CN102629078A - Exposure technology and device - Google Patents
Exposure technology and device Download PDFInfo
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- CN102629078A CN102629078A CN2011102380779A CN201110238077A CN102629078A CN 102629078 A CN102629078 A CN 102629078A CN 2011102380779 A CN2011102380779 A CN 2011102380779A CN 201110238077 A CN201110238077 A CN 201110238077A CN 102629078 A CN102629078 A CN 102629078A
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Abstract
The invention belongs to the field of exposure technology and discloses an exposure technology, which comprises steps of: vertically arranging a substrate coated with a photoresist, making the substrate parallel to a mask for exposure, and carrying out exposure on the photoresist while making the light irradiation direction of the exposure machine perpendicular to the mask. The invention also discloses an exposure device, which contains a substrate carrying platform for fixing the exposed substrate and a mask carrying platform for fixing the mask. The substrate carrying platform is vertically arranged. The mask carrying platform can be overturned from the horizontal plane to be parallel to the substrate carrying platform. According to the invention, the exposure mode is changed from traditional horizontal exposure mode to vertical exposure mode, deformation of the mask due to its gravity is overcome, and the whole graphic deformation obtained by exposure is minimized. In addition, the whole positioning accuracy of the graph obtained by exposure during the subsequent process is raised, and adverse phenomena such as light leakage and nonuniform brightness caused by large graphic tolerance difference are avoided.
Description
Technical field
The present invention relates to the exposure technique field, particularly relate to a kind of exposure technology and device.
Background technology
The existing exposure device that utilizes to the technological process of resist exposure is: at first with in the glass substrate input exposure flow process; Glass substrate is loaded on the baseplate carrier, carries out preparatory contraposition, through vacuumizing processing glass substrate is adsorbed on the baseplate carrier then; Gap between adjustment glass substrate and the mask; And realizing the accurate contraposition between glass substrate and the mask, contraposition utilizes ultraviolet light to the resist exposure on the glass substrate after accomplishing; Remove the vacuum between glass substrate and the baseplate carrier then, glass substrate is unloaded from baseplate carrier.
In the existing exposure technology, glass substrate and mask average level are provided with, because the effect of mask self gravitation, mask is easy to deform, and deformation takes place figure integral body after causing making public, and influences the product yield.
Be example with the color membrane substrates processing procedure below, describe the existing existing drawback of exposure technology.Fig. 1 shows and utilizes the synoptic diagram of existing exposure technology to resist exposure on the color membrane substrates; The glass substrate 2 that is coated with photoresist 3 is attracted on the baseplate carrier 1; Mask 5 is fixed on the mask microscope carrier 4; Be positioned at glass substrate 2 top certain distances, ultraviolet light 6 is through 3 exposures of the photoresist on 5 pairs of glass substrates 2 of mask.Under illustrated Exposure mode condition, the surface state that mask 5 is placed on the mask microscope carrier 4 is as shown in fig. 1, though mask thicker (about usually 8mm), because the influence of deadweight can find out that mask 5 surfaces still have depression.Fig. 2 shows the synoptic diagram after the photoresist developing of Fig. 1 exposure, and the out-of-flatness on mask 5 surfaces is amplified on glass substrate 2 surfaces through exposure, can cause post-develop glue pattern 7 whole deformation at quarter.
Fig. 3 is based on actual tolerance that color membrane substrates produced and the diagram of the deviation between the design tolerance after Fig. 1 exposure; Dashed graph is represented the design tolerance figure among the figure; The solid line figure of band round dot is represented actual tolerance figure; As can be seen from the figure, actual tolerance and design tolerance have certain departing from.The color membrane substrates that Fig. 4 is based on after Fig. 1 exposure carries out the tolerance variations diagram that the pictures different making technology is occurred; The dashed graph representative coordinates indicates among the figure; The solid line figure of band round dot is represented the wherein actual tolerance figure of image once making technology; The solid line figure of band cross is represented the actual tolerance figure of another time image making technology, as can be seen from the figure, has certain tolerance variations between the pictures different making technology.
Can find out by Fig. 3 and Fig. 4; In the color membrane substrates processing procedure; Because mask 5 surface curvatures cause having aligned and coincided deviation between each image making technology; When especially use color membrane substrates to the wide visual angle of transverse electric field effect display technique or fringe field switching technology, the standard size of deceiving matrix is very little, under the bigger situation of tolerance variations, is easy to occur bad light leakage phenomena as shown in Figure 5.Among Fig. 5, the regional area of getting on the color membrane substrates 8 is an example, and 10 are black matrix among the figure; R/G/B representes respectively red/green/blue color film; On normal color membrane substrates 8, light leak zone 9 has appearred in red color membrane portions, and the brightness irregularities phenomenon can appear in the display of processing thus.
Summary of the invention
The technical matters that (one) will solve
The technical matters that the present invention will solve is mask distortion how to avoid causing because of the mask action of gravity in the exposure technology and the photoresist figure bulk deformation phenomenon behind the exposure imaging.
(2) technical scheme
In order to solve the problems of the technologies described above; The present invention provides a kind of exposure technology; The substrate that is coated with photoresist vertically is provided with, and it is parallel with said substrate with mask to make public, and the irradiate light direction of exposure machine is made public to said photoresist perpendicular to said mask.
Wherein, the said substrate that will be coated with photoresist vertically is provided with and is specially: said substrate is fixed on the baseplate carrier of level, said baseplate carrier is carried out 90 ° of upsets, realize that substrate vertically is provided with.
Wherein, said exposure is specially with said substrate is parallel with mask: said mask is fixed on the mask microscope carrier of level, said mask microscope carrier is carried out 90 ° of upsets, realize that mask is parallel with substrate.
The present invention also provides a kind of exposure device, comprises that fixing said baseplate carrier vertically is provided with by the baseplate carrier of exposure base and the fixing mask microscope carrier of mask, and said mask microscope carrier can be turn to parallel with said baseplate carrier by surface level.
Wherein, said exposure device also includes rollover stand, and said rollover stand is arranged between said mask microscope carrier and the mask microscope carrier mount pad, drives the mask microscope carrier by said rollover stand and between surface level and vertical plane, overturns.
Wherein, said exposure device also includes rollover stand, and said rollover stand is arranged between said baseplate carrier and the baseplate carrier mount pad, drives baseplate carrier by said rollover stand and between surface level and vertical plane, overturns.
(3) beneficial effect
Exposure technology that technique scheme provided and exposure device change to the vertical exposure mode with Exposure mode by the conventional horizontal exposure, overcome mask plate owing to the deformation that the self gravitation effect causes, the whole deformation of the figure that exposure is obtained reduces; And improve the whole aligning accuracy of figure in successive process that exposure obtains, avoid because bad phenomenon such as light leak that the figure tolerance differences causes more greatly and brightness irregularities.
Description of drawings
Fig. 1 utilizes the synoptic diagram of existing exposure technology to resist exposure on the color membrane substrates;
Fig. 2 is to the synoptic diagram after the photoresist developing that makes public among Fig. 1;
Fig. 3 is based on actual tolerance that color membrane substrates produced and the diagram of the deviation between the design tolerance after Fig. 1 exposure;
The color membrane substrates that Fig. 4 is based on after Fig. 1 exposure carries out the tolerance variations diagram that the pictures different making technology is occurred;
Fig. 5 is based on the light leakage phenomena synoptic diagram that color membrane substrates occurred after Fig. 1 exposure;
Fig. 6 utilizes the synoptic diagram of the exposure technology of the embodiment of the invention to resist exposure on the color membrane substrates;
Fig. 7 is to the synoptic diagram after the photoresist developing that makes public among Fig. 6.
Wherein, 1: baseplate carrier; 2: glass substrate; 3: photoresist; 4: the mask microscope carrier; 5: mask; 6: ultraviolet light; 7: post-develop is carved glue pattern; 8: color membrane substrates; 9: the light leak zone; 10: black matrix.
Embodiment
Below in conjunction with accompanying drawing and embodiment, specific embodiments of the invention describes in further detail.Following examples are used to explain the present invention, but are not used for limiting scope of the present invention.
In order to overcome the existing series of malpractice of existing horizontal exposure technology; Present embodiment is based on the existing level exposure technology; The substrate that is coated with photoresist vertically is provided with; Exposure is set to parallel with substrate with mask, the irradiate light direction of exposure machine is made public to photoresist perpendicular to mask, and exposure machine commonly used uses ultraviolet light to resist exposure.Mask plate is owing to vertically place; Horizontal direction deformation takes place very little, though at vertical direction the self gravitation influence is arranged, from vertical direction; The relative existing level Exposure mode of its thickness thickness increases very many; And the supporting role of mask plate microscope carrier in addition, therefore vertically mask is very little in vertical direction deformation, can get rid of the influence of mask deformation to the figure tolerance during exposure basically; The photoresist figure that forms after the exposure improves the product yield according to regular being transferred on the substrate of design.
Present embodiment is an example with the making technology of color membrane substrates, describes exposure technology wherein in detail.The technological process of its exposure is: at first with in the glass substrate input exposure flow process, glass substrate is loaded on the baseplate carrier, carries out preparatory contraposition; Through vacuumizing processing glass substrate is adsorbed on the baseplate carrier then; If baseplate carrier is vertically to be provided with, then directly realize the vertical setting of glass substrate, if the baseplate carrier original position is for being horizontally disposed with; Then baseplate carrier be set to turning, through the vertical setting of the 90 ° of realization glass substrates that overturn.When glass substrate vertically is provided with, mask also vertically is provided with, its set-up mode is identical with the set-up mode of glass substrate.Then, move glass substrate, guarantee prepsetting gap between the two near mask plate; And realizing the accurate contraposition between glass substrate and the mask plate, contraposition utilizes ultraviolet light to the resist exposure on the glass substrate after accomplishing; After exposure is accomplished,, then need control basal plate microscope carrier rollback if baseplate carrier turn to current vertical position by original horizontal level; Leave the mask certain distance; Again the reverse upset of baseplate carrier is returned back to the original level position for 90 °, remove the vacuum between glass substrate and the baseplate carrier afterwards, glass substrate is unloaded from baseplate carrier.
Fig. 6 shows the exposure technology of the utilizing present embodiment synoptic diagram to resist exposure on the color membrane substrates; The glass substrate 2 that is coated with photoresist 3 is attracted on the vertical baseplate carrier 1; Mask 5 is fixed on the mask microscope carrier 4 of vertical setting; Glass substrate 2 has all been realized vertical setting with mask 5, and mask 5 is positioned at the place ahead certain distance near glass substrate 2 one sides, and the radiation direction of ultraviolet light 6 is in a horizontal manner through 3 exposures of the photoresist on 5 pairs of glass substrates 2 of mask.Fig. 7 shows the synoptic diagram after the photoresist developing that makes public among Fig. 6, and the vertical set-up mode of mask 5 makes it all very little with the deformation of vertical direction in the horizontal direction, thereby makes the photoresist figure deformation that obtains after exposure and the development also very little.
Above-mentioned exposure technology can improve the tolerance grade of exposure process in the color membrane substrates manufacture craft; Optimize the homogeneity of overlapping distribution between each zone, surface and the black matrix of red/green/blue each layer pattern and chock insulator matter figure; Thereby reduce the possibility of bad generations such as light leak, reduce owing to red/green/blue each layer pattern, chock insulator matter figure and black matrix contraposition out of true, the caused various brightness irregularities of skewness.
Based on the exposure technology of embodiment 1, present embodiment provides a kind of exposure device, and this exposure device only need be realized vertical parallel get final product of glass substrate with mask of being made public.Particularly, vertically be provided with by the baseplate carrier of exposure base, and make the mask microscope carrier of fixing mask parallel with baseplate carrier with fixing in the exposure device.
In order to make the functional diversities of exposure device, present embodiment preferably is provided with rollover stand between baseplate carrier and baseplate carrier mount pad, drives baseplate carrier by this rollover stand and between surface level and vertical plane, overturns; Simultaneously also can between mask microscope carrier and mask microscope carrier mount pad, rollover stand be set, drive the mask microscope carrier by this rollover stand and between surface level and vertical plane, overturn.Based on the exposure device of said structure, promptly can realize embodiment 1 described vertical exposure technology, can realize needed level exposure under the specified conditions again, two functions are combined in the device, the structure of simplification device reduces cost.
Can be found out that by above embodiment the embodiment of the invention changes to the vertical exposure mode with Exposure mode by the conventional horizontal exposure, overcome mask plate owing to the deformation that the self gravitation effect causes, the whole deformation of the figure that exposure is obtained reduces; And improve the whole aligning accuracy of figure in successive process that exposure obtains, avoid because bad phenomenon such as light leak that the figure tolerance differences causes more greatly and brightness irregularities.
The above only is a preferred implementation of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from know-why of the present invention; Can also make some improvement and replacement, these improvement and replacement also should be regarded as protection scope of the present invention.
Claims (6)
1. an exposure technology is characterized in that, the substrate that is coated with photoresist vertically is provided with, and it is parallel with said substrate with mask to make public, and the irradiate light direction of exposure machine is made public to said photoresist perpendicular to said mask.
2. exposure technology as claimed in claim 1 is characterized in that, the said substrate that will be coated with photoresist vertically is provided with and is specially: said substrate is fixed on the baseplate carrier of level, said baseplate carrier is carried out 90 ° of upsets, realize that substrate vertically is provided with.
3. exposure technology as claimed in claim 1; It is characterized in that; Said exposure is specially with said substrate is parallel with mask: said mask is fixed on the mask microscope carrier of level, said mask microscope carrier is carried out 90 ° of upsets, realize that mask is parallel with substrate.
4. exposure device comprises fixingly being it is characterized in that by the baseplate carrier of exposure base and the fixing mask microscope carrier of mask said baseplate carrier vertically is provided with that said mask microscope carrier can be turn to parallel with said baseplate carrier by surface level.
5. exposure device as claimed in claim 4; It is characterized in that; Said exposure device also includes rollover stand, and said rollover stand is arranged between said mask microscope carrier and the mask microscope carrier mount pad, drives the mask microscope carrier by said rollover stand and between surface level and vertical plane, overturns.
6. exposure device as claimed in claim 4; It is characterized in that; Said exposure device also includes rollover stand, and said rollover stand is arranged between said baseplate carrier and the baseplate carrier mount pad, drives baseplate carrier by said rollover stand and between surface level and vertical plane, overturns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102380779A CN102629078A (en) | 2011-08-18 | 2011-08-18 | Exposure technology and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102380779A CN102629078A (en) | 2011-08-18 | 2011-08-18 | Exposure technology and device |
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| CN102629078A true CN102629078A (en) | 2012-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011102380779A Pending CN102629078A (en) | 2011-08-18 | 2011-08-18 | Exposure technology and device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014176822A1 (en) * | 2013-04-28 | 2014-11-06 | 京东方科技集团股份有限公司 | Exposure system, exposure method and mask support structure |
| CN104749874A (en) * | 2015-03-26 | 2015-07-01 | 京东方科技集团股份有限公司 | Mask plate, mask exposure apparatus and mask exposure method |
| CN105565253A (en) * | 2014-10-17 | 2016-05-11 | 中芯国际集成电路制造(上海)有限公司 | MEMS (Micro-Electro-Mechanical System) device, manufacturing method thereof and electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5204711A (en) * | 1990-06-08 | 1993-04-20 | Nippon Seiko Kabushiki Kaisha | Projection exposure device |
| CN1573406A (en) * | 2003-05-30 | 2005-02-02 | 株式会社Orc制作所 | Apparatus and method for projection exposure |
| CN1896875A (en) * | 2006-06-02 | 2007-01-17 | 上海微电子装备有限公司 | Photoetching equipment |
-
2011
- 2011-08-18 CN CN2011102380779A patent/CN102629078A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5204711A (en) * | 1990-06-08 | 1993-04-20 | Nippon Seiko Kabushiki Kaisha | Projection exposure device |
| CN1573406A (en) * | 2003-05-30 | 2005-02-02 | 株式会社Orc制作所 | Apparatus and method for projection exposure |
| CN1896875A (en) * | 2006-06-02 | 2007-01-17 | 上海微电子装备有限公司 | Photoetching equipment |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014176822A1 (en) * | 2013-04-28 | 2014-11-06 | 京东方科技集团股份有限公司 | Exposure system, exposure method and mask support structure |
| CN105565253A (en) * | 2014-10-17 | 2016-05-11 | 中芯国际集成电路制造(上海)有限公司 | MEMS (Micro-Electro-Mechanical System) device, manufacturing method thereof and electronic device |
| CN105565253B (en) * | 2014-10-17 | 2019-06-28 | 中芯国际集成电路制造(上海)有限公司 | A kind of MEMS device and preparation method thereof, electronic device |
| CN104749874A (en) * | 2015-03-26 | 2015-07-01 | 京东方科技集团股份有限公司 | Mask plate, mask exposure apparatus and mask exposure method |
| WO2016150043A1 (en) * | 2015-03-26 | 2016-09-29 | 京东方科技集团股份有限公司 | Mask plate, mask exposure device and mask exposure method |
| US10067417B2 (en) | 2015-03-26 | 2018-09-04 | Boe Technology Group Co., Ltd. | Mask plate, mask exposure device and mask exposure method |
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Application publication date: 20120808 |