CN105183083B - A kind of battery fastening structure of laptop - Google Patents
A kind of battery fastening structure of laptop Download PDFInfo
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- CN105183083B CN105183083B CN201510575119.6A CN201510575119A CN105183083B CN 105183083 B CN105183083 B CN 105183083B CN 201510575119 A CN201510575119 A CN 201510575119A CN 105183083 B CN105183083 B CN 105183083B
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Abstract
The present invention relates to laptops, more particularly to a kind of battery fastening structure of laptop, the mainboard includes substrate and is fixed on the adhesive layer of base upper portion, the top of adhesive layer is fixed with articulamentum, adhesive layer is connected between base upper portion and articulamentum lower part, being immersed on articulamentum has conductive circuit layer, ink layer is coated in conductive circuit layer, terminal is fixed in conductive circuit layer, terminal is equipped with soldering-tin layer, central processing unit is welded on the surface of mainboard, embedded multi-media card, memory, power management integrated circuit, wireless receiver and bluetooth, the left side edge of mainboard is extended with solar panel to left part, shrapnel is fixed on the downside of the right end of solar panel, the left side upper surface of mainboard is equipped with power contact, shrapnel conflict is electrically transmitted on power contact；At least strong with thermal conductivity, high efficiency and heat radiation improves the service life of each element, manufacture easy to produce, compresses the relatively firm effect of contact.
Description
Technical field
The present invention relates to laptops, and in particular to a kind of battery fastening structure of laptop.
Background technology
Mainboard（English：Motherboard Mainboard, abbreviation Mobo）, also known as motherboard, system board, logic card, mother
Plate, bottom plate etc. are center or the main circuit board for forming Complex Electronic Systems Based such as electronic computer.Typical mainboard can provide
A series of junctions for processor, video card, sonic-effect card, hard disk, memory, engage the equipment such as external equipment.They are typically directly
It is inserted into related slot or uses connection.
In the prior art, application number：201310019056.7 the applying date：2013.01.19, apply for title：A kind of notes
The radiator of this computer, the radiator are come for laptop radiating using refrigerant.Refrigerant in the present invention
It is liquid of the boiling point between 50~65 DEG C, it is loaded into the closed fluid reservoir on main board for notebook computer, at this
Fluid reservoir both sides are connected separately with outlet tube and liquid back pipe；From the other end of outlet tube to the liquid back pipe other end, connect successively
It is connected to the heat exchanger plates for treating heat dissipation element of top placement laptop, steam transmitting pipe and outer gelled heat exchanger.With this
Invention, can save the radiator fan in nearly all laptop, because apparatus of the present invention are not required to electric power, without mechanical movement
And the reason of transmission mechanism, therefore have substantially will not impaired advantage.
How effectively solar panel is mounted in laptop, and ensures to radiate to laptop, it can be with
It solves, and how to radiate to the inside of laptop in a manner that radiator is installed in outside, be this field skill
The technical bottleneck of art personnel.
A kind of battery fastening structure of laptop how is designed, the inside of laptop can be carried out efficient
Heat dissipation becomes the technical issues of we are badly in need of solving.
Invention content
It is an object of the invention to overcome the deficiencies in the prior art, and provide a kind of battery peace of laptop
Assembling structure.
The purpose of the present invention is by following technical solution to complete, a kind of battery fastening structure of laptop,
The mainboard includes substrate and is fixed on the adhesive layer of base upper portion, and the top of adhesive layer is fixed with articulamentum, and adhesive layer connects
It is connected between base upper portion and articulamentum lower part, being immersed on articulamentum has conductive circuit layer, and ink is coated in conductive circuit layer
Layer, terminal is fixed in conductive circuit layer, terminal is equipped with soldering-tin layer, central processing unit, insertion are welded on the surface of mainboard
Formula multimedia card, memory, power management integrated circuit, wireless receiver and bluetooth mainboard left side edge be extended with to left part
Solar panel, the right end downside of solar panel are fixed with shrapnel, and the left side upper surface of mainboard is equipped with power contact, and shrapnel is contradicted in electricity
It is electrically transmitted on contact in source.
The shrapnel includes the bending of rectangle, and the both ends of bending are fixed with inserted terminal, are equipped with to weld in inserted terminal
The wiring hole of power cord.
The substrate is made of polyimide resin, and the bottom of substrate is fixed with heat-conducting layer, and heat-conducting layer uses boron nitride
Material makes.
The central processing unit is fixedly welded on the terminal in mainboard centre position, wherein, embedded multi-media card, storage
Device, power management integrated circuit, wireless receiver and bluetooth are arranged along central processing unit and are welded on mainboard.
The embedded multi-media card is set on the left side of central processing unit, and embedded multi-media card is fixedly welded on mainboard
Left side centre position.
The memory be equipped with it is multiple, memory is arranged in the following side of central processing unit at equal intervals
The power management integrated circuit is fixedly welded on the left side of mainboard, and power supply is fixed on mainboard left side
Contact, power contact are electrically connected by mainboard left side with power management integrated circuit.
The wireless receiver and bluetooth are fixedly welded at the upper edge of mainboard.
Multiple slots are fixed in the right edge of the mainboard.
A kind of production method of computer main board, includes the following steps；
A substrate is provided for providing overall support for mainboard, substrate is plate-like；
One adhesive layer is provided, adhesive layer is coated with or spread upper face of the cloth in substrate；
An articulamentum is provided, articulamentum is bonded by fixed between adhesive layer and the upper surface of substrate；
Conductive circuit layer on articulamentum is installed, conductive circuit layer is fixed into the company of being immersed in by way of high pressure conflict
It connects in layer surface；
Heat safe ink layer is coated on the surface of conductive circuit layer and metal is welded to connect in conductive circuit layer
Terminal；
The welding soldering-tin layer on metal terminal.
Compared with prior art, the present invention with following obvious advantage and effect：
1st, it is reasonable in design, it is completely embedded, stability height；
2nd, selection is convenient, and manufacture easy to produce is easy to universal；
3rd, thermal conductivity is strong, high efficiency and heat radiation, improves the service life of each element；
4th, the thickness of mainboard is thin and length and width are relatively narrow, is easily installed；
5th, high temperature resistant, the strength of materials is higher, sturdy and durable；
6th, elasticity compresses contact, stable connection, dismountable installation.
Description of the drawings
Fig. 1 is the installation diagram of the solar panel in the present invention；
Fig. 2 is the schematic diagram of the shrapnel in the present invention；
Fig. 3 is the layout of the mainboard in the present invention；
Fig. 4 is the structure diagram of bottom case in the present invention；
Fig. 5 is the sectional view of the mainboard in the present invention；
In figure, mainboard 1, substrate 11, heat-conducting layer 111, adhesive layer 12, articulamentum 13, conductive circuit layer 14, ink layer 15,
Terminal 16, soldering-tin layer 17, central processing unit 21, embedded multi-media card 22, memory 23, power management integrated circuit 24, electricity
Source contact 241, wireless receiver 25, bluetooth 26, slot 27, solar panel 3, shrapnel 31, bending 311, inserted terminal 312, wiring hole
313rd, A is the bottom case of laptop.
Specific embodiment
Below in conjunction with attached drawing, the present invention will be described in detail：As shown in Fig. 1,3, a kind of notes of the present invention
The battery fastening structure of this computer, the mainboard 1 include substrate 11 and the adhesive layer 12 for being fixed on 11 top of substrate, adhesive layer
12 top is fixed with articulamentum 13, and adhesive layer 12 is connected between 13 lower part of 11 top of substrate and articulamentum, on articulamentum 13
Immersing has conductive circuit layer 14, and ink layer 15 is coated in conductive circuit layer 14, and terminal 16 is fixed in conductive circuit layer 14, end
Son 16 is equipped with soldering-tin layer 17, be welded on the surface of mainboard 1 central processing unit 21, embedded multi-media card 22, memory 23,
Power management integrated circuit 24, wireless receiver 25 and bluetooth 26, the left side edge of mainboard 1 are extended with solar panel 3 to left part, electricity
Shrapnel 31 is fixed on the downside of the right end of pond plate 3, the left side upper surface of mainboard 1 is equipped with power contact 241, and shrapnel 31 is contradicted in electricity
It is electrically transmitted on source contact 241；At least strong with thermal conductivity, high efficiency and heat radiation improves the service life of each element, system easy to produce
It makes, elasticity compresses contact, stable connection, the effect removably installed.
Mainboard 1 is mounted in the bottom case A of laptop, various components are fixedly welded on to the table of mainboard 1 respectively
On face, using the thermal diffusivity of mainboard 1, the heat dissipation effect of each component is improved, wherein being main hair by central processing unit 21
Thermal element, the centre position that central processing unit 21 is fixed on to mainboard 1 are effectively radiated.
Mainboard 1 absorbs 21 heat of central processing unit of intermediate position, and conducts heat to entire mainboard 1, so as to carry
The radiating efficiency of high mainboard 1.
Shown in Fig. 1 ~ Fig. 5, a kind of battery fastening structure of laptop, the left side edge of mainboard 1 is to left part
Solar panel 3 is extended with, solar panel 3 is the block structure of flat, can be lithium ion battery, wherein, by the power cord of solar panel 3
It is welded on shrapnel 31, using shrapnel 31 is fixedly welded on the downside of the right end of solar panel 3, the electric current in solar panel 31 is transmitted to
On the power contact 241 of the left side of mainboard 1.
The left side upper surface of mainboard 1 is fixedly welded with power contact 241, and power contact 241 is the metal derby of rectangle, can
To be made of wear-resisting steel disc, and steel disc is welded on the left side of mainboard 1, passes through power contact 241 and conductive circuit layer
14 fix welding, each component power supply into conductive circuit layer 14.
It is contacted using compressing between shrapnel 31 and power contact 241, ensures power supply between the two.
Shrapnel 31 is contradicted electrically to be transmitted on power contact 241, and low pressure contact between the two is realized removably
Connection, wherein shrapnel 31 are made of steel disc or copper sheet, have the effect of preferable rub resistance contact, and electric conductivity is stablized.
The shrapnel 31 includes the bending 311 of rectangle, and rectangle copper sheet or steel disc are carried out being bent into arc shape, utilize arc
The bending structure of shape is contradicted on power contact 241, is electrically connected, and is avoided welding of the prior art and is passed through conducting wire
It is attached.
The both ends of bending 311 are fixed with inserted terminal 312, and inserted terminal 312 gos deep into or is caught in the end of solar panel 3,
By plug-in type or snap-in connection, inserted terminal 312 and the right-hand end of solar panel 3 are fixed, the conducting wire of solar panel 312 is welded
It is connected in the wiring hole 313 of inserted terminal 312, so as to fulfill fixation, bending 311 is avoided to fall, ensure stable mounting structure.
The wiring hole 313 for welding power cord is equipped in inserted terminal 312, passes through leading for wiring hole 313 and solar panel 312
Line is welded, stabilized structure.
The mainboard 1 includes substrate 11 and the adhesive layer 12 for being fixed on 11 top of substrate, and adhesive layer 12 is is coated on master
Organic high-temp glue or inorganic high-temp glue may be used in high temperature resistant glue and double faced adhesive tape on plate 1, wherein high temperature resistant glue.
Wherein, organic silicon glue, phenolic resin glue, urea-formaldehyde resin adhesive, heatproof epoxy glue, polyimides glue etc..This kind of glue
Can have softer, elastic or toughness or hard rigid.Organic high-temp glue can generally add in functional filler, assign
The functions such as its insulation, heat conduction, magnetic conduction, fire prevention, fire-retardant.High temperature resistant epoxy glue-joint strength is quite high in the epoxy glue of heatproof, resistance to
The resistance to effect to run at high speed is fine, and ageing-resistant excellent, effect is very prominent.Inorganic high-temp glue：Inorganic high-temperature resistant glue heatproof can be with
Reach 1800 DEG C, can for a long time be used in fire, it is worldwide below 1300 DEG C to have broken high-temperature-resistant adhesive heatproof
Technical barrier, high temperature resistant inorganic adhesive are a kind of utilization inorganic nano materials through high temperature resistant inorganic nanometer made of polycondensation reaction
Compound binding agent, by the screening to composition proportion and preparation technology parameter, it is suspension of the pH value for neutrality to obtain binding agent
Dispersion, not only cohesive force is strong and non-corrosive to metallic matrix, but also can keep good adhesive property under high temperature again
And corrosion resistance, service life are long.Inorganic oxide copper high-temperature-resistant adhesive is easy to use, available for the directly viscous of heat-resisting material
It connects, coating can be directly in 400-1000 DEG C of high-temperature substrate surface spraying, and while moisture evaporation, coating can be adhered to moment
Matrix surface, the high temperature resistant protective coating even compact of formation, thermal shock resistance is good, and protection effect is notable.
The top of adhesive layer 12 is fixed with articulamentum 13, wherein, articulamentum 13 is made of resin material, wherein, resin
Material uses thermosetting resin, and thermosetting resin after hardening, due to intermolecular cross-linking, forms reticular structure, thus rigidity it is big,
Hardness is high, heatproof is high, nonflammable, product size stability is good, but property is crisp.Thus most thermosetting resins are being shaped to make
Before product, various reinforcing materials are all added in, such as wood powder, mineral powder, fiber or textile make its enhancing, and reinforced plastics is made.
In thermosetting resin, reinforcing material and other additives, such as curing agent, colorant, lubricant are added in, thermosetting property can be made
Plastics, for some in powdery, granular, some is made bulk, sheet, is referred to as moulding compound.The common processing method of thermosetting plastics has
Molding, lamination, transfer modling, casting etc., certain kinds can also be used to be injection moulded.Thermosetting resin is mostly used polycondensation（See polymerization）
Method produces.Common thermosetting resin has phenolic resin, Lauxite, melamine formaldehyde resin, epoxy resin, unsaturated tree
Fat, polyurethane, polyimides, organic siliconresin etc..Wherein, the Si-O keys of organic siliconresin have higher bond energy（363kJ/
mol）, so more stable, heat resistance and high temperature resistance are very high.Generally its thermal stability range is up to 200~250
DEG C, meet the exothermic temperature demand of mainboard 1.
11 top of substrate with what 13 lower part of articulamentum fastened is linked together using adhesive layer 12, forms stable mainboard
1 structure.
Being immersed on articulamentum 13 has conductive circuit layer 14, and conductive circuit layer 14 uses copper foil or silver foil.Copper foil is a kind of the moon
Matter electrolysis material, one layer thin, the continuous metal foil being deposited on articulamentum 13, its electric conductor as mainboard 1.Copper
Foil is easily bonded on the articulamentum 13 of insulation, and circuit patterns are formed using surface corrosion is carried out to copper foil.Copper foil has low table
Face oxygen species, can adhere to various different substrate materials, such as metal, insulating materials etc., possess wider temperature use scope.It is main
To be applied to be electromagnetically shielded and antistatic, copper-foil conducting electricity is placed in substrate surface, metal substrate combining has excellent conduction,
And provide the effect of electromagnetic shielding.It can be divided into:Self-adhesion copper foil double lead copper foil, singly leads copper foil etc..Electron level copper foil (purity 99.7%
More than, thickness 5um-105um) be electronics industry basic material, be conducive to direct selection, convenient for universal.
Silver foil using the silver bullion of plate, silver foil is carried out to roll extension, using chemical attack, silver foil is corroded to be formed
Circuit patterns.In the application, conductive circuit layer 14 is fabricated to using silver foil, conductive circuit layer 14 has higher electric conductivity,
It is very fast to transmit signal.
Ink layer 15 is coated in conductive circuit layer 14, ink layer 15 by the way of silk-screen printing or flexible printing,
High temperature resistant ink is coated with or is printed in conductive circuit layer 14,
Its contained composition of high temperature resistant ink：It is mainly formed with polyvinyl chloride (PVC) and phthalate, polychlorostyrene second
Dilute and phthalic acid ester, color fixing agent, stabilizer, thickener mixing composition thermosetting ink.High temperature resistant ink utilizes its thermosetting
Property, enhance the support effect of ink layer 15, the high temperature resistant ink produced using organic material can be realized higher exhausted
Edge effect.
Terminal 16 is fixed in conductive circuit layer 14, terminal 16 can be the terminal of the metal of hollow cylinder, wherein, end
Son 16 can be single hole, diplopore, socket, and hook etc. uses, and copper is silver-plated, and copper is zinc-plated, copper, aluminium, and the materials such as iron make, middle-end
Son 16 has higher signal transmission using the silver-plated single hole terminal of copper, several single hole terminals are arranged in pin shape.
Terminal 16 is equipped with soldering-tin layer 17, and soldering-tin layer 17 is coated on using scolding tin on terminal 16 or in the hole of terminal 16, profit
It with the scolding tin of droplet-like, is welded by scolding tin, scolding tin is by terminal 16 fixed in conductive circuit layer 14 and each component
Weld together.
I.e. using each terminal 16 on 1 surface of mainboard, using welding by central processing unit 21, embedded multi-media card
22nd, the components such as memory 23, power management integrated circuit 24, wireless receiver 25 and bluetooth 26 are welded on 1 surface of mainboard.
The substrate 11 is made of polyimide resin, and polyimides is the best high-molecular organic material of comprehensive performance
One of, high temperature resistant is up to 400 DEG C or more, long-time service temperature range -200~300 DEG C, no sharp melting point, high insulating property,
103 hertz of lower dielectric constants 4.0, dielectric loss only 0.004~0.007, to H class F insulating material Fs wherein, polyimides uses category F,
Condensation polymer type aromatic polyimide, condensation polymer type aromatic polyimide are by aromatic diamine and aromatic dianhydride, aromatic series
Prepared by tetrabasic carboxylic acid or aromatic tetracarboxylic acid's dialkyl react.Since the synthetic reaction of condensation polymer type polyimides is such as two
It is carried out in the sprotic solvent of the higher boilings such as methylformamide, N-Methyl pyrrolidone, and composite polyimide material leads to
It is often using prepreg moulding process, the sprotic solvent of these higher boilings prepared kapton polyimide in prepreg
It is difficult that volatilization is clean, while is cyclized in polyamic acid in journey（Imidization）Also there is volatile matter releasing in period, this is easy for compound
Hole is generated in material product, it is difficult to obtain high quality, the composite material without hole.
The bottom of substrate 11 is fixed with heat-conducting layer 111, and block-like heat-conducting layer 111 is made of boron nitride material.By leading
Heat in mainboard 1 is carried out heat conduction by thermosphere 111, so as to fulfill the heat dissipation to mainboard 1.Boron nitride has resistance to chemical attack
Matter, not by inorganic acid and water erosion.Compressive strength is 170MPa.High-temperature stability is fine, resistance to heat shocks is fine, intensity is very high,
Thermal conductivity factor very high expansion coefficient is relatively low, the very big insulating properties of resistivity is higher, it is corrosion-resistant, can microwave or saturating infrared ray thoroughly.
The central processing unit 21 is fixedly welded on the terminal in 1 centre position of mainboard, wherein, embedded multi-media card
22nd, memory 23, power management integrated circuit 24, wireless receiver 25 and bluetooth 26 are arranged and are welded along central processing unit 21
On mainboard 1.
Mainboard 1 efficiently radiates to the central processing unit 21 in centre position.Utilize its around central processing unit 21
He radiates relatively low element, and the heat of central processing unit 21 is distributed.
The embedded multi-media card 22 is set on the left side of central processing unit 21, and embedded multi-media card 22 is fixedly welded on
The left side centre position of mainboard 1.Soaking is carried out to the left side of central processing unit 21.
The memory 23 be equipped with it is multiple, using 4 memories 23, centre is arranged at equal intervals using memory 23
The following side of device 21 is managed, progress uniformly gives out heat.
The power management integrated circuit 24 is fixedly welded on the left side of mainboard 1, is fixed on 1 left side of mainboard
Power contact 241, power contact 241 are electrically connected by 1 left side of mainboard with power management integrated circuit 24.
It is contacted, carried out conductive with blocky or sheet battery by power contact 241.Utilize power management integrated circuit
The working condition of 24 pairs of batteries controls, and the electricity for avoiding supplying to central processing unit 21 is larger.
The wireless receiver 25 and bluetooth 26 are fixedly welded at the upper edge of mainboard 1.Letter can effectively be avoided
Number interference, improve and access wireless receiver 25 and bluetooth 26 or the efficiency of release signal.
Multiple slots 27 are fixed in the right edge of the mainboard 1.Wherein, slot 27 includes USB interface, IEEE1394
Interface, USB interface, S-Video leading-out terminals, TV-OUT interfaces, Modem（RJ-11）, network card interface（RJ-45）、S/PDIF
The interfaces such as interface, PC card interfaces, Express card slots, card reader interface.
By being fixedly welded in the right edge of mainboard 1 for multiple slots 27 unification, be conducive to the arrangement of conductive circuit layer 14,
Meanwhile it using the gap of multiple slots 27 and vacant, radiates to mainboard 1.
A kind of production method of computer main board, includes the following steps；
A substrate 11 is provided for providing overall support for mainboard 1, substrate 11 is plate-like；
Substrate 11 is produced by the way of integral molded plastic, by an adhesive layer 12, adhesive layer 12 is coated with or spread cloth in base
The upper face at bottom 11；Bonding fixed between the upper surface of adhesive layer 12 and substrate 11 is formed into plate knot using adhesive layer 12
Structure.
An articulamentum 13 is provided, articulamentum 13 is bonded by fixed between the upper surface of adhesive layer 12 and substrate 11；
Conductive circuit layer 14 is installed on articulamentum 13, and it is heavy conductive circuit layer 14 to be fixed by way of high pressure conflict
It is immersed on 13 surface of articulamentum；By the conductive circuit layer 14 corroded by way of extruding, immerse or be fitted in articulamentum 13
Surface on, form stable connection structure.
Heat safe ink layer 15 is coated on the surface of conductive circuit layer 14 and is welded to connect in conductive circuit layer 14
The terminal 16 of metal；The terminal 16 of metal is welded in conductive circuit layer 14 using the mode for welding welding.
The welding scolding tin on metal terminal 16, so as to form soldering-tin layer 17.
By foregoing description, those skilled in the art can implement.
Described in this specification above content is only to structure example explanation of the present invention；Moreover, this hair
The title that bright parts are taken can also be different, what all construction, feature and principles according to described in inventional idea of the present invention were done etc.
Effect or simple change, are included in the protection domain of patent of the present invention.
Claims (9)
1. a kind of battery fastening structure of laptop, is connected to mainboard, it is characterised in that：The mainboard (1) is including substrate
(11) and the adhesive layer (12) on substrate (11) top is fixed on, the top of adhesive layer (12) is fixed with articulamentum (13), bonds
Layer (12) is connected between substrate (11) top and articulamentum (13) lower part, and being immersed on articulamentum (13) has conductive circuit layer
(14), ink layer (15) is coated in conductive circuit layer (14), terminal (16), terminal (16) are fixed in conductive circuit layer (14)
Soldering-tin layer (17) is equipped with, central processing unit (21), embedded multi-media card (22), storage are welded on the surface of mainboard (1)
Device (23), power management integrated circuit (24), wireless receiver (25) and bluetooth (26), the left side edge of mainboard (1) is to left part
Solar panel (3) is extended with, shrapnel (31) is fixed on the downside of the right end of solar panel (3), the left side upper surface of mainboard (1) is equipped with electricity
Source contact (241), shrapnel (31) conflict are electrically transmitted on power contact (241).
2. the battery fastening structure of laptop according to claim 1, it is characterised in that：The shrapnel (31) is including square
The bending (311) of shape, the both ends of bending (311) are fixed with inserted terminal (312), are equipped with to weld electricity in inserted terminal (312)
The wiring hole (313) of source line.
3. the battery fastening structure of laptop according to claim 1, it is characterised in that：The substrate (11) is using poly-
Imide resin makes, and the bottom of substrate (11) is fixed with heat-conducting layer (111), and heat-conducting layer (111) is made of boron nitride material.
4. the battery fastening structure of laptop according to claim 1, it is characterised in that：The central processing unit (21)
It is fixedly welded on the terminal in mainboard (1) centre position, wherein, embedded multi-media card (22), memory (23), power management
Integrated circuit (24), wireless receiver (25) and bluetooth (26) are arranged along central processing unit (21) and are welded on mainboard (1).
5. the battery fastening structure of laptop according to claim 1, it is characterised in that：The embedded multi-media card
(22) set on the left side of central processing unit (21), embedded multi-media card (22) is fixedly welded on the left side interposition of mainboard (1)
It puts.
6. the battery fastening structure of laptop according to claim 1, it is characterised in that：The memory (23) is equipped with
Multiple, memory (23) is arranged in the following side of central processing unit (21) at equal intervals.
7. the battery fastening structure of laptop according to claim 1, it is characterised in that：The power management integrates electricity
Road (24) is fixedly welded on the left side of mainboard (1), is fixed with power contact (241) on mainboard (1) left side, power supply touches
Point (241) is electrically connected by mainboard (1) left side and power management integrated circuit (24).
8. the battery fastening structure of laptop according to claim 1, it is characterised in that：The wireless receiver (25)
And bluetooth (26) is fixedly welded at the upper edge of mainboard (1).
9. the battery fastening structure of laptop according to claim 1, it is characterised in that：The right side of the mainboard (1)
Multiple slots (27) are fixed on side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510575119.6A CN105183083B (en) | 2015-09-11 | 2015-09-11 | A kind of battery fastening structure of laptop |
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|---|---|---|---|
| CN201510575119.6A CN105183083B (en) | 2015-09-11 | 2015-09-11 | A kind of battery fastening structure of laptop |
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| CN105183083A CN105183083A (en) | 2015-12-23 |
| CN105183083B true CN105183083B (en) | 2018-06-29 |
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| CN201510575119.6A Active CN105183083B (en) | 2015-09-11 | 2015-09-11 | A kind of battery fastening structure of laptop |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111133401B (en) * | 2018-05-31 | 2023-10-31 | 北京比特大陆科技有限公司 | Data processing apparatus |
| CN116056307B (en) * | 2022-08-30 | 2024-07-02 | 荣耀终端有限公司 | Motherboard architecture and electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101587363A (en) * | 2009-07-03 | 2009-11-25 | 秦彪 | Notebook computer, host box and mainboard thereof |
| CN103207642A (en) * | 2012-01-17 | 2013-07-17 | 上海本星电子科技有限公司 | Notebook computer without thermovent |
| CN104166427A (en) * | 2013-05-16 | 2014-11-26 | 英业达科技有限公司 | Battery connecting port module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9705115B2 (en) * | 2012-06-07 | 2017-07-11 | Apple Inc. | Battery structure and integration |
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2015
- 2015-09-11 CN CN201510575119.6A patent/CN105183083B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101587363A (en) * | 2009-07-03 | 2009-11-25 | 秦彪 | Notebook computer, host box and mainboard thereof |
| CN103207642A (en) * | 2012-01-17 | 2013-07-17 | 上海本星电子科技有限公司 | Notebook computer without thermovent |
| CN104166427A (en) * | 2013-05-16 | 2014-11-26 | 英业达科技有限公司 | Battery connecting port module |
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| CN105183083A (en) | 2015-12-23 |
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