CN205014998U - Sample test processing apparatus - Google Patents
Sample test processing apparatus Download PDFInfo
- Publication number
- CN205014998U CN205014998U CN201520753808.7U CN201520753808U CN205014998U CN 205014998 U CN205014998 U CN 205014998U CN 201520753808 U CN201520753808 U CN 201520753808U CN 205014998 U CN205014998 U CN 205014998U
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- Prior art keywords
- specimen holder
- supporting mechanism
- operation post
- topworks
- upset
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Abstract
The utility model provides a sample test processing apparatus can solve the problem that the prior art system is complicated, huge and efficiency is lower. This sample test processing apparatus, including foundation structure spare, operation post, sample frame, sample frame supporting mechanism, controller and a plurality of technology processing unit, wherein foundation structure spare, operation post, sample frame top -down arrange in proper order, sample frame supporting mechanism is used for the cooperation connection and locks the sample frame, the equal fixed mounting of a plurality of technology processing unit is in the operation post, and operation post and foundation structure spare are connected fixedly, are provided with unified operation line connection mouth on the foundation structure spare, the operation post have in vertical direction with operation circuit hookup location corresponds has a perfect understanding the pore, sample frame supporting mechanism passes below the operation post it stretches out to have a perfect understanding the pore to be connected with horizontal rotation actuating mechanism and lift actuating mechanism horizontal rotation and the vertical lift function in order to realize sample frame supporting mechanism.
Description
Technical field
The utility model relates to a kind of for testing or the device of processing sample, can be used in carrying out surface test and turn-over process to various sample.
Background technology
Semiconductor laser has that volume is little, energy efficiency is high, the life-span is long, be easy to the advantages such as modulation, and its range of application covers whole opto-electronics, becomes the core technology of current photoelectron science.And semiconductor laser chip is technological core and the source of whole laser industry chain, it is the key driving whole industry development.In semiconductor device technology, surface treatment is most important, determines performance and the life-span of device, is also the technical difficult points of industry development.
The process of laser semiconductor chip surface state is mainly optimized reformation to improve optical output power and serviceable life for semiconductor laser chip surface state.Laser surface state processing intent removes surface contamination, the labile states such as saturated surface dangling bonds, or further comprise surface modification to meet the use of device better, as improved surface light damage threshold etc.The process of current laser chip surface state, relates generally to surface cleaning, passivation and plated film etc.
Consider diversity and the accuracy of sample preparation technique, at present the main mode adopting different process device to carry out line production in workshop, therefore, whole system is comparatively complicated, huge, too increases the difficulty cooperatively interacted between each process unit.Therefore, a kind of device that comprehensively can complete multiple process procedure is needed badly, optimization system overall architecture.In fact, this is not only the demand of semiconductor laser chip process, LED chip, component of machine (small components) and chemical material etc. test or process also all wish as far as possible simplification device, raise the efficiency.
For the surface treatment of semi-conductor chip, sample usually needs to be placed in specimen holder and installs fixing, and specimen holder itself is also unsettled setting, fixed by supporting construction, the usual position of technique unit processed sample is constant, therefore, when requiring all to deal with the two sides of sample, also need specimen holder can carry out overturning and keep the relative position of pending surface and technique unit constant especially.
Utility model content
The purpose of this utility model is to provide a kind of sample test/treating apparatus, can solve prior art systems complexity, the problem that huge and efficiency is lower.
Scheme of the present utility model is as follows:
A kind of sample test/treating apparatus, comprise base structure (roof of such as vacuum chamber), operation post, specimen holder, specimen holder supporting mechanism, controller and multiple PROCESS FOR TREATMENT unit, wherein base structure, operation post, specimen holder are arranged from top to bottom successively; Described specimen holder is for loading pending sample, and described specimen holder supporting mechanism is used for being connected and locks specimen holder, makes specimen holder be in operating area below operation post; Described multiple PROCESS FOR TREATMENT unit is all fixedly installed in operation post, operation post and base structure are connected and fixed, base structure is provided with unified service line connector, operation post in the vertical direction has the through duct corresponding with described service line link position; Described specimen holder supporting mechanism stretches out through described through duct below operation post, and is connected with and horizontally rotates driving mechanism and lift drive mechanism to realize horizontally rotating and VTOL (vertical take off and landing) function of specimen holder supporting mechanism.
" from top to bottom ", " level ", " vertically " that mention in above scheme is the restriction considering that relative position relation is done, the locus that not definitely restriction is actual.Above-described base structure can have different version, if the vacuum environment that sample test/processing requirements is closed, then and the roof, cover plate etc. of such as vacuum chamber; If permission open space, then such as fixed support, pedestal etc.
Based on above scheme, the utility model has also done following optimization further:
Above-mentioned operation post is installed by operation post supporting mechanism and base structure to fix, operation post supporting mechanism corresponds to the space that described through duct is provided for accommodating specimen holder supporting mechanism, the corresponding electric wiring of described multiple PROCESS FOR TREATMENT unit also cabling in this space.Or operation post also can directly contact fixing with the bottom surface of base structure.
Above-mentioned operation post supporting mechanism and specimen holder supporting mechanism forming sleeves form on the whole, operation post supporting mechanism is fixed on base structure as outer tube grafting, specimen holder supporting mechanism passes operation post supporting mechanism as interior pipe, the corresponding circuit of described multiple PROCESS FOR TREATMENT unit cabling in the annular space that sleeve pipe is formed.
The lower end of above-mentioned specimen holder supporting mechanism is that claw structure is to lock specimen holder.
For demands such as semi-conductor chip double treatment, a upset topworks (being positioned in the horizontal direction of specimen holder) can be set up, for being connected and driving specimen holder to overturn, overturn topworks and specimen holder supporting mechanism being connected to specimen holder by described controller coordinate.
Above-mentioned specimen holder comprises the fixed frame of level and be positioned at the tumbler of fixed frame, tumbler is provided with the through hole for loading pending sample, and tumbler to be installed with fixed frame by trip shaft and is connected; When specimen holder is positioned at process station, described specimen holder supporting mechanism and fixed frame are fixedly connected; When needing upset, the drive end of described upset topworks is coaxially connected and fixed with the trip shaft of specimen holder in the horizontal direction, specimen holder supporting mechanism and fixed frame are thrown off, and make upset topworks can drive the pending chip of tumbler and loading thereof can relative to fixed frame flip-flop movement.
At least two parallel described tumblers are provided with in above-mentioned fixed frame.
When specimen holder needs to overturn, lift drive mechanism drives specimen holder supporting mechanism and fixing specimen holder thereof to move down, upset topworks horizontal direction is extended and is connected with the trip shaft of specimen holder, then specimen holder supporting mechanism and specimen holder are thrown off and are gone up, after the tumbler of specimen holder overturns by topworks to be flipped, specimen holder supporting mechanism again moves down and is fixedly connected with the fixed frame of specimen holder, upset topworks and specimen holder are retracted after throwing off, and specimen holder supporting mechanism and specimen holder rise to required position.
Except above specimen holder structure, the specimen holder without fixed frame of following form can also be designed: namely specimen holder is the tumbler of single piece, when needing upset, upset topworks horizontal direction is extended and is fixedly connected with specimen holder, specimen holder supporting mechanism and specimen holder are thrown off, upset topworks continues in the horizontal direction to extend or bounce back thus drags the projected position of specimen holder away from specimen holder supporting mechanism, after topworks to be flipped drives specimen holder upset, then drag specimen holder and keep in the center and be again connected and fixed with supporting mechanism.
Above-mentioned multiple PROCESS FOR TREATMENT unit comprises sample heating unit, temperature detection feedback unit and cooling unit; Specimen holder supporting mechanism is provided with bias unit, makes to apply bias voltage according to process requirements to specimen holder when specimen holder supporting mechanism locks specimen holder.
Annealing process can utilize sample heating unit wherein and cooling unit to realize.And the design of bias unit, above one-piece construction can be made full use of, simple introducing (grid bias power supply) wire is connected to specimen holder supporting mechanism, and specimen holder, originally as conductive material, makes external control power up the biasing electric field namely forming pending chip and target workspace.
The utility model has the following advantages:
1, system architecture is simple and clear, compact, can carry out multiple PROCESS FOR TREATMENT, raise the efficiency under same environment.
2, specimen holder can realize larger area, can hold up to 300 laser chips, achieve the mass production of laser chip surface treatment process, significant to the development promoting whole laser chip industry.
3, chip can be made under same environment to carry out double treatment fast, and not affect layout and the use of other functional parts; Especially for the process of semi-conductor chip, the hidden danger bringing pollution because shifting environment is avoided.
4, for the technique such as passivation, plated film, bias unit can arrange different bias values by technological requirement, increases compactness and the adhesion of rete under effectively ensureing the prerequisite that rete is injury-free.
5, as completed repeatedly coating process, the heating arrangement in vacuum chamber and cooling device make the annealing in process can carrying out face modification in coating process at any time according to demand.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that the utility model is applied in semiconductor laser chip surface processing equipment.
Fig. 2 is the structural representation in Fig. 1 in vacuum chamber.
Fig. 3 is agent structure schematic diagram of the present utility model.
Fig. 4 is the schematic diagram that structure shown in Fig. 3 increases elevating mechanism.
Fig. 5 is the first embodiment of specimen holder in the utility model.
Fig. 6 is the second embodiment of specimen holder in the utility model.
Fig. 7, Fig. 8 are the third embodiments of specimen holder in the utility model.
Fig. 9 overturns the schematic diagram (upward view) that topworks and specimen holder be connected in the utility model.
Drawing reference numeral illustrates:
1-vacuum technology chamber; 2-vacuum pump connector; The upset topworks of 3-specimen holder; 4-target; 5-target base whirligig; 6-operation post bracing or strutting arrangement; The supporting mechanism of 7-specimen holder; 8-operation post; 9-specimen holder; 901, the fixed frame of 911-specimen holder; 902, the tumbler (rotating bezel) of 912-specimen holder; 903, the trip shaft of 913-specimen holder; 922-is without fixed border tumbler; 10-view window; 11-plate valve; 12-buffer chamber, the position that 13-" sleeve pipe " sealing is fixing;
14-process gas gas circuit; 15-assist gas gas circuit; 16-assist gas hybrid chamber; 17-assist gas venthole; 18-process gas mix chamber; 19-target covering device; The elevating mechanism of 20-specimen holder bracing or strutting arrangement; 21-process gas air admission hole; 22-process gas venthole; 23-specimen holder bracing or strutting arrangement claw; 24-reflection shield (so that by sample homogeneous heating); 25-heating unit; 26-temperature detecting unit.
Embodiment
Below in conjunction with accompanying drawing, be applied as example with semiconductor laser chip surface processing equipment aspect, introduce structure of the present utility model and effect in detail.
In the present embodiment, vacuum technology chamber interior arranges operation post, and operation post is connected by the top of operation post bracing or strutting arrangement with vacuum technology chamber, and operation post can be placed in the top of sputtering target material, also can inverted structure.
Heating unit, cooling unit and temperature feedback unit are equipped with in operation post inside, regulate and control sample temperature according to the temperature of variant technological process defined.Heating unit can adopt but be not limited to the mode such as electrical heating or infrared lamps, after every thin film is coated with, all whether can carry out the condition of annealing in process and annealing by process choice, in vacuum technology chamber optionally complete passivating film be coated with after or multilayer dielectric film be coated with after carry out annealing in process.
Bias unit is via described operation post bracing or strutting arrangement inside access specimen holder.Carry out that physics cleans at sample surfaces, chemical etching and be coated with deielectric-coating technological process in start bias unit, different bias values is set by technological requirement, to control the compactness etc. of rete.
The supporting mechanism of specimen holder and operation post bracing or strutting arrangement are sleeve structure, and the annular space of the supporting mechanism of operation post bracing or strutting arrangement and specimen holder is used for the control signal cabling of sample heating unit, temperature detection feedback unit, bias unit, cooling device etc.
Specimen holder can be elevated in vertical direction, also can set up universal stage and drive its 360 degree of rotations in the horizontal direction.Adjust the height of specimen holder as requested, can align the treatment effect such as thickness, homogeneity.
The upset topworks of specimen holder can be connected with specimen holder, completes that physics is clean, after chemical etching, passivating film be coated with and be coated with deielectric-coating, overturn by sample, carry out surface treatment process to other end surface on the surface of chip one end.Upset mode can depending on the concrete condition of cavity design: scheme one, specimen holder are moved down by the elevating mechanism of specimen holder bracing or strutting arrangement, specimen holder switching mechanism horizontal direction is extended and is connected and fixed with specimen holder, specimen holder bracing or strutting arrangement and specimen holder depart from rising certain altitude, after specimen holder overturns by driving mechanism to be flipped, specimen holder bracing or strutting arrangement declines and is connected with specimen holder, retracts after turnover driving mechanism and specimen holder depart from, specimen holder rises to required position to carry out subsequent technique and sees Fig. 5; Scheme two, carries out upset by sample turnover driving mechanism by the local sample in the middle of specimen holder and sees Fig. 6; Scheme three, specimen holder is designed to the tumbler of single piece, is moved out to larger space to realize upset, and then puts back to, reconnect fixing, see Fig. 7, Fig. 8 with the supporting mechanism of specimen holder with the flexible of horizontal direction of switching mechanism.
The base of target is provided with whirligig, can place multiple target, and sputtering target can carry out rotation switching according to the service condition of process requirements and target or mix many target as sputter.
The concrete using method of this semiconductor laser chip surface processing equipment:
1) guarantee that the plate valve 11 connected between vacuum technology chamber 1 and cushion chamber 12 is in closed condition;
2) pending semiconductor devices, as laser chip is positioned in specimen holder 9;
3) specimen holder 9 is put on the sample delivery frame of surge chamber, 10 are evacuated to cushion chamber
-5 ~-7torr;
4) open plate valve, specimen holder 9 is sent into vacuum technology chamber and is fixed on operation post 8;
5) plate valve 11 is closed;
6) open technological process menu, (menu allows synthesis clean, etching, passivation, plated film, all kinds of technological processs such as annealing to start technological process.Also allow to load all kinds of gas, as Ar, H2, N2, O2, etching gas etc., to air pressure and the process power of process, the time etc. can be program control);
A) clean: to start heating unit and sample is heated to temperature required, pass into gas to vacuum technology chamber, under grid bias power supply effect, produce stable plasma, sample surfaces is cleaned;
B) etch: regulate heating-up temperature, pass into gas, open bias unit, under grid bias power supply effect, produce stable plasma, pass into corrosive gas and sample surfaces is etched;
C) passivation: regulate heating-up temperature, pass into inert gas, under RF power supply or grid bias power supply effect, produce stable plasma, then pass into passivation reaction gas and carry out Passivation Treatment, by completing annealing process to the heating and cooling process of passivating film after reaction terminates;
D) plated film: regulate heating-up temperature, pass into inert gas, under the effect of RF power supply, produce stable plasma, plasma bombardment target carries out plated film, open grid bias power supply simultaneously, regulate bias value to make rete increase its compactness and adhesion under injury-free prerequisite.
7) after completing single-sided process process, as needed double treatment, can overturn sample, carrying out PROCESS FOR TREATMENT to another side, the menu of process can completely different one side in addition.
8) after having processed, open plate valve, sample is moved on to cushion chamber;
9) close plate valve 11, exit to atmospheric pressure to buffer chamber 12;
10) sample handled well is taken out.
This equipment can complete under a vacuum environment that the physics in the face, chamber being positioned at chip two ends is clean, chemical etching, surface modification successively, passivating cavity surface film is coated with and deielectric-coating process for plating, dispose the non-radiative recombination center such as surface state or interface state in face, chamber to greatest extent, even change surface energy band structure, the output power of effective raising laser chip and COMD threshold value, increase the chip life-span.
Claims (10)
1. sample test/treating apparatus, is characterized in that: comprise base structure, operation post, specimen holder, specimen holder supporting mechanism, controller and multiple PROCESS FOR TREATMENT unit, wherein base structure, operation post, specimen holder are arranged from top to bottom successively; Described specimen holder is for loading pending sample, and described specimen holder supporting mechanism is used for being connected and locks specimen holder, makes specimen holder be in operating area below operation post; Described multiple PROCESS FOR TREATMENT unit is all fixedly installed in operation post, operation post and base structure are connected and fixed, base structure is provided with unified service line connector, operation post in the vertical direction has the through duct corresponding with described service line link position; Described specimen holder supporting mechanism stretches out through described through duct below operation post, and is connected with and horizontally rotates driving mechanism and lift drive mechanism to realize horizontally rotating and VTOL (vertical take off and landing) function of specimen holder supporting mechanism.
2. sample test/treating apparatus according to claim 1, it is characterized in that: described operation post is installed by operation post supporting mechanism and base structure to fix, operation post supporting mechanism corresponds to the space that described through duct is provided for accommodating specimen holder supporting mechanism, the corresponding electric wiring of described multiple PROCESS FOR TREATMENT unit also cabling in this space.
3. sample test/treating apparatus according to claim 2, it is characterized in that: described operation post supporting mechanism and specimen holder supporting mechanism forming sleeves form on the whole, operation post supporting mechanism is fixed on base structure as outer tube grafting, specimen holder supporting mechanism passes operation post supporting mechanism as interior pipe, the corresponding circuit of described multiple PROCESS FOR TREATMENT unit cabling in the annular space that sleeve pipe is formed.
4. sample test/treating apparatus according to claim 1, is characterized in that: the lower end of described specimen holder supporting mechanism is that claw structure is to lock specimen holder.
5. sample test/treating apparatus according to claim 1, it is characterized in that: this sample test/treating apparatus also comprises the upset topworks be positioned in the horizontal direction of specimen holder, for being connected and driving specimen holder to overturn, overturn topworks and specimen holder supporting mechanism being connected to specimen holder by described controller coordinate.
6. sample test/treating apparatus according to claim 5, it is characterized in that: described specimen holder comprises the fixed frame of level and is positioned at the tumbler of fixed frame, tumbler is provided with the through hole for loading pending sample, tumbler to be installed with fixed frame by trip shaft and is connected; When specimen holder is positioned at process station, described specimen holder supporting mechanism and fixed frame are fixedly connected; When needing upset, the drive end of described upset topworks is coaxially connected and fixed with the trip shaft of specimen holder in the horizontal direction, specimen holder supporting mechanism and fixed frame are thrown off, and make upset topworks can drive the pending chip of tumbler and loading thereof can relative to fixed frame flip-flop movement.
7. sample test/treating apparatus according to claim 6, is characterized in that: be provided with at least two parallel described tumblers in described fixed frame.
8. sample test/treating apparatus according to claim 6, it is characterized in that: when specimen holder needs to overturn, lift drive mechanism drives specimen holder supporting mechanism and fixing specimen holder thereof to move down, upset topworks horizontal direction is extended and is connected with the trip shaft of specimen holder, then specimen holder supporting mechanism and specimen holder are thrown off and are gone up, after the tumbler of specimen holder overturns by topworks to be flipped, specimen holder supporting mechanism again moves down and is fixedly connected with the fixed frame of specimen holder, upset topworks and specimen holder are retracted after throwing off, specimen holder supporting mechanism and specimen holder rise to required position.
9. sample test/treating apparatus according to claim 5, it is characterized in that: described specimen holder is the tumbler of single piece, when needing upset, upset topworks horizontal direction is extended and is fixedly connected with specimen holder, specimen holder supporting mechanism and specimen holder are thrown off, upset topworks continues in the horizontal direction to extend or bounce back thus drags the projected position of specimen holder away from specimen holder supporting mechanism, after topworks to be flipped drives specimen holder upset, then drag specimen holder and keep in the center and be again connected and fixed with supporting mechanism.
10. sample test/treating apparatus according to claim 1, is characterized in that: described multiple PROCESS FOR TREATMENT unit comprises sample heating unit, temperature detection feedback unit and cooling unit; Specimen holder supporting mechanism is provided with bias unit, makes to apply bias voltage according to process requirements to specimen holder when specimen holder supporting mechanism locks specimen holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520753808.7U CN205014998U (en) | 2015-09-25 | 2015-09-25 | Sample test processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520753808.7U CN205014998U (en) | 2015-09-25 | 2015-09-25 | Sample test processing apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN205014998U true CN205014998U (en) | 2016-02-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520753808.7U Withdrawn - After Issue CN205014998U (en) | 2015-09-25 | 2015-09-25 | Sample test processing apparatus |
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| CN (1) | CN205014998U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105180986A (en) * | 2015-09-25 | 2015-12-23 | 西安立芯光电科技有限公司 | Sample testing/processing device |
-
2015
- 2015-09-25 CN CN201520753808.7U patent/CN205014998U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105180986A (en) * | 2015-09-25 | 2015-12-23 | 西安立芯光电科技有限公司 | Sample testing/processing device |
| CN105180986B (en) * | 2015-09-25 | 2017-11-28 | 西安立芯光电科技有限公司 | A kind of sample test/processing unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160203 Effective date of abandoning: 20171128 |