WO2014176822A1

WO2014176822A1 - Exposure system, exposure method and mask support structure

Info

Publication number: WO2014176822A1
Application number: PCT/CN2013/078230
Authority: WO
Inventors: 张继凯; 吴洪江; 黎敏; 万冀豫; 杨同华; 查长军
Original assignee: 京东方科技集团股份有限公司; 北京京东方显示技术有限公司
Priority date: 2013-04-28
Filing date: 2013-06-27
Publication date: 2014-11-06
Also published as: CN103268057B; CN103268057A

Abstract

An exposure system, an exposure method and a mask plate support structure. The exposure system comprises: a support structure (5) used for supporting a mask plate (1), and a base stage (6) used for arranging a substrate (7), wherein the support structure (5) supports the mask plate (1), enabling the mask plate (1) to be obliquely set to an angle of θ relative to a horizontal plane, and the base stage (6) supports the substrate (7) , enabling the substrate (7) parallel to the mask plate (1). This structure can effectively reduce the sag amount of the mask plate.

Description

Exposure system, exposure method and mask support structure

The present invention relates to an exposure system, an exposure method, and a mask support structure. Background technique

At present, when the substrate is exposed, the base, the reticle, and the substrate are horizontally placed, wherein the reticle is horizontally placed on the support structure, and the support structure supports the edge of the reticle. Due to the influence of gravity, a sag is generated in the middle of the reticle. . 1 is a schematic view of the middle portion of the mask when the mask is horizontally placed. As shown in FIG. 1, the support structure 5 supports the edge of the mask 1. Under the action of gravity, the middle portion of the mask 1 is bent downward to generate a sag amount. When the exposure is performed, since the middle portion of the mask 1 is bent, the exposure shift is caused.

In the prior art, the problem of solving the downward sag of the reticle to produce a sag amount is mainly as follows.

2 is a schematic view showing the increase of the surface negative pressure on the mask plate in the prior art. As shown in FIG. 2, a vacuum device is disposed above the mask plate 1. The negative pressure device includes a negative pressure structure 2 and an adsorption hole 3, and the adsorption hole 3 Located above the two edges of the mask 1 , when the vacuum device is activated, the adsorption hole 3 is sucked into a portion of the air above the mask 1 to reduce the pressure above the mask 1 , and the air below the mask 1 is generated. An upward force reduces or eliminates the effect of the gravity of the reticle 1 on itself, thereby reducing or eliminating the degree of curvature and sag in the middle of the reticle 1.

3 is a schematic view showing the two edges of the reticle mask in the prior art. As shown in FIG. 3, a pressing device 4 is disposed at both edges of the reticle 1, and the squeezing device 4 produces a slanting device 4 from the two edges to the middle direction. The force of the mask 1 is tilted up, thereby reducing the degree of bending and the amount of sag in the middle of the mask 1.

In order to increase the surface negative pressure on the reticle, it is necessary to provide a negative pressure device above the reticle. In this way, the cost of the negative pressure device is generated, and the economic benefit is reduced. In the manner of squeezing the two edges of the mask, it is necessary to provide a pressing device at both edges of the mask. In this way, it is possible to damage the mask during the process of pressing both edges of the mask, thereby causing unnecessary damage. Summary of the invention

According to an embodiment of the present invention, there is provided an exposure system including: a support structure for supporting the mask and a base for setting a substrate, wherein the support structure supports the mask such that the mask The stencil is angled with respect to a horizontal plane and the pedestal supports the substrate such that the substrate is parallel to the reticle.

According to an embodiment of the present invention, there is also provided an exposure method, comprising: disposing the mask plate on a support structure such that the mask plate is disposed at an angle with respect to a horizontal plane to set a substrate on the base; The base is disposed in parallel with the mask; the substrate is exposed through the mask.

According to an embodiment of the present invention, a mask support structure is further provided, including: a support frame on which a mask plate is disposed; and an inclination adjusting device for adjusting the support frame to Tilt the preset angle relative to the horizontal plane^

Preferably, the irradiation direction of the light for exposure is perpendicular to the surface of the mask.

Preferably, the set angle ^{0 ≥ arCCOS (0} - ⁰⁵ where is the maximum sag amount when the reticle is horizontally placed.

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly described below. It is obvious that the drawings in the following description relate only to some embodiments of the present invention, rather than to the present invention. limit.

Figure 1 is a schematic view of the middle portion of the mask placed horizontally;

2 is a schematic view showing an increase in surface negative pressure on a mask plate in the prior art;

3 is a schematic view showing two edges of a squeeze mask in the prior art;

4 illustrates an arrangement of a support structure for supporting a reticle and a base for supporting a substrate in an exposure system according to an embodiment of the present invention;

Figure 5 is a schematic view showing the relationship between the inclination angle of the mask and the force; and

Figure 6 shows the relationship between the set angle S and the sag amount H. detailed description

In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the following will be combined with the present invention. The technical solutions of the embodiments of the present invention are clearly and completely described in the accompanying drawings. It is apparent that the described embodiments are part of the embodiments of the invention, rather than all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the described embodiments of the present invention without departing from the scope of the invention are within the scope of the invention.

An exposure system is provided in accordance with an embodiment of the present invention. As shown in Fig. 4, the exposure system includes: a support structure 5 for supporting the mask 1 and a base 6 for arranging the substrate 7. The support structure 5 supports the mask 1 such that the mask 1 is inclined at a predetermined angle with respect to the horizontal plane. The base 6 supports the substrate 7 such that the substrate 7 is parallel to the mask 1.

Since the mask 1 is at a set angle to the horizontal plane and the base 6 is parallel to the mask 1, the abutment 6 is at a set angle with the horizontal plane ^

In this embodiment, the mask plate 1 and the horizontal plane are set at a specific angle: the surface of the mask 1 is at a set angle with the horizontal plane. The base 6 is at a set angle with the horizontal plane. Specifically, the surface of the base 6 is horizontal and horizontal. Setting angle

Preferably, the setting angle ^{≥ arccos (0} - ⁰⁵ ) is the maximum amount of sag when the mask 1 is horizontally placed.

Ideally, the support structure supports the edge of the reticle and there is no sag when the reticle is placed horizontally. However, in practice, the mask is subjected to its own gravity, and a certain amount of sag is generated in a direction perpendicular to the surface thereof. The maximum sag amount is a dish, and the force of the reticle in a direction perpendicular to the surface thereof is G. Since the reticle is elastically changed, there is a modulus of elasticity in the direction perpendicular to the reticle and the modulus of elasticity is constant if the reticle is not broken.

Fig. 5 schematically shows the inclination angle of the mask 1, i.e., the relationship between the angle ^ and the force of the mask 1. As shown in Fig. 5, after the mask 1 is at a set angle to the horizontal plane, the ideal mask 10 has no sag in the direction perpendicular to its surface, but is still affected by gravity.

1 will produce a sag amount ( ^{h < h} ^ ) in a direction perpendicular to the surface thereof, and the force that the reticle 1 receives in a direction perpendicular to the surface thereof is G cos because the reticle 1 is not broken, the elasticity The modulus is fixed, so the equation relationship ^{= G} dish ^{= G c} can be established. ^s , from which the equation can be derived. According to the requirements of the current exposure, the sag of the mask 1 is not more than 0.05 mm, and the shell 'J = ^{005 θ χ ί} ι ^ΜΑχ ≤ 0.05, so ≥ arccos (0.05 / ) and 0 < ^ < 90 ° can be derived.

In summary, satisfying the setting angle of ^≥arccos ( ^05/ U and 0 << ⁹ 0) enables the mask Board 1 meets the specifications required for exposure.

Figure 6 shows the relationship between the set angle and the droop _3⁄4 when ^ = ²⁵ "^. As shown in Fig. 6, the relationship between the set angle and the sag is H = cos ^x ^ = 0.25 cos ^ When the mask 1 is placed horizontally ^ 0, the amount of sag H = h _MAX = 0.25 mm _? The maximum amount of sag at this time. When H ≤ 0.05 mm, arccosd / ⁵ ) < ^ < ⁹ 0 ° can be calculated, that is, all The set angle that satisfies this condition can be.

In this embodiment, the mask is at a set angle to the horizontal plane such that the amount of sag of the mask is less than the maximum amount of sag, which greatly reduces the amount of sag of the mask, thereby overcoming the problem of sag of the mask.

In an exposure system provided by this embodiment, the mask is supported at a set angle to the horizontal plane, and the base is parallel to the mask to overcome the sagging problem of the mask. In addition, the mask plate, the substrate, and the base are tilted to reduce the probability of particles falling on the mask, the substrate, and the base during exposure.

Further, preferably, the irradiation direction of the light for exposure 8 is perpendicular to the mask 1. When the irradiation direction of the exposure light line 8 is perpendicular to the mask 1, the light intensity transmitted through the mask is the largest.

According to an embodiment of the present invention, there is further provided an exposure method, the exposure method comprising the following steps S201-S204:

Step S201: disposing the mask on the support structure so that the mask is inclined with respect to the horizontal plane.

For example, the mask is placed on the support structure, the support structure is supported on the edge of the mask, and the support structure is adjusted such that the mask is disposed at a set angle S to the horizontal.

Step S202: The substrate is placed on the base.

For example, the substrate is placed on the base and the substrate and the base are kept relatively fixed.

Step S203: The base is arranged in parallel with the mask.

For example, based on the position of the mask, the position of the base is adjusted such that the base is placed in parallel with the mask, and the substrate is also disposed in parallel with the mask.

Step S204: Exposing the substrate through the mask.

The substrate is exposed through the mask using light for exposure.

Preferably, the direction of illumination of the exposure light is perpendicular to the mask. When the illumination direction of the exposure light is perpendicular to the mask, the light intensity transmitted through the mask is maximized.

Preferably, the set angle satisfies ^≥arcc ° ^s ( ^{( ) 5 /} U , where the leg is the maximum amount of sag when the reticle 1 is placed horizontally. Optionally, in an actual application, the order of the foregoing steps S201, S202, S203, and S204 may be adjusted. For example, step S202 and step S203 may be performed first, then step S101 is performed, and finally step S204 is performed.

The exposure method provided by this embodiment can be implemented by using the exposure system provided in the previous embodiment.

In addition, by arranging the mask, the substrate, and the abutment obliquely, the probability of particles falling on the mask, the substrate, and the pedestal during exposure can be reduced.

Further, according to an embodiment of the present invention, there is further provided a mask supporting structure comprising: a support frame on which a mask plate is disposed; and an inclination adjusting device for adjusting the support frame, Tilt the preset angle relative to the horizontal plane

As previously discussed, preferably, the set angle ^{≥ arca} ^ ^{Q5 /} U , wherein the dish is the maximum amount of sag when the reticle is placed horizontally.

The above embodiments are only used to explain the technical solutions of the embodiments of the present invention, and are not limited thereto; although the embodiments of the present invention are described in detail with reference to the foregoing embodiments, those skilled in the art should understand that The technical solutions described in the embodiments are modified, or the equivalents of the technical features are replaced by the equivalents. The modifications and substitutions of the embodiments do not depart from the spirit and scope of the technical solutions of the embodiments of the embodiments of the present invention.

Claims

Claim

What is claimed is: 1. An exposure system comprising: a support structure for supporting the mask and a base for setting a substrate, wherein the support structure supports the mask such that the mask is inclined with respect to a horizontal plane The angle is fixed and the base supports the substrate such that the substrate is parallel to the reticle.

The exposure system according to claim 1, wherein an irradiation direction of the light for exposure is perpendicular to a surface of the mask.

The exposure system according to claim 1 or 2, wherein the set angle ^ ≥ rccos (0.05 / ^) _? wherein 3⁄4M is the maximum sag amount when the reticle is horizontally placed.

4. An exposure method comprising:

The mask is disposed on the support structure such that the mask is inclined at an angle relative to a horizontal plane ^

Locating a substrate on the base;

Arranging the base in parallel with the mask;

The substrate is exposed through the mask.

The exposure method according to claim 4, wherein the irradiation direction of the light for exposure is perpendicular to the surface of the mask.

The exposure method of claim 4 or 5 as claimed in claim 6, wherein said predetermined angle ^ ≥ rccos (0.05 / ^) ? Wherein the maximum amount of sag ^ dish placed in said horizontal mask.

A reticle support structure comprising: a support frame on which a reticle is disposed; and an inclination adjusting device for adjusting the support frame to be inclined at a predetermined angle with respect to a horizontal plane

The mask supporting structure according to claim 7, wherein the set angle ^ ≥ rccos (0.05 / ^) _? wherein 3⁄4M is the maximum sag amount when the reticle is horizontally placed.