JP6581964B2 - Ｃｍｐ研磨ヘッド用の基板歳差運動機構 - Google Patents

Ｃｍｐ研磨ヘッド用の基板歳差運動機構 Download PDF

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Publication number
JP6581964B2
JP6581964B2 JP2016500364A JP2016500364A JP6581964B2 JP 6581964 B2 JP6581964 B2 JP 6581964B2 JP 2016500364 A JP2016500364 A JP 2016500364A JP 2016500364 A JP2016500364 A JP 2016500364A JP 6581964 B2 JP6581964 B2 JP 6581964B2
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Japan
Prior art keywords
assembly
retaining ring
substrate
head
gear
Prior art date
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Active
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JP2016500364A
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English (en)
Japanese (ja)
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JP2016515303A5 (OSRAM
JP2016515303A (ja
Inventor
チー ハン チェン，
チー ハン チェン，
ゴータム シャシャンク ダンダヴェート，
ゴータム シャシャンク ダンダヴェート，
ジェイ グルサミー，
ジェイ グルサミー，
サミュエル チュ−チャン スウ，
サミュエル チュ−チャン スウ，
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2016515303A publication Critical patent/JP2016515303A/ja
Publication of JP2016515303A5 publication Critical patent/JP2016515303A5/ja
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Publication of JP6581964B2 publication Critical patent/JP6581964B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2016500364A 2013-03-14 2014-02-24 Ｃｍｐ研磨ヘッド用の基板歳差運動機構 Active JP6581964B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/827,629 US20140273756A1 (en) 2013-03-14 2013-03-14 Substrate precession mechanism for cmp polishing head
US13/827,629 2013-03-14
PCT/US2014/018069 WO2014158548A1 (en) 2013-03-14 2014-02-24 Substrate precession mechanism for cmp polishing head

Publications (3)

Publication Number Publication Date
JP2016515303A JP2016515303A (ja) 2016-05-26
JP2016515303A5 JP2016515303A5 (OSRAM) 2017-03-30
JP6581964B2 true JP6581964B2 (ja) 2019-09-25

Family

ID=51529186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016500364A Active JP6581964B2 (ja) 2013-03-14 2014-02-24 Ｃｍｐ研磨ヘッド用の基板歳差運動機構

Country Status (6)

Country Link
US (1) US20140273756A1 (OSRAM)
JP (1) JP6581964B2 (OSRAM)
KR (1) KR102243725B1 (OSRAM)
CN (1) CN105190845B (OSRAM)
TW (1) TWI617393B (OSRAM)
WO (1) WO2014158548A1 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9381613B2 (en) * 2013-03-13 2016-07-05 Applied Materials, Inc. Reinforcement ring for carrier head
US20140273756A1 (en) * 2013-03-14 2014-09-18 Chih Hung Chen Substrate precession mechanism for cmp polishing head
JP7051332B2 (ja) 2017-08-23 2022-04-11 キヤノン株式会社 有機化合物及び光電変換素子
KR102459832B1 (ko) * 2017-11-22 2022-10-28 주식회사 케이씨텍 캐리어
TWI639486B (zh) * 2018-05-31 2018-11-01 國立清華大學 全向整合式調節裝置
KR102736275B1 (ko) 2020-11-10 2024-12-02 어플라이드 머티어리얼스, 인코포레이티드 국부적인 웨이퍼 압력을 갖는 연마 헤드
US20230381917A1 (en) * 2022-05-27 2023-11-30 Applied Materials, Inc. Clamping retainer for chemical mechanical polishing

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3724869B2 (ja) * 1995-10-09 2005-12-07 株式会社荏原製作所 ポリッシング装置および方法
JP2008229846A (ja) * 1995-10-09 2008-10-02 Ebara Corp ポリッシング装置及び方法並びにトップリング
JPH10156712A (ja) * 1996-11-29 1998-06-16 Oki Electric Ind Co Ltd ウエハ研磨装置
JP2000334655A (ja) * 1999-05-26 2000-12-05 Matsushita Electric Ind Co Ltd Ｃｍｐ加工装置
JP2001298006A (ja) * 2000-04-17 2001-10-26 Ebara Corp 研磨装置
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
CN1852787A (zh) * 2000-08-31 2006-10-25 多平面技术公司 化学机械抛光(cmp)头、设备和方法以及由此制造的平面化半导体晶片
US6527625B1 (en) * 2000-08-31 2003-03-04 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a soft backed polishing head
JP2004106173A (ja) * 2002-08-29 2004-04-08 Fujikoshi Mach Corp 両面研磨装置
KR100502362B1 (ko) * 2003-08-05 2005-07-21 두산디앤디 주식회사 컨디셔너 캐리어용 복합운동기구가 구비된 반도체 웨이퍼표면연마장비
US7338569B2 (en) * 2004-09-29 2008-03-04 Agere Systems Inc. Method and system of using offset gage for CMP polishing pad alignment and adjustment
CN101023511A (zh) * 2004-09-30 2007-08-22 株式会社瑞萨科技 半导体器件的制造方法
US7699688B2 (en) * 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
KR101022277B1 (ko) * 2009-02-25 2011-03-21 그린스펙(주) 실리콘 베어 웨이퍼 연마장치용 캐리어 헤드
JP5303491B2 (ja) * 2010-02-19 2013-10-02 信越半導体株式会社 研磨ヘッド及び研磨装置
US20130288577A1 (en) * 2012-04-27 2013-10-31 Applied Materials, Inc. Methods and apparatus for active substrate precession during chemical mechanical polishing
US20140273756A1 (en) * 2013-03-14 2014-09-18 Chih Hung Chen Substrate precession mechanism for cmp polishing head

Also Published As

Publication number Publication date
KR20150132842A (ko) 2015-11-26
TWI617393B (zh) 2018-03-11
CN105190845B (zh) 2019-02-22
CN105190845A (zh) 2015-12-23
TW201446417A (zh) 2014-12-16
WO2014158548A1 (en) 2014-10-02
US20140273756A1 (en) 2014-09-18
JP2016515303A (ja) 2016-05-26
KR102243725B1 (ko) 2021-04-23

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