CN105174988A - Method for connecting ceramic by adopting porous ceramic middle layer - Google Patents
Method for connecting ceramic by adopting porous ceramic middle layer Download PDFInfo
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- CN105174988A CN105174988A CN201510619427.4A CN201510619427A CN105174988A CN 105174988 A CN105174988 A CN 105174988A CN 201510619427 A CN201510619427 A CN 201510619427A CN 105174988 A CN105174988 A CN 105174988A
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Abstract
The invention provides a method for connecting ceramic by adopting a porous ceramic middle layer. The method comprises the steps of firstly selecting porous ceramic with a certain porosity and hole diameter range, adopting a cutting machine to cut the porous ceramic into sheets with a certain thickness, placing the porous ceramic sheets and brazing filler metal together between two weldments and then performing brazing. In the brazing-heating process, the brazing filler metal melts and flows into small holes of the middle layer and reacts with the interfaces of the ceramic weldments at two ends to form joints, and the formed joints are even in component, smaller in internal residual stress and excellent in mechanical property.
Description
Technical field
The invention belongs to ceramic joining technical field, be specifically related to a kind ofly have that cost is low, simple to operate, strength of joint is high and the employing porous ceramics middle layer of the plurality of advantages such as stable performance connects the method for pottery.
Background technology
Stupalith is widely used in Aeronautics and Astronautics, military project, nuclear energy, automobile etc.But this material plasticity is poor, processing difficulties, not easily make large-scale or complex-shaped component, therefore its use is restricted.At present, connecting the modal method of stupalith is soldering, and its solder used mostly is metallic substance.The joint adopting this technology to make can not only play the premium properties of pottery, meets more designs and process requirements, also has that cost is low, simple to operate, strength of joint is high and the plurality of advantages such as stable performance simultaneously.
Ceramic joining is mainly concerned with two problems: 1) Problem of Wettability: because the physics and chemistry character on metal solder surface differs greatly with ceramic phase ratio, and general metal solder is difficult to be formed ceramic surface wetting; 2) residual stress problems: Ceramic brazing adopts metal solder, between general metallic substance and pottery, thermal expansion coefficient difference is comparatively large, in soldering temperature-fall period, easily near the linkage interface of joint, forms high unrelieved stress.
Active element can be added in solder for Problem of Wettability in the past, be resolved by the reaction between active element and pottery.For residual stress problems, common remission method has: the CTE of adjustment pottery and metal is poor; Adopt lower temperature or slow speed of cooling; Middle layer or buffer layer is inserted in joint; Adopt and relax structure etc.Due to pottery and metal between thermal expansivity differ greatly, adjustment bi-material CTE mispairing and cooling slow cooling method effect very limited; And insert middle layer or relief layer and often make to introduce in solder layer extra reacting phase, the mechanical property of infringement joint.In order to obtain low unrelieved stress and reliable and stable joint, need to find out a kind of novel method alleviating joint unrelieved stress.
Summary of the invention
For the above-mentioned problems in the prior art, the object of the present invention is to provide and a kind ofly have that cost is low, simple to operate, strength of joint is high and the employing porous ceramics middle layer of the plurality of advantages such as stable performance connects the method for pottery.
A kind of described method adopting porous ceramics middle layer to connect pottery, it is characterized in that the porous ceramics thin slice choosing certain porosity and pore diameter range, this porous ceramics thin slice is positioned over together with solder in the middle of two ceramic member, in soldering heat-processed, solder thawing enters in the aperture of porous ceramics thin slice, and react with two ends ceramic interface and form joint, realize ceramic joining.
A kind of described method adopting porous ceramics middle layer to connect pottery, is characterized in that comprising the steps:
1) choose aperture 5-20 μm, the porous ceramics of porosity 15%-30%, be processed into the porous ceramics thin slice of 0.5-1.5mm by cutting machine;
2) put solder in the porous ceramics thin slice both sides of step 1), and be fixed;
3) according to pottery, step 2) porous ceramics thin slice, pottery order above-mentioned materials is put into soldering oven.In heat-processed, solder thawing enters in the aperture of middle layer porous ceramics thin slice, and forms joint with the ceramic member surface reaction at two ends, then slow cooling takes out.
A kind of described method adopting porous ceramics middle layer to connect pottery, it is characterized in that described porous ceramics thin slice aperture 5-20 μm, porosity 15%-30%, sheet thickness is 0.5-1.5mm.
A kind of described method adopting porous ceramics middle layer to connect pottery, is characterized in that described porous ceramics thin slice is bonding by 502 glue with solder.
A kind of described method adopting porous ceramics middle layer to connect pottery, it is characterized in that porous ceramics thin slice first carries out preheating insulation before putting into soldering oven, preheating temperature is 300 DEG C, and soaking time is 20-40min.
A kind of described method adopting porous ceramics middle layer to connect pottery, lower the temperature after it is characterized in that weldering pricker 1.5-2.5 hour, furnace cooling after temperature to 300 DEG C.
By adopting above-mentioned technology, compared with prior art, advantage of the present invention is as follows:
1) the present invention adopt limit aperture, porosity and thickness porous ceramics as middle layer, stress level in remarkable reduction joint, the unrelieved stress in ceramic joint is mainly from following two aspects: 1) be connected the unrelieved stress that the hot mispairing between mother metal and connecting material causes; 2) string stress that causes in solidification shrinkage process of solder alloy; Concerning ceramic joint, first part's stress belongs to macrostress, and butt junction performance impact is maximum; In the invention process process, joining region tissue in joint is made up of the solder of pottery and interior filling thereof, now connecting material is integrally considered, then joining region and two ends be connected pottery coefficient of thermal expansion differences diminish, the macrostress therefore caused by hot mispairing will significantly decline; In this case, joint internal stress level depends primarily on string stress.The present invention is when actual soldering, the solder alloy of melting enters in the through hole of ceramic inter-layer, be divided into the little melting zone that several are relatively isolated, during solidification shrinkage, whole contraction by larger area is transformed into the solidification shrinkage that many little melting zones isolate relatively by alloy, because the solidification shrinkage direction of adjacent little melting zone alloy is contrary, the stress in joint also can be reduced to a certain extent; In addition, absorb energy, shock resistance and release stress significantly because hole has, by the regulation and control to solder amount and setting rate etc., to make after connection remnant hole in joint, reduce the stress level in joint further;
2) ceramic joining method of the present invention, by adopting porous ceramics as middle layer, and define its porosity, pore diameter range and thickness, this porous ceramics thin slice is positioned in the middle of two weldments with solder together, carry out soldering subsequently, in soldering heat-processed, solder thawing enters in the aperture in middle layer, and form joint with two ends weldment surface reaction, the linker components formed is even, there is low stress level, joint mechanical property is outstanding, excellent high strength, creep resistance and fatigue property, its cost is low, simple to operate, high and the stable performance of strength of joint, the joint obtained by the method provides guarantee by for the reliability service of ceramic joint under high-temperature service.
Accompanying drawing explanation
Fig. 1 is the principle schematic using the method to form brazed joint.
In figure: 1-ceramic member, 2-solder, 3-solder gap, 4-porous ceramics thin slice.
Embodiment
Below in conjunction with embodiment, the invention will be further described, but protection scope of the present invention is not limited in this.
As shown in Figure 1, employing porous ceramics middle layer of the present invention connects the method for pottery, choose the porous ceramics thin slice 4 of certain porosity and pore diameter range, this porous ceramics thin slice 4 is positioned over together with solder 2 in the middle of two ceramic member 1, in soldering heat-processed, solder 2 melts in the solder gap 3 of aperture and porous ceramics thin slice 4 and ceramic member 2 termination entering porous ceramics thin slice 4, and form joint with two ends ceramic member 2 surface reaction, realize ceramic joining, described porous ceramics thin slice 4 aperture 5-20 μm, the porous ceramics of porosity 15%-30%, the thin slice of 0.5-1.5mm is processed into by cutting machine.
To connect silicon carbide ceramics, its connection procedure is as follows:
1) choose 15 μm, aperture, the porous silicon carbide ceramic of porosity 20%, be processed into the porous silicon carbide ceramic thin slice of 1mm by precision gas cutting machine;
2) put solder and silicon carbide ceramics test specimen to be connected in the porous silicon carbide ceramic thin slice both sides of step 1), with 502 glue, each several part is bonded together;
3) by step 2) in bonding test specimen put into soldering oven, heating is welded: be incubated 0.5h when rising to 300 DEG C by room temperature, glue in test specimen is volatilized, is warming up to target brazing temperature subsequently, after being down to 300 DEG C with the speed of 10 DEG C/min during cooling, cool to room temperature with the furnace.
By ceramic joining method of the present invention, adopt porous ceramics as middle layer, this porous ceramics thin slice is positioned in the middle of two weldments with solder together, carry out soldering subsequently, in soldering heat-processed, solder thawing enters in the aperture in middle layer, and form joint with two ends weldment surface reaction, the linker components formed is even, there is low stress level, joint mechanical property is outstanding, excellent high strength, creep resistance and fatigue property, its cost is low, simple to operate, high and the stable performance of strength of joint, the joint obtained by the method provides guarantee by for the reliability service of ceramic joint under high-temperature service.
Claims (6)
1. the method adopting porous ceramics middle layer to connect pottery, it is characterized in that the porous ceramics thin slice choosing certain porosity and pore diameter range, this porous ceramics thin slice is positioned over together with solder in the middle of two ceramic member, in soldering heat-processed, solder thawing enters in the aperture of porous ceramics thin slice, and form joint with two ends ceramic member surface reaction, realize ceramic joining.
2. a kind of method adopting porous ceramics middle layer to connect pottery according to claim 1, is characterized in that comprising the steps:
1) choose aperture 5-20 μm, the porous ceramics of porosity 15%-30%, be processed into the porous ceramics thin slice of 0.5-1.5mm by cutting machine;
2) put solder in the porous ceramics thin slice both sides of step 1), and be fixed;
3) according to pottery, step 2) porous ceramics thin slice, pottery order above-mentioned materials is put into soldering oven, add thermo-welding, in heat-processed, solder thawing enters in the aperture of middle layer porous ceramics thin slice, and form joint with the ceramic member surface reaction at two ends, then slow cooling takes out.
3. a kind of method adopting porous ceramics middle layer to connect pottery according to claim 1, it is characterized in that described porous ceramics thin slice aperture 5-20 μm, porosity 15%-30%, sheet thickness is 0.5-1.5mm.
4. a kind of method adopting porous ceramics middle layer to connect pottery according to claim 1, is characterized in that described porous ceramics thin slice, solder and two ends ceramic member are bonding by 502 glue.
5. a kind of method adopting porous ceramics middle layer to connect pottery according to claim 1, is characterized in that the preheating insulation first carrying out certain hour before porous ceramics thin slice puts into soldering oven.
6. a kind of method adopting porous ceramics middle layer to connect pottery according to claim 1, to lower the temperature 1.5-2.5 hour after it is characterized in that weldering pricker, furnace cooling after temperature to 300 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510619427.4A CN105174988A (en) | 2015-09-25 | 2015-09-25 | Method for connecting ceramic by adopting porous ceramic middle layer |
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| CN201510619427.4A CN105174988A (en) | 2015-09-25 | 2015-09-25 | Method for connecting ceramic by adopting porous ceramic middle layer |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106493443A (en) * | 2016-10-25 | 2017-03-15 | 哈尔滨工业大学 | A kind of composite interlayer ceramic soldering or the method for ceramic matric composite and metal |
| CN109133964A (en) * | 2018-09-26 | 2019-01-04 | 北京无线电测量研究所 | Xenogenesis ceramic joining method |
| CN109843831A (en) * | 2016-10-12 | 2019-06-04 | 日本碍子株式会社 | Intermediate member |
| CN115635156A (en) * | 2022-10-13 | 2023-01-24 | 中国第一汽车股份有限公司 | Laser brazing method for compensation net |
-
2015
- 2015-09-25 CN CN201510619427.4A patent/CN105174988A/en active Pending
Non-Patent Citations (1)
| Title |
|---|
| 焦涛: "BN/SiO2与Nb的钎焊连接工艺及机理研究", 《哈尔滨工业大学硕士学位论文》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109843831A (en) * | 2016-10-12 | 2019-06-04 | 日本碍子株式会社 | Intermediate member |
| CN106493443A (en) * | 2016-10-25 | 2017-03-15 | 哈尔滨工业大学 | A kind of composite interlayer ceramic soldering or the method for ceramic matric composite and metal |
| CN109133964A (en) * | 2018-09-26 | 2019-01-04 | 北京无线电测量研究所 | Xenogenesis ceramic joining method |
| CN115635156A (en) * | 2022-10-13 | 2023-01-24 | 中国第一汽车股份有限公司 | Laser brazing method for compensation net |
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Application publication date: 20151223 |