CN105190845B - 用于cmp抛光头的基板进动机制 - Google Patents

用于cmp抛光头的基板进动机制 Download PDF

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Publication number
CN105190845B
CN105190845B CN201480014938.7A CN201480014938A CN105190845B CN 105190845 B CN105190845 B CN 105190845B CN 201480014938 A CN201480014938 A CN 201480014938A CN 105190845 B CN105190845 B CN 105190845B
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China
Prior art keywords
ring assemblies
coupled
bearing
head assembly
substrate
Prior art date
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CN201480014938.7A
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English (en)
Chinese (zh)
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CN105190845A (zh
Inventor
C·H·陈
G·S·丹达瓦特
J·古鲁萨米
S·C-C·徐
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN105190845A publication Critical patent/CN105190845A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN201480014938.7A 2013-03-14 2014-02-24 用于cmp抛光头的基板进动机制 Active CN105190845B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/827,629 US20140273756A1 (en) 2013-03-14 2013-03-14 Substrate precession mechanism for cmp polishing head
US13/827,629 2013-03-14
PCT/US2014/018069 WO2014158548A1 (en) 2013-03-14 2014-02-24 Substrate precession mechanism for cmp polishing head

Publications (2)

Publication Number Publication Date
CN105190845A CN105190845A (zh) 2015-12-23
CN105190845B true CN105190845B (zh) 2019-02-22

Family

ID=51529186

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480014938.7A Active CN105190845B (zh) 2013-03-14 2014-02-24 用于cmp抛光头的基板进动机制

Country Status (6)

Country Link
US (1) US20140273756A1 (OSRAM)
JP (1) JP6581964B2 (OSRAM)
KR (1) KR102243725B1 (OSRAM)
CN (1) CN105190845B (OSRAM)
TW (1) TWI617393B (OSRAM)
WO (1) WO2014158548A1 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014163735A1 (en) * 2013-03-13 2014-10-09 Applied Materials, Inc. Reinforcement ring for carrier head
US20140273756A1 (en) * 2013-03-14 2014-09-18 Chih Hung Chen Substrate precession mechanism for cmp polishing head
JP7051332B2 (ja) 2017-08-23 2022-04-11 キヤノン株式会社 有機化合物及び光電変換素子
KR102459832B1 (ko) * 2017-11-22 2022-10-28 주식회사 케이씨텍 캐리어
TWI639486B (zh) * 2018-05-31 2018-11-01 國立清華大學 全向整合式調節裝置
WO2022103583A1 (en) 2020-11-10 2022-05-19 Applied Materials, Inc. Polishing head with local wafer pressure
US20230381915A1 (en) * 2022-05-27 2023-11-30 Applied Materials, Inc. Operation of clamping retainer for chemical mechanical polishing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010039172A1 (en) * 2000-04-17 2001-11-08 Norio Kimura Polishing apparatus
CN1488470A (zh) * 2002-08-29 2004-04-14 ����Խ��е��ҵ��ʽ���� 抛光机
CN101023511A (zh) * 2004-09-30 2007-08-22 株式会社瑞萨科技 半导体器件的制造方法
CN201168928Y (zh) * 2005-12-28 2008-12-24 应用材料公司 一种用于衬底化学机械抛光装置的载具头及其柔性膜
CN101396805A (zh) * 2006-11-22 2009-04-01 应用材料股份有限公司 具有保持环和夹持环的研磨头

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3724869B2 (ja) * 1995-10-09 2005-12-07 株式会社荏原製作所 ポリッシング装置および方法
JP2008229846A (ja) * 1995-10-09 2008-10-02 Ebara Corp ポリッシング装置及び方法並びにトップリング
JPH10156712A (ja) * 1996-11-29 1998-06-16 Oki Electric Ind Co Ltd ウエハ研磨装置
JP2000334655A (ja) * 1999-05-26 2000-12-05 Matsushita Electric Ind Co Ltd Ｃｍｐ加工装置
CN1852787A (zh) * 2000-08-31 2006-10-25 多平面技术公司 化学机械抛光(cmp)头、设备和方法以及由此制造的平面化半导体晶片
US6527625B1 (en) * 2000-08-31 2003-03-04 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a soft backed polishing head
KR100502362B1 (ko) * 2003-08-05 2005-07-21 두산디앤디 주식회사 컨디셔너 캐리어용 복합운동기구가 구비된 반도체 웨이퍼표면연마장비
US7338569B2 (en) * 2004-09-29 2008-03-04 Agere Systems Inc. Method and system of using offset gage for CMP polishing pad alignment and adjustment
US7699688B2 (en) * 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
KR101022277B1 (ko) * 2009-02-25 2011-03-21 그린스펙(주) 실리콘 베어 웨이퍼 연마장치용 캐리어 헤드
JP5303491B2 (ja) * 2010-02-19 2013-10-02 信越半導体株式会社 研磨ヘッド及び研磨装置
US20130288577A1 (en) * 2012-04-27 2013-10-31 Applied Materials, Inc. Methods and apparatus for active substrate precession during chemical mechanical polishing
US20140273756A1 (en) * 2013-03-14 2014-09-18 Chih Hung Chen Substrate precession mechanism for cmp polishing head

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010039172A1 (en) * 2000-04-17 2001-11-08 Norio Kimura Polishing apparatus
CN1488470A (zh) * 2002-08-29 2004-04-14 ����Խ��е��ҵ��ʽ���� 抛光机
CN101023511A (zh) * 2004-09-30 2007-08-22 株式会社瑞萨科技 半导体器件的制造方法
CN201168928Y (zh) * 2005-12-28 2008-12-24 应用材料公司 一种用于衬底化学机械抛光装置的载具头及其柔性膜
CN101396805A (zh) * 2006-11-22 2009-04-01 应用材料股份有限公司 具有保持环和夹持环的研磨头

Also Published As

Publication number Publication date
TW201446417A (zh) 2014-12-16
KR20150132842A (ko) 2015-11-26
JP6581964B2 (ja) 2019-09-25
KR102243725B1 (ko) 2021-04-23
JP2016515303A (ja) 2016-05-26
TWI617393B (zh) 2018-03-11
WO2014158548A1 (en) 2014-10-02
US20140273756A1 (en) 2014-09-18
CN105190845A (zh) 2015-12-23

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