CN105180986B - A kind of sample test/processing unit - Google Patents
A kind of sample test/processing unit Download PDFInfo
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- CN105180986B CN105180986B CN201510624126.0A CN201510624126A CN105180986B CN 105180986 B CN105180986 B CN 105180986B CN 201510624126 A CN201510624126 A CN 201510624126A CN 105180986 B CN105180986 B CN 105180986B
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- specimen holder
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Abstract
The present invention provides a kind of sample test/processing unit, can solve the problem that the problem of prior art systems are complicated, huge and less efficient.Sample test/the processing unit, including base structure, operation post, specimen holder, specimen holder supporting mechanism, controller and multiple PROCESS FOR TREATMENT units, wherein base structure, operation post, specimen holder are sequentially arranged from top to bottom；The specimen holder supporting mechanism is used to being connected and locking specimen holder；The multiple PROCESS FOR TREATMENT unit is fixedly installed in operation post, operation post is connected with base structure, unified service line connector is provided with base structure, operation post in the vertical direction penetrates duct with corresponding with the service line link position；The specimen holder supporting mechanism stretches out from below operation post through the insertion duct, and is connected with and rotates horizontally drive mechanism and lift drive mechanism to realize the horizontal rotation of specimen holder supporting mechanism and vertical lift function.
Description
Technical field
The present invention relates to a kind of device for being used to testing or handling sample, can be used in carrying out surface test to various samples
With turn-over processing.
Background technology
Semiconductor laser has the advantages that small volume, energy efficiency height, long lifespan, is easy to modulation, and its application covers
Whole opto-electronics have been covered, have turned into the core technology of current photoelectron science.And semiconductor laser chip is whole laser
The technological core of industrial chain and source, it is the key for driving whole industry development.In semiconductor device technology, surface treatment is extremely
Close important, determine performance and the life-span of device, and the technical difficult points of industry development.
The processing of laser semiconductor chip surface state optimizes reformation primarily directed to semiconductor laser chip surface state and come
Improve optical output power and service life.Laser surface state processing intent is to remove surface contamination, saturated surface dangling bonds etc. no
Stable state, or further include surface modification to conform better to the use of device, such as improve surface light injury threshold.Mesh
The processing of preceding laser chip surface state, relates generally to surface cleaning, passivation and plated film etc..
In view of the diversity and accuracy of sample treatment technique, mainly entered at present using different process device in workshop
The mode of row continuous productive process, therefore, whole system are complex, huge, also increase what is cooperated between each process unit
Difficulty.Therefore, need a kind of device that can be integrated and complete multiple process procedures badly, optimize system overall architecture.In fact, this is not
Only be semiconductor laser chip processing demand, LED chip, component of machine (small element) and chemical material etc. test or
Processing is desirable to simplify device as far as possible, improves efficiency.
Surface treatment for semiconductor chip, sample usually requires to be placed in specimen holder installation fixation, and specimen holder is in itself
And it is hanging set, fixed by supporting construction, the usual position of the technique unit handled sample is constant, therefore, when will
Ask when being dealt with to the two sides of sample, there is also a particular need for specimen holder can be overturn and keep surface to be treated and technique list
The relative position of member is constant.
The content of the invention：
It is an object of the invention to provide a kind of sample test/processing unit, can solve the problem that prior art systems are complicated, huge
The problem of big and less efficient.
The solution of the present invention is as follows：
A kind of sample test/processing unit, including base structure (such as roof of vacuum chamber), operation post, specimen holder,
Specimen holder supporting mechanism, controller and multiple PROCESS FOR TREATMENT units, wherein base structure, operation post, specimen holder are from top to bottom
It is sequentially arranged；The specimen holder is used to load pending sample, and the specimen holder supporting mechanism is used to being connected and locking sample
Product frame so that the operating area that specimen holder is in below operation post；The multiple PROCESS FOR TREATMENT unit is fixedly installed in operation
Platform, operation post are connected with base structure, and unified service line connector is provided with base structure, and operation post exists
On vertical direction duct is penetrated with corresponding with the service line link position；The specimen holder supporting mechanism is from operation post
Lower section is stretched out through the insertion duct, and is connected with and rotates horizontally drive mechanism and lift drive mechanism to realize specimen holder branch
The horizontal rotation of support mechanism and vertical lift function.
" from top to bottom " that is mentioned in above scheme, " level ", " vertical " allow for the limit that relative position relation is made
It is fixed, not definitely limit actual locus.Above-described base structure can have different structure type, if sample
The vacuum environment of product test/processing requirement closing, then the roof such as vacuum chamber, cover plate；If allow open space, example
Such as fixed support, pedestal.
Based on above scheme, the present invention has also further made following optimization：
Above-mentioned operation post is fixed by operation post supporting mechanism and base structure installation, and operation post supporting mechanism is corresponding
The space for housing specimen holder supporting mechanism is provided in the insertion duct, the multiple PROCESS FOR TREATMENT unit is electric accordingly
Circuit is also in the space interior cabling.Or operation post directly can also contact fixation with the bottom surface of base structure.
Forming sleeves form, operation post supporting mechanism are made on the whole for above-mentioned operation post supporting mechanism and specimen holder supporting mechanism
It is outer tube plugged and fixed in base structure, specimen holder supporting mechanism passes through operation post supporting mechanism as inner tube, the multiple
The annular space interior cabling that the corresponding circuit of PROCESS FOR TREATMENT unit is formed in sleeve pipe.
The lower end of above-mentioned specimen holder supporting mechanism is claw structure to lock specimen holder.
For demands such as semiconductor chip double treatments, a upset executing agency can be set up and (be located at the level of specimen holder
On direction), for being connected and driving specimen holder to overturn, executing agency is overturn by the controller coordinate and specimen holder supports
Mating connection of the mechanism to specimen holder.
Above-mentioned specimen holder includes horizontal fixed frame and the tumbler in fixed frame, is provided with tumbler for filling
The through hole of pending sample is carried, tumbler is connected by trip shaft and fixed frame installation；When specimen holder is positioned at processing station, institute
Specimen holder supporting mechanism is stated to be fixedly connected with fixed frame；When needing upset, the drive end of the upset executing agency is along water
Square disengaged to the coaxially connected fixation of the trip shaft of specimen holder, specimen holder supporting mechanism and fixed frame so that upset execution machine
Structure can drive the pending chip of tumbler and its loading can be relative to fixed frame flip-flop movement.
The tumbler of parallel at least two is provided with above-mentioned fixed frame.
When specimen holder needs upset, lift drive mechanism drives the specimen holder of specimen holder supporting mechanism and its fixation to move down,
Overturn executing agency's horizontal direction elongation and the trip shaft of specimen holder is connected, then specimen holder supporting mechanism takes off with specimen holder
Open and go up, after executing agency to be flipped overturns the tumbler of specimen holder, specimen holder supporting mechanism moves down again and specimen holder
Fixed frame be fixedly connected, retracted after upset executing agency and specimen holder disengagement, specimen holder supporting mechanism and specimen holder
Rise to required position.
In addition to above specimen holder structure, the specimen holder without fixed frame of following form can also be designed：I.e. specimen holder is
The tumbler of single piece is, it is necessary to when overturning, and the horizontal direction elongation of upset executing agency is fixedly connected with specimen holder, sample
Product frame supporting mechanism and specimen holder disengage, and upset executing agency continues to extend or bounce back remote so as to drag specimen holder in the horizontal direction
From the projected position of specimen holder supporting mechanism, after executing agency's driving specimen holder upset to be flipped, then drag specimen holder and return original
Position is connected with supporting mechanism again.
Above-mentioned multiple PROCESS FOR TREATMENT units include sample heating unit, temperature detection feedback unit and cooling unit；In sample
Bias unit is installed on product frame supporting mechanism so that can be according to technique when specimen holder supporting mechanism locks specimen holder
Demand is biased to specimen holder.
Annealing process can utilize sample heating unit therein and cooling unit to realize.And the design of bias unit, can be with
Above overall structure is made full use of, simple (grid bias power supply) wire that introduces is connected to specimen holder supporting mechanism, and specimen holder sheet is as leading
Electric material so that outside control power-up forms pending chip and the biasing electric field of target workspace.
The present invention has advantages below：
1st, system architecture is concise, compact, and multiple PROCESS FOR TREATMENTs can be carried out under same environment, improves efficiency.
2nd, specimen holder can realize larger area, can accommodate up to 300 laser chips, realize at laser chip surface
The mass production of reason process, the development to the whole laser chip industry of promotion are significant.
3rd, can make chip under same environment quickly carry out double treatment, without influence other functional parts layout and
Use；Particularly with the processing of semiconductor chip, avoid because transfer environment brings the hidden danger of pollution.
4th, different bias values can be set by technological requirement, can be effectively ensured for the techniques such as passivation, plated film, bias unit
Increase the compactness and adhesive force of film layer on the premise of film layer is injury-free.
5th, such as need to complete multiple coating process, the heater and cooling device in vacuum chamber make can be at any time in coating process
The annealing of film surface modification is carried out as desired.
Brief description of the drawings
Fig. 1 is the schematic diagram of the invention applied in semiconductor laser chip surface processing equipment.
Fig. 2 is the structural representation in vacuum chamber in Fig. 1.
Fig. 3 is the agent structure schematic diagram of the present invention.
Fig. 4 is the schematic diagram of the increase elevating mechanism of structure shown in Fig. 3.
Fig. 5 is the first embodiment of specimen holder in the present invention.
Fig. 6 is second of embodiment of specimen holder in the present invention.
Fig. 7, Fig. 8 are the third embodiments of specimen holder in the present invention.
Fig. 9 is that the schematic diagram (upward view) that executing agency is connected with specimen holder is overturn in the present invention.
Drawing reference numeral explanation：
1- vacuum technology chambers；2- vavuum pump connectors；The upset executing agency of 3- specimen holders；4- targets；5- targets bottom
Seat rotating device；6- operation post support meanss；The supporting mechanism of 7- specimen holders；8- operation posts；9- specimen holders；901st, 911- samples
The fixed frame of frame；902nd, the tumbler (rotating bezel) of 912- specimen holders；903rd, the trip shaft of 913- specimen holders；922- is without fixed edge
Frame tumbler；10- observation windows；11- plate valves；12- buffer chambers, the fixed position of 13- " sleeve pipe " sealings；
14- process gas gas circuits；15- aids in gas gas circuit；16- aids in gas mixing chamber；17- aids in gas venthole；
18- process gas mix chambers；19- target covering devices；The elevating mechanism of 20- sample rack supporting devices；21- process gas air inlets
Hole；22- process gas ventholes；23- sample rack supporting device claws；24- reflection shields (so as to which sample is uniformly heated)；25-
Heating unit；26- temperature detecting units.
Embodiment
Below in conjunction with accompanying drawing, by taking the application in terms of semiconductor laser chip surface processing equipment as an example, this hair is discussed in detail
Bright structure and effect.
In the present embodiment, vacuum technology chamber interior sets operation post, and operation post passes through operation post support meanss and vacuum
The top of processing chamber is connected, and operation post can be placed in the top of sputtering target material, can also inverted structure.
Heating unit, cooling unit and temperature feedback unit are housed inside operation post, advised according to variant technical process
Fixed temperature regulates and controls sample temperature.Heating unit can use but be not limited to electrical heating or the mode such as infrared lamps, every
After thin film is coated with, the condition that whether can be made annealing treatment and be annealed by process choice can in vacuum technology chamber
Optionally complete passivating film be coated with after or multilayer dielectric film be coated with after made annealing treatment.
Bias unit is via access specimen holder inside the operation post support meanss.Be cleaned physically in sample surfaces,
Chemical etching and it is coated with the technical process of deielectric-coating and starts bias unit, different bias values is set by technological requirement, with control
It is film-made compactness of layer etc..
The supporting mechanism of specimen holder and the branch that operation post support meanss are sleeve structure, operation post support meanss and specimen holder
The annular space of support mechanism is used for the control letter of sample heating unit, temperature detection feedback unit, bias unit, cooling device etc.
Number cabling.
Specimen holder can lift in vertical direction, can also set up turntable and drive its 360 degree of rotation in the horizontal direction.Root
According to the height for requiring adjustment specimen holder, the treatment effects such as thickness, uniformity can be aligned.
The upset executing agency of specimen holder can be connected with specimen holder, and it is clear to complete physics on the surface of chip one end
Clean, chemical etching, passivating film are coated be coated with deielectric-coating after, sample is overturn, another end surfaces are surface-treated
Process.Upset mode can regard the concrete condition of cavity design：The lift that scheme one, specimen holder pass through sample rack supporting device
Structure moves down, and the elongation of specimen holder switching mechanism horizontal direction is connected with specimen holder, and sample rack supporting device departs from specimen holder
Rise certain altitude, after drive mechanism to be flipped overturns specimen holder, sample rack supporting device declines to be connected with specimen holder, is overturn
Drive mechanism is retracted after departing from specimen holder, and specimen holder rises to required position progress subsequent technique and sees Fig. 5；Scheme two,
Local sample among specimen holder is carried out by upset by sample turnover driving mechanism and sees Fig. 6；Scheme three, specimen holder is designed as one
The tumbler of body part form, larger space is moved out to realize upset, Ran Houzai with the flexible of horizontal direction of switching mechanism
Put back to, reconnect and fix with the supporting mechanism of specimen holder, referring to Fig. 7, Fig. 8.
The base of target is provided with rotating device, can place multiple targets, and sputtering target can be according to process requirements and target
Service condition carries out rotating switching or the more target as sputter of mixing.
The specifically used method of the semiconductor laser chip surface processing equipment：
1) plate valve 11 for ensuring to connect between vacuum technology chamber 1 and cushion chamber 12 is closed；
2) pending semiconductor devices, such as laser chip are positioned in specimen holder 9；
3) specimen holder 9 is put on the sample delivery frame in surge chamber, 10 is evacuated to cushion chamber- 5~-7Torr；
4) plate valve is opened, specimen holder 9 is sent into vacuum technology chamber and is fixed on operation post 8；
5) plate valve 11 is closed；
6) technological process menu is opened, starting technological process, (menu allows synthesis clean, etching, passivation, plated film, annealing
Etc. all kinds of technical process.Also allow to load all kinds of gases, such as Ar, H2, N2, O2, etching gas etc., air pressure and processing to processing
Power, time etc. can be with program control)；
A) clean：Start heating unit and heat the sample to required temperature, be passed through gas to vacuum technology chamber, biasing
Power supply effect is lower to produce stable plasma, and sample surfaces are cleaned；
B) etch：Heating-up temperature is adjusted, is passed through gas, opens bias unit, stabilization is produced under grid bias power supply effect
Plasma, it is passed through corrosive gas and sample surfaces is performed etching；
C) it is passivated：Heating-up temperature is adjusted, is passed through inert gas, is produced under RF power supply or grid bias power supply effect stable etc.
Gas ions, then pass to passivation reaction gas and be passivated processing, reaction terminate after by the heating and cooling to passivating film at
Reason completes annealing process；
D) plated film：Heating-up temperature is adjusted, is passed through inert gas, stable plasma is produced under RF power supply effect, etc.
Gas ions bombardment target carries out plated film, while opens grid bias power supply, and regulation bias value makes film layer increase on the premise of injury-free
Add its compactness and adhesive force.
7) after completing single-sided process processing, double treatment is such as needed, sample can be overturn, PROCESS FOR TREATMENT is carried out to another side,
The menu of processing can be with entirely different one side in addition.
8) after the completion of handling, plate valve is opened, sample is moved on to cushion chamber；
9) plate valve 11 is closed, atmospheric pressure is deflated to buffer chamber 12；
10) sample handled well is taken out.
The equipment can be sequentially completed the physics cleaning positioned at the Cavity surface at chip both ends under a vacuum environment, chemistry is carved
Erosion, surface are modified, passivating cavity surface film be coated with deielectric-coating process for plating, dispose surface state or the interface of Cavity surface to greatest extent
The non-radiative recombination centers such as state, or even change surface energy band structure, the power output and COMD threshold values of laser chip are effectively improved,
Increase the chip life-span.
Claims (9)
- A kind of 1. sample test/processing unit, it is characterised in that：Including base structure, operation post, specimen holder, specimen holder branch Support mechanism, controller and multiple PROCESS FOR TREATMENT units, wherein base structure, operation post, specimen holder are sequentially arranged from top to bottom； The specimen holder is used to load pending sample, and the specimen holder supporting mechanism is used to being connected and locking specimen holder so that The operating area that specimen holder is in below operation post；The multiple PROCESS FOR TREATMENT unit is fixedly installed in operation post, operation post It is connected with base structure, unified service line connector is provided with base structure, operation post is in vertical direction It is upper to penetrate duct with corresponding with the service line link position；The specimen holder supporting mechanism passes through from below operation post The insertion duct is stretched out, and is connected with and rotates horizontally drive mechanism and lift drive mechanism to realize specimen holder supporting mechanism Rotate horizontally and be vertically moved up or down function；The operation post is fixed by operation post supporting mechanism and base structure installation, and operation post supporting mechanism corresponds to institute State insertion duct and space for housing specimen holder supporting mechanism, the multiple corresponding electric wiring of PROCESS FOR TREATMENT unit are provided Also in the space interior cabling.
- 2. sample test/processing unit according to claim 1, it is characterised in that：The operation post supporting mechanism and sample Product frame supporting mechanism forming sleeves form on the whole, operation post supporting mechanism is as outer tube plugged and fixed in base structure, sample Product frame supporting mechanism passes through operation post supporting mechanism as inner tube, and the multiple corresponding circuit of PROCESS FOR TREATMENT unit is in sleeve pipe institute The annular space interior cabling of formation.
- 3. sample test/processing unit according to claim 1, it is characterised in that：Under the specimen holder supporting mechanism Hold is claw structure to lock specimen holder.
- 4. sample test/processing unit according to claim 1, it is characterised in that：Sample test/the processing unit is also wrapped The upset executing agency in the horizontal direction of specimen holder is included, for being connected and driving specimen holder to overturn, by the control Device processed coordinates the mating connection of upset executing agency and specimen holder supporting mechanism to specimen holder.
- 5. sample test/processing unit according to claim 4, it is characterised in that：The specimen holder includes horizontal consolidate Determine frame and the tumbler in fixed frame, the through hole for loading pending sample is provided with tumbler, tumbler leads to Trip shaft is crossed to connect with fixed frame installation；When specimen holder is positioned at processing station, the specimen holder supporting mechanism coordinates with fixed frame It is connected；When needing upset, trip shaft of the drive end for overturning executing agency in the horizontal direction with specimen holder coaxially connects Connect fixation, specimen holder supporting mechanism disengages with fixed frame so that upset executing agency can drive treating for tumbler and its loading Process chip can be relative to fixed frame flip-flop movement.
- 6. sample test/processing unit according to claim 5, it is characterised in that：It is provided with the fixed frame parallel At least two tumblers.
- 7. sample test/processing unit according to claim 5, it is characterised in that：When specimen holder needs upset, lifting is driven Motivation structure drives the specimen holder of specimen holder supporting mechanism and its fixation to move down, the horizontal direction elongation of upset executing agency and specimen holder Trip shaft be connected, then specimen holder supporting mechanism is disengaged and gone up with specimen holder, and executing agency to be flipped is by specimen holder Tumbler upset after, specimen holder supporting mechanism moves down again to be fixedly connected with the fixed frame of specimen holder, overturn execution machine Structure is retracted after being disengaged with specimen holder, and specimen holder supporting mechanism and specimen holder rise to required position.
- 8. sample test/processing unit according to claim 4, it is characterised in that：The specimen holder is single piece Tumbler, it is necessary to when overturning, the horizontal direction elongation of upset executing agency is fixedly connected with specimen holder, and specimen holder supports machine Structure disengages with specimen holder, and upset executing agency continues to extend or bounce back so as to drag specimen holder away from specimen holder branch in the horizontal direction The projected position of support mechanism, after executing agency to be flipped driving specimen holder upset, then drag specimen holder keep in the center again with branch Support mechanism is connected.
- 9. sample test/processing unit according to claim 1, it is characterised in that：The multiple PROCESS FOR TREATMENT unit bag Include sample heating unit, temperature detection feedback unit and cooling unit；Bias unit is installed on specimen holder supporting mechanism, made Proper specimen holder supporting mechanism can be biased when locking specimen holder according to process requirements to specimen holder.
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| CN201510624126.0A CN105180986B (en) | 2015-09-25 | 2015-09-25 | A kind of sample test/processing unit |
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| CN201510624126.0A CN105180986B (en) | 2015-09-25 | 2015-09-25 | A kind of sample test/processing unit |
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| CN105180986A CN105180986A (en) | 2015-12-23 |
| CN105180986B true CN105180986B (en) | 2017-11-28 |
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| JP2014110270A (en) * | 2012-11-30 | 2014-06-12 | Disco Abrasive Syst Ltd | Cleaning device |
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| CN101210888A (en) * | 2006-12-29 | 2008-07-02 | 斯尔瑞恩公司 | Wafer inspection machine and method |
| CN101241840A (en) * | 2007-02-05 | 2008-08-13 | 东京毅力科创株式会社 | Vacuum processing apparatus and method, and storage medium |
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