 10 and substrate 1.
Circuit board 10 may further include component of metal (such as copper) the track (not shown) for electrical interconnection circuitry plate 10.It can be with
Solder resist (or solder mask) is applied to substrate 1.Solder resist is preferably reflexive to be emitted for reflecting by light source 16
Light.Therefore, solder resist can provide the reflecting surface of circuit board 10 for reflecting light launched by light source.The gold of substrate 1
Metal surface and/or dielectric layer 15 can be provided for reflecting the reflecting surface of the light emitted by light source 16.Circuit board 10
It can be, for example, printed circuit board, PCB, optionally with metal core (that is, there is substrate made of metal).
According to example (not shown), only part of substrate can use dielectric layer and be covered, and substrate is another
Part is uncovered (or being exposure).In the example proposed, the part of the reflecting surface of circuit board can be by being situated between in electricity
Solder resist (or any reflecting surface of dielectric layer) at matter layer provides, and another part of reflecting surface can be by base
The unmasked portion at bottom provides.The reflecting attribute of substrate by the substrate as metal and/or can be applied to the anti-of substrate
Coating is penetrated to provide.
Light source 16 can be installed to substrate 1 after substrate 1 is folded.Alternatively, light source 16 can be in foldable substrate 1
It is mounted before, as illustrated in FIG. 6.In addition, circuit board 10 can be installed to (not by being configured to the driver of driving light source 16
Show), substrate 1 on the identical side of light source 16 or the side of substrate 1 installed with light source 16 it is opposite one
On side.
The circuit board 10 of carrying light source 16 may be mounted in lighting apparatus 30, such as show the perspective view of lighting apparatus 30
Fig. 7 and the exploded view that shows lighting apparatus 30 Fig. 8 it is illustrated.Lighting apparatus 30 may include shell (or frame)
31, circuit board 10 can be supported wherein, driver 34 is coupled to circuit board 10, such as in circuit board 10 and 16 couplings of light source
On the opposite side in the side closed.Lighting apparatus 30 may further include for lighting apparatus 30 to be connected to power supply
Contact pin 32 and the cover 33 (for example, being made of glass) for protecting transparent (or translucent) of light source 16.Optionally, should
Cover may include optical element, such as diffuser element.
Circuit board 10 may be used as the funnel shaped reflector of lighting apparatus 30 and be preferably hardness for light source
16 funnel shaped support construction.The defect of the circuit board shown in JP2011040510 is the bending part of circuit board only
It is only allowed in the reflection of the light towards the slave LED transmitting on the direction of the long side of circuit board, and in the short side towards circuit board
The light emitted on direction does not reflect.By the embodiment proposed, circuit board 10 provides the light source 16 in more direction
The reflection of the light of transmitting.
Further, circuit board 10 may be used as the radiator for the component of such as light source 16 carried by circuit board 10.Circuit
The heat conducting material (for example, metal) of plate 10 dissipates to the heat generated by light source 16.In addition, folding 9 may be used as into one
Step enhances the dissipation of heat fin from the dissipation of heat of light source 16.Since the polygon funnel shaped of circuit board is obtained by folding 9, in circuit
Material spilling is reduced in the manufacture of plate 10.It is initially the polygon funnel shaped of planar substrates by formation and is generated excessive
Material (folding 9) is not removed, and is instead used as dissipation of heat fin.The hexagonal shape of substrate, which has, to be advantageous in that
Due to hexagonal shape allow from single (metal) piece (at least almost) be cut into multiple hexagonal substrates without waste material because
This material spilling further decreases.
According to Fig. 9 shown embodiment, circuit board 10 may further include the week of the funnel shaped configuration around substrate
The long spring 20 extended is to be funnel shaped configuration by substrate support.Spring 20 can be for example including slightly springy ring
Substrate is maintained at the position of folding by the very best part, such as becket.Therefore, spring 20 can prolong on the outside of funnel shaped
It stretches and substrate 1 is maintained at folding position.Spring 20 can be by being supported in the groove 21 folded in 9.
According to embodiment, the folding may include a not more than fold line (such as Figure 10 is illustrated) or be not more than
Two fold lines (as illustrated in Figure 11).Figure 10 be with by the first part of substrate and second part 111,121 separation
The cross section of the folding 91 of one fold line 61.Fold 91 by substrate not the rolling over from adjacent substrate of bending part 151,161
Folded part 141,131, which marks off, to be come.Figure 11 is with the first folding for separating the first part of substrate and second part 111,121
Superimposing thread 61 and the second fold line for marking off the second part 122 of substrate from the unfolded part 142 of adjacent substrate
The cross section of 72 folding 92.Transition between the first part 112 of substrate and the unfolded part 132 of adjacent substrate can be with
It is straight or curved (or not limited by fold line at least).
For the sake of clarity, multiple special characteristics (such as light source, the angle of the polygonal shape of substrate and in the accompanying drawings
One fold line, the second fold line and third fold line) in only one (and as exception, folded complete as indicated by reference marker
Portion is indicated with reference marker 9).
Although having carried out detailed view and description, this diagram and description to embodiment in the drawings and the preceding description
It is considered as descriptive or is exemplary not restricted, the present invention is not limited to the disclosed embodiments.
For example, each fold may include more than three fold lines.Further, folding can be from the different pleurapophysis of substrate
Out.Circuit board can have more than six or fold less than six.At least one light source and/or driver may be mounted at leakage
Any side of bucket-shaped substrate.
By studying attached drawing, open and appended claims, those skilled in the art is required by practice
It is understood that when the invention of protection and implements other deformations for the disclosed embodiments.In the claims, word " packet
Include " other elements or step is not precluded and plural number is not precluded in indefinite article "a" or "an".Certain measures are at that
This different only fact being recited in mutually different dependent does not indicate that the combination of these measures cannot be utilized.It is weighing
Any reference marker in benefit requirement should not be construed as limited to range.
Claims (17)
1. the circuit board (10) of at least one light source (16) of the one kind for carrying lighting apparatus (30), circuit board (10) packet
It includes:
Substrate (1), have polygon funnel shaped and at least one fold (9), it is described at least one fold from the substrate
Periphery (3) extend to the interior section (2) of the substrate towards center, it is described at least one fold by the substrate
Folded portion is formed, and the polygon funnel shaped is formed by the unfolded part (13,14) of the substrate, the substrate
Be initially the shape of polygon plane, the polygon plane includes at least three straight flanges and the center, wherein it is described at least
The depth of one folding increases along the direction of the interior section from the substrate towards the periphery of the substrate.
2. circuit board according to claim 1, wherein at least one described folding (9) includes at least one fold line (6)
And it is located at two parts (11,12) of the substrate (1) of the opposite side of the fold line (6).
3. circuit board according to claim 2, wherein the angle between described two parts (11,12) of the substrate (1)
Degree is within 0 ° to 90 ° of interval.
4. circuit board according to claim 2 or 3, wherein described two parts (11,12) are at least partly adjacent to each other
It connects.
5. circuit board according to any one of claim 1-3, wherein at least one described folding (9) includes from the base
At least two fold lines (5,6,7) that the burble point of the periphery at bottom (1) extends towards common ground (8).
6. circuit board according to any one of claim 1-3, wherein it is described at least one fold (9) from the substrate
(1) angle (4) extends and the interior section up to the substrate (1).
7. circuit board according to any one of claim 1-3, wherein at least one described folding (9) is with the polygon
Funnel shaped is inwardly projecting.
8. circuit board according to any one of claim 1-3, wherein it is described at least one fold (9) be arranged as dissipating by
The heat that at least one described light source (16) generates.
9. circuit board according to any one of claim 1-3, wherein the substrate (1) includes having to be at least 1W/
(mK) material of thermal conductivity.
10. circuit board according to any one of claim 1-3, further comprise be arranged in it is anti-at the substrate (1)
Reflective surface, thus the light that reflection is emitted by least one described light source (16).
11. circuit board according to any one of claim 1-3 further comprises arrangement to reflect by described at least one
The reflection solder resist of the light of a light source transmitting.
12. circuit board according to any one of claim 1-3 further comprises at least partly around the substrate
(1) spring (20) that the outside of the polygon funnel shaped extends, so that support is in the institute of the polygon funnel shaped
State substrate.
13. circuit board according to claim 3, wherein the angle between described two parts (11,12) of the substrate (1)
Degree is within 0 ° to 45 ° of interval.
14. circuit board according to claim 13, wherein between described two parts (11,12) of the substrate (1)
Angle is within 0 ° to 10 ° of interval.
15. circuit board according to claim 9, wherein the material is metal.
16. a kind of lighting apparatus, comprising:
According to circuit board defined by aforementioned any claim, and
It is coupled at least one light source (16) of the circuit board.
17. a kind of method of manufacture for carrying the circuit board (10) of at least one light source (16) of lighting apparatus, the method
Include:
It provides substrate (1), there is the polygon plane shape including at least three straight flanges and center；And
The substrate (1) is folded, so that forming at least one folds (9), at least one described folding (9) forms protrusion simultaneously
And the interior section (2) of the substrate is extended to from the periphery of the substrate (3) towards the center, wherein it is described at least
The depth of one folding increases along the direction of the interior section from the substrate towards the periphery of the substrate, by
This described substrate obtains polygon funnel shaped.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13166495 | 2013-05-03 | ||
| EP13166495.5 | 2013-05-03 | ||
| PCT/EP2014/058844 WO2014177625A1 (en) | 2013-05-03 | 2014-04-30 | Circuit board comprising at least one fold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105210457A CN105210457A (en) | 2015-12-30 |
| CN105210457B true CN105210457B (en) | 2019-03-08 |
Family
ID=48463706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480024976.0A Active CN105210457B (en) | 2013-05-03 | 2014-04-30 | The circuit board folded including at least one |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9872381B2 (en) |
| EP (1) | EP2992742B8 (en) |
| JP (1) | JP2016522963A (en) |
| CN (1) | CN105210457B (en) |
| RU (1) | RU2015151853A (en) |
| WO (1) | WO2014177625A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3094161B1 (en) * | 2015-05-08 | 2017-10-18 | OSRAM GmbH | A lighting device and corresponding method |
| CN106545756A (en) * | 2016-10-18 | 2017-03-29 | 上海顿格电子贸易有限公司 | A kind of Universal LED substrate |
| DE102017114235B4 (en) | 2017-06-27 | 2020-01-02 | Bjb Gmbh & Co. Kg | Luminaire for room and building lighting |
| WO2019048345A1 (en) * | 2017-09-11 | 2019-03-14 | Signify Holding B.V. | Led strips with collimated light emission |
| DE102017127094A1 (en) * | 2017-11-17 | 2019-05-23 | CONDA Technik und Form GmbH | luminaire body |
| CN108131652B (en) * | 2017-12-06 | 2020-05-19 | 梁栋 | Heat sink and method for manufacturing the same |
| CN208780959U (en) * | 2018-10-30 | 2019-04-23 | 京东方科技集团股份有限公司 | A kind of reflector plate, backlight module and display device |
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| JPH0636620A (en) | 1992-07-14 | 1994-02-10 | Nec Gumma Ltd | Flexible flat cable |
| US5519596A (en) * | 1995-05-16 | 1996-05-21 | Hewlett-Packard Company | Moldable nesting frame for light emitting diode array |
| US20070001177A1 (en) * | 2003-05-08 | 2007-01-04 | Koninklijke Philips Electronics N.V. | Integrated light-emitting diode system |
| JP2004363352A (en) * | 2003-06-05 | 2004-12-24 | Keyence Corp | Uv irradiation apparatus |
| JP2005340184A (en) * | 2004-04-30 | 2005-12-08 | Du Pont Toray Co Ltd | Led lighting apparatus |
| US20080271913A1 (en) | 2005-01-25 | 2008-11-06 | Noritsugu Enomoto | Three-Dimensional Wiring Body for Mounting Electronic Component and Electronic Component Mounting Structure |
| JPWO2006080301A1 (en) * | 2005-01-25 | 2008-06-19 | 古河電気工業株式会社 | Electronic component mounting wiring body and electronic component mounting structure |
| DE102007046639A1 (en) * | 2007-09-27 | 2009-04-02 | Büchner, Thomas | Electrical printed circuit board arrangement i.e. LED-illumination device, for illuminating objects, has carrier plate sections bent in angular position along material attenuation regions i.e. material bridges |
| JP4621799B1 (en) | 2009-05-22 | 2011-01-26 | シャープ株式会社 | Light reflecting sheet, light source device and display device |
| IT1396164B1 (en) | 2009-07-27 | 2012-11-16 | Venturini | FARO LED |
| JP5333765B2 (en) | 2009-08-07 | 2013-11-06 | 中村製作所株式会社 | Printed circuit board for light emitting module |
| US8829771B2 (en) * | 2009-11-09 | 2014-09-09 | Lg Innotek Co., Ltd. | Lighting device |
| DE102009054840A1 (en) | 2009-12-17 | 2011-06-22 | Poly-Tech Service GmbH, 67681 | Illuminant with a plurality of LEDs |
| JP5323668B2 (en) * | 2009-12-24 | 2013-10-23 | 日本メクトロン株式会社 | LIGHTING DEVICE AND MANUFACTURING METHOD THEREOF |
| JP5853374B2 (en) * | 2010-03-12 | 2016-02-09 | オムロン株式会社 | Lighting device |
| JP2011249536A (en) | 2010-05-26 | 2011-12-08 | Daisho Denshi Co Ltd | Flexible wiring board, light-emitting module, manufacturing method of light-emitting module, and manufacturing method of flexible wiring board |
| JP2011249534A (en) * | 2010-05-26 | 2011-12-08 | Daisho Denshi Co Ltd | Flexible wiring board, light-emitting module, manufacturing method of light-emitting module, and manufacturing method of flexible wiring board |
| JP5914839B2 (en) | 2010-10-25 | 2016-05-11 | パナソニックＩｐマネジメント株式会社 | LIGHT EMITTING DEVICE AND LIGHTING APPARATUS HAVING THE SAME |
| TWI446602B (en) | 2011-06-13 | 2014-07-21 | Subtron Technology Co Ltd | Package carrier and package structure |
| CN102595788B (en) * | 2012-03-05 | 2015-02-04 | 蔡子丰 | Manufacturing method of three-dimensional metal-based Printed Circuit Board (PCB) assembly structure in light-emitting |
| CN202652681U (en) * | 2012-06-08 | 2013-01-02 | 王定锋 | LED three-dimensional circuit board |
-
2014
- 2014-04-30 US US14/888,789 patent/US9872381B2/en active Active
- 2014-04-30 WO PCT/EP2014/058844 patent/WO2014177625A1/en active Application Filing
- 2014-04-30 JP JP2016511062A patent/JP2016522963A/en active Pending
- 2014-04-30 EP EP14721344.1A patent/EP2992742B8/en active Active
- 2014-04-30 RU RU2015151853A patent/RU2015151853A/en not_active Application Discontinuation
- 2014-04-30 CN CN201480024976.0A patent/CN105210457B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014177625A1 (en) | 2014-11-06 |
| US9872381B2 (en) | 2018-01-16 |
| JP2016522963A (en) | 2016-08-04 |
| EP2992742B8 (en) | 2019-01-09 |
| US20160088721A1 (en) | 2016-03-24 |
| EP2992742B1 (en) | 2018-12-05 |
| RU2015151853A (en) | 2017-06-08 |
| CN105210457A (en) | 2015-12-30 |
| EP2992742A1 (en) | 2016-03-09 |
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Effective date of registration: 20210208 Address after: Eindhoven Patentee after: Signify Holdings Ltd. Address before: The city of Eindhoven in Holland Patentee before: Royal Philips Co.,Ltd. |