CN105208798A - 双面电路板导电膜施镀工艺 - Google Patents
双面电路板导电膜施镀工艺 Download PDFInfo
- Publication number
- CN105208798A CN105208798A CN201510506670.5A CN201510506670A CN105208798A CN 105208798 A CN105208798 A CN 105208798A CN 201510506670 A CN201510506670 A CN 201510506670A CN 105208798 A CN105208798 A CN 105208798A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- whole hole
- plating
- deionized water
- sent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 45
- 238000005516 engineering process Methods 0.000 title claims abstract description 18
- 239000008367 deionised water Substances 0.000 claims abstract description 26
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 22
- 238000005406 washing Methods 0.000 claims abstract description 15
- 238000005554 pickling Methods 0.000 claims abstract description 13
- 238000009713 electroplating Methods 0.000 claims abstract description 12
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims abstract description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 30
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 10
- 239000012535 impurity Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 10
- 239000010949 copper Substances 0.000 abstract description 10
- 229910052802 copper Inorganic materials 0.000 abstract description 10
- 230000007797 corrosion Effects 0.000 abstract 4
- 238000005260 corrosion Methods 0.000 abstract 4
- 238000007598 dipping method Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510506670.5A CN105208798B (zh) | 2015-08-18 | 2015-08-18 | 双面电路板导电膜施镀工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510506670.5A CN105208798B (zh) | 2015-08-18 | 2015-08-18 | 双面电路板导电膜施镀工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105208798A true CN105208798A (zh) | 2015-12-30 |
CN105208798B CN105208798B (zh) | 2018-07-06 |
Family
ID=54956122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510506670.5A Active CN105208798B (zh) | 2015-08-18 | 2015-08-18 | 双面电路板导电膜施镀工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105208798B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106304693A (zh) * | 2016-08-31 | 2017-01-04 | 河源西普电子有限公司 | 一种用于柔性电路板的镀金工艺 |
CN107635361A (zh) * | 2017-09-13 | 2018-01-26 | 东莞联桥电子有限公司 | 一种铁氟龙pcb板的电镀加工方法 |
CN108712832A (zh) * | 2018-08-10 | 2018-10-26 | 四川海英电子科技有限公司 | 一种电路板导电膜施镀工艺 |
CN108822974A (zh) * | 2018-05-23 | 2018-11-16 | 昆山市线路板厂 | 一种挠性电路板整孔剂 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101631427A (zh) * | 2008-07-14 | 2010-01-20 | 深圳市九和咏精密电路有限公司 | 电路板制作过程中的镀厚金方法 |
CN102912395A (zh) * | 2012-11-15 | 2013-02-06 | 苏州正信电子科技有限公司 | 一种盲埋孔电镀铜填孔方法 |
CN103108501A (zh) * | 2013-01-18 | 2013-05-15 | 金悦通电子(翁源)有限公司 | 一种微孔板化学铜活化回洗工艺及其系统 |
-
2015
- 2015-08-18 CN CN201510506670.5A patent/CN105208798B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101631427A (zh) * | 2008-07-14 | 2010-01-20 | 深圳市九和咏精密电路有限公司 | 电路板制作过程中的镀厚金方法 |
CN102912395A (zh) * | 2012-11-15 | 2013-02-06 | 苏州正信电子科技有限公司 | 一种盲埋孔电镀铜填孔方法 |
CN103108501A (zh) * | 2013-01-18 | 2013-05-15 | 金悦通电子(翁源)有限公司 | 一种微孔板化学铜活化回洗工艺及其系统 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106304693A (zh) * | 2016-08-31 | 2017-01-04 | 河源西普电子有限公司 | 一种用于柔性电路板的镀金工艺 |
CN107635361A (zh) * | 2017-09-13 | 2018-01-26 | 东莞联桥电子有限公司 | 一种铁氟龙pcb板的电镀加工方法 |
CN108822974A (zh) * | 2018-05-23 | 2018-11-16 | 昆山市线路板厂 | 一种挠性电路板整孔剂 |
CN108712832A (zh) * | 2018-08-10 | 2018-10-26 | 四川海英电子科技有限公司 | 一种电路板导电膜施镀工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN105208798B (zh) | 2018-07-06 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Plating process of conductive film on double sided circuit board Effective date of registration: 20210127 Granted publication date: 20180706 Pledgee: Suining branch of Bank of China Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980000674 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220120 Granted publication date: 20180706 Pledgee: Suining branch of Bank of China Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980000674 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Plating process of conductive film on double-sided circuit board Effective date of registration: 20220402 Granted publication date: 20180706 Pledgee: Suining Fengfa Modern Agricultural Financing Guarantee Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980003717 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221227 Granted publication date: 20180706 Pledgee: Suining Fengfa Modern Agricultural Financing Guarantee Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980003717 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Coating process of conductive film on double-sided circuit board Effective date of registration: 20230105 Granted publication date: 20180706 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029897 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20180706 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029897 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Coating process of conductive film on double-sided circuit boards Granted publication date: 20180706 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2024980001767 |