CN105182692B - Base plate exposure platform and exposure machine - Google Patents
Base plate exposure platform and exposure machine Download PDFInfo
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- CN105182692B CN105182692B CN201510507584.6A CN201510507584A CN105182692B CN 105182692 B CN105182692 B CN 105182692B CN 201510507584 A CN201510507584 A CN 201510507584A CN 105182692 B CN105182692 B CN 105182692B
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- exposure
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- pin
- support pin
- base plate
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Abstract
The present invention provides a kind of base plate exposure platform and the exposure machine with the base plate exposure platform, the scattering coating with scattering process is coated with the surface of the support pin of base plate exposure platform of the present invention, the reflected light on support pin side is set to be changed to spread light, reduce the normal reflection amount of light, so as to improve in exposure process, the problem of easily forming pin mura on substrate；Another base plate exposure platform of the present invention, the side of pin is supported perpendicular to the surface of platform body, pin is supported not have inclined plane with platform body, so as to improve in exposure process the problem of causing easily to form pin mura on substrate supporting the reflex of pin inclined plane；The exposure machine of the present invention, provided with aforesaid substrate exposure stage, can be avoided in exposure manufacture process the problem of forming pin mura on substrate caused by supporting pin, with high exposure accuracy and resolution.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of base plate exposure platform and with the base plate exposure platform
Exposure machine.
Background technology
In display technology field, liquid crystal display (Liquid Crystal Display, LCD) and Organic Light Emitting Diode
The flat-panel monitors such as display (Organic Light Emitting Diode, OLED) progressively replace CRT monitor, extensively
General is applied to LCD TV, mobile phone, personal digital assistant, digital camera, computer screen or notebook computer screen etc..
In LTPS LCD (Low Temperature Poly-silicon, LTPS) and AMOLED (Active-matrix
Organic light-emitting diode) manufacturing process in, can repeatedly utilize patterning processes.Specifically, scribbling light
The surface of photoresist places mask plate, and then substrate is exposed using exposure machine, specifically, exposure machine is super by opening
High-pressure mercury-vapor lamp sends UV ultraviolet lights, the image information on mask plate is transferred on the substrate surface for scribbling photoresist, base
In the pattern of mask plate, photoresist has the part being exposed and the part not being exposed.Developer solution is recycled to enter photoresist
Row development, you can remove the part that photoresist is exposed, retains the part (positive photoresist) that photoresist is not exposed, or go
Except the part that photoresist is not exposed, retain the part (negative photoresist) that photoresist is exposed, so that photoresist formation institute
The figure needed.
Fig. 1 is the dimensional structure diagram of exposure machine in the prior art, as shown in figure 1, exposure machine includes being used to carry base
In the exposure stage (Plate Stage) 50 of plate, exposure process, substrate is positioned in the exposure stage 50 of exposure machine；Such as Fig. 2 institutes
Show, exposure stage 50 and the contact surface of substrate are used to support using the nipple support pin (pin) 51 of several marshallings, to reduce
With the contact area of substrate, so as to avoid the electrostatic breakdown phenomenon (generation of (Electro-Static discharge, ESD).But
It is that the support pin 51 of projection can cause light volume reflection difference, the form for supporting pin 51 is projected on the photoresist to substrate, from
And form pin mura.For example, reaching 500PPI (Pixels Per Inch, inches area for liquid crystal panel resolution ratio
Number of pixels) more than when, the exposure machine resolving power for array base palte needs to reach below 2.0um, now easily produce pin
Mura, so as to influence image quality.
The cardinal principle of above-mentioned pin mura formation is：As shown in Figure 2 and Figure 3, the support pin 51 in exposure stage 50 is usual
Manufactured for metal, and be the cone shape with inclined plane such as massif shape, as shown in figure 4, because support pin 51 is metal material
Matter, its surface is more smooth after long-term use, then the wide part penetrated in its inclined plane is by normal reflection；So as to such as Fig. 5 institutes
Show, support the reflected light in the inclined plane of pin 51 to cause the energy inequality of the photoresist 20 on the face of substrate 10, so that pin will be supported
51 fractions distribution transcription forms pin mura to pattern imaging.
Therefore, it is necessary to a kind of base plate exposure platform and exposure machine be provided, to solve the above problems.
The content of the invention
It is an object of the invention to provide a kind of base plate exposure platform, the exposure accuracy and resolution of exposure machine can be improved,
It can avoid in exposure manufacture process the problem of forming pin mura on substrate caused by supporting pin.
Another object of the present invention is to provide a kind of exposure machine, can avoid in exposure manufacture process because support pin caused by base
The problem of pin mura being formed on plate, with high exposure accuracy and resolution.
To achieve the above object, the present invention provides a kind of base plate exposure platform, including platform body and protrudes from described flat
Multiple support pins on playscript with stage directions body；
The support pin is used for supporting substrate, and the support wire surface is coated with scattering coating.
The material of the scattering coating is ceramics.
The platform body is identical with supporting the material of pin, is metal；The platform body is with support pin using welding
Or be integrally formed and be made.
The support pin is in round table-like, surface inclination of the side relative to the platform body of the support pin.
The support pin is cylindrical, and the side of the support pin is vertical relative to the surface of the platform body.
The present invention also provides a kind of base plate exposure platform, including platform body and protrudes from many on the platform body
Individual support pin；
The support pin is used for supporting substrate, and the side of the support pin is vertical relative to the surface of the platform body.
The support pin is cylindrical.
The platform body is identical with supporting the material of pin, is metal；The platform body is with support pin using welding
Or be integrally formed and be made.
The support wire surface is coated with scattering coating, and the material of the scattering coating is ceramics.
The present invention also provides a kind of exposure machine, including above-described base plate exposure platform.
Beneficial effects of the present invention：Tool is coated with a kind of base plate exposure platform that the present invention is provided, the surface for supporting pin
There is the scattering coating of scattering process, make the reflected light on support pin be changed to spread light, light normal reflection amount is reduced, so as to improve
In exposure process, the problem of easily forming pin mura on substrate；Another base plate exposure platform that the present invention is provided, supports pin
Side perpendicular to the surface of the platform body, support pin does not have inclined plane with platform body, so as to improve exposure process
The problem of causing on substrate easily to form pin mura the middle reflex because supporting pin inclined plane；The exposure machine of the present invention,
Provided with aforesaid substrate exposure stage, it can avoid in exposure manufacture process because forming asking for pin mura on substrate caused by support pin
Topic, with high exposure accuracy and resolution.
Brief description of the drawings
Below in conjunction with the accompanying drawings, it is described in detail by the embodiment to the present invention, technical scheme will be made
And other beneficial effects are apparent.
In accompanying drawing,
Fig. 1 is a kind of existing dimensional structure diagram of exposure machine；
Fig. 2 is the partial enlarged drawing of the exposure stage of Fig. 1 exposure machine；
Fig. 3 is supporting the cross-sectional view at pin for Fig. 2 exposure stage；
The distribution schematic diagram of reflected light on the inclined-plane for the support pin that Fig. 4 is Fig. 3；
Fig. 5 is the mura formed in existing exposure stage exposure process on substrate schematic diagram；
Fig. 6 is supporting the cross-sectional view at pin for the base plate exposure platform of one embodiment of the invention；
The distribution schematic diagram of reflected light on the side for the support pin that Fig. 7 is Fig. 6；
Fig. 8 is the schematic diagram of light reflection of Fig. 7 base plate exposure platform in exposure process；
Fig. 9 is supporting the cross-sectional view at pin for the base plate exposure platform of another embodiment of the present invention；
Figure 10 is the schematic diagram of light reflection of Fig. 9 base plate exposure platform in exposure process.
Embodiment
Further to illustrate the technological means and its effect of the invention taken, below in conjunction with being preferable to carry out for the present invention
Example and its accompanying drawing are described in detail.
Present invention firstly provides a kind of base plate exposure platform, Fig. 6 is propping up for an embodiment of base plate exposure platform of the present invention
The cross-sectional view at pin is supportted, the base plate exposure platform includes platform body 100 and protrudes from the platform body 100
On multiple support pins 110；The support pin 100 is used for supporting substrate 200, and support pin 100 surface is coated with scattering and applied
Layer 120.
Specifically, the material of the scattering coating 120 is ceramics, so that the surface roughening of support pin 110.
Specifically, the platform body 100 is identical with supporting the material of pin 110, and it is metal, the platform body 100
It can be made between support pin 110 of welding, it would however also be possible to employ be integrally formed and be made.
Specifically, the support pin 110 is in round table-like, the side of the support pin is relative to the platform body 100
Surface is tilted.The support pin 110 can also be cylindrical, and now the side of the support pin 110 is relative to the platform sheet
The surface of body 100 is vertical.
As shown in fig. 7, light is penetrated when supporting on pin 110, because the surface for supporting pin 110 is coated with the scattering of ceramic material
Coating, so that the surface roughening of support pin 110, reflected light thereon is changed to spread light, the composition of normal reflection light is significantly
In reduction, exposure process, as shown in figure 8, the effect due to scattering coating 120 on the side of support pin 110, will be penetrated in support pin
The light on 110 surfaces is scattered so that the light that the photoresist 210 on substrate 200 is received is more uniform, so as to improve exposed
The problem of easily pin mura being formed on Cheng Zhong, substrate.
Fig. 9 show cross-sectional view of another embodiment of base plate exposure platform of the present invention at support pin, should
Base plate exposure platform, including platform body 100 and protrude from multiple support pins 110 ' on the platform body.The support
Pin 110 ' is used for supporting substrate 200, and the side of the support pin 110 ' is vertical relative to the surface of the platform body 100.
Specifically, the support pin 110 ' is cylindrical.
Specifically, the platform body 100 is identical with supporting the material of pin 110 ', it is metal；The support pin 110 '
It can be made between the platform body 100 of welding, it would however also be possible to employ be integrally formed and be made.The support pin 110 '
Surface can also coat scattering coating, and the material of the scattering coating can be ceramics.
As shown in Figure 10, in exposure process, light penetrate support pin 110 ' on when, due to support pin 110 ' side perpendicular to
The surface of the platform body 100, support pin 100 ' does not have inclined plane with platform body 100, and the vertical directive exposure of UV light is flat
During platform, reflected light on its face also vertical photoresist 210 injected on substrate 200 and substrate 200, i.e. photoresist 210 is received
Light be uniform, so as to improve in exposure process because causing supporting the reflex of pin inclined plane on substrate easily
The problem of shape pin mura.
Based on above substrate exposure stage, the present invention also provides a kind of exposure machine, including any one above-mentioned substrate exposes
Optical platform, can be used in improving the problem of easily forming mura on substrate in exposure process, the exposure machine can be used for LTPS
In LCD, AMOLED processing procedure, array factory, the exposure machine of Cai Mo factories are also used as.
In summary, it is coated with and makees with scattering on a kind of base plate exposure platform that the present invention is provided, the surface for supporting pin
Scattering coating, makes the reflected light on support pin be changed to spread light, light volume reflection is reduced, so as to improve exposure process
In, the problem of easily forming pin mura on substrate；Hang down another base plate exposure platform that the present invention is provided, the side of support pin
Straight in the surface of the platform body, support pin does not have inclined plane with platform body, so as to improve in exposure process because of support
The reflex of pin inclined plane and the problem of cause on substrate easily to form pin mura；The exposure machine of the present invention, provided with above-mentioned
Base plate exposure platform, the problem of can avoiding in exposure manufacture process because forming pin mura on substrate caused by support pin, has
High exposure accuracy and resolution.
It is described above, for the person of ordinary skill of the art, can be with technique according to the invention scheme and technology
Other various corresponding changes and deformation are made in design, and all these changes and deformation should all belong to appended right of the invention
It is required that protection domain.
Claims (10)
1. a kind of base plate exposure platform, it is characterised in that including platform body and protrude from multiple on the platform body
Support pin；
The support pin is used for the substrate that the support in exposure process scribbles photoresist, and the support pin side is coated with scattering and applied
Layer, so that in the surface roughening of support pin, exposure process, by scattering the effect of coating, will penetrate in support wire surface
Light is scattered so that the light that the photoresist on substrate is received is more uniform.
2. base plate exposure platform as claimed in claim 1, it is characterised in that the material of the scattering coating is ceramics.
3. base plate exposure platform as claimed in claim 1, it is characterised in that the platform body and the material phase for supporting pin
Together, it is metal；The platform body uses welding or is integrally formed and is made with support pin.
4. base plate exposure platform as claimed in claim 1, it is characterised in that the support pin is in round table-like, the support pin
Side relative to the platform body surface tilt.
5. base plate exposure platform as claimed in claim 1, it is characterised in that the support pin is cylindrical, the support pin
Side it is vertical relative to the surface of the platform body.
6. a kind of base plate exposure platform, it is characterised in that including platform body and protrude from multiple on the platform body
Support pin；
The support pin is used for the substrate that the support in exposure process scribbles photoresist, and the side of the support pin is relative to described
The surface of platform body is vertical；
The support pin side is coated with scattering coating, so that in the surface roughening of support pin, exposure process, passing through scattering
The effect of coating, the light penetrated in support wire surface is scattered so that the light that the photoresist on substrate is received is more uniform.
7. base plate exposure platform as claimed in claim 6, it is characterised in that the support pin is cylindrical.
8. base plate exposure platform as claimed in claim 6, it is characterised in that the platform body and the material phase for supporting pin
Together, it is metal；The platform body uses welding or is integrally formed and is made with support pin.
9. base plate exposure platform as claimed in claim 6, it is characterised in that the material of the scattering coating is ceramics.
10. a kind of exposure machine, it is characterised in that including the base plate exposure platform as described in claim 1 or 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510507584.6A CN105182692B (en) | 2015-08-18 | 2015-08-18 | Base plate exposure platform and exposure machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510507584.6A CN105182692B (en) | 2015-08-18 | 2015-08-18 | Base plate exposure platform and exposure machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105182692A CN105182692A (en) | 2015-12-23 |
| CN105182692B true CN105182692B (en) | 2017-09-01 |
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| CN201510507584.6A Active CN105182692B (en) | 2015-08-18 | 2015-08-18 | Base plate exposure platform and exposure machine |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107505814A (en) * | 2017-08-28 | 2017-12-22 | 深圳市华星光电技术有限公司 | A kind of exposure machine article carrying platform device |
| CN108415224A (en) * | 2018-03-22 | 2018-08-17 | 京东方科技集团股份有限公司 | Exposure system and exposure machine microscope carrier |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001244177A (en) * | 2000-02-28 | 2001-09-07 | Nikon Corp | Stage apparatus and holder, scanning aligner and aligner |
| JP4288694B2 (en) * | 2001-12-20 | 2009-07-01 | 株式会社ニコン | Substrate holding apparatus, exposure apparatus, and device manufacturing method |
| JP2004264371A (en) * | 2003-02-21 | 2004-09-24 | Tadahiro Omi | Exposure apparatus for liquid crystal panel |
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